A silicon wafer shaping device

Abstract

The utility model relates to the technical field of silicon wafer processing discloses a kind of silicon wafer shaping devices, including vertically arranged mounting plate and horizontally arranged, and the mounting platform for the installation of external quartz boat installation;The rear of the mounting platform is connected with the lower end of mounting plate, the front of the mounting plate is equipped with shaping part, at least two rows of shaping structures of left and right interval distribution are equipped on the shaping part, each column of shaping structure includes sequentially arranged from top to bottom, and the corresponding several shaping grooves of several silicon wafers in quartz boat are inserted;The shaping part is further connected with moving drive part, to drive shaping part reciprocating movement, to make the notch of shaping groove can be close to and abut silicon wafer side edge to realize shaping. The mounting platform of fixed installation quartz boat is set up in matching, shaping part is determined relative to the initial position of quartz boat, to prevent quartz boat deviation, shaping misplacement;Again cooperate two rows of shaping structures to shape the left and right two ends of silicon wafer;Can improve shaping effect and production line efficiency, reduce the fragment rate.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and specifically to a silicon wafer shaping device. Background Technology

[0002] In the fabrication of solar cells, silicon wafers are often loaded onto quartz boats. As shown in publications CN221379319U and CN218471907U, several silicon wafers are inserted into the toothed structure of the quartz boat. The toothed structure includes several toothed grooves arranged sequentially along the Z-axis, with each silicon wafer typically inserted into one toothed groove on one side. A chuck is then used to remove the silicon wafers from the toothed structure of the quartz boat for further processing. However, after high-temperature processing, the silicon wafers in the toothed structure of the quartz boat are often not neatly arranged. They need to be shaped or straightened to prevent misalignment of the chuck when removing the wafers, which can lead to problems such as chipping and breakage.

[0003] CN214588752U discloses a silicon wafer shaping and groove cleaning device for a quartz boat, which is used to shape silicon wafers within the groove structure of a quartz boat. The silicon wafer shaping mechanism includes a shaping component and a driving assembly connected to each other. The shaping component has several shaping grooves that mate with the silicon wafers. The driving assembly drives the shaping component, using the shaping grooves to press the silicon wafers within the groove structure of the quartz boat into the groove structure, thereby shaping the silicon wafers and arranging them neatly within the groove structure. However, this silicon wafer shaping and groove cleaning device for a quartz boat has the following drawbacks:

[0004] (1) The forming part of the silicon wafer forming and groove cleaning device for the quartz boat has only a single row of forming grooves. The single row of forming grooves can only abut and form the lower end of several silicon wafers. At this time, the upper end of several silicon wafers may still tilt and shift, and be not neatly arranged (or, the single row of forming grooves can only abut and form the middle part of several silicon wafers, and the upper or lower end of several silicon wafers may still tilt and shift, and be not neatly arranged), thus affecting the forming effect, increasing the forming rework rate, and consequently affecting the forming efficiency.

[0005] (2) The quartz boat silicon wafer shaping and groove cleaning device does not have an installation platform that can load and fix the quartz boat; on the one hand, the starting position of the shaping tool relative to the quartz boat is uncertain, and the consistency of each shaping cannot be guaranteed, resulting in poor shaping effect; on the other hand, the quartz boat cannot be stably fixed, and may move or shift during operation, which may lead to misalignment of the shaping tool and easily cause silicon wafer fragments. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a silicon wafer shaping device to straighten silicon wafers, improve the problem of wafer jamming and fragmentation during the automation process, and improve production line efficiency.

[0007] Based on this, the present invention discloses a silicon wafer shaping device, including a vertically arranged mounting plate and a horizontally arranged mounting platform for mounting an external quartz boat; the rear of the mounting platform is connected to the lower end of the mounting plate, and a shaping component is installed in front of the mounting plate. The shaping component has at least two rows of shaping structures spaced apart from left to right. Each row of shaping structures includes several shaping grooves arranged from top to bottom and corresponding to several silicon wafers inserted into the quartz boat.

