Image sensor package structure capable of reducing air bubbles in the filling adhesive

Abstract

This utility model discloses an image sensor packaging structure that reduces air bubbles in the filler adhesive, relating to the field of semiconductor packaging technology. It includes a substrate, an image sensor, a sidewall plate, leads, a transparent cover plate, side plates, and filler adhesive. The image sensor is fixed above the substrate. The sidewall plate is located around its photosensitive area and sealed by the transparent cover plate. Leads connect the two, and the sidewall plate is located between the leads and the photosensitive area. The side plate vertically surrounds the leads. The side plate has a vertical injection hole and a horizontally connected dispensing hole. The lower end of the dispensing hole is flush with the upper surface of the substrate. The outer wall of the sidewall plate, the inner wall of the side plate, and the upper side surface of the substrate form a cavity, into which filler adhesive fills the cavity and the injection hole. The image sensor packaging structure provided by this utility model that reduces air bubbles in the filler adhesive solves the problem of insufficient adhesive injection and air bubbles in the prior art; this utility model can reduce air bubbles generated during adhesive injection.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to an image sensor packaging structure that can reduce air bubbles in the filler adhesive. Background Technology

[0002] In existing image sensor packaging structures, to achieve dustproof sealing of the photosensitive area, a sidewall plate (or supporting sidewall) is typically placed above the periphery of the photosensitive area of ​​the image sensor. The top of this sidewall plate is sealed with transparent glass, forming an independent dustproof cavity between it and the sensor. Simultaneously, to protect the leads between the sensor and the substrate, adhesive needs to be filled around the leads. In this case, a rectangular sideplate might be placed around the bottom of the sensor periphery and above the substrate. This sideplate, along with the sidewall plate inside the rectangular frame, forms an annular cavity with the upper surface of the substrate to accommodate the adhesive. Its main function is to restrict the flow range of the adhesive and provide mechanical support.

[0003] For example, the image sensor packaging structure disclosed in Chinese patent application No. 201920709761.2 discloses an image sensor packaging structure with side plates. However, since the filler glue is usually output from vertically upwards by a dispensing needle, and the end of the dispensing needle that dispenses glue usually tapers inwards to form an inverted cone shape, there are areas at the junction of the side plate and the substrate (especially at the four corners or bends) that are difficult for the dispensing needle to reach, resulting in the problem that the filler glue cannot fully cover the area. After the gaps are formed, the glue layer will be uneven in thickness or have voids at the junction edge after the filler glue cures, reducing the support strength for the leads. When the packaging structure is subjected to external forces (such as vibration or thermal stress), the glue layer is prone to local deformation towards the gaps, which will pull the leads and may lead to lead breakage or electrical connection failure. Utility Model Content

[0004] To address the aforementioned technical problems, the image sensor packaging structure provided by this utility model can reduce air bubbles generated during glue injection.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] This utility model provides an image sensor packaging structure that reduces air bubbles in the filler adhesive, comprising a substrate, an image sensor, a sidewall plate, leads, a transparent cover plate, side plates, and filler adhesive. The image sensor is fixed above the substrate. The sidewall plate is disposed around the photosensitive area above the image sensor. The leads connect the substrate and the image sensor. The sidewall plate is located between the leads and the photosensitive area. A transparent cover plate is provided on the upper side of the sidewall plate for sealing. The side plate surface is vertical. The side plate is sealed and fixed around the leads. The side plate has a plurality of injection holes extending vertically. The side plate has a plurality of dispensing holes facing the image sensor. The dispensing holes have horizontal axes. The dispensing holes communicate with the injection holes. The axis of the dispensing holes is parallel to the upper surface of the substrate. The lower end of the dispensing hole opening is flush with the upper surface of the substrate. An injection cavity is formed on the outer wall of the sidewall plate, the inner wall of the side plate, and the upper side surface of the substrate. The filler adhesive fills the injection cavity and the injection holes.

[0007] The image sensor packaging structure provided by this utility model can reduce air bubbles in the filler glue. Preferably, the glue injection hole is provided at the corner of the side plate.

[0008] The image sensor packaging structure provided by this utility model can reduce air bubbles in the filler adhesive. Preferably, the side plate is made of epoxy resin.

[0009] The image sensor packaging structure provided by this utility model can reduce air bubbles in the filling adhesive. Preferably, the number of adhesive outlet holes is 4 to 12; the adhesive outlet holes are evenly distributed circumferentially along the inner wall of the square frame of the side plate.

[0010] The image sensor packaging structure provided by this utility model can reduce air bubbles in the filler adhesive. Preferably, a sealing ring is provided at the bottom edge of the side wall plate.

