A silicon wafer extraction mechanism

Abstract

This utility model relates to a silicon wafer extraction mechanism, including a material platform with a horizontally arranged groove; a silicon wafer basket with inserts placed inside the groove; a conveyor frame with roller seats and a distance sensor; at least two drive rollers are arranged on the roller seats; a conveyor belt is wound around the drive rollers; a base with a lifting cylinder; the lifting cylinder supports the material platform; wherein, the silicon wafers in the silicon wafer baskets are arranged horizontally; near one end of the silicon wafer basket, the roller seat extends out of the outer edge of the conveyor frame to form a suspended section; the distance sensor is arranged on the suspended section; vertically, the silicon wafers in the silicon wafer baskets coincide with the suspended section. This utility model automatically determines, through the distance sensor, whether a silicon wafer in contact with the conveyor belt has been extracted from the silicon wafer basket, thus improving the intelligence level of the silicon wafer extraction mechanism.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, and in particular to a silicon wafer extraction mechanism. Background Technology

[0002] The silicon wafer basket is equipped with strip partitions that form multiple card slots. Several silicon wafers are placed in these card slots to prevent them from contacting and sticking together.

[0003] When automatically feeding silicon wafers into the wafer tray, the tray moves relative to the conveyor belt, allowing each wafer to contact the belt one by one. The friction between the conveyor belt and the wafer then pulls the wafer out of the slot. Existing moving wafer tray devices use a step-by-step drive, moving the tray a fixed distance periodically. This method has poor responsiveness; even if the conveyor belt hasn't pulled out the currently contacted wafer, the tray will still move the predetermined distance, causing un-pulled wafers to be crushed and damaged by the conveyor belt. This damage necessitates machine shutdown for conveyor belt cleaning, wasting wafers and reducing wafer feeding efficiency.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a silicon wafer extraction mechanism to improve the intelligence level of the silicon wafer extraction mechanism.

[0006] The technical solution of this utility model is as follows:

[0007] The silicon wafer extraction mechanism includes:

[0008] The material platform has a horizontally arranged groove; a silicon wafer basket with inserts is placed in the groove.

[0009] The conveyor frame is equipped with roller seats and distance sensors; at least two drive rollers are provided on the roller seats; a conveyor belt is wound around the drive rollers;

[0010] The base is equipped with a lifting cylinder; the lifting cylinder supports the material platform.

[0011] The silicon wafers in the silicon wafer basket are arranged horizontally; near one end of the silicon wafer basket, the roller seat extends out of the outer edge of the conveyor frame to form a suspended section; the distance sensor is arranged on the suspended section; in the vertical direction, the silicon wafers in the silicon wafer basket and the suspended section overlap.

[0012] A further technical solution is that a support plate is provided between the base and the material platform; the lifting cylinder supports the support plate; the material platform is rotatably connected to the support plate; a tilting cylinder is also provided on the support plate; the end of the tilting cylinder away from the support plate is connected to the material platform.

[0013] A further technical solution is that a first protrusion extends from the bearing plate; the tilting cylinder is rotatably connected to the first protrusion via a pin; a second protrusion is also provided on the material platform; the tilting cylinder is rotatably connected to the second protrusion via a pin.

[0014] A further technical solution is that two first columns are vertically arranged on the bearing plate; the material platform is rotatably connected to the material platform via a rotating shaft.

[0015] A further technical solution is that two second columns are vertically arranged on the support plate; when the material platform is parallel to the support plate, the second columns contact the material platform.

[0016] A further technical solution is that a baffle is provided on the outer edge of the material platform; a groove is formed between the baffle and the material platform.

[0017] A further technical solution is that when the material platform is set vertically, a notch is opened on the baffle below; the notch is aligned with the silicon wafers in the silicon wafer basket.

[0018] A further technical solution is that the silicon wafer basket includes a base plate, a side plate disposed on the opposite side of the base plate, and a strip partition disposed on the side plate; a slot is formed between adjacent strip partitions; and the silicon wafer is disposed in the slot.

[0019] A further technical solution is that two silicon wafer baskets are arranged side by side on the material platform; correspondingly, two sets of conveyor belts are arranged on the conveyor frame to align the two silicon wafer baskets.

[0020] A further technical solution is that at least three lifting cylinders are provided; the three lifting cylinders together support the material platform.