[0008] The shaping component is also connected to a moving drive component to drive the shaping component to move back and forth so that the opening of the shaping groove can approach and abut against the side of the silicon wafer to achieve shaping.

[0009] Preferably, the mounting platform is provided with at least two support bars spaced apart for supporting the quartz boat; both the mounting platform and the support bars are provided with a plurality of mounting holes for fixing and mounting the quartz boat.

[0010] Preferably, the spacing between the two rows of shaping structures is 125-155mm; during shaping, the two rows of shaping structures are located at the left and right ends of several silicon wafers inserted into the quartz boat, respectively.

[0011] Preferably, each column of the shaping structure includes a plurality of shaping teeth arranged sequentially from top to bottom, and two adjacent shaping teeth in each column of the shaping structure form a shaping groove, wherein the groove opening width is 2.5-3.5mm.

[0012] Preferably, the silicon wafer shaping device of this utility model further includes a rotary drive component, which is connected to the mounting plate via a rotary shaft. After the quartz boat is installed on the mounting platform, the rotary drive component drives the rotary shaft to rotate, thereby causing the mounting plate, the shaping component, and the mounting platform to rotate together by 90°, so that the mounting plate is flipped onto a flat surface, so that the opening of the shaping groove faces upward toward the upper side of the silicon wafer inside the quartz boat.

[0013] More preferably, the front surface of the mounting plate is provided with at least two blocking strips, which are located on the left and right outer sides of the shaping component, respectively, and the height of the blocking strips is greater than the height of the shaping structure, so that when the mounting plate is flipped onto the plane, the side of the silicon wafer inside the quartz boat contacts the blocking strips first.

[0014] More preferably, the rotary drive is located on the left or right outer side of the mounting plate, and the rotary shaft includes a first rotary shaft arranged in the front-back direction and a second rotary shaft arranged in the left-right direction. One end of the first rotary shaft is rotatably connected to the rotary drive, and the other end of the first rotary shaft is rotatably connected to the second rotary shaft through a coupling. The second rotary shaft is fixedly connected to the mounting plate through a fixing block.

[0015] More preferably, the silicon wafer shaping device of this utility model further includes a mounting base located below the mounting plate. The rotary drive component is mounted on the mounting base via a bracket. The two ends of the second rotary shaft are located on the left and right outer sides of the mounting plate, respectively, and the two ends of the second rotary shaft are mounted on the mounting base via a first bearing seat and a second bearing seat, respectively.

[0016] More preferably, the lower end of the mounting plate and the lower surface of the mounting platform are further provided with reinforcing ribs, and the reinforcing ribs are provided with through holes for the second rotating shaft to pass through.

[0017] Preferably, the moving drive component is installed on the lower surface of the mounting platform, and the moving output end of the moving drive component is connected to the shaping component. An elongated hole is also provided on the rear end of the mounting platform for the moving output end of the moving drive component to drive the shaping component to move.

[0018] More preferably, the rotary drive component is a motor, and the movable drive component is a cylinder.

[0019] Compared with the prior art, the present invention has at least the following beneficial effects:

[0020] In this silicon wafer shaping device, before shaping (in the initial state), the mounting platform is horizontally positioned to facilitate the installation of the quartz boat. The device is equipped with a mounting platform for fixing the quartz boat; thus, installing the quartz boat in a fixed position on the mounting platform ensures a defined starting position of the shaped component relative to the quartz boat, reducing uncertainties during the shaping process and improving the shaping effect. It also avoids displacement and misalignment of the shaping structure caused by unstable fixing of the quartz boat, thereby reducing the silicon wafer breakage rate.

