An automatic wafer handling apparatus for wafer inspection
By using a multi-directional moving drive and a negative pressure hole design in the wafer inspection equipment, the wafer moving mechanism is simplified, the cumbersome problems in the prior art are solved, and more efficient and reliable wafer handling and inspection are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU POWER TECH CO LTD
- Filing Date
- 2025-07-04
- Publication Date
- 2026-06-19
AI Technical Summary
Existing wafer inspection equipment has a cumbersome moving mechanism, complex hardware structure and control program, resulting in high failure rate and increased manufacturing cost.
A multi-directional moving drive device is adopted, with two pairs of switchable insert plates. The insert plates have negative pressure holes to stabilize wafer movement, simplifying the drive device and control program. The wafer is moved alternately to the testing equipment and wafer cassette through the insert plates.
This reduces the complexity of hardware structure and control programs, improves the stability and efficiency of wafer movement, and reduces failure rate and manufacturing costs.
Smart Images
Figure CN224386095U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of wafer inspection technology, and in particular relates to an automatic wafer handling device for wafer inspection. Background Technology
[0002] Wafer manufacturing is an extremely complex process. Elemental silicon requires multiple refining and processing steps, including impurity removal, purity adjustment, and crystal growth rate control. Afterward, it undergoes crystal growth, dicing and polishing, and cleaning to obtain a wafer blank. This blank then undergoes numerous processes such as photolithography, wet etching, and dry etching to create the desired patterns and structures. Therefore, defects, impurities, or inhomogeneities are inevitable on wafers, which can lead to performance degradation or even chip failure. With the rapid development of semiconductor technology, wafer size and integration have continuously increased. Early manual inspection methods were inefficient and unable to meet the needs of large-scale production. With the development of electro-optics, image processing, and AI technologies, automated inspection technologies are gradually replacing manual inspection.
[0003] Chinese patent document CN119361491A discloses a wafer transport and inspection machine, including a main unit housing, a wafer hopper, a hopper lifting drive device, an inlet / outlet arm, an inlet / outlet arm translation drive device, a central suction cup, a suction cup lifting drive device, a suction cup horizontal adjustment mechanism, a suction cup flipping drive device, a suction cup rotation drive device, an edge-finding sensor, an edge-finding sensor advance / retreat drive device, a flipping arm, a flipping arm lifting and turning drive device, a first inspection and handling arm, a second inspection and handling arm, an inspection and handling arm lifting drive device, and an inspection and handling arm translation drive device. It can be placed on a table or workbench to perform microscopic inspection of wafers with a microscope. It can automatically load, flip, find edges, transport, and unload wafers for microscopic inspection. It can assist operators in performing wafer surface inspection, back edge inspection, back center inspection, and microscopic inspection.
[0004] In the aforementioned patented solution, the first inspection and handling arm, the second inspection and handling arm, the inbound / outbound arm, and each corresponding independent drive device are often not required to work simultaneously in actual applications, but rather to work sequentially and alternately. Therefore, the three actuators / arms used for handling are redundant, resulting in complex hardware structures and control programs, which inevitably increases the failure rate and manufacturing costs. Utility Model Content
[0005] To overcome the technical problems of cumbersome wafer moving mechanisms, complex hardware structures and control programs in existing wafer inspection technologies, which increase overall failure rates and manufacturing costs, this invention aims to provide an automated wafer handling device for wafer inspection. This device utilizes a multi-directionally movable drive unit with two pairs of switchable insert plates. The insert plates also have negative pressure holes for stabilizing the wafers. The two pairs of insert plates move alternately and reciprocally, moving the wafers from the wafer cassette to the inspection device and then returning them to the wafer cassette. This reduces the number of actuators and the drive unit, thereby lowering the complexity of the hardware structure and control programs, reducing failure rates and manufacturing costs.
[0006] To achieve the above objectives, this utility model adopts the following technical solution: an automatic wafer handling device for wafer inspection, comprising a worktable, a wafer carrier stage for placing wafer cassettes slidably connected longitudinally to the worktable, a manual wafer flipping section disposed on the worktable, and an automatic wafer handling section disposed on the worktable; the automatic wafer handling section includes a transverse plate slidably connected horizontally to the worktable, a longitudinal plate slidably connected longitudinally to the transverse plate, a rotating plate rotatably connected to the longitudinal plate by a rotating shaft arranged longitudinally, and two pairs of insert plates disposed on the rotating plate; each of the insert plates has a plurality of uniformly distributed negative pressure holes at its upper end; wherein, the upper end of the longitudinal plate is provided with an interface post; the rotating plate is provided with a gear ring rotatably connected to the outer circumference of the interface post; the upper end of the interface post is provided with two vacuum connectors, and the two vacuum connectors are respectively connected to the negative pressure holes on the two pairs of insert plates.
[0007] The negative pressure hole is used to adsorb the wafer, increasing the stability of wafer movement; the two pairs of insert plates are used to move the wafer, reducing the movement distance of the automatic wafer transfer unit and improving work efficiency; the wafer movement drive device is simplified, the number of execution components and drive devices is reduced, and the complexity of hardware structure and control program is reduced accordingly.
