Workpiece conveying unit and substrate cutting apparatus comprising the same

Abstract

This utility model relates to a workpiece conveying unit and a substrate cutting device including the same. The workpiece conveying unit adsorbs and conveys a workpiece with a substrate bonded to it by adhesive tape through an opening in a shielding bracket. The workpiece conveying unit comprises: a first support rod with an adsorption nozzle for adsorbing one side of the workpiece; a second support rod with an adsorption nozzle for adsorbing the other side of the workpiece; a guide rod intersecting the first and second support rods to guide their movement; a rotating rod whose inner side is connected to the inner side of the guide rod via a rotating shaft and rotates about the rotating shaft; a first telescopic rod whose one side is connected to the inner side of the first support rod via a rotating shaft and whose other side is connected to one side of the rotating rod via a rotating shaft; and a second telescopic rod whose one side is connected to the inner side of the second support rod via a rotating shaft and whose other side is connected to the other side of the rotating rod via the rotating shaft.

Description

Technical Field

[0001] This utility model relates to a workpiece conveying unit and a substrate cutting device including the workpiece conveying unit. Background Technology

[0002] Substrates used in semiconductor processes are separated into chip units by cutting them using a substrate dicing device.

[0003] Such substrates include wafers, sapphire, and glass.

[0004] In order to transport the substrate, the substrate cutting device uses adhesive tape to bond the support with an opening to the substrate to form a workpiece.

[0005] Such workpieces are attached to the workpiece conveying unit for transport.

[0006] The diameter of the workpiece varies depending on the diameter of the substrate. For example, the substrate diameter can be 8 inches or 12 inches, and the support has a corresponding diameter, so the diameter of the workpiece varies depending on the diameter of the substrate.

[0007] In order to transport workpieces of different diameters, it is necessary to change the position of the suction nozzle in the workpiece conveying unit that adsorbs the workpiece.

[0008] The recent demand is for technologies that allow for easy repositioning of the suction nozzle.

[0009] (Patent Document 1) JP3765265B2 Utility Model Content

[0010] The purpose of this invention is to provide a workpiece conveying unit and a substrate cutting device including the workpiece conveying unit.

[0011] According to an embodiment of the present invention, a workpiece conveying unit adsorbs and conveys a workpiece with a substrate bonded to it by adhesive tape through an opening in a shielding bracket. The workpiece conveying unit includes: a first support rod with an adsorption nozzle for adsorbing one side of the workpiece; a second support rod with an adsorption nozzle for adsorbing the other side of the workpiece; a guide rod that crosses the first and second support rods to guide their movement; a rotating rod whose inner side is connected to the inner side of the guide rod via a rotating shaft and rotates about the rotating shaft; a first telescopic rod whose one side is connected to the inner side of the first support rod via a rotating shaft and whose other side is connected to one side of the rotating rod via a rotating shaft; and a second telescopic rod whose one side is connected to the inner side of the second support rod via a rotating shaft and whose other side is connected to the other side of the rotating rod via a rotating shaft.

[0012] According to an embodiment, the first telescopic rod and the second telescopic rod are positioned such that the distance between the first support rod and the second support rod is separated or brought closer together according to the rotation direction of the rotating rod, so as to be able to transport workpieces of different diameters.

[0013] According to an embodiment, the first telescopic rod and the second telescopic rod cause the first support rod and the second support rod to move, thereby adjusting the distance between the first support rod and the second support rod to a first distance or a second distance.

[0014] According to an embodiment, the workpiece conveying unit further includes: a first fixed part disposed on the guide rod at a position corresponding to a first spacing; a second fixed part disposed on the guide rod at a position corresponding to a second spacing; and a fixing part disposed on the first support rod and selectively fixed to the first fixed part or the second fixed part.

[0015] According to an embodiment, the first fixed part and the second fixed part are grooves; the fixing part is a pin inserted into the groove; the fixing part is inserted into the first fixed part or the second fixed part to fix the distance between the first support rod and the second support rod.

[0016] According to an embodiment, the workpiece conveying unit further includes: a first sensor unit disposed on the guide rod at a position corresponding to a first spacing; a second sensor unit disposed on the guide rod at a position corresponding to a second spacing; and a sensing unit disposed on the first support rod to selectively sense the first sensor unit or the second sensor unit.