[0021] The beneficial technical effects of this utility model are as follows:

[0022] (1) In the silicon wafer extraction mechanism of this utility model, a lifting cylinder drives a material platform supporting a silicon wafer basket, and the conveyor belt of the suspended section aligns with the silicon wafers in the silicon wafer basket. The lifting cylinder drives the material platform to descend, causing the silicon wafers in the silicon wafer basket to contact the conveyor belt. Utilizing the friction between the conveyor belt and the silicon wafers, the conveyor belt extracts the silicon wafers from the silicon wafer basket. Subsequently, the lifting cylinder continues to lower the material platform, thus extracting all the silicon wafers in the silicon wafer basket, automatically extracting the silicon wafers from the silicon wafer basket. Furthermore, a distance sensor is installed on the suspended section, which can preset the distance between the distance sensor and the silicon wafer in contact with the conveyor belt. If the conveyor belt accidentally fails to extract a contacting silicon wafer, the distance sensor detects that there are still silicon wafers within the preset distance, automatically determining that the silicon wafer in contact with the conveyor belt has not been extracted from the silicon wafer basket. This judgment can be made without operator observation, improving the intelligence level of the silicon wafer extraction mechanism.

[0023] (2) Furthermore, a tilting cylinder is provided between the support plate and the material platform. By extending and retracting the tilting cylinder, the material platform can be driven to rotate around the support plate to switch the material platform to be horizontal or vertical. When the material platform is horizontal, it is convenient to place the silicon wafer basket in the groove. When the material platform is vertical, it is convenient for the conveyor belt to extract the silicon wafers from the silicon wafer basket.

[0024] (3) Furthermore, two silicon wafer baskets are arranged side by side on a material platform, and two sets of conveyor belts are also set on the conveyor frame to simultaneously extract silicon wafers from the two silicon wafer baskets, thereby improving the extraction efficiency of silicon wafers. Attached Figure Description

[0025] Figure 1 A three-dimensional structural schematic diagram of a silicon wafer extraction mechanism according to an embodiment of the present disclosure is shown.

[0026] Figure 2 A schematic diagram of the cooperation structure between the silicon wafer basket and the conveyor belt in a silicon wafer extraction mechanism according to an embodiment of the present disclosure is shown.

[0027] Figure 3 A schematic diagram of the material platform and support plate in a silicon wafer extraction mechanism according to an embodiment of the present disclosure is shown.

[0028] Marked in the attached diagram:

[0029] 1. Base; 11. Lifting cylinder; 2. Bearing plate; 21. First column; 211. Rotating shaft; 22. Second column; 23. Tilting cylinder; 24. First protrusion; 3. Material platform; 31. Baffle; 311. Notch; 32. Second protrusion; 33. Groove; 4. Silicon wafer basket; 41. Base plate; 42. Side plate; 43. Strip partition; 431. Slot; 5. Conveyor frame; 51. Conveyor belt; 511. Motor; 52. Roller seat; 521. Transmission roller; 522. Suspended section; 6. Distance sensor. Detailed Implementation

[0030] To make the objectives, features, and advantages of this utility model more apparent and understandable, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes and to aid those skilled in the art in understanding and reading the content disclosed herein. They are not intended to limit the implementation conditions of this utility model and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model.

[0031] In the description of this utility model, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Figure 1 A three-dimensional structural schematic diagram of a silicon wafer extraction mechanism according to an embodiment of the present disclosure is shown. Figure 2 A schematic diagram of the fit between the silicon wafer tray and the conveyor belt in a silicon wafer extraction mechanism according to an embodiment of this disclosure is shown. Please refer to... Figure 1 and Figure 2 The silicon wafer extraction mechanism includes a material platform 3 with a horizontally arranged groove 33. A wafer-type silicon wafer basket 4 is placed within the groove 33. A conveyor frame 5 is equipped with a roller seat 52 and a distance sensor 6. At least two drive rollers 521 are mounted on the roller seat 52. The drive rollers 521 are connected to the roller seat 52 via a rotating shaft (not shown in the figure) and a bearing. The rotating shaft is connected to a motor 511. A conveyor belt 51 is wound around the drive rollers 521. A base 1 is equipped with a lifting cylinder 11. The lifting cylinder 11 supports the material platform 3. Vertically, the silicon wafers in the wafer basket 4 overlap with the suspended section 522. The lifting cylinder 11 drives the material platform 3 to descend, causing the silicon wafers in the wafer basket 4 to contact the conveyor belt 51. Utilizing the friction between the conveyor belt 51 and the silicon wafers, the conveyor belt 51 extracts the silicon wafers from the wafer basket 4. Subsequently, the lifting cylinder 11 continues to lower the material platform 3, which can extract all the silicon wafers in the silicon wafer basket 4, thus automatically extracting the silicon wafers in the silicon wafer basket 4.

