Silicon-based OLED lamination packaging device

Abstract

This utility model discloses a silicon-based OLED bonding and encapsulation device, relating to the field of silicon-based OLED bonding and encapsulation technology. It includes a housing, a cover mounted on the top of the housing, mounting components at the four corners of the housing and cover, an extrusion component for extruding optical adhesive on the top of the cover, an extrusion plate at the bottom of the extrusion component, a driving component on one side of the housing, and an adjustment component on one side of the driving component. The advantages of this utility model are: by setting the driving component and the adjustment component, the discharge rate of multiple sets of through-holes can be easily adjusted; the device that facilitates flow rate adjustment can accurately control the output amount of optical adhesive according to the specifications and process requirements of different products, ensuring that the optical adhesive is evenly distributed on the bonding interface during the bonding process, avoiding situations where there is too much or too little adhesive in certain areas.

Description

Technical Field

[0001] This utility model relates to the field of silicon-based OLED bonding and packaging technology, and in particular to a silicon-based OLED bonding and packaging device. Background Technology

[0002] Silicon-based OLED is a new display technology that fabricates OLED devices on silicon wafers. It combines the high image quality of OLED with the high integration and low power consumption of silicon-based CMOS circuits. With its thinness, high resolution and other characteristics, it has broad application prospects in near-eye display fields such as VR and AR, and is driving innovation in the display industry.

[0003] Water and oxygen intrusion can cause chemical reactions in OLED materials, reducing the device's luminous efficiency, shortening its lifespan, and even leading to malfunctions such as black screens. Bonding and encapsulation can form a dense barrier, effectively preventing water and oxygen from entering the device and protecting the OLED material from damage, thus extending the device's lifespan. Therefore, bonding and encapsulation devices are necessary. However, in traditional silicon-based OLED bonding and encapsulation devices, uneven optical adhesive flow can lead to uneven distribution between the silicon-based OLED display panel and the cover glass. Excessive flow can cause the optical adhesive to overflow into non-bonded areas, causing contamination and forming protrusions after curing, affecting the flatness of the display panel. Insufficient flow cannot fully fill the bonding gaps, easily generating air bubbles, resulting in loose bonding, reduced sealing and reliability, and difficulty in disassembling the cover. The difficult-to-remove cover makes comprehensive and thorough maintenance difficult. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] A silicon-based OLED bonding and encapsulation device includes a housing, a cover mounted on the top of the housing, mounting components at the four corners of the housing and the cover, an extrusion component for extruding optical adhesive at the top of the cover, an extrusion plate at the bottom of the extrusion component, a driving component on one side of the housing, and an adjustment component on one side of the driving component.

[0007] The mounting assembly includes a mounting frame mounted on the outside of the housing and the cover. A threaded rod is threadedly connected to the inner wall of the mounting frame, and a sliding rod is slidably mounted on the inner wall of the mounting frame. One end of the threaded rod is fixed to one end of the sliding rod.

[0008] The adjustment component includes a connecting plate disposed on one side of the drive component. An adjustment plate is rotatably mounted on the inner wall of the connecting plate via a rotating shaft. An adjustment frame is rotatably mounted on the inner wall of the adjustment plate via a rotating shaft, and the bottom of the adjustment frame is slidably connected to the inner wall of the housing.

[0009] In a preferred embodiment of the silicon-based OLED bonding and encapsulation device of this utility model, the extrusion assembly includes a fixing frame fixed to the top of the cover, a cylinder is fixedly connected to the inner wall of the fixing frame, and the outer side of the cylinder is fixedly connected to the inner wall of the cover. The piston rod of the cylinder is fixedly connected to the top of the extrusion plate.

[0010] In a preferred embodiment of the silicon-based OLED bonding and encapsulation device of this utility model, the driving component includes a motor disposed on one side of the housing, the output end of the motor is fixedly connected to a rotating rod, and the outer side of the rotating rod is fixedly connected to the inner wall of the connecting plate, and one end of the rotating rod is rotatably connected to one side of the housing.

