Infrared chip heat dissipation structure

Abstract

This utility model discloses an infrared chip heat dissipation structure, relating to the field of heat dissipation structure technology. It includes: a shell and a top cover, an assembly groove, a second magnet, and a bracket. A first magnet is installed on the inner wall of the assembly groove. A sliding rod is movably installed on the inner wall of the sliding groove. A pressing block is installed at the bottom of the sliding rod. A slot is provided on the outer wall of the pressing block. A limiting post is installed on the inner wall of the slot. A sliding plate is mounted around the outer wall of the limiting post. A spring is installed on the inner wall of the slot. A hemispherical block is installed on the outer wall of the sliding plate. Two sets of hemispherical grooves are provided on the outer wall of the bracket. A linkage plate is installed on the top of the sliding rod. This utility model, through the installation of an assembly mechanism, allows the second magnet and the first magnet to attract each other, initially installing the top cover. Subsequently, by pushing the linkage plate, when the pressing block moves to the top of the top cover, the hemispherical block is engaged in the hemispherical groove, securely installing the top cover on the top of the shell. Installation and disassembly are very convenient and do not require bolts.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically to a heat dissipation structure for an infrared chip. Background Technology

[0002] In infrared chip heat dissipation, fans are a common and effective active cooling method, especially suitable for scenarios with high heat dissipation requirements or poor environmental ventilation. Fans accelerate the transfer and dissipation of heat on the chip surface by forcing airflow. When the fan is running, it blows the surrounding cool air toward the chip and at the same time exhausts the hot air generated by the chip, forming convection, thereby effectively reducing the chip temperature. Installing the fan directly near the chip allows the air blown by the fan to act directly on the chip surface, accelerating the dissipation of heat.

[0003] Patent document CN221730017U discloses a heat dissipation device, which includes: a main body, a cooling component, and a cooling auxiliary component. The main body has a first cavity inside, the cooling component is disposed in the first cavity, and the top of the main body has several cooling holes, all of which communicate with the first cavity. The cooling auxiliary component is installed on the main body and communicates with the first cavity. The cooling auxiliary component is used to provide cool air to the first cavity. In use, a laptop is placed at the cooling holes on the top of the main body, and the cooling component delivers the cool air provided by the cooling auxiliary component to the bottom of the laptop for cooling, thus solving the problem that existing cooling desks mainly rely on fans for cooling, resulting in poor cooling performance.

[0004] However, the heat dissipation device in the aforementioned published literature mainly addresses the problem that existing heat dissipation tables rely solely on fans for cooling, resulting in poor cooling performance and inconvenience in installing the top cover onto the outer casing.

[0005] In view of this, it is necessary to develop an assembly mechanism that will allow the top cover to be easily installed on the outer casing. Utility Model Content

[0006] The purpose of this invention is to provide an infrared chip heat dissipation structure to solve the technical problem mentioned in the background art of making the infrared chip heat dissipation structure easy to assemble.

[0007] To achieve the above objectives, this utility model provides the following technical solution: an infrared chip heat dissipation structure, comprising: a shell and a top cover, wherein the outer wall of the shell is provided with an assembly mechanism, the assembly mechanism being used to facilitate the installation of the top cover on the shell;

[0008] The assembly mechanism includes an assembly slot, a second magnet, and a bracket. The top of the outer shell has an assembly slot, and four sets of assembly slots are provided. A first magnet is installed on the inner wall of the assembly slot, and a second magnet is installed on the bottom of the top cover. The bracket is located on the outer wall of the outer shell, and the inner wall of the bracket has a sliding groove. A sliding rod is movably installed on the inner wall of the sliding groove. A pressing block is installed at the bottom of the sliding rod. A slot is provided on the outer wall of the pressing block. A limiting post is installed on the inner wall of the slot. A sliding plate is installed around the outer wall of the limiting post. A spring is installed on the inner wall of the slot, and one end of the spring extends to the outer wall of the sliding plate. A hemispherical block is installed on the outer wall of the sliding plate. The outer wall of the bracket has two sets of hemispherical grooves, and a linkage plate is installed on the top of the sliding rod.

[0009] Preferably, the top cover is located at the top of the outer shell, the inner wall of the top cover is provided with heat dissipation grooves, the inner wall of the outer shell is provided with flow grooves, and a cooling fan is installed on the inner wall of the outer shell.