[0021] During the shaping process, two rows of shaping structures are located at the left and right ends of several silicon wafers inserted into the quartz boat, respectively. This ensures that the two rows of shaping structures can work together to shape the left and right ends of the silicon wafers, preventing the left or right ends from tilting or shifting and becoming misaligned. This results in a more orderly arrangement of the shaped silicon wafers, reduces the number of times the wafers get stuck, improves the shaping effect, and mitigates the problems of wafers getting stuck and breaking during the automated process. This reduces the breakage rate and significantly reduces the rework rate, thereby improving shaping efficiency and production line efficiency. Attached Figure Description

[0022] Figure 1This is a three-dimensional structural diagram of a silicon wafer shaping device according to this embodiment.

[0023] Figure 2 for Figure 1 Enlarged view of part number A.

[0024] Figure 3 This is a front view of a silicon wafer shaping apparatus according to this embodiment.

[0025] Figure 4 This is a top view of a silicon wafer shaping device according to this embodiment.

[0026] Figure 5 This is a right view of a silicon wafer shaping apparatus according to this embodiment.

[0027] Reference numerals: Mounting plate 1; First support bar 11; Blocking bar 12; Shaping component 2; Shaping structure 21; Shaping tooth 211; Shaping groove 212; Mounting platform 3; Second support bar 31; Mounting hole 32; Elongated hole 33; Moving drive component 4; Reinforcing rib 5; Through hole 51; Rotating drive component 6; Bracket 61; First rotating shaft 62; Coupling 63; First bearing seat 64; Second rotating shaft 65; Fixing block 66; Second bearing seat 67; Mounting base 7. Detailed Implementation

[0028] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] Example

[0030] This embodiment provides a silicon wafer shaping device; see [link to relevant documentation]. Figure 1-4 It includes a rotary drive component 6, a mounting plate 1, and a mounting platform 3 for mounting an external quartz boat. The mounting plate 1 is vertically positioned along the Z-axis; while the mounting platform 3 is horizontally positioned along the XOY plane, with its length along the Y-axis. Furthermore, in this embodiment, combined with... Figure 1 , 3 It can be seen that in the initial state (i.e., when the rotating drive component 6 has not caused the mounting plate 1 and the mounting platform 3 to flip), the Y-axis corresponds to the front-back direction, the X-axis corresponds to the left-right direction, and the Z-axis corresponds to the up-down direction. In the initial state, the mounting platform 3 is set horizontally along the XOY plane, which facilitates the installation of the quartz boat on the mounting platform 3.

[0031] The mounting platform 3 has at least two spaced-apart second support bars 31 for supporting the quartz boat. The two second support bars 31 work together to support the quartz boat, improving stability. Both the mounting platform 3 and the support bars have several mounting holes 32 for fixing the quartz boat. In practice, the mounting holes 32 can be through holes. For example, the lower end of the bolts connecting the quartz boat can be passed through the mounting holes 32 and the nut in sequence, and then the nut can be tightened to install and fix the quartz boat onto the second support bars 31 and the mounting platform 3. The mounting surface of the quartz boat can have a groove that engages with the second support bars 31 to increase the stability and reliability of the quartz boat on the mounting platform 3.

[0032] The rear of the mounting platform 3 is fixedly connected to the lower end of the mounting plate 1. A shaping component 2 is mounted on the front of the mounting plate 1. The shaping component 2 has at least two rows of shaping structures 21 spaced apart from left to right. Each row of shaping structures 21 includes several shaping slots 212 arranged from top to bottom and corresponding to several silicon wafers inserted into the quartz boat. The shaping component 2 is also connected to a moving drive component 4 (such as...). Figure 3 As shown, the shaping component 2 is driven to reciprocate along the Y-axis, so that the opening of the shaping groove 212 can approach and abut against the side of the silicon wafer to achieve silicon wafer shaping, and the opening of the shaping groove 212 is retracted to its original position after shaping. In practice, the moving driving component 4 is a cylinder.

[0033] Specifically, the moving drive component 4 is fixedly installed on the lower surface of the mounting platform 3, and the moving output end of the moving drive component 4 is connected to the shaping component 2. An elongated hole 33 (e.g., for the moving output end of the moving drive component 4 to drive the shaping component 2) is also provided on the rear end of the mounting platform 3. Figure 1 , 4 (As shown).