[0011] The above technical solution has the following advantages or beneficial effects:

[0012] This utility model discloses an image sensor packaging structure that reduces air bubbles in the filler adhesive, relating to the field of semiconductor packaging technology. It includes a substrate, an image sensor, a sidewall plate, leads, a transparent cover plate, side plates, and filler adhesive. The image sensor is fixed above the substrate. The sidewall plate is disposed around the photosensitive area above the image sensor. The leads connect the substrate and the image sensor. The sidewall plate is located between the leads and the photosensitive area. A transparent cover plate is provided on the upper side of the sidewall plate for sealing. The side plate surface is vertical. The side plate is sealed and fixed around the leads. A plurality of injection holes are vertically oriented through the side plate. A plurality of dispensing holes are formed on the side of the side plate facing the image sensor. The dispensing holes have horizontal axes and communicate with the injection holes. The axis of the dispensing holes is parallel to the upper surface of the substrate. The lower end of the dispensing hole opening is flush with the upper surface of the substrate. An injection cavity is formed on the outer wall of the sidewall plate, the inner wall of the side plate, and the upper side surface of the substrate. The filler adhesive fills the injection cavity and the injection holes. The image sensor packaging structure provided by this utility model can reduce air bubbles in the filler glue, solving the problem of insufficient glue injection and air bubbles in the prior art; this utility model can reduce air bubbles generated during glue injection. Attached Figure Description

[0013] The present invention, its features, shape, and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference numerals denote like parts throughout the drawings. The drawings are not intentionally drawn to scale; the focus is on illustrating the gist of the invention.

[0014] Figure 1 This is a schematic diagram of the overall structure of the image sensor packaging structure that reduces air bubbles in the filler adhesive provided in Embodiment 1 of this utility model. Detailed Implementation

[0015] The technical solutions of the present utility model will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to illustrate selected embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without inventive effort are within the protection scope of the present utility model.

[0016] Example 1:

[0017] The image sensor packaging structure provided in Embodiment 1 of this utility model can reduce air bubbles in the filler adhesive, such as... Figure 1As shown, the system includes a substrate 1, an image sensor 2, a sidewall plate 3, a lead wire 4, a transparent cover plate 5, a side plate 6, and a filler adhesive. The image sensor 2 is fixed above the substrate 1. The sidewall plate 3 is disposed around the photosensitive area 21 above the image sensor 2. The lead wire 4 connects the substrate 1 and the image sensor 2. The sidewall plate 3 is located between the lead wire 4 and the photosensitive area 21. The transparent cover plate 5 is provided on the upper side of the sidewall plate 3 for sealing. The side plate 6 has a vertical surface. The side plate 6 is sealed and fixed around the lead wire 4. The side plate 6 is vertical. A plurality of injection holes 61 are provided through the side plate 6; a plurality of dispensing holes 62 are provided on the side of the side plate 6 facing the image sensor 2; the axis of the dispensing holes 62 is horizontal; the dispensing holes 62 are connected to the injection holes 61; the axis of the dispensing holes 62 is parallel to the upper surface of the substrate 1; the lower end of the opening of the dispensing holes 62 is flush with the upper surface of the substrate 1; an injection cavity is formed on the outer wall of the side wall plate 3, the inner wall of the side plate 6 (the inner wall of the square frame of the side plate 6), and the upper side surface of the substrate 1; the filler glue is filled in the injection cavity; the filler glue is filled in the injection holes 61.

[0018] When the image sensor packaging structure provided in Embodiment 1 of this utility model, which reduces air bubbles in the filler glue, is in operation, the signal will pass through the transparent cover plate 5 and be received by the photosensitive area 21.

[0019] In actual assembly, after fixing the image sensor 2, side wall plate 3, and transparent cover plate 5, and connecting the image sensor 2 and substrate 1 with the lead wire 4, a side plate 6 is set on the substrate 1, so that the side plate 6 surrounds the outside of the lead wire 4 and is on the substrate 1. Then, above the side plate 6, the dispensing head is positioned above the upper opening of the dispensing hole 61. After the glue enters the dispensing hole 61, it flows downward along the dispensing hole 61 and finally flows out from the opening of the dispensing hole 62 facing the image sensor 2. This filler glue will initially fill the edge between the side plate 6 and the substrate 1. Then, the dispensing head is used to fill the annular dispensing cavity between the side plate 6 and the side wall plate 3 with subsequent filler glue, ensuring that the filler glue fully covers and seals the lead wire. The difference from the prior art is that in this embodiment, the filler glue is first set at the edge of the side plate 6 and the substrate where it is difficult to dispense glue and where the filler glue is prone to air bubbles, and then other filler glue is added, thereby ensuring that the filler glue can fully fill the dispensing cavity.

