LED chip cooling device

Abstract

This utility model discloses an LED chip cooling device, relating to the field of chip cooling technology. It includes a support plate with two fixing buckles hinged to the top surface of the support plate on both sides of the chip. A heat transfer plate is mounted on the bottom surface of each fixing buckle. A fixing plate is hinged to one end of the top surface of one of the two fixing buckles. A heat dissipation component is provided on one side of the support plate. This utility model facilitates the rapid transfer of heat generated by the chip to the heat transfer plate through the contact between the fixing buckles and the heat transfer plate, improving heat conduction efficiency and achieving efficient heat absorption. Furthermore, the parallel connection between the heat transfer plate and the heat transfer pipe, and between the heat transfer tank and the second connecting pipe, facilitates the dispersion of heat to the cooling tank, improving the speed and uniformity of heat transfer. Ultimately, this solves the problems of existing passive cooling methods failing to meet the heat dissipation requirements of high-power LED chips, as well as the inconvenience of large tower-style cooling and chip-mounted fan structures being inconvenient for internal placement.

Description

Technical Field

[0001] This utility model relates to the field of chip cooling technology, and in particular to an LED chip cooling device. Background Technology

[0002] LED chips generate a significant amount of heat during operation. If this heat cannot be dissipated in time, the chip temperature will rise, affecting its luminous efficiency, lifespan, and stability. Passive cooling is a common method in existing LED chip cooling devices, which typically involves directly attaching heat sinks to the chip surface and relying on natural convection between the fins and the air to dissipate heat. However, as the performance of LED chips continues to improve, their power density gradually increases, resulting in a significant increase in the amount of heat generated during operation. Passive cooling, relying solely on heat conduction and natural convection, is no longer sufficient to quickly remove the large amount of heat, causing the chip temperature to rise continuously. This severely impacts the luminous efficiency and lifespan, failing to meet the heat dissipation requirements of high-power LED chips.

[0003] To address this issue, some existing devices employ tower-style cooling or active cooling methods such as installing cooling fans on the LED chips. However, tower-style cooling structures are bulky and require significant space, making them unsuitable for devices with limited internal space. Similarly, directly mounting the cooling fans on the LED chips also results in a large structural size, making it inconvenient to place within miniaturized, integrated LED devices. Furthermore, the connection between the fan and the chip is often complex, leading to inconvenient installation and maintenance. Additionally, the fan may generate vibration and noise during operation, affecting the stability of the device and the user experience. Therefore, improvements are needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an LED chip cooling device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an LED chip cooling device, comprising a support plate, wherein two fixing buckles are mirror-hinged on the top surface of the support plate on both sides of the chip, and a heat transfer plate is abutted against the bottom surface of the fixing buckles; a fixing plate is hinged at one end of the top surface of one of the two fixing buckles; and a heat dissipation component is provided on one side of the support plate.

[0006] Preferably, an internally threaded cylinder is fixedly connected to the center of the top surface of the temperature transfer plate, and an externally threaded connector is internally threaded to the internally threaded cylinder. A temperature transfer pipe is fixedly connected to one end of the externally threaded connector, and a cooling tank is connected and fixedly connected to one end of the temperature transfer pipe.

[0007] Preferably, the heat dissipation assembly includes multiple heat dissipation pipes evenly arranged inside the cooling tank. A through hole is opened on the outer wall of one end face of the cooling tank, which connects to the inner wall. An installation cylinder is fixedly connected to the through hole, and a miniature axial flow fan is installed inside the installation cylinder.

[0008] Preferably, two fixing grooves are symmetrically opened on both sides of the top surface of the heat transfer plate, one end of the fixing buckle is inserted into the fixing groove, the outer wall of the cooling tank is fixedly provided with mounting seats on both sides, and one end of the heat transfer pipe is connected to multiple heat dissipation pipes.

[0009] Preferably, a fixing hole is provided at the end of the top surface of the fixing plate away from the hinge axis, and a corresponding mating pin hole is provided on the top surface of the other fixing buckle of the two fixing buckles, and a fixing pin is inserted between the fixing hole and the mating pin hole.

[0010] Preferably, a lower heat transfer plate is attached to the bottom surface of the support plate, and a heat transfer tank is connected to one side of the outer wall of the lower heat transfer plate. A connecting pipe opening is opened on the top surface of the heat transfer tank, and a second connecting pipe is inserted into the connecting pipe opening in parallel with one end of the heat transfer pipe.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: The connection between the fixing buckle and the upper heating plate facilitates the rapid transfer of heat generated by the chip to the upper heating plate, improving heat conduction efficiency and enabling efficient heat absorption. Furthermore, the parallel connection between the upper heating plate and the heat transfer pipe, and between the heat transfer tank and the second connecting pipe, facilitates the dispersion of heat to the cooling tank, improving the speed and uniformity of heat transfer and enabling multi-path heat dissipation. The combination of multiple heat dissipation pipes and a micro axial flow fan within the cooling tank accelerates airflow, improving the heat dissipation efficiency of the heat dissipation components and enabling efficient heat dissipation. The hinged connection between the fixing buckle and the fixing plate, along with the through-hole connection of the fixing pin, facilitates quick installation and disassembly of the upper heating plate, improving operational convenience and enabling chip maintenance. Ultimately, this invention solves the problems of existing passive cooling methods failing to meet the heat dissipation requirements of high-power LED chips, and the problems of tower-style heat dissipation and chip-mounted fan structures being too large for internal placement, thus improving the efficiency, adaptability, and ease of maintenance of LED chip cooling. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0013] Figure 1 This is a first-view schematic diagram of the overall structure proposed in this utility model;