[0010] Preferably, the bottom of the housing is provided with an adjustment mechanism, which is used to facilitate fine-tuning of the heat dissipation structure after installation.

[0011] Preferably, the adjustment mechanism includes an adjustment shell, a mounting plate, and a mounting groove, with the adjustment shell located at the bottom of the outer shell.

[0012] Preferably, an installation plate is installed at the bottom of the adjusting shell, and the inner wall of the installation plate is provided with an installation groove.

[0013] Preferably, a drive motor is installed on the inner wall of the adjusting shell, a threaded screw is installed at the output end of the drive motor, a threaded ring is installed around the outer wall of the threaded screw, and one end of the threaded ring is fixedly connected to the bottom of the shell.

[0014] Preferably, a limiting rod is installed on the inner wall of the adjusting shell, and one end of the limiting rod passes through the inside of the threaded ring.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This utility model features an assembly mechanism that facilitates the installation of the top cover onto the outer shell. Existing top covers are bolted to the outside of the shell, making disassembly cumbersome. Therefore, this design needs improvement. First, the top cover is moved from the side to the top of the shell, causing the second magnet to move into the assembly slot. The second magnet and the first magnet attract each other, thus initially installing the top cover. Then, the linkage plate is pushed, which moves two sets of sliding rods synchronously. There are four sets of sliding rods, and the bracket is fixedly connected to the outer wall of the shell, causing the extrusion block to move. At this time, the spring is under pressure. When the extrusion block moves to the top of the top cover, the hemispherical block is located on one side of the lower hemispherical groove. The spring then resets and pushes the sliding plate to move on the limiting post, thus locking the hemispherical block into the hemispherical groove and securing the top cover to the top of the shell. This improves the stability of the top cover and makes installation and disassembly very convenient, eliminating the need for bolts.

[0017] 2. This utility model features an adjustment mechanism that facilitates fine-tuning of the installed heat dissipation structure. Existing housings cannot be moved once installed in a designated position, making it impossible to fine-tune their position as needed. Therefore, this design needs improvement. First, the heat dissipation structure is installed in the designated position using bolts via a mounting plate and mounting slot. Then, the drive motor rotates the threaded screw, and the limiting rod limits the threaded ring. The threaded ring moves on the threaded screw, thus adjusting the position of the housing. This allows for fine-tuning of the housing's position as required. Simultaneously, the drive motor is connected to an external power source, and an external control terminal controls the operation of the drive motor. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the front structure of the outer shell of this utility model;

[0020] Figure 3 This is a schematic diagram of the front structure of the linkage plate of this utility model;

[0021] Figure 4 This is a schematic diagram of the front structure of the extrusion block of this utility model;

[0022] Figure 5 This is a schematic diagram of the side structure of the adjustment shell of this utility model.

[0023] In the diagram: 1. Outer shell; 2. Top cover; 3. Heat dissipation groove; 4. Cooling fan; 5. Flow groove; 6. Assembly groove; 7. First magnet; 8. Second magnet; 9. Bracket; 10. Slide groove; 11. Slide rod; 12. Extrusion block; 13. Slot; 14. Limiting post; 15. Sliding plate; 16. Spring; 17. Hemispherical block; 18. Hemispherical groove; 19. Linkage plate; 20. Adjustment shell; 21. Mounting plate; 22. Mounting groove; 23. Drive motor; 24. Threaded screw; 25. Threaded ring; 26. Limiting rod. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Please see Figure 1 and Figure 2An infrared chip heat dissipation structure includes: a housing 1 and a top cover 2. The top cover 2 is located on top of the housing 1. The inner wall of the top cover 2 is provided with a heat dissipation groove 3. The inner wall of the housing 1 is provided with a flow groove 5. A cooling fan 4 is installed on the inner wall of the housing 1. The housing 1 is installed on one side of the infrared chip, and the top cover 2 is installed on the top of the housing 1 by bolts, so that the heat dissipation groove 3 faces the infrared chip. The cooling fan 4 is connected to an external power supply, and the external control terminal controls the operation of the cooling fan 4, so that the infrared chip is cooled by blowing air through the heat dissipation groove 3.

