Light-emitting substrate and display device

Abstract

This application provides a light-emitting substrate and a display device. The light-emitting substrate includes a substrate, a plurality of light-emitting units, and a heat exchange channel. The plurality of light-emitting units are spaced apart and arranged on one side of the substrate. The heat exchange channel is located on the same side of the substrate as the light-emitting units, and includes a plurality of interconnected sub-heat exchange channels spaced apart on the substrate. At least one sub-heat exchange channel is located between adjacent light-emitting units. The heat exchange channel has a fluid inlet and a fluid outlet. This improves the heat dissipation efficiency of the display device.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a light-emitting substrate and a display device. Background Technology

[0002] As pixel sizes in display devices become smaller and pixel densities increase, the heat generated by the light-emitting units in the display devices becomes difficult to dissipate, causing the device temperature to become too high and its lifespan to decrease. Utility Model Content

[0003] This application addresses the shortcomings of related technologies by proposing a light-emitting substrate and a display device to solve the problem of heat dissipation in display devices in related technologies.

[0004] This application provides a light-emitting substrate, including:

[0005] Substrate;

[0006] Multiple light-emitting units are arranged at intervals on one side of the substrate;

[0007] A heat exchange channel is located on the same side of the substrate as the light-emitting unit. The heat exchange channel includes a plurality of interconnected sub-heat exchange channels arranged at intervals on the substrate, and at least one of the sub-heat exchange channels is located between adjacent light-emitting units. The heat exchange channel is provided with a fluid inlet and a fluid outlet.

[0008] In some embodiments, the distance from the surface of the heat exchange channel away from the substrate to the substrate is less than or equal to the distance from the surface of the light-emitting unit away from the substrate to the substrate; and / or,

[0009] The distance from the surface of the heat exchange channel facing the substrate to the substrate is greater than or equal to the distance from the surface of the light-emitting unit facing the substrate to the substrate.

[0010] In some embodiments, the light-emitting unit includes a first electrode, a semiconductor layer, and a second electrode sequentially stacked on the substrate, with each of the second electrodes connected to form a surface electrode, the surface electrode being located on the side of the heat exchange channel away from the substrate.

[0011] In some embodiments, the light-emitting substrate further includes a plurality of enclosure portions, each enclosure portion forming the sub-heat exchange channel; each enclosure portion includes two opposing sidewalls, a bottom wall located on the side of the two sidewalls facing the substrate and connected to the sidewalls, and a top wall located on the side of the two sidewalls away from the substrate and connected to the sidewalls; the surface of the top wall away from the substrate is flush with the surface of the semiconductor layer away from the substrate.

[0012] In some embodiments, the sidewalls of the enclosure are made of a light-absorbing material or a reflective material.

[0013] In some embodiments, the sidewalls of the enclosure are made of a metallic material, and the light-emitting substrate further includes an insulating layer disposed between the enclosure and the adjacent light-emitting unit.

[0014] In some embodiments, the sidewalls and bottom wall of the enclosure are integral structures.

[0015] In some embodiments, the plurality of light-emitting units are arranged in multiple columns, and at least some of the sub-heat exchange channels are located between two adjacent columns of light-emitting units; the heat exchange channel further includes a plurality of connecting channels, each of the connecting channels connecting two adjacent sub-heat exchange channels; two connecting channels connected to the same sub-heat exchange channel are respectively located on opposite sides of the sub-heat exchange channel in the column direction.

[0016] In some embodiments, the width of the heat exchange channel in a first direction ranges from 1 to 30 micrometers, wherein the first direction is parallel to the surface of the substrate facing the light-emitting unit, and the first direction is parallel to the radial cross-section of the heat exchange channel.

[0017] This application also provides a display device, including the light-emitting substrate as described above.