[0014] Figure 2This is a first-view schematic diagram of the overall cross-sectional structure proposed in this utility model;

[0015] Figure 3 This is a first-view schematic diagram of the overall structure for removing the fixing buckle proposed in this utility model;

[0016] Figure 4 This is a schematic diagram of the overall structure of the lower temperature transfer plate proposed in this utility model.

[0017] The numbers in the diagram are: 1. Support plate; 2. Fixing buckle; 3. Fixing plate; 4. Temperature transfer pipe; 5. Upper temperature transfer plate; 6. Cooling tank; 7. Fixing groove; 8. Internal threaded cylinder; 9. Connecting pipe port; 10. Temperature transfer tank; 11. Second connecting pipe; 12. Lower temperature transfer plate; 13. Heat dissipation pipe; 14. Miniature axial flow fan. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Example: See Figure 1-4 This utility model discloses an LED chip cooling device, comprising a support plate 1. Two fixing buckles 2 are mirror-hinged on the top surface of the support plate 1 on both sides of the chip. A heat transfer plate 5 is mounted on the bottom surface of each fixing buckle 2. A fixing plate 3 is hinged to one end of the top surface of one of the fixing buckles 2. A heat dissipation component is provided on one side of the support plate 1. The support plate 1 is made of aluminum alloy, which has good thermal conductivity and is lightweight. The fixing buckles 2 are made of spring steel, which has good elasticity and corrosion resistance. The cooperation between the fixing buckles 2 and the fixing plate 3 facilitates quick and easy fixing of the heat transfer plate 5, improving installation efficiency and achieving a tight connection between the chip and the heat dissipation structure, ensuring effective heat conduction. An internally threaded cylinder 8 is fixedly connected to the center of the top surface of the heat transfer plate 5. An externally threaded connector is internally threaded into the internally threaded cylinder 8, and a heat transfer pipe 4 is fixedly connected to one end of the externally threaded connector. One end of the heat transfer pipe 4 is connected to and fixedly connected to a cooling tank 6; a semiconductor cooling chip is installed on the inner wall of the cooling tank 6; the heat transfer plate 5 is made of copper alloy with high thermal conductivity; the heat transfer pipe 4 is a stainless steel corrugated pipe, which is resistant to high temperature and has good flexibility; the threaded connection between the internal threaded cylinder 8 and the external threaded joint facilitates the installation and disassembly of the heat transfer pipe 4, improves maintenance convenience, and thus achieves efficient heat transfer; the heat dissipation component includes multiple heat dissipation pipes 13 evenly arranged inside the cooling tank 6, and a through hole is opened on the outer wall of one end face of the cooling tank 6 connecting to the inner wall, and an installation cylinder is fixedly connected at the through hole, and a miniature axial flow fan 14 is installed inside the installation cylinder; the heat dissipation pipes 13 are made of aluminum alloy finned tubes with a large heat dissipation area; the cooperation between the multiple heat dissipation pipes 13 and the miniature axial flow fan 14 facilitates the acceleration of airflow, improves heat dissipation efficiency, and thus achieves the function of rapid cooling.

[0020] In this utility model, two fixing grooves 7 are symmetrically opened on both sides of the top surface of the heat transfer plate 5. One end of the fixing buckle 2 is inserted into the fixing groove 7. Mounting seats are fixedly connected to both sides of the outer wall of the cooling tank 6. One end of the heat transfer pipe 4 is connected to multiple heat dissipation pipes 13. The design of the fixing grooves 7 facilitates the accurate positioning of the fixing buckles 2 and improves the installation accuracy. The mounting seats are made of rubber shock-absorbing material, which reduces the vibration transmission during the operation of the fan. Through the cooperation of the fixing grooves 7 and the fixing buckles 2, and the connection between the heat transfer pipe 4 and the heat dissipation pipes 13, the structural stability and heat dissipation uniformity are improved, thereby ensuring the reliability of the cooling effect. A fixing hole is opened at the end of the top surface of the fixing plate 3 away from the hinge axis. The top surface of the other fixing buckle 2 of the two fixing buckles 2 is opened with a corresponding mating pin hole. A fixing pin is inserted between the fixing hole and the mating pin hole. Both the fixing plate 3 and the fixing pin are made of rubber shock-absorbing material. Made of stainless steel, it has strong corrosion resistance. The fixing holes, mating pin holes, and fixing pin shaft facilitate a secure connection between the two fixing buckles 2, improving the fixing strength and ensuring close contact between the upper heat transfer plate 5 and the chip. A lower heat transfer plate 12 is attached to the bottom surface of the support plate 1. A heat transfer tank 10 is connected to one side of the outer wall of the lower heat transfer plate 12. A connecting pipe port 9 is opened on the top surface of the heat transfer tank 10, and a second connecting pipe 11 is inserted into the connecting pipe port 9, parallel to one end of the heat transfer pipe 4. Coolant flows inside the heat transfer pipe 4. The lower heat transfer plate 12 is made of graphene composite material, which has excellent thermal conductivity. The coolant uses the low-boiling-point environmentally friendly refrigerant R134a. The cooperation between the lower heat transfer plate 12, the heat transfer tank 10, and the second connecting pipe 11, as well as the phase change circulation of the coolant, facilitates multi-path heat dissipation, improves heat dissipation efficiency, and can quickly remove the heat generated by the chip.