[0033] In this design, the silicon wafers within the wafer basket 4 are horizontally positioned. Near one end of the wafer basket 4, a roller seat 52 extends beyond the outer edge of the conveyor frame 5, forming a suspended section 522. A distance sensor 6 is mounted on this suspended section 522. The distance between the distance sensor 6 and the silicon wafer contacting the conveyor belt 51 can be preset. If the conveyor belt 51 fails to extract a contacting silicon wafer, the distance sensor 6 detects that a silicon wafer remains within the preset distance. This allows the sensor to automatically determine that the silicon wafer in contact with the conveyor belt 51 has not been extracted from the wafer basket 4, enabling the operator to make this judgment without intervention and enhancing the intelligence of the wafer extraction mechanism.

[0034] In some embodiments, the lifting cylinder 11 is controlled by a programmable logic controller (PLC), and the distance sensor 6 is connected to the PLC. When the distance sensor 6 detects a silicon wafer at a preset position, it sends an electrical signal to the PLC, at which point the PLC prevents the lifting cylinder 11 from retracting, thereby improving the automation level of the silicon wafer extraction mechanism.

[0035] The aforementioned distance sensor 6 can be an ultrasonic ranging sensor, a laser ranging sensor, or an infrared ranging sensor.

[0036] Please refer to Figure 1 A support plate 2 is also provided between the base 1 and the material platform 3. A lifting cylinder 11 supports the support plate 2. The material platform 3 is rotatably connected to the support plate 2. A tilting cylinder 23 is also provided on the support plate 2. The end of the tilting cylinder 23 away from the support plate 2 is connected to the material platform 3. Specifically, a first protrusion 24 extends from the support plate 2. The tilting cylinder 23 is rotatably connected to the first protrusion 24 by a pin. A second protrusion 32 is also provided on the material platform 3. The tilting cylinder 23 is rotatably connected to the second protrusion 32 by a pin. By extending and retracting the tilting cylinder 23, the material platform 3 can be driven to rotate around the support plate 2 to switch the material platform 3 to be horizontal or vertical. When the material platform 3 is horizontal, it is convenient to place the silicon wafer basket 4 in the groove 33. When the material platform 3 is vertical, it is convenient for the conveyor belt 51 to extract the silicon wafers in the silicon wafer basket 4.

[0037] Preferably, two first columns 21 are vertically arranged on the support plate 2. The material platform 3 is rotatably connected to the support plate 2 via a rotating shaft 211. Two second columns 22 are vertically arranged on the support plate 2. When the material platform 3 is parallel to the support plate 2, the second columns 22 contact the material platform 3. The first columns 21 and the second columns 22 cooperate to support the material platform 3, leaving a gap between the material platform 3 and the support plate 2 to accommodate the tilting cylinder 23.

[0038] Figure 3 A schematic diagram of the material stage and support plate in a silicon wafer extraction mechanism according to an embodiment of this disclosure is shown. Please refer to... Figure 1 and Figure 3A baffle 31 is provided on the outer edge of the material platform 3, and the baffle 31 is arranged around the material platform 3, forming a groove 33 between the baffle 31 and the material platform 3. The silicon wafer basket 4 is arranged in the groove 33. When the material platform 3 is set vertically, the baffle 31 below supports the silicon wafer basket 4.

[0039] Preferably, when the material platform 3 is vertically arranged, a notch 311 is provided on the lower baffle 31. The notch 311 is aligned with the silicon wafers inside the silicon wafer basket 4. The conveyor belt 51 rises into the notch 311 and contacts the bottom silicon wafer of the silicon wafer basket 4. The notch 311 prevents the conveyor belt 51 from interfering with the baffle 31.

[0040] More preferably, at least three lifting cylinders 11 are provided. The three lifting cylinders 11 together support the material platform 3, ensuring the stability of the material platform 3.

[0041] Please refer to Figure 1 and Figure 2 The silicon wafer basket 4 includes a base plate 41, a side plate 42 disposed on the opposite side of the base plate 41, and strip partitions 43 disposed on the side plate 42. A slot 431 is formed between adjacent strip partitions 43. The silicon wafer is disposed in the slot 431. When the material table 3 is vertically arranged, the side plate 42 of the silicon wafer basket 4 in the groove 33 is also vertically arranged.