[0017] According to the embodiment, the sensing part is sensed by the first sensor unit when the first support rod is adjusted to a first spacing, and by the second sensor unit when the first support rod is adjusted to a second spacing.

[0018] According to an embodiment, a substrate cutting apparatus includes a workpiece conveying unit. The substrate cutting apparatus further includes: a standby stage, which is used to hold the workpiece in place before it is adsorbed and conveyed by the workpiece conveying unit for the purpose of performing the cutting process; a first standby sensor unit and a second standby sensor unit, which selectively sense the diameter of the workpiece placed on the standby stage; and a control unit, which receives first information sensed by the first sensor unit or the second sensor unit and second information sensed by the first standby sensor unit or the second standby sensor unit.

[0019] According to the embodiment, the control unit compares the first information and the second information to determine whether the workpiece conveying unit can convey the input workpiece.

[0020] According to the embodiment, if the second standby sensor unit senses the workpiece in a state sensed by the first sensor unit instead of the first standby sensor unit, or if the first standby sensor unit senses the workpiece in a state sensed by the second sensor unit instead of the second standby sensor unit, then it is determined that the diameter of the input workpiece is inconsistent with the diameter of the workpiece that the workpiece conveying unit can convey.

[0021] It has the effect of easily changing the position of the suction nozzle based on the workpiece diameter. Attached Figure Description

[0022] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Although similar reference numerals denote similar constituent elements, the present invention is not limited thereto.

[0023] Figure 1 This is a diagram relating to a workpiece conveying unit for conveying a workpiece of a first diameter according to an embodiment of the present invention.

[0024] Figure 2 This is a diagram relating to a workpiece conveying unit for conveying a workpiece of a second diameter according to an embodiment of the present invention.

[0025] Figure 3 This is a diagram relating to a substrate cutting apparatus including a workpiece conveying unit according to an embodiment of the present invention.

[0026] (Explanation of reference numerals in the attached diagram)

[0027] 1: Workpiece conveying unit; 11: Support frame

[0028] 12: Adhesive tape 13: Substrate

[0029] 10: Workpiece S: Adsorption nozzle

[0030] 110: Guide rod; 121: First support rod

[0031] 122: Second support rod; R: Rotation shaft

[0032] 210: Rotating rod; 221: First telescopic rod

[0033] 222: Second telescopic rod; 310: Fixing part

[0034] 321: First fixed part; 322: Second fixed part

[0035] 410: Sensing unit; 421: First sensor unit

[0036] 422: Second sensor unit 2: Standby station Detailed Implementation

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which the present invention pertains can easily implement it.

[0038] This invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0039] like Figure 1 as well as Figure 2 As shown, according to an embodiment of the present invention, the workpiece conveying unit 1 can adsorb and convey the workpiece 10, on which the substrate 13 is bonded, through the adsorption nozzle S.

[0040] The diameter of workpiece 10 can vary depending on the diameter of substrate 13. For example, substrate 13 can have a diameter of 8 inches or 12 inches, and support 11 can have a corresponding diameter, so the diameter of workpiece 10 can vary depending on the diameter of substrate 13.

[0041] According to an embodiment of the present invention, the workpiece conveying unit 1 may include a first support rod 121, a second support rod 122, a guide rod 110, a rotating rod 210, a first telescopic rod 221, and a second telescopic rod 222.

[0042] The first support rod 121 can be equipped with suction nozzles S to suction one side of the workpiece 10. The suction nozzles S can be respectively disposed on both sides of the first support rod 121.

[0043] The second support rod 122 can be equipped with suction nozzles S to suction the other side of the workpiece 10. The suction nozzles S can be respectively disposed on both sides of the second support rod 122.

[0044] The suction nozzles S, which are configured on the first support rod 121 and the second support rod 122, can adsorb the support 11 of the workpiece 10 at multiple positions and stably transport the workpiece 10.

[0045] The guide rod 110 can cross the first support rod 121 and the second support rod 122 to guide the movement of the first support rod 121 and the second support rod 122. The first support rod 121 and the second support rod 122 can be coupled to the track of the guide rod 110 and guided to move by the track.

[0046] The inner side of the rotating rod 210 can be connected to the inner side of the guide rod 110 through the rotating shaft R and rotate with the rotating shaft R as a reference.