[0021] Working principle: In use of this invention, the upper heat transfer plate 5 is first tightly fixed to the LED chip using the fixing buckle 2. One end of the fixing buckle 2 is inserted into the fixing groove 7 of the upper heat transfer plate 5, forming a stable clamping structure with the fixing plate 3 and the fixing pin, ensuring efficient heat conduction. The heat generated by the chip is simultaneously absorbed by the upper heat transfer plate 5 and the lower heat transfer plate 12: the upper heat transfer plate 5 conducts heat to the coolant in the heat transfer pipe 4 through the internal threaded cylinder 8, and the lower heat transfer plate 12 collects the heat into the same coolant circulation system through the heat transfer tank 10 and the second connecting pipe 11; cooling... After absorbing heat, the liquid vaporizes into high-temperature steam, which flows along the heat transfer pipe 4 to the cooling tank 6. Inside the cooling tank 6, the steam enters the densely arranged heat dissipation pipes 13, while the cold end of the semiconductor refrigeration chip actively cools down, accelerating the liquefaction of the steam. The operation of the micro axial flow fan 14 creates forced convection, quickly removing the heat from the surface of the heat dissipation pipes 13, causing the coolant to condense into a liquid state and flow back to the heat transfer pipe 4, completing the closed-loop heat dissipation cycle. The mounting base on the outer wall of the cooling tank 6 ensures that the device is securely installed inside the equipment, achieving an efficient and reliable heat dissipation process. At this point, the device is in use.

[0022] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A LED chip cooling device, comprising a support plate (1), characterized in that: The top surface of the support plate (1) is provided with two fixing buckles (2) that are mirrored and hinged on both sides of the chip. The bottom surface of the fixing buckle (2) is abutted against the heat transfer plate (5). The middle of the top surface of the heat transfer plate (5) is fixedly provided with an internal threaded cylinder (8). The internal threaded cylinder (8) is internally threaded with an external threaded connector. One of the fixing buckles (2) is hinged to one end of the top surface of one of the fixing buckles (2) and a fixing plate (3) is provided. A heat dissipation component is provided on one side of the support plate (1). The heat dissipation component includes multiple heat dissipation pipes (13) that are evenly arranged inside the cooling tank (6). A through hole is opened on the outer wall of one end face of the cooling tank (6) that connects to the inner wall.

2. The LED chip cooling device of claim 1, wherein: One end of the external threaded joint is fixedly connected to a heat transfer pipe (4), and one end of the heat transfer pipe (4) is connected to a cooling tank (6).

3. The LED chip cooling device of claim 2, wherein: An installation cylinder is fixedly connected to the through hole, and a miniature axial flow fan (14) is installed inside the installation cylinder.

4. The LED chip cooling device of claim 3, wherein: The heat transfer plate (5) has two symmetrically arranged fixing slots (7) on both sides of its top surface. One end of the fixing buckle (2) is inserted into the fixing slot (7). The cooling tank (6) has mounting seats fixed on both sides of its outer wall. One end of the heat transfer pipe (4) is connected to multiple heat dissipation pipes (13).

5. The LED chip cooling device of claim 4, wherein: The top surface of the fixing plate (3) is provided with a fixing hole at one end away from the hinge axis. The top surface of the other fixing buckle (2) of the two fixing buckles (2) is provided with a corresponding fixing hole and a connecting pin hole. A fixing pin is inserted between the fixing hole and the connecting pin hole.

6. The LED chip cooling device of claim 5, wherein: The bottom surface of the support plate (1) is attached to a lower heat transfer plate (12), and a heat transfer tank (10) is connected to one side of the outer wall of the lower heat transfer plate (12). A connecting pipe port (9) is opened on the top surface of the heat transfer tank (10), and a second connecting pipe (11) is inserted on the connecting pipe port (9) in parallel with one end of the heat transfer pipe (4).

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