[0018] The beneficial effects of this application include:

[0019] In this application, heat exchange channels are provided in the interval areas between multiple light-emitting units. The light-emitting units and heat exchange channels are arranged adjacent to each other, allowing direct heat exchange with the heat exchange fluid within the channels. Compared to placing the heat exchange channels above or below the light-emitting units or within the substrate, this reduces thermal resistance and improves heat exchange efficiency. Furthermore, directly placing the heat exchange channels within the interval areas of the light-emitting units eliminates the need for additional space, improving the overall space utilization of the light-emitting substrate. When the heat from the light-emitting units needs to be dissipated, cooling fluid can be introduced into the heat exchange channels. The cooling fluid flows in from the fluid inlet, passes through each sub-heat exchange channel, and then flows out from the fluid outlet, further improving the heat dissipation efficiency of the light-emitting substrate.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] Figure 1 The diagram shown is a top view of the light-emitting substrate provided in an exemplary embodiment of this application.

[0023] Figure 2 The image shown is an exemplary embodiment of this application. Figure 1 A schematic diagram of a cross-section cut along section line AA.

[0024] Figure 3 The diagram shown is a top view of the light-emitting substrate provided in another exemplary embodiment of this application.

[0025] Figures 4a to 4i The diagram shows the structural steps of a method for preparing a light-emitting substrate according to an exemplary embodiment of this application.

[0026] In the figure: 10-substrate; 20-light-emitting unit; 21-first electrode; 22-semiconductor layer; 23-second electrode (surface electrode); 30-heat exchange channel; 31-sub-heat exchange channel; 32-connection channel; 33-fluid inlet; 34-fluid outlet; 310-enclosing portion; 311, 312-sidewalls; 313-bottom wall; 314-top wall; 40-insulating layer; 50-protective layer; 60-filling layer; 70-sacrificial layer. Detailed Implementation

[0027] The light-emitting substrate and display device in the embodiments of this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments may complement or combine with each other.

[0028] This application provides a light-emitting substrate, such as... Figure 1 and Figure 2 As shown, where Figure 1 This is a top view of a portion of the film layer of the light-emitting substrate provided in this embodiment; Figure 2 As shown Figure 1 A cross-sectional schematic diagram of an exemplary embodiment, cut along section line AA. The light-emitting substrate includes a substrate 10, a plurality of light-emitting units 20, and a heat exchange channel 30. The plurality of light-emitting units 20 are spaced apart and arranged on one side of the substrate 10; the heat exchange channel 30 is located on the same side of the substrate 10 as the light-emitting units 20, and the heat exchange channel 30 includes a plurality of interconnected sub-heat exchange channels 31 spaced apart on the substrate 10, at least one sub-heat exchange channel 31 being located between adjacent light-emitting units 20; the heat exchange channel 30 is provided with a fluid inlet 33 and a fluid outlet 34.

[0029] In this application, heat exchange channels 30 are provided in the interval areas between multiple light-emitting units 20. The light-emitting units 20 and the heat exchange channels 30 are arranged adjacent to each other, allowing direct heat exchange with the heat exchange fluid within the heat exchange channels 30. Compared to placing the heat exchange channels 30 above or below the light-emitting units 20 or within the substrate 10, this reduces thermal resistance and improves heat exchange efficiency. Furthermore, directly placing the heat exchange channels 30 within the interval areas of the light-emitting units 20 eliminates the need for additional space, improving the overall space utilization of the light-emitting substrate. When the heat from the light-emitting units 20 needs to be dissipated, cooling fluid can be introduced into the heat exchange channels 30. The cooling fluid flows in from the fluid inlet 33, passes through each sub-heat exchange channel 31, and then flows out from the fluid outlet 34, which helps improve the heat dissipation efficiency of the light-emitting substrate.

[0030] Furthermore, when the light-emitting unit 20 is in an extreme low-temperature environment, it is advisable to introduce warm fluid or antifreeze into the heat exchange channel 30 to improve the adaptability of the light-emitting substrate to normal operation in extreme low-temperature environments.

[0031] In some embodiments, the heat exchange fluid can be a gas, a liquid, or a solid-liquid mixture. Further, the heat exchange fluid can be air, liquid water, an ice-water mixture, ethylene glycol, propylene glycol, oil, liquid metal, nanofluids, etc.