[0047] One side of the first telescopic rod 221 can be connected to the inner side of the first support rod 121 via a rotating shaft R, and the other side can be connected to one side of the rotating rod 210 via a rotating shaft R.

[0048] One side of the second telescopic rod 222 can be connected to the inner side of the second support rod 122 via a rotating shaft R, and the other side can be connected to the other side of the rotating rod 210 via a rotating shaft R.

[0049] The first telescopic rod 221 and the second telescopic rod 222 can be spaced apart or brought closer together depending on the rotation direction of the rotating rod 210, so as to be able to transport workpieces 10 of different diameters. For example, when the rotating rod 210 rotates clockwise, the distance between the first support rod 121 and the second support rod 122 can be separated, and when the rotating rod 210 rotates counterclockwise, the distance between the first support rod 121 and the second support rod 122 can be brought closer together.

[0050] Regarding the spacing between the first support rod 121 and the second support rod 122, it can be, for example... Figure 1 As shown, the separated state is the state used for conveying workpiece 10 of the first diameter, as... Figure 2 As shown, the close-up state is the state used for conveying the workpiece 10 of the second diameter.

[0051] Specifically, the first telescopic rod 221 and the second telescopic rod 222 can move the first support rod 121 and the second support rod 122 to adjust the distance between the first support rod 121 and the second support rod 122 to a first distance or a second distance. For example, a workpiece 10 of the first diameter can be bonded to a 12-inch substrate 13 and transported at the first distance. Alternatively, a workpiece 10 of the second diameter can be bonded to an 8-inch substrate 13 and transported at the second distance.

[0052] Specifically, the workpiece conveying unit 1 may also include a first fixed part 321, a second fixed part 322, and a fixing part 310.

[0053] The first fixed part 321 can be disposed at the position of the guide rod 110 corresponding to the first spacing.

[0054] The second fixed part 322 can be disposed at the position of the guide rod 110 corresponding to the second spacing.

[0055] The fixing part 310 can be disposed on the first support rod 121 and selectively fixed to the first fixed part 321 or the second fixed part 322.

[0056] Specifically, the first fixed portion 321 and the second fixed portion 322 can be grooves. The fixing portion 310 can be a pin inserted into the groove. The fixing portion 310 of the pin can be inserted into the first fixed portion 321 or the second fixed portion 322 of the groove to fix the distance between the first support rod 121 and the second support rod 122.

[0057] Specifically, the workpiece conveying unit 1 may further include a first sensor unit 421, a second sensor unit 422, and a sensing unit 410.

[0058] The first sensor unit 421 can be configured at a position on the guide rod 110 corresponding to the first spacing.

[0059] The second sensor unit 422 can be configured at a position on the guide rod 110 corresponding to the second spacing.

[0060] The sensing unit 410 can be disposed on the first support rod 121 to selectively sense the first sensor unit 421 or the second sensor unit 422.

[0061] In addition, specifically, if the first support rod 121 is adjusted to the first spacing, the sensing unit 410 can be sensed by the first sensor unit 421.

[0062] If the first support rod 121 is adjusted to the second spacing, the sensing unit 410 can be sensed by the second sensor unit 422.

[0063] like Figure 3 As shown, the substrate cutting apparatus according to an embodiment of the present invention may include a workpiece conveying unit 1, a standby stage 2, a first standby sensor unit, a second standby sensor unit, and a control unit.

[0064] The standby table 2 allows the workpiece 10 to remain in standby mode before being picked up and transported by the workpiece conveying unit 1 for the cutting process. The workpiece 10 can be placed on the table for standby or stored in a carrier for standby.

[0065] The first standby sensor unit (not shown) and the second standby sensor unit (not shown) can selectively sense the diameter D1 of the workpiece 10 placed on the standby stage 2. For example, the first standby sensor unit and the second standby sensor unit can directly sense the workpiece 10 through a sensing sensor, or indirectly sense the position of the bracket that is adjusted to match the diameter of the workpiece 10.

[0066] The control unit (not shown) can receive first information sensed by the first sensor unit 421 or the second sensor unit 422, and second information sensed by the first standby sensor unit or the second standby sensor unit. The control unit can compare the received first information and second information to determine whether the workpiece conveying unit 1 can convey the input workpiece 10.