[0034] Furthermore, each column of the shaping structure 21 includes a plurality of shaping teeth 211 arranged sequentially from top to bottom (e.g., Figure 2 As shown), two adjacent shaping teeth 211 in each row of shaping structures 21 form a shaping groove 212 (as shown). Figure 2 (As shown). The number, position, and width of the shaping grooves 212 included in each row of shaping structures 21 correspond to the number, position, and thickness of the silicon wafers inserted into the quartz boat. Specifically, the width of the shaping groove 212 (which is the dimension along the Z-axis) is 2.5-3.5mm (e.g., 3mm).

[0035] The spacing between the two rows of shaping structures 21 is 125-155mm. During shaping, the two rows of shaping structures 21 are located at the left and right ends of several silicon wafers inserted into the quartz boat, respectively, to ensure that the two rows of shaping structures 21 can jointly straighten the left and right ends of the silicon wafers, preventing the left or right ends from tilting or shifting, or from being misaligned. After shaping, the silicon wafers are more neatly arranged, reducing the number of times the teeth get stuck, thereby improving the shaping effect, improving the problem of silicon wafers getting stuck and breaking during the automation process, reducing the breakage rate, and greatly reducing the rework rate of shaping, thus improving shaping efficiency and production line efficiency.

[0036] See Figure 1 , 3 -5, the rotary drive component 6 is connected to the mounting plate 1 via a rotary shaft. In practice, the rotary drive component 6 is a motor. Specifically, the rotary drive component 6 is located on the left outer side or right outer side (e.g., the left outer side) of the mounting plate 1. The rotary shaft includes a first rotary shaft 62 arranged along the Y-axis and a second rotary shaft 65 arranged along the X-axis. One end of the first rotary shaft 62 is rotatably connected to the rotary drive component 6, and the other end of the first rotary shaft 62 is rotatably connected to the second rotary shaft 65 via a coupling 63. The second rotary shaft 65 is connected to a fixing block 66 (e.g., a motor). Figure 3 (As shown) is fixedly connected to mounting plate 1.

[0037] Before shaping (i.e., in the initial state), to facilitate the installation of the quartz boat on the mounting platform 3, the mounting platform 3 is set horizontally along the XOY plane, while the mounting plate 1 is set vertically along the Z-axis. At this time, several silicon wafers are also horizontally inserted into the quartz boat along the XOY plane. To facilitate the shaping of the silicon wafers in the quartz boat, the weight of the silicon wafers themselves is used to improve the shaping efficiency, and to facilitate the subsequent removal of the shaped silicon wafers from the quartz boat into the next process, after the quartz boat is installed on the mounting platform 3, the rotary drive 6 drives the first rotary shaft 62 to rotate, so that the first rotary shaft 62 drives the second rotary shaft 65 to rotate through the coupling 63 (which acts as a link between the first rotary shaft 62 and the second rotary shaft 65, ensuring that the first rotary shaft 62 and the second rotary shaft 65 rotate synchronously). This causes the second rotary shaft 65 to drive the fixed block 66 and the mounting plate 1 to rotate backward by 90°. Since the mounting plate 1 is fixedly connected to the mounting platform 3, and the mounting platform 3 and the shaping component 2 are connected by the moving drive 4, As a single unit, the mounting plate 1 can also drive the mounting platform 3, the moving drive component 4, and the shaping component 2 to rotate 90° together. After rotating 90° (at this time, in the flipped state), the mounting plate 1 and the shaping component 2 are flipped to the horizontal plane, while the mounting platform 3 is flipped to a vertical position, so that the groove opening of the shaping groove 212 faces upward towards the lower side of the silicon wafer in the quartz boat. This facilitates the subsequent use of the silicon wafer's own gravity to enhance the shaping effect, making the silicon wafers in the quartz boat neatly arranged, and making it convenient to pick up the shaped silicon wafers from the top of the quartz boat for the next process.