[0032] In some embodiments, the distance from the surface of the heat exchange channel 30 away from the substrate 10 to the substrate 10 is less than or equal to the distance from the surface of the light-emitting unit 20 away from the substrate 10 to the substrate 10. This avoids increasing the overall thickness of the light-emitting substrate due to the addition of the heat exchange channel 30, which is beneficial for making the light-emitting substrate thinner. In one example, the light-emitting unit 20 includes a first electrode 21, a semiconductor layer 22, and a second electrode 23 sequentially stacked on the substrate 10, such as... Figure 2 As shown, the distance from the surface of the heat exchange channel 30 away from the substrate 10 to the substrate 10 is d1, and the distance from the surface of the light-emitting unit 20 away from the substrate 10 to the substrate 10 is d2, where d1 is less than d2.

[0033] In some embodiments, the distance from the surface of the heat exchange channel 30 facing the substrate 10 to the substrate 10 is greater than or equal to the distance from the surface of the light-emitting unit 20 facing the substrate 10 to the substrate 10. Similarly to the aforementioned embodiments, this avoids the heat exchange channel 30 occupying an area in the substrate 10, thereby improving the overall space utilization of the device. In one example, the light-emitting unit 20 includes a first electrode 21, a semiconductor layer 22, and a second electrode 23 sequentially stacked on the substrate 10, such as... Figure 2As shown, the distance from the surface of the heat exchange channel 30 facing the substrate 10 to the substrate 10 is greater than the distance from the surface of the light-emitting unit 20 facing the substrate 10 to the substrate 10. The distance from the surface of the heat exchange channel 30 facing the substrate 10 to the side surface of the substrate 10 facing the light-emitting unit 20 is equal to 0. The distance from the surface of the light-emitting unit 20 facing the substrate 10 to the side surface of the substrate 10 facing the light-emitting unit 20 is the negative value of the height d3 of the first electrode 21 in the direction from the substrate 10 to the light-emitting unit 20.

[0034] In some embodiments, such as Figure 2 As shown, the light-emitting unit 20 includes a first electrode 21, a semiconductor layer 22, and a second electrode 23 sequentially stacked on the substrate 10. The second electrodes 23 are connected to form a surface electrode 23, which is located on the side of the heat exchange channel 30 away from the substrate 10. Connecting the second electrodes 23 of each light-emitting unit 20 to form the surface electrode 23 provides a unified voltage reference, thereby simplifying the driving circuit design, reducing power consumption, and improving brightness uniformity.

[0035] In some embodiments, the light-emitting unit 20 is a Micro LED, a mini LED, or an OLED.

[0036] In some embodiments, such as Figure 2 As shown, the light-emitting substrate also includes a plurality of enclosure portions 310, each enclosure portion 310 enclosing to form a heat exchange channel 31; each enclosure portion 310 includes two opposing sidewalls 311, 312, a bottom wall 313 located on the side of the two sidewalls 311, 312 facing the substrate 10 and connected to the sidewalls 311, 312, and a top wall 314 located on the side of the two sidewalls 311, 312 away from the substrate 10 and connected to the sidewalls 311, 312; the surface of the top wall 314 away from the substrate 10 is flush with the surface of the semiconductor layer 22 away from the substrate 10.

[0037] In this embodiment, the top wall 314 of the enclosure portion 310 is flush with the surface of the semiconductor layer 22 away from the substrate 10. This ensures that when the second electrode 23 is formed on the side of the semiconductor layer 22 away from the substrate 10, the surface used to lay the second electrode 23 is flat. The second electrode 23 can remain relatively flat, avoiding the risk of open circuit caused by step differences between different parts of the second electrode 23. This can further improve the working stability of the light-emitting substrate and the device yield.