[0067] Specifically, if the second standby sensor unit senses the workpiece 10 but not the workpiece 10 in a state sensed by the first sensor unit 421, or if the first standby sensor unit senses the workpiece 10 but not the workpiece 10 in a state sensed by the second sensor unit, then it is determined that the diameter D1 of the input workpiece 10 is inconsistent with the diameter D2 of the workpiece 10 that the workpiece conveying unit 1 can convey.

[0068] The present invention has been described in detail above through preferred embodiments, but the present invention is not limited thereto and can be implemented in various ways within the scope of the claims.

Claims

1. A workpiece conveying unit, comprising adsorbing and conveying a workpiece with a substrate bonded to it by adhesive tape at an opening of a shielding bracket, characterized in that, The workpiece conveying unit includes: The first support rod is equipped with an adsorption nozzle to adsorb one side of the workpiece; The second support rod is equipped with an adsorption nozzle to adsorb the other side of the workpiece; A guide rod, intersecting the first support rod and the second support rod, guides the movement of the first support rod and the second support rod; The inner side of the rotating rod is connected to the inner side of the guide rod through a rotating shaft and rotates around the rotating shaft as a reference. The first telescopic rod has one side connected to the inner side of the first support rod via a rotating shaft and the other side connected to one side of the rotating rod via a rotating shaft; and The second telescopic rod has one side connected to the inner side of the second support rod via a rotating shaft and the other side connected to the other side of the rotating rod via a rotating shaft; The first telescopic rod and the second telescopic rod are spaced apart or brought closer together according to the rotation direction of the rotating rod, so as to be able to transport workpieces of different diameters.

2. The workpiece conveying unit according to claim 1, characterized in that, The first telescopic rod and the second telescopic rod move the first support rod and the second support rod to adjust the distance between the first support rod and the second support rod to a first distance or a second distance.

3. The workpiece conveying unit according to claim 2, characterized in that, The workpiece conveying unit further includes: The first fixed part is disposed at the position of the guide rod corresponding to the first spacing; The second fixed part is disposed at a position on the guide rod corresponding to the second spacing; and A fixing part is disposed on the first support rod and selectively fixed to the first fixing part or the second fixing part.

4. The workpiece conveying unit according to claim 3, characterized in that, The first fixed portion and the second fixed portion are grooves; The fixing part is a pin that is inserted into the groove; The fixing part is inserted into the first fixing part or the second fixing part to fix the distance between the first support rod and the second support rod.

5. The workpiece conveying unit according to claim 2, characterized in that, The workpiece conveying unit further includes: The first sensor unit is disposed on the guide rod at a position corresponding to the first spacing; The second sensor unit is disposed at a position on the guide rod corresponding to the second spacing; and A sensing unit, disposed on the first support rod, selectively senses either the first sensor unit or the second sensor unit. If the first support rod is adjusted to the first spacing, the sensing part is sensed by the first sensor part. If the first support rod is adjusted to the second spacing, the sensing part is sensed by the second sensor part.

6. A substrate cutting apparatus characterized by comprising: Includes the workpiece conveying unit according to any one of claims 1 to 5.

7. The substrate cutting apparatus according to claim 6, characterized in that, When the substrate cutting apparatus includes the workpiece conveying unit as described in claim 5 The substrate cutting device further includes: The standby table is used to allow the workpiece to stand by before it is picked up and transported by the workpiece conveying unit in preparation for the cutting process. The first standby sensor unit and the second standby sensor unit selectively sense the diameter of the workpiece placed on the standby station; and The control unit receives first information sensed by the first sensor unit or the second sensor unit, and second information sensed by the first standby sensor unit or the second standby sensor unit. The control unit compares the first information and the second information to determine whether the workpiece conveying unit can convey the input workpiece.

8. The substrate cutting apparatus according to claim 7, characterized in that, If the state is sensed by the first sensor unit but is sensed by the second standby sensor unit instead of the first standby sensor unit, or if the state is sensed by the second sensor unit but is sensed by the first standby sensor unit instead of the second standby sensor unit, It is determined that the diameter of the input workpiece is inconsistent with the diameter of the workpiece that the workpiece conveying unit can convey.

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