[0038] The rear surface of the mounting plate 1 is also provided with at least two first support bars 11 spaced apart on the left and right (e.g., Figure 4-5 (As shown). In this way, after the mounting plate 1 is flipped 90° backward, the two first support bars 11 can stably support the mounting plate 1 on the horizontal plane.

[0039] Specifically, a mounting base 7 is installed below the mounting plate 1. The rotary drive component 6 is mounted on the mounting base 7 via a bracket 61. The left and right ends of the second rotary shaft 65 are located on the left and right outer sides of the mounting plate 1, respectively, and are mounted on the mounting base 7 via a first bearing seat 64 and a second bearing seat 67. The first bearing seat 64 and the second bearing seat 67 provide support for the left and right ends of the second rotary shaft 65. Through the cooperation of the bracket 61, the first bearing seat 64, and the second bearing seat 67, the rotary drive component 6 and the second rotary shaft 65 can be stably mounted on the mounting base 7.

[0040] Furthermore, the front surface of the mounting plate 1 is also provided with at least two blocking strips 12 (such as...). Figure 1 , 3 -4) The two blocking strips 12 are located on the left and right outer sides of the shaping component 2, respectively, and the height of the blocking strips 12 (which is the dimension along the Y-axis) is greater than the height of the shaping structure 21. In this way, when the mounting plate 1 and the shaping component 2 are flipped onto the plane, the lower side of the silicon wafer in the quartz boat can contact the blocking strips 12 first, preventing the shaping teeth 211 from damaging the silicon wafer during the flipping process of the mounting platform 3 and the quartz boat, thereby reducing the card and breakage rate.

[0041] See Figure 1 , 5 The lower end of the mounting plate 1 and the lower surface of the mounting platform 3 are also provided with reinforcing ribs 5, and the reinforcing ribs 5 are provided with through holes 51 for the second rotating shaft 65 to pass through (e.g., Figure 1 (As shown). The reinforcing rib 5 can provide mechanical reinforcement to the mounting plate 1 and the mounting platform 3, thereby enhancing the mechanical strength of the entire silicon wafer shaping device.

[0042] The silicon wafer shaping device of this embodiment is also equipped with a mounting platform 3 for fixing the quartz boat. In this way, the quartz boat is installed in a fixed position on the mounting platform 3, so that the starting position of the shaping component 2 relative to the quartz boat is determined, ensuring the consistency of each shaping, reducing uncertainties in the shaping process, and helping to improve the shaping effect. It can also avoid the displacement caused by the inability to fix the quartz boat stably and the misalignment of the shaping structure 21, thus reducing the silicon wafer breakage rate.

[0043] The working process of the silicon wafer shaping device in this embodiment is as follows:

[0044] Before shaping, the quartz boat containing several silicon wafers is fixedly installed on the mounting platform 3. Then, the rotation drive 6 starts working, slowly rotating the mounting plate 1, mounting platform 3, and shaping component 2 together by 90°, so that the mounting plate 1 and shaping component 2 are flipped to the horizontal plane. At this time, the groove opening of the shaping groove 212 faces upward towards the lower side of the silicon wafer in the quartz boat, and the rotation drive 6 is turned off. Then, the movement drive 4 starts working, driving the shaping component 2 to move closer to the silicon wafer, so that the groove opening of the shaping groove 212 approaches and abuts the lower side of the silicon wafer, so that the upper side of the silicon wafer contacts the inner wall of the toothed groove in the quartz boat, thereby shaping the several silicon wafers inserted into the toothed groove in the quartz boat, so that the several silicon wafers are neatly inserted and arranged in the quartz boat. After shaping, the movement drive 4 drives the shaping component 2 to retract together.