[0008] Furthermore, a lifting plate is slidably connected longitudinally on the worktable; a semi-circular bracket is rotatably connected to the upper end of the lifting plate; a plurality of evenly distributed support arms extending toward the center of the semi-circular bracket are provided on the semi-circular bracket; and a suction cup is provided at the end of the support arm.
[0009] The semi-circular support and the suction cup are used to flip the wafer, thereby enabling the detection of the front and back sides of the wafer.
[0010] Specifically, the manual wafer flipping unit includes a primary rotating part rotatably connected to the worktable, a secondary rotating part rotatably connected to the primary rotating part, and a vacuum turntable for negative pressure adsorption of wafers rotatably connected to the secondary rotating part; the rotation axes of the primary rotating part, the secondary rotating part, and the vacuum turntable are perpendicular to each other; the semi-circular support can be selectively moved to directly above or below the vacuum turntable.
[0011] Specifically, a universal hand crank is movably connected to the worktable; a connecting rod assembly for transmission is provided between the universal hand crank and the first-stage rotating part and the second-stage rotating part; a horizontal rotating motor that is transmissionally connected to the vacuum turntable is provided on the second-stage rotating part.
[0012] Furthermore, a detection device is provided on the side of the worktable away from the cassette stage; the manual flipping section is located between the cassette stage and the detection device.
[0013] The testing equipment is used for automatic testing of wafers. After the vacuum turntable picks up the wafer, the wafer on the vacuum turntable is flipped in multiple directions by operating the universal hand crank, and the problems detected by the testing equipment are manually re-inspected or confirmed.
[0014] Furthermore, a rack is longitudinally arranged on the longitudinal transfer plate; a longitudinal transfer motor is arranged on the transverse transfer plate, and a longitudinal transfer gear connected to the rack transmission is arranged on the output shaft of the longitudinal transfer motor.
[0015] Specifically, the transverse plate is provided with a swing arm at one end rotatably connected to the transverse plate, and a pressure roller is rotatably connected to the other end of the swing arm; a torsion spring is provided between the swing arm and the transverse plate, and the elastic force of the torsion spring is used to make the pressure roller abut against the side wall of the longitudinal plate.
[0016] Specifically, the longitudinal plate is provided with a slide rail; the transverse plate is provided with a slider that is slidably connected to the slide rail; the slider and the swing arm are respectively located on both sides of the longitudinal gear.
[0017] The swing arm and the pressure roller reduce the movement gap and activity margin between the motion mechanisms, improve the positional movement accuracy of the wafer, and help improve the repeatability accuracy during the automated operation of the wafer.
[0018] Furthermore, a lead screw is rotatably connected to the worktable and threadedly connected to the carrier platform; multiple sets of positioning blocks are detachably connected to the upper end of the carrier platform.
[0019] The positioning block is compatible with different types of wafer cassettes, and can position and fix the wafer cassettes.
[0020] Furthermore, a horizontal plate is horizontally arranged at the upper end of the longitudinal transfer plate; the gear ring is rotatably connected to the end of the horizontal plate away from the longitudinal transfer plate; a shifting motor is arranged on the longitudinal transfer plate; and a first belt is arranged between the shifting motor and the gear ring.
[0021] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0022] 1. This utility model is used to remove wafers from a wafer box and send them to a testing device for testing. After the testing is completed, the wafers are placed back into the wafer box. At the same time, the removed wafer box can be flipped over to perform double-sided testing of the wafers. In addition, the wafers can be placed on a vacuum turntable and manually flipped for manual re-inspection and verification.
[0023] 2. This utility model only sets up an automatic wafer transfer section, which simplifies the wafer handling device and the corresponding driving device; the automatic wafer transfer section includes two pairs of insert plates for handling wafers. The two pairs of insert plates can independently perform semi-circular movement of the wafers, which reduces the movement distance of the automatic wafer transfer section and also reduces the idle time of the automatic wafer transfer section, thereby improving the working efficiency of the wafer handling equipment and the testing equipment.
[0024] 3. This utility model is equipped with a torsion spring and a swing arm, which makes the pressure roller press against the longitudinal transfer plate, reducing the movement gap and activity margin between the motion mechanisms, improving the motion accuracy and repeatability of the insertion plate, reducing manual intervention, and improving the wafer handling efficiency. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the structure of this utility model;
[0026] Figure 2 This is an exploded view of the components of this utility model;
[0027] Figure 3 This is an exploded structural diagram of the automatic sheet-carrying section of this utility model;
[0028] Figure 4 This is a schematic diagram of the structure of the carrier platform of this utility model;
[0029] Figure 5 This is a schematic diagram of the structure of the transverse sliding plate of this utility model;
[0030] Figure 6 This is a schematic diagram of the manual flipping section of this utility model;
[0031] Figure 7 This is a schematic diagram of the lifting plate and semi-circular bracket of this utility model.