[0011] As a preferred embodiment of the silicon-based OLED bonding and encapsulation device of this utility model, the inner wall of the housing is provided with through holes, and the through holes are arranged in an array.

[0012] In a preferred embodiment of the silicon-based OLED bonding and encapsulation device of this utility model, the inner wall of the housing is connected to a feeding tube, and a feeding valve is installed on the outer side of the feeding tube.

[0013] In a preferred embodiment of the silicon-based OLED bonding and encapsulation device of this utility model, two sets of partitions are fixedly connected to the inner wall of the housing, and sealing strips are fixedly connected to the bottom of both sets of partitions, with the bottom of the sealing strips slidably connected to the inner wall of the adjustment frame.

[0014] In a preferred embodiment of the silicon-based OLED bonding and encapsulation device of this utility model, a support frame for fixing the motor is fixedly connected to one side of the housing, and multiple sets of sliding grooves are formed on the inner wall of the housing. A slider for connecting with the adjustment frame is slidably connected to the inner wall of the sliding groove.

[0015] In summary, this utility model has the following beneficial effects:

[0016] 1. By setting up the drive component and adjustment component, the discharge volume of multiple sets of through holes can be easily adjusted. The device that facilitates flow adjustment can accurately control the output of optical adhesive according to the specifications and process requirements of different products. During the bonding process, the optical adhesive is evenly distributed on the bonding interface, avoiding the situation of excessive or insufficient adhesive in some areas.

[0017] 2. The installation components facilitate the installation and removal of the cover. The easy-to-remove cover allows for more thorough cleaning, enabling maintenance personnel to access the device and remove dust, impurities, and residual optical adhesive and other contaminants. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0019] Figure 1 This is an overall structural diagram of a silicon-based OLED bonding and encapsulation device.

[0020] Figure 2 This is a structural diagram of the housing and cover of a silicon-based OLED bonding and encapsulation device.

[0021] Figure 3 This is a structural diagram of the housing and separator of a silicon-based OLED bonding and encapsulation device.

[0022] Figure 4 This is a structural diagram of the cover and extrusion plate of a silicon-based OLED bonding and encapsulation device.

[0023] The following are the labeling elements in the diagram: 1. Shell; 2. Cover; 3. Mounting assembly; 31. Mounting frame; 32. Threaded rod; 33. Slide rod; 4. Extrusion assembly; 41. Fixing frame; 42. Cylinder; 5. Extrusion plate; 6. Drive assembly; 61. Motor; 62. Rotating rod; 7. Adjustment assembly; 71. Connecting plate; 72. Adjusting plate; 73. Adjusting frame; 8. Through hole; 9. Feeding pipe; 10. Feeding valve; 11. Partition plate; 12. Sealing strip; 13. Support frame; 14. Slide groove; 15. Slider. Detailed Implementation

[0024] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0025] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0027] Example 1:

[0028] Reference Figures 1-4 This is the first embodiment of the present invention. This embodiment provides a silicon-based OLED bonding and encapsulation device, including a housing 1, a cover 2 installed on the top of the housing 1, mounting components 3 provided at the four corners of the housing 1 and the cover 2, an extrusion component 4 for extruding optical adhesive on the top of the cover 2, an extrusion plate 5 provided at the bottom of the extrusion component 4, a driving component 6 provided on one side of the housing 1, and an adjustment component 7 provided on one side of the driving component 6. Under the drive of the cylinder 42 in the extrusion component 4, the extrusion plate 5 directly applies pressure to the optical adhesive in the housing 1, causing the optical adhesive to flow out at a certain flow rate and pressure to participate in the bonding and encapsulation process of the silicon-based OLED. Its movement state and pressure directly affect the outflow of the optical adhesive.

[0029] The housing 1 is designed to contain the optical adhesive and to perform the bonding and encapsulation of the silicon-based OLED, protecting the internal components from interference and damage from the external environment. The cover 2 cooperates with the housing 1 to seal the inside of the device, preventing the optical adhesive from overflowing during the operation, while protecting the internal optical adhesive and other components from external factors such as dust and impurities, ensuring the quality of bonding and encapsulation.