[0038] In some embodiments, the sidewalls 311 and 312 of the enclosure 310 are made of light-absorbing or reflective materials. When the sidewalls 311 and 312 of the enclosure 310 are made of light-absorbing materials, light crosstalk between adjacent light-emitting units 20 can be further avoided. When the sidewalls 311 and 312 of the enclosure 310 are made of reflective materials, light utilization can be improved while avoiding light crosstalk. In one example, the material of the enclosure 310 can be a light-absorbing photoresist material, a light-absorbing resin material, or a metal. Further, the material of the enclosure 310 can be gold (Au), aluminum (Al), copper (Cu), or silver (Ag), etc.

[0039] In some embodiments, such as Figure 2 As shown, the sidewalls 311 and 312 of the enclosure 310 are made of metal. The light-emitting substrate also includes an insulating layer 40, which is disposed between the enclosure 310 and the adjacent light-emitting unit 20. In this embodiment, the sidewalls 311 and 312 of the enclosure 310 are made of metal, which can improve light utilization while avoiding light crosstalk. The sidewalls 311 and 312 of the enclosure 310 can be made of gold (Au), aluminum (Al), copper (Cu), or silver (Ag), etc. In order to ensure electrical insulation between the enclosure 310 and the light-emitting unit 20, an insulating layer 40 can be provided between the enclosure 310 and the adjacent light-emitting unit 20. Further, the insulating layer 40 can be made of silicon oxide, silicon nitride, or aluminum oxide, etc.

[0040] In some embodiments, the sidewalls 311, 312 and bottom wall 313 of the enclosure 310 are an integral structure. This further improves the sealing of the heat exchange channel 30 and prevents leakage of the heat exchange fluid.

[0041] In some embodiments, the bottom wall 313 of the enclosure 310 is made of the same material as the side walls 311 and 312. In some embodiments, the bottom wall 313 of the enclosure 310 may be made of gold (Au), aluminum (Al), copper (Cu), or silver (Ag), etc.

[0042] In some embodiments, when the sidewalls 311 and 312 of the heat exchange channel 30 are made of metal, the top wall 314 of the enclosure 310 is made of an insulating material to ensure insulation between the surface electrode 23 and the sidewalls 311 and 312 of the heat exchange channel 30 when the surface electrode 23 covers the heat exchange channel 30. The top wall 314 of the enclosure 310 can be made of silicon oxide, silicon nitride, aluminum oxide, etc.

[0043] In some embodiments, such as Figure 1 or Figure 3As shown, multiple light-emitting units 20 are arranged in multiple columns, and at least some sub-heat exchange channels 31 are located between two adjacent columns of light-emitting units 20; the heat exchange channel 30 also includes multiple connecting channels 32, each connecting channel 32 connecting two adjacent sub-heat exchange channels 31; the two connecting channels 32 connected to the same sub-heat exchange channel 31 are located on opposite sides of the sub-heat exchange channel 31 in the column direction.

[0044] In this embodiment, the heat exchange channel 30 can be formed by connecting the sub-heat exchange channels 31 through the connecting channel 32. Furthermore, by setting the fluid inlet 33 and the fluid outlet 34, the heat exchange fluid can gradually flow through the interval area of ​​the light-emitting units 20 distributed on the light-emitting substrate, so as to improve the heat exchange uniformity and heat exchange efficiency of each light-emitting unit 20.

[0045] In one example, such as Figure 1 As shown, the heat exchange channel 30 includes a first sub-heat exchange channel 31a, a second sub-heat exchange channel 31b, and a third sub-heat exchange channel 31c arranged sequentially. Two connecting channels 32 connected to the second sub-heat exchange channel 31b are respectively the first connecting channel 32a and the second connecting channel 32b. The first connecting channel 32a is located on the side of the second sub-heat exchange channel 31b facing the first sub-heat exchange channel 31a, and the second connecting channel 32b is located on the side of the second sub-heat exchange channel 31b facing the third sub-heat exchange channel 31c. That is, in this embodiment, the heat exchange channel 30 is arranged in a serpentine pattern, which allows the heat exchange channel 30 to contact as many light-emitting units 20 as possible on the light-emitting substrate while forming a single flow channel, enabling sufficient heat exchange between the heat exchange fluid and the light-emitting units 20.