[0042] Preferably, two silicon wafer baskets 4 are arranged side by side on the material platform 3. Correspondingly, two sets of conveyor belts 51 are arranged on the conveyor frame 5 to align with the two silicon wafer baskets 4. Each set of conveyor belts 51 includes two conveyor belts 51, ensuring that the conveyor belts 51 stably support the silicon wafers when they are being pulled out of the silicon wafer baskets 4. The two sets of conveyor belts 51 cooperate to simultaneously pull out the silicon wafers from the two silicon wafer baskets 4, improving the silicon wafer extraction efficiency.

[0043] The specific workflow of this utility model is as follows:

[0044] The tilting cylinder 23 retracts, driving the material platform 3 to rotate around the support plate 2 until the second column 22 contacts the material platform 3. The operator or the feeding equipment places the silicon wafer basket 4 containing silicon wafers into the groove 33. The tilting cylinder 23 extends, driving the material platform 3 to rotate around the support plate 2 until the material platform 3 is vertical, at which point the lower baffle 31 supports the silicon wafer basket 4. The motor 511 drives the transmission roller 521 to rotate, and the electric conveyor belt 51 moves. The lifting cylinder 11 opens and retracts until the distance sensor 6 detects that the silicon wafer has moved to the preset position. At this time, the silicon wafer contacts the moving conveyor belt 51, and the conveyor belt 51 pulls the silicon wafer out of the slot 431 through friction. After the silicon wafer is pulled out of the slot 431 and moves away from the distance sensor 6, the distance sensor 6 no longer detects the silicon wafer. At this time, the lifting cylinder 11 retracts again to lower the silicon wafer basket 4 until the distance sensor 6 detects that the silicon wafer has moved to the preset position. The lifting cylinder 11 lowers the silicon wafer basket 4 and the distance sensor 6 detects the distance to the silicon wafers alternately until all the silicon wafers in the silicon wafer basket 4 are extracted by the conveyor belt 51, thus completing the extraction of silicon wafers from the silicon wafer basket 4.

[0045] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A silicon wafer extraction mechanism, comprising: The silicon wafer extraction mechanism includes: The material platform has a horizontally arranged groove; a silicon wafer basket with inserts is placed in the groove. The conveyor frame is equipped with roller seats and distance sensors; at least two drive rollers are provided on the roller seats; a conveyor belt is wound around the drive rollers; The base is equipped with a lifting cylinder; the lifting cylinder supports the material platform. The silicon wafers in the silicon wafer basket are arranged horizontally; near one end of the silicon wafer basket, the roller seat extends out of the outer edge of the conveyor frame to form a suspended section; the distance sensor is arranged on the suspended section; in the vertical direction, the silicon wafers in the silicon wafer basket and the suspended section overlap.

2. The silicon wafer extraction mechanism of claim 1, wherein: A support plate is also provided between the base and the material platform; the lifting cylinder supports the support plate; the material platform is rotatably connected to the support plate; a tilting cylinder is also provided on the support plate; the end of the tilting cylinder away from the support plate is connected to the material platform.

3. The silicon wafer extraction mechanism of claim 2, wherein: A first protrusion extends from the support plate; the tilting cylinder is rotatably connected to the first protrusion via a pin; a second protrusion is also provided on the material platform; the tilting cylinder is rotatably connected to the second protrusion via a pin.

4. The silicon wafer extraction mechanism as described in claim 2, characterized in that: Two first columns are vertically arranged on the support plate; the material platform is rotatably connected to the material platform via a rotating shaft.

5. The silicon wafer extraction mechanism as described in claim 3, characterized in that: Two second columns are vertically arranged on the support plate; when the material platform is parallel to the support plate, the second columns contact the material platform.

6. The silicon wafer extraction mechanism as described in claim 1, characterized in that: A baffle is provided on the outer edge of the material platform; a groove is formed between the baffle and the material platform.

7. The silicon wafer extraction mechanism as described in claim 6, characterized in that: When the material platform is set vertically, a notch is opened on the baffle below; the notch is aligned with the silicon wafers in the silicon wafer basket.

8. The silicon wafer extraction mechanism as described in claim 1, characterized in that: The silicon wafer basket includes a base plate, a side plate disposed on the opposite side of the base plate, and strip partitions disposed on the side plates; a slot is formed between adjacent strip partitions; and a silicon wafer is disposed in the slot.

9. The silicon wafer extraction mechanism as described in claim 1, characterized in that: Two silicon wafer baskets are arranged side by side on the material platform; correspondingly, two sets of conveyor belts are arranged on the conveyor frame to align the two silicon wafer baskets.

10. The silicon wafer extraction mechanism as described in claim 1, characterized in that: At least three lifting cylinders are provided; the three lifting cylinders together support the material platform.

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