[0030] Mounting assembly 3 includes a mounting frame 31 mounted on the outside of housing 1 and cover 2. The inner wall of mounting frame 31 is threaded with a threaded rod 32, and a sliding rod 33 slides on the inner wall of mounting frame 31. One end of threaded rod 32 is fixed to one end of sliding rod 33.

[0031] The mounting frame 31 is designed to connect to the outer side of the housing 1 and the cover 2, serving to fix and position them. The threaded rod 32 is threaded to the inner wall of the mounting frame 31. Rotating the threaded rod 32 allows the mounting frame 31 to move, thereby adjusting the tightness of the connection between the cover 2 and the housing 1, facilitating the disassembly and installation of the cover 2. The sliding rod 33 is designed to support the mounting frame 31. It should be noted that the sliding rod 33 extends into part of the inner wall of the mounting frame 31, so it will not slip when multiple sets of mounting frames 31 move outward. It should be noted that during use, the threaded rod 32 needs to be cleaned regularly by the operator and lubricated to prevent it from being exposed to the outside for a long time and getting stuck due to dust.

[0032] The adjustment assembly 7 includes a connecting plate 71 disposed on one side of the drive assembly 6. An adjustment plate 72 is rotatably mounted on the inner wall of the connecting plate 71 via a rotating shaft. An adjustment frame 73 is rotatably mounted on the inner wall of the adjustment plate 72 via a rotating shaft, and the bottom of the adjustment frame 73 is slidably connected to the inner wall of the housing 1.

[0033] The connecting plate 71 is used to transmit the rotational motion of the rotating rod 62 to the adjusting plate 72, playing the role of motion transmission and conversion. Driven by the connecting plate 71, the adjusting plate 72 converts the rotational motion into the linear motion of the adjusting frame 73, thereby adjusting the position of the adjusting frame 73 and thus adjusting the coverage of the through hole 8 by the adjusting frame 73, thereby controlling the flow rate of the optical adhesive. Driven by the adjusting plate 72, the adjusting frame 73 slides on the inner wall of the housing 1. By changing its position, the size of the optical adhesive flow channel is adjusted, thereby precisely controlling the flow rate of the optical adhesive to meet the needs of different bonding and encapsulation processes.

[0034] Example 2:

[0035] This is the second embodiment of the present invention, which is based on the previous embodiment.

[0036] Specifically, the extrusion assembly 4 includes a fixing frame 41 fixed to the top of the cover 2, a cylinder 42 fixedly connected to the inner wall of the fixing frame 41, and the outer side of the cylinder 42 fixedly connected to the inner wall of the cover 2. The piston rod of the cylinder 42 is fixedly connected to the top of the extrusion plate 5.

[0037] The mounting bracket 41 is used to fix the cylinder 42. The cylinder 42 drives the extrusion plate 5 to move up and down through the extension and retraction of its piston rod, thereby extruding the optical adhesive inside the housing 1 and controlling the flow and pressure of the optical adhesive to meet the process requirements of silicon-based OLED bonding and encapsulation. It should be noted that the cylinder 42 is composed of an air compressor, an air tank, a filter pressure reducing valve, a directional control valve, and a flow control valve. During use, the air compressor compresses the ambient air to a set pressure and stores it in the air tank. The filter pressure reducing valve further purifies the air and stabilizes the pressure, and delivers it to the control valve through an air pipe. The directional control valve switches the airflow channel according to the electrical signal to determine the extension and retraction direction of the cylinder 42. The flow control valve adjusts the airflow speed and controls the movement speed of the cylinder 42. Compressed air enters the rod chamber or rodless chamber of the cylinder 42, pushing the piston to move. The piston drives the piston rod to output linear reciprocating motion.

[0038] Specifically, the drive assembly 6 includes a motor 61 disposed on one side of the housing 1. The output end of the motor 61 is fixedly connected to a rotating rod 62, and the outer side of the rotating rod 62 is fixedly connected to the inner wall of the connecting plate 71. One end of the rotating rod 62 is rotatably connected to one side of the housing 1.