[0046] In another example, such as Figure 3 As shown, the heat exchange channel 30 includes a first sub-heat exchange channel 31a, a second sub-heat exchange channel 31b, and a third sub-heat exchange channel 31c arranged sequentially. The two connecting channels 32 connected to the second sub-heat exchange channel 31b are the first connecting channel 32a and the second connecting channel 32b, respectively. Both the first connecting channel 32a and the second connecting channel 32b are located on the side of the second sub-heat exchange channel 31b facing the first sub-heat exchange channel 31a. The two connecting channels 32 connected to the third sub-heat exchange channel 31c are the third connecting channel 32c and the fourth connecting channel 32d, respectively. Both the third connecting channel 32c and the fourth connecting channel 32d are located on the side of the third sub-heat exchange channel 31c facing the second sub-heat exchange channel 31b. That is, multiple flow channels can be formed in this embodiment. When heat exchange fluid is introduced into the heat exchange channel 30, the heat exchange fluid can flow along different flow paths simultaneously, which can further accelerate the heat exchange rate and further improve the heat exchange rate.

[0047] In some embodiments, such as Figure 2As shown, the width w of the heat exchange channel 30 in the first direction ranges from 1 to 30 micrometers. This first direction is parallel to the surface of the substrate 10 facing the light-emitting unit 20 and is also parallel to the radial cross-section of the heat exchange channel 30. In some examples, the width w of the heat exchange channel 30 in the direction parallel to both the surface of the substrate 10 facing the light-emitting unit 20 and the radial cross-section of the heat exchange channel 30 can be 1 micrometer, 5 micrometers, 10 micrometers, 20 micrometers, or 30 micrometers. The specific design can be tailored to the specific circumstances.

[0048] This application also provides a display device, which includes the light-emitting substrate of any of the above embodiments.

[0049] In some embodiments, the display device may be a liquid crystal display device, which includes a liquid crystal panel and a backlight disposed on the non-display side of the liquid crystal panel, the backlight including the light-emitting substrate described above.

[0050] In another embodiment, the light-emitting substrate in the display device is used as a display substrate. When the light-emitting substrate is used as a display substrate, each light-emitting chip is a sub-pixel.

[0051] For ease of understanding, this application also provides a method for preparing a light-emitting substrate, applied to the light-emitting substrate provided in the foregoing embodiments, comprising the following steps:

[0052] Step 100: As Figure 4c As shown, a filling layer 60 is formed between the semiconductor layers 22 of each light-emitting unit 20;

[0053] Step 200: As Figure 4d As shown, the filling layer 60 is patterned to form the bottom wall 313 and side walls 311, 312 of the enclosure portion 310;

[0054] Step 300: As Figure 4e As shown, a sacrificial layer 70 is filled in the groove formed by the bottom wall 313 and the side walls 311 and 312 of the enclosure portion 310;

[0055] Step 400: As Figure 4f As shown, a top wall 314 of the enclosure 310 is formed on the sidewalls 311 and 312 of the enclosure 310 and on the side of the sacrificial layer 70 away from the substrate 10.

[0056] Step 500: As Figure 4g As shown, a second electrode 23 is formed on the top wall 314 of the enclosure portion 310 and on the side of the semiconductor layer 22 away from the substrate 10.

[0057] Step 600: As Figure 4h As shown, a protective layer 50 is formed on the side of the second electrode 23 away from the substrate 10;

[0058] Step 700: As Figure 4i As shown, a sacrificial layer etchant is applied to the light-emitting substrate to remove the sacrificial layer 70. The space enclosed by the bottom wall 313 of the enclosure portion 310, the two opposing side walls 311 and 312, and the top wall 314 forms a heat exchange channel 30.

[0059] In this embodiment, a three-dimensional heat transfer channel 30 can be formed using the sacrificial layer 70. Compared with the fabrication methods in related technologies that form heat transfer channels in a substrate, the fabrication method of this application is simpler, easier to operate, and lower in cost.