[0028] Please see Figure 1 , Figure 3 and Figure 4 The outer wall of the outer shell 1 is provided with an assembly mechanism for facilitating the installation of the top cover 2 onto the outer shell 1. The assembly mechanism includes an assembly groove 6, a second magnet 8, and a bracket 9. The top of the outer shell 1 is provided with the assembly groove 6, and four sets of the assembly groove 6 are provided. The inner wall of the assembly groove 6 is equipped with a first magnet 7, and the bottom of the top cover 2 is equipped with a second magnet 8. The bracket 9 is located on the outer wall of the outer shell 1. The inner wall of the bracket 9 is provided with a sliding groove 10, and a sliding rod 11 is movably installed on the inner wall of the sliding groove 10. A pressing block 12 is installed at the bottom of the sliding rod 11. The outer wall of the pressing block 12 is provided with a slot 13, and a limiting post 14 is installed on the inner wall of the slot 13. A sliding plate 15 is installed around the outer wall of the limiting post 14. A spring 16 is installed on the inner wall of the slot 13, and one end of the spring 16 extends to the outer wall of the sliding plate 15. A hemispherical block 17 is installed on the outer wall of the sliding plate 15. The outer wall of the bracket 9 is provided with two sets of hemispherical grooves 18, and a linkage plate is installed on the top of the sliding rod 11. 19. The existing top cover 2 is installed on the outside of the outer shell 1 by bolts, which is very cumbersome to disassemble. Therefore, it needs to be improved. First, the top cover 2 is moved from the side to the top of the outer shell 1, so that the second magnet 8 moves into the assembly slot 6. The second magnet 8 and the first magnet 7 are attracted to each other, and the top cover 2 is initially installed. Then, the linkage plate 19 is pushed. The linkage plate 19 is used to move the two sets of sliding rods 11 synchronously. There are four sets of sliding rods 11. The bracket 9 is fixedly connected to the outer wall of the outer shell 1, so that the pressing block 12 moves. At this time, the spring 16 is in a compressed state. When the pressing block 12 moves to the top of the top cover 2, the hemispherical block 17 is located on one side of the lower hemispherical groove 18. Then the spring 16 returns to its original position and pushes the sliding plate 15 to move on the limiting post 14, so that the hemispherical block 17 is inserted into the hemispherical groove 18, and the top cover 2 is firmly installed on the top of the outer shell 1, thereby improving the stability of the top cover 2 and making the installation and disassembly very convenient without the need for bolts.

[0029] Please see Figure 1 and Figure 5The bottom of the outer casing 1 is provided with an adjustment mechanism for easy fine-tuning of the heat dissipation structure after installation. The adjustment mechanism includes an adjustment shell 20, a mounting plate 21, and a mounting groove 22. The adjustment shell 20 is located at the bottom of the outer casing 1, and the mounting plate 21 is installed at the bottom of the adjustment shell 20. The inner wall of the mounting plate 21 is provided with a mounting groove 22. A drive motor 23 is installed on the inner wall of the adjustment shell 20. A threaded screw 24 is installed at the output end of the drive motor 23. A threaded ring 25 is installed around the outer wall of the threaded screw 24, and one end of the threaded ring 25 is fixedly connected to the bottom of the outer casing 1. A limit rod 26 is installed on the inner wall of the adjustment shell 20, and one end of the limit rod 26 passes through... Since the existing housing 1 cannot be moved after being installed in the designated position, it is impossible to fine-tune the position of the housing 1 according to the requirements. Therefore, this needs to be improved. First, the heat dissipation structure is installed in the designated position by bolts through the mounting plate 21 and mounting groove 22. Then, the drive motor 23 drives the threaded screw 24 to rotate. The limit rod 26 limits the threaded ring 25, so the threaded ring 25 moves on the threaded screw 24, which drives the housing 1 to adjust its position. This makes it easy to fine-tune the position of the housing 1 according to the requirements. At the same time, the drive motor 23 is connected to the external power supply, and the external control terminal controls the operation of the drive motor 23.