[0045] Then, the external suction cup device removes several shaped silicon wafers from the quartz boat and puts several new silicon wafers into the quartz boat; the moving drive 4 drives the shaping component 2 to work and shape the newly placed silicon wafers; after shaping, the moving drive 4 drives the shaping component 2 to retract together; this process is repeated; after all shaping is completed, the rotating drive 6 starts to work and slowly flips the mounting plate 1, the mounting platform 3 and the shaping component 2 back to their original positions.

[0046] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0047] The technical solution provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A silicon wafer shaping apparatus characterized by comprising: It includes a vertically mounted mounting plate and a horizontally mounted mounting platform for mounting an external quartz boat; the rear of the mounting platform is connected to the lower end of the mounting plate, and a shaping component is mounted on the front of the mounting plate. The shaping component has at least two rows of shaping structures spaced apart from left to right. Each row of shaping structures includes several shaping grooves arranged from top to bottom and corresponding to several silicon wafers inserted into the quartz boat. The shaping component is also connected to a moving drive component to drive the shaping component to move back and forth so that the opening of the shaping groove can approach and abut against the side of the silicon wafer to achieve shaping.

2. A silicon wafer shaping apparatus according to claim 1, wherein The mounting platform is provided with at least two support bars spaced apart for supporting the quartz boat; both the mounting platform and the support bars are provided with a number of mounting holes for fixing the quartz boat.

3. The apparatus of claim 1 wherein: The spacing between the two rows of shaping structures is 125-155mm; during shaping, the two rows of shaping structures are located at the left and right ends of several silicon wafers inserted into the quartz boat, respectively.

4. The apparatus of claim 1 wherein: Each column of the shaping structure includes several shaping teeth arranged sequentially from top to bottom. Two adjacent shaping teeth in each column of the shaping structure form a shaping groove, and the groove opening width is 2.5-3.5mm.

5. The apparatus of claim 1 wherein: It also includes a rotary drive component, which is connected to the mounting plate via a rotary shaft. After the quartz boat is mounted on the mounting platform, the rotary drive component drives the rotary shaft to rotate, thereby causing the mounting plate, the shaping component, and the mounting platform to rotate together by 90°, so that the mounting plate is flipped onto a flat surface, so that the opening of the shaping groove faces upward toward the silicon wafer side inside the quartz boat.

6. The apparatus according to claim 1 or 5, wherein The front surface of the mounting plate is also provided with at least two blocking strips. The two blocking strips are located on the left and right outer sides of the shaping component, and the height of the blocking strips is greater than the height of the shaping structure, so that when the mounting plate is flipped onto the plane, the side of the silicon wafer inside the quartz boat contacts the blocking strips first.

7. A silicon wafer shaping apparatus as claimed in claim 5, wherein The rotary drive is located on the left or right outer side of the mounting plate. The rotary shaft includes a first rotary shaft arranged in the front-back direction and a second rotary shaft arranged in the left-right direction. One end of the first rotary shaft is rotatably connected to the rotary drive, and the other end of the first rotary shaft is rotatably connected to the second rotary shaft through a coupling. The second rotary shaft is fixedly connected to the mounting plate through a fixing block.

8. A silicon wafer shaping apparatus as claimed in claim 7, wherein It also includes a mounting base located below the mounting plate. The rotary drive is mounted on the mounting base via a bracket. The two ends of the second rotary shaft are located on the left and right outer sides of the mounting plate, respectively, and the two ends of the second rotary shaft are mounted on the mounting base via a first bearing seat and a second bearing seat, respectively.

9. The apparatus of claim 7 wherein: The lower end of the mounting plate and the lower surface of the mounting platform are also provided with reinforcing ribs, and the reinforcing ribs are provided with through holes for the second rotating shaft to pass through.

10. The apparatus of claim 1 wherein: The moving drive component is fixedly installed on the lower surface of the installation platform, and the moving output end of the moving drive component is connected to the shaping component. The rear end of the installation platform is also provided with an elongated hole for the moving output end of the moving drive component to drive the shaping component to move.

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