[0060] In some embodiments, the sacrificial layer 70 may be made of a photoresist material. The sacrificial layer etchant may be made of a photoresist etchant.

[0061] In some embodiments, step 700 can be achieved by immersing the light-emitting substrate in a sacrificial layer etching solution to remove the sacrificial layer 70.

[0062] In some embodiments, when the sidewalls 311 and 312 of the enclosure 310 are made of metal, the process before step 100 further includes:

[0063] Step 101: As Figure 4a As shown, a first electrode 21 and a semiconductor layer 22 of each light-emitting unit 20 are formed on the substrate 10;

[0064] Step 102: As Figure 4b As shown, an insulating layer 40 is formed on the sidewalls 311, 312 of the semiconductor layer 22 of each light-emitting unit 20.

[0065] In this embodiment, the insulating layer 40 in step 102 can isolate the semiconductor layer 22 and the sidewalls 311 and 312 of the enclosure portion 310, thus preventing electrical connection between the two.

[0066] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

Claims

1. A light-emitting substrate, characterized in that, include: Substrate; Multiple light-emitting units are arranged at intervals on one side of the substrate; A heat exchange channel is located on the same side of the substrate as the light-emitting unit. The heat exchange channel includes a plurality of interconnected sub-heat exchange channels arranged at intervals on the substrate, and at least one of the sub-heat exchange channels is located between adjacent light-emitting units. The heat exchange channel is provided with a fluid inlet and a fluid outlet.

2. The light-emitting substrate according to claim 1, characterized in that, The distance from the surface of the heat exchange channel away from the substrate to the substrate is less than or equal to the distance from the surface of the light-emitting unit away from the substrate to the substrate; and / or, The distance from the surface of the heat exchange channel facing the substrate to the substrate is greater than or equal to the distance from the surface of the light-emitting unit facing the substrate to the substrate.

3. The light-emitting substrate according to claim 1, characterized in that, The light-emitting unit includes a first electrode, a semiconductor layer, and a second electrode sequentially stacked on the substrate. Each of the second electrodes is connected to form a surface electrode, which is located on the side of the heat exchange channel away from the substrate.

4. The light-emitting substrate according to claim 3, characterized in that, The light-emitting substrate further includes a plurality of enclosure portions, each enclosure portion forming the sub-heat exchange channel; each enclosure portion includes two opposing sidewalls, a bottom wall located on the side of the two sidewalls facing the substrate and connected to the sidewalls, and a top wall located on the side of the two sidewalls away from the substrate and connected to the sidewalls; the surface of the top wall away from the substrate is flush with the surface of the semiconductor layer away from the substrate.

5. The light-emitting substrate according to claim 4, characterized in that, The sidewalls of the enclosure are made of light-absorbing or reflective materials.

6. The light-emitting substrate according to claim 4, characterized in that, The sidewalls of the enclosure are made of metal, and the light-emitting substrate also includes an insulating layer, which is disposed between the enclosure and the adjacent light-emitting unit.

7. The light-emitting substrate according to claim 4, characterized in that, The side walls and bottom walls of the enclosure are an integral structure.

8. The light-emitting substrate according to claim 1, characterized in that, The plurality of light-emitting units are arranged in multiple columns, and at least some of the sub-heat exchange channels are located between two adjacent columns of light-emitting units; the heat exchange channel also includes a plurality of connecting channels, each of the connecting channels connecting two adjacent sub-heat exchange channels; the two connecting channels connected to the same sub-heat exchange channel are respectively located on opposite sides of the sub-heat exchange channel in the column direction.

9. The light-emitting substrate according to claim 1, characterized in that, The width of the heat exchange channel in the first direction ranges from 1 to 30 micrometers, wherein the first direction is parallel to the surface of the substrate facing the light-emitting unit, and the first direction is parallel to the radial cross-section of the heat exchange channel.

10. A display device, characterized in that, Includes the light-emitting substrate as described in any one of claims 1 to 9.

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