[0039] The motor 61 is configured to drive the rotating rod 62 to rotate, providing power support for the movement of the adjustment assembly 7. The rotating rod 62 is configured to transmit the rotational power of the motor 61 to the connecting plate 71, causing the connecting plate 71 to rotate. When the connecting plate 71 rotates, it causes the adjustment plate 72 to move. It is worth noting that the inner wall of the adjustment plate 72 slides on the inner wall of the housing 1 with the rotating shaft of the adjustment frame 73, and the slot is set horizontally. Thus, when the adjustment plate 72 moves, it can move horizontally, and finally causes the adjustment frame 73 to move horizontally.

[0040] Specifically, the inner wall of the housing 1 has through holes 8, and the through holes 8 are arranged in an array.

[0041] The through holes 8 are arranged in an array to provide channels for the flow of optical adhesive within the housing 1, allowing the optical adhesive to flow along a predetermined path. At the same time, the array design helps to evenly distribute the flow of optical adhesive, ensuring uniform bonding and encapsulation.

[0042] Example 3:

[0043] This is the third embodiment of the present invention, which is based on the first two embodiments.

[0044] Specifically, the inner wall of the housing 1 is connected to a feeding pipe 9, and a feeding valve 10 is installed on the outer side of the feeding pipe 9.

[0045] The feeding tube 9 serves as a channel for adding optical adhesive into the housing 1, allowing operators to accurately add the optical adhesive into the device and ensure the continuity of the production process. The feeding valve 10 is used to control the opening and closing of the feeding tube 9. By switching the feeding valve 10 on and off, the amount and time of adding optical adhesive can be precisely controlled, avoiding waste and overflow of optical adhesive.

[0046] Specifically, two sets of partitions 11 are fixedly connected to the inner wall of the housing 1, and sealing strips 12 are fixedly connected to the bottom of both sets of partitions 11. The bottom of the sealing strips 12 is slidably connected to the inner wall of the adjustment frame 73.

[0047] The partition 11 is used to divide the internal space of the housing 1 into different areas, which helps to control and guide the flow and distribution of the optical adhesive. The sealing strip 12 is installed at the bottom of the partition 11 and slides in connection with the inner wall of the adjustment frame 73 to seal and prevent the optical adhesive from leaking from the gap between the partition 11 and the adjustment frame 73 during the sliding process of the adjustment frame 73, thus ensuring the sealing of the device and the control accuracy of the optical adhesive flow.

[0048] Specifically, a support frame 13 for fixing the motor 61 is fixedly connected to one side of the housing 1, and multiple sets of sliding grooves 14 are opened on the inner wall of the housing 1. A slider 15 for connecting with the adjustment frame 73 is slidably connected to the inner wall of the sliding groove 14.

[0049] The support frame 13 is used to fix the motor 61, securely mounting the motor 61 on one side of the housing 1, reducing the vibration and displacement of the motor 61 during operation, and ensuring the stable operation of the motor 61. The slide groove 14 is used to provide a sliding track for the slider 15, restricting the movement direction of the slider 15 so that it can only move in a straight line along the slide groove 14. The slider 15 is used to provide guidance and support for the movement of the adjustment frame 73, ensuring that the adjustment frame 73 can slide smoothly and accurately, and improving the movement accuracy and stability of the adjustment component 7.