[0020] The image sensor packaging structure provided in Embodiment 1 of this utility model can reduce air bubbles in the filler adhesive, which solves the problem of insufficient adhesive filling and air bubbles in the prior art; this utility model can reduce air bubbles generated during adhesive filling.

[0021] As a preferred embodiment, in this case, an injection hole 61 is provided at the corner of the side panel 6. The corner of the side panel 6 is also an area prone to air bubbles, so it is necessary to prioritize the application of filler glue there to prevent air bubbles from forming during subsequent filling.

[0022] In this embodiment, the side plate 6 is made of epoxy resin. Epoxy resin has high tensile strength and modulus, and can serve as a rigid support frame to stably surround the lead wire, withstand the shrinkage stress during the curing of the filler adhesive and external mechanical vibration, and avoid changes in cavity size caused by side plate deformation.

[0023] As a preferred embodiment, in this embodiment, the number of dispensing holes is 4 to 12; the dispensing holes 62 are evenly distributed circumferentially along the inner wall of the square frame of the side plate 6. In this embodiment, the side plate 6 is square, and at least 4 dispensing holes are located at the midpoints of the four sides of the square frame of the side plate 6, ultimately realizing that the filling adhesive flows from the center of the four sides to the four corners.

[0024] As a preferred embodiment, a sealing ring 7 is provided at the bottom edge of the side wall panel 3. The function of the sealing ring 7 is to prevent dust and moisture from entering the cavity through the assembly gap between the side wall panel and the substrate, thus avoiding contamination of the photosensitive area of ​​the image sensor.

[0025] In summary, this utility model discloses an image sensor packaging structure that reduces air bubbles in the filler adhesive, relating to the field of semiconductor packaging technology. It includes a substrate, an image sensor, a sidewall plate, leads, a transparent cover plate, side plates, and filler adhesive. The image sensor is fixed above the substrate. The sidewall plate is disposed around the photosensitive area above the image sensor. The leads connect the substrate and the image sensor. The sidewall plate is located between the leads and the photosensitive area. A transparent cover plate is provided on the upper side of the sidewall plate for sealing. The side plate surface is vertical. The side plate is sealed and fixed around the leads. A plurality of injection holes are vertically oriented through the side plate. A plurality of dispensing holes are formed on the side of the side plate facing the image sensor. The dispensing hole axis is horizontal. The dispensing holes communicate with the injection holes. The dispensing hole axis is parallel to the upper surface of the substrate. The lower end of the dispensing hole opening is flush with the upper surface of the substrate. An injection cavity is formed on the outer wall of the sidewall plate, the inner wall of the side plate, and the upper side surface of the substrate. The filler adhesive fills the injection cavity and the injection holes. The image sensor packaging structure provided by this utility model can reduce air bubbles in the filler glue, solving the problem of insufficient glue injection and air bubbles in the prior art; this utility model can reduce air bubbles generated during glue injection.

[0026] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. An image sensor packaging structure that reduces air bubbles in the filler adhesive, comprising a substrate, an image sensor, a sidewall plate, leads, and a transparent cover plate; the image sensor is fixed above the substrate; the sidewall plate is disposed around the photosensitive area above the image sensor; the leads connect the substrate and the image sensor; the sidewall plate is located between the leads and the photosensitive area; and a transparent cover plate is disposed on the upper side of the sidewall plate for sealing. Its features are, It also includes side panels and filler adhesive; The side plate is vertical; the side plate is sealed and fixed around the periphery of the lead wire; the side plate has a plurality of injection holes through it in the vertical direction; the side plate has a plurality of dispensing holes on the side facing the image sensor; the dispensing hole has a horizontal axis; the dispensing hole is connected to the injection hole; the axis of the dispensing hole is parallel to the upper surface of the substrate; the lower end of the opening of the dispensing hole is flush with the upper surface of the substrate. An injection cavity is formed on the outer wall of the side wall panel, the inner wall of the side panel, and the upper side of the substrate; the filler adhesive fills the injection cavity; the filler adhesive fills the injection hole. 2.The image sensor package structure with reduced air bubble filling of claim 1, wherein, The glue injection hole is provided at the corner of the side plate.

3. The image sensor packaging structure for reducing air bubbles in filler adhesive as described in claim 1, characterized in that, The side panel is made of epoxy resin.

4. The image sensor packaging structure for reducing air bubbles in filler adhesive as described in claim 1, characterized in that, The number of adhesive outlet holes is 4 to 12; the adhesive outlet holes are evenly distributed circumferentially along the inner wall of the square frame of the side plate.

5. The image sensor packaging structure for reducing air bubbles in filler adhesive as described in claim 1, characterized in that, A sealing ring is provided at the bottom edge of the side wall panel.

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