A ceramic chip package structure of isolated gate driver
By designing a multi-layer ceramic structure and metallization layer, combined with a through-type heat sink architecture, the problems of high electrical isolation and fast response of isolated gate drivers are solved, achieving high reliability and high integration packaging, and reducing process complexity.
CN224386024UActive Publication Date: 2026-06-19CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
- Filing Date
- 2025-06-18
- Publication Date
- 2026-06-19
Smart Images
Figure CN224386024U_ABST
Abstract
This utility model discloses a ceramic surface-mount package structure for an isolated gate driver, including a ceramic body, a chip bonding area, an edge bonding area, an external electrode area, a sealing ring, and a cover plate. The ceramic body is welded to a frame using multilayer ceramic components, and the ceramic body, sealing ring, and cover plate form a cavity. Eight electrode areas are externally led out from the bottom of the ceramic body. The chip bonding area is located on the inner surface of the ceramic body and is designed with a recessed shape. The chip is welded to the recessed area through a bottom metal electrode sheet to achieve hermetic encapsulation. The edge bonding area includes a ceramic body with a metallized layer on the inner surface of the cavity. This utility model has the characteristics of good insulation performance, small size, ultra-high integration, light weight, fast heat dissipation, and high reliability, and has very high promotional value.
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