[0050] In use, first, install and debug all components of the device. Then, add an appropriate amount of optical adhesive into the housing 1 through the feeding pipe 9. During the addition process, the amount and time of addition are precisely controlled by the feeding valve 10 to prevent waste and overflow of the optical adhesive. Then, start the motor 61. The output end of the motor 61 drives the rotating rod 62 to rotate. The rotating rod 62 transmits the rotational power to the connecting plate 71, causing the connecting plate 71 to rotate. The connecting plate 71 drives the adjusting plate 72 to move. The movement of the adjusting plate 72 causes the adjusting frame 73 to move laterally. By changing the position of the adjusting frame 73, its alignment with the through hole 8 is adjusted. The coverage is adjusted to regulate the size of the optical adhesive flow channel and precisely control the flow rate of the optical adhesive. Then, the cylinder 42 is started, and the air compressor compresses and delivers air. After being regulated by a series of control valves, the compressed air enters the corresponding chamber of the cylinder 42, pushing the piston to move. The piston drives the piston rod, which in turn drives the extrusion plate 5 to move up and down. The extrusion plate 5 applies pressure to the optical adhesive in the housing 1, so that the optical adhesive flows out from the through hole 8 at a certain flow rate and pressure. A valve body synchronized with the extrusion assembly 4 is provided at the through hole 8 to prevent the optical adhesive from flowing out when the extrusion plate 5 is pressed down.

[0051] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A silicon-based OLED on-cell packaging device comprising a housing (1), characterized in that: The top of the housing (1) is fitted with a cover (2), and mounting components (3) are provided at the four corners of the housing (1) and the cover (2). The top of the cover (2) is fitted with a pressing component (4) for pressing the optical adhesive. The bottom of the pressing component (4) is fitted with a pressing plate (5). A driving component (6) is provided on one side of the housing (1), and an adjusting component (7) is provided on one side of the driving component (6). The mounting assembly (3) includes a mounting frame (31) mounted on the outside of the housing (1) and the cover (2). The inner wall of the mounting frame (31) is threaded with a threaded rod (32), and a sliding rod (33) slides on the inner wall of the mounting frame (31). One end of the threaded rod (32) is fixed to one end of the sliding rod (33). The adjustment component (7) includes a connecting plate (71) disposed on one side of the drive component (6). The inner wall of the connecting plate (71) is rotatably connected to an adjustment plate (72) via a rotating shaft. The inner wall of the adjustment plate (72) is rotatably connected to an adjustment frame (73) via a rotating shaft. The bottom of the adjustment frame (73) is slidably connected to the inner wall of the housing (1).

2. The silicon-based OLED on package device of claim 1, wherein: The extrusion assembly (4) includes a fixing frame (41) fixed to the top of the cover (2), a cylinder (42) is fixedly connected to the inner wall of the fixing frame (41), and the outer side of the cylinder (42) is fixedly connected to the inner wall of the cover (2). The piston rod of the cylinder (42) is fixedly connected to the top of the extrusion plate (5).

3. The silicon-based OLED bonding and encapsulation device as described in claim 1, characterized in that: The drive assembly (6) includes a motor (61) disposed on one side of the housing (1). The output end of the motor (61) is fixedly connected to a rotating rod (62), and the outer side of the rotating rod (62) is fixedly connected to the inner wall of the connecting plate (71). One end of the rotating rod (62) is rotatably connected to one side of the housing (1).

4. The silicon-based OLED bonding and encapsulation device as described in claim 1, characterized in that: The inner wall of the housing (1) is provided with through holes (8), and the through holes (8) are arranged in an array.

5. The silicon-based OLED bonding and encapsulation apparatus as described in claim 1, characterized in that: The inner wall of the housing (1) is connected to a feeding pipe (9), and a feeding valve (10) is installed on the outer side of the feeding pipe (9).

6. The silicon-based OLED bonding and encapsulation apparatus as described in claim 1, characterized in that: The inner wall of the housing (1) is fixedly connected with two sets of partitions (11), and the bottom of each set of partitions (11) is fixedly connected with a sealing strip (12), and the bottom of the sealing strip (12) is slidably connected to the inner wall of the adjustment frame (73).

7. The silicon-based OLED bonding and encapsulation apparatus as described in claim 1, characterized in that: A support frame (13) for fixing the motor (61) is fixedly connected to one side of the housing (1). Multiple sets of sliding grooves (14) are opened on the inner wall of the housing (1). A slider (15) for connecting with the adjustment frame (73) is slidably connected to the inner wall of the sliding groove (14).

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