[0030] The working principle is as follows: The outer casing 1 is installed on one side of the infrared chip, and the top cover 2 is bolted to the top of the outer casing 1, so that the heat sink 3 faces the infrared chip. The cooling fan 4 is connected to an external power supply, and the external control terminal controls the operation of the cooling fan 4, which then blows air to cool the infrared chip through the heat sink 3. The existing top cover 2 is bolted to the outside of the outer casing 1, making disassembly very cumbersome. Therefore, this needs to be improved. First, the top cover 2 is moved from the side to the top of the outer casing 1, causing the second magnet 8 to move into the assembly slot 6, so that the second magnet 8 and the first magnet 7 attract each other, thus initially installing the top cover 2. Then, the linkage plate 19 is pushed. The linkage plate 19 is used to move two sets of sliding rods 11 synchronously, and there are four sets of sliding rods 11. The bracket 9 is fixedly connected to the outer wall of the outer casing 1, causing the pressing block 12 to move. At this time, the spring 16 is under pressure. When the pressing block 12 moves to the top of the top cover 2, the hemispherical block 1... When 7 is located on one side of the lower hemispherical groove 18, the spring 16 resets and pushes the sliding plate 15 to move on the limiting post 14, thus locking the hemispherical block 17 into the hemispherical groove 18, and firmly installing the top cover 2 on the top of the outer shell 1, thereby improving the stability of the top cover 2 and making installation and removal very convenient without the need for bolts. The existing outer shell 1 cannot be moved after being installed in the designated position, so it is impossible to fine-tune the position of the outer shell 1 according to the needs. Therefore, this needs to be improved. First, the heat dissipation structure is installed in the designated position by bolts through the mounting plate 21 and the mounting groove 22. Then, the drive motor 23 works to drive the threaded screw 24 to rotate. The limiting rod 26 limits the threaded ring 25, so the threaded ring 25 moves on the threaded screw 24, thereby driving the outer shell 1 to adjust its position, which is convenient for fine-tuning the position of the outer shell 1 according to the needs. At the same time, the drive motor 23 is connected to the external power supply, and the external control terminal controls the drive motor 23 to work.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A heat dissipation structure for an infrared chip, characterized in that, Includes: a shell (1) and a top cover (2), wherein the outer wall of the shell (1) is provided with an assembly mechanism for facilitating the installation of the top cover (2) on the shell (1); The assembly mechanism includes an assembly slot (6), a second magnet (8), and a bracket (9). The top of the outer shell (1) is provided with an assembly slot (6), and four sets of assembly slots (6) are provided. The inner wall of the assembly slot (6) is equipped with a first magnet (7), and the bottom of the top cover (2) is equipped with a second magnet (8). The bracket (9) is located on the outer wall of the outer shell (1). The inner wall of the bracket (9) is provided with a sliding groove (10). A sliding rod (11) is movably installed on the inner wall of the sliding groove (10). A pressing block (1) is installed at the bottom of the sliding rod (11). 2) The outer wall of the extrusion block (12) is provided with a slot (13), the inner wall of the slot (13) is installed with a limiting post (14), the outer wall of the limiting post (14) is surrounded by a sliding plate (15), the inner wall of the slot (13) is installed with a spring (16), and one end of the spring (16) extends to the outer wall of the sliding plate (15). The outer wall of the sliding plate (15) is installed with a hemispherical block (17), the outer wall of the bracket (9) is provided with two sets of hemispherical grooves (18), and the top of the slide rod (11) is installed with a linkage plate (19).

2. The infrared chip heat dissipation structure according to claim 1, characterized in that: The top cover (2) is located on the top of the outer shell (1). The inner wall of the top cover (2) is provided with a heat dissipation groove (3), the inner wall of the outer shell (1) is provided with a flow groove (5), and a cooling fan (4) is installed on the inner wall of the outer shell (1).

3. The infrared chip heat dissipation structure according to claim 1, characterized in that: The bottom of the outer casing (1) is provided with an adjustment mechanism, which is used to facilitate fine-tuning of the heat dissipation structure after installation.

4. The infrared chip heat dissipation structure according to claim 3, characterized in that: The adjustment mechanism includes an adjustment shell (20), a mounting plate (21), and a mounting groove (22), with the adjustment shell (20) located at the bottom of the outer shell (1).

5. The infrared chip heat dissipation structure according to claim 4, characterized in that: The bottom of the adjusting shell (20) is equipped with an installation plate (21), and the inner wall of the installation plate (21) is provided with an installation groove (22).

6. The infrared chip heat dissipation structure according to claim 4, characterized in that: The inner wall of the regulating shell (20) is equipped with a drive motor (23), the output end of the drive motor (23) is equipped with a threaded screw (24), the outer wall of the threaded screw (24) is surrounded by a threaded ring (25), and one end of the threaded ring (25) is fixedly connected to the bottom of the outer shell (1).

7. The infrared chip heat dissipation structure according to claim 6, characterized in that: The inner wall of the adjusting shell (20) is fitted with a limiting rod (26), and one end of the limiting rod (26) passes through the inside of the threaded ring (25).

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