[0032] In the diagram: 11. Workbench; 12. Wafer cassette placement area; 13. Control panel; 21. Carrier stage; 22. Propeller motor; 23. Lead screw; 24. Positioning block; 31. Transverse plate; 32. Longitudinal plate; 321. Slide rail; 322. Rack; 323. Interface post; 324. Vacuum connector; 33. Rotating plate; 331. Gear ring; 332. Detection port; 34. Insertion plate; 341. Negative pressure hole; 35. Transposition motor; 351. Transposition pulley; 352. First belt 36. Longitudinal motor; 361. Longitudinal gear; 362. Slider; 363. Swing arm; 364. Pressure roller; 365. Torsion spring; 37. Transverse motor; 371. Second belt; 38. Horizontal plate; 41. Lifting plate; 42. Semicircular bracket; 421. Support arm; 43. Suction cup; 44. Tilting motor; 45. Lifting motor; 51. Vacuum turntable; 52. Horizontal motor; 53. Universal hand crank; 54. Linkage assembly; 55. First-stage rotating part; 56. Second-stage rotating part. Detailed Implementation
[0033] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0034] In the description of this utility model, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.
[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In this description of the utility model, "a number" means two or more, unless otherwise explicitly specified.
[0036] In this utility model, unless otherwise explicitly specified and limited, terms such as "set" and "install" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0037] See Figures 1-7 An automated wafer handling device for wafer inspection includes a worktable 11, a wafer carrier stage 21 for placing wafer cassettes that is longitudinally slidably connected to the worktable 11, an inspection device disposed on the side of the worktable 11 away from the wafer carrier stage 21, a manual wafer flipping unit disposed on the worktable 11 between the wafer carrier stage 21 and the inspection device, and an automated wafer handling unit disposed on the worktable 11.
[0038] The automatic plate handling unit includes a horizontal sliding plate 31 slidably connected to the worktable 11, a longitudinal sliding plate 32 slidably connected to the horizontal sliding plate 31, a rotating plate 33 rotatably connected to the longitudinal sliding plate 32 with a rotating shaft arranged longitudinally, and two pairs of insert plates 34 arranged on the rotating plate 33; a second belt 371 is rotatably connected to the worktable 11; a horizontal moving motor 37 is provided on the worktable 11 and is drivenly connected to the second belt 371; the horizontal sliding plate 31 is arranged on the second belt 371.
[0039] A rack 322 is longitudinally arranged on the longitudinal transfer plate 32; a longitudinal transfer motor 36 is arranged on the transverse transfer plate 31, and a longitudinal transfer gear 361, which is drivenly connected to the rack 322, is arranged on the output shaft of the longitudinal transfer motor 36. A swing arm 363 is arranged on the transverse transfer plate 31, one end of which is rotatably connected to the transverse transfer plate 31, and a pressure roller 364 is rotatably connected to the other end of the swing arm 363; a torsion spring 365 is arranged between the swing arm 363 and the transverse transfer plate 31, and the elastic force of the torsion spring 365 is used to make the pressure roller 364 abut against the side wall of the longitudinal transfer plate 32. A slide rail 321 is longitudinally arranged on the longitudinal transfer plate 32; a slider 362 is arranged on the transverse transfer plate 31 and is slidably connected to the slide rail 321; the slider 362 and the swing arm 363 are respectively located on both sides of the longitudinal transfer gear 361.
[0040] Each of the insert plates 34 has a plurality of evenly distributed negative pressure holes 341 on its upper end; the longitudinal moving plate 32 has an interface post 323 longitudinally arranged on its upper end; the rotating plate 33 has a gear ring 331 rotatably connected to the outer circumference of the interface post 323; the interface post 323 has two vacuum connectors 324 on its upper end, and the two vacuum connectors 324 are respectively connected to the negative pressure holes 341 on the two pairs of insert plates 34. The gear ring 331 has a positioning ring whose axis is coaxial with its rotation axis; the outer wall of the positioning ring has a detection port 332.
[0041] A horizontal plate 38 is horizontally arranged on the upper end of the longitudinal transfer plate 32; the gear ring 331 is rotatably connected to the end of the horizontal plate 38 away from the longitudinal transfer plate 32; a shifting motor 35 is arranged on the longitudinal transfer plate 32; a shifting pulley 351 is arranged on the output shaft of the shifting motor 35; a first belt 352 is arranged between the shifting pulley 351 and the gear ring 331.
[0042] A lifting plate 41 is slidably connected longitudinally to the workbench 11; a semi-circular bracket 42 is rotatably connected to the upper end of the lifting plate 41; a plurality of evenly distributed support arms 421 extending toward the center of the semi-circular bracket 42 are provided on the semi-circular bracket 42; a suction cup 43 is provided at the end of the support arm 421; a flipping motor 44 is provided on the lifting plate 41 and rotatably connected to the semi-circular bracket 42; and a lifting motor 45 is provided on the workbench 11 for driving the lifting plate 41 to slide longitudinally.
[0043] The manual wafer flipping unit includes a primary rotating part 55 rotatably connected to the worktable 11, a secondary rotating part 56 rotatably connected to the primary rotating part 55, and a vacuum turntable 51 for negative pressure adsorption of wafers rotatably connected to the secondary rotating part 56; the rotation axes of the primary rotating part 55, the secondary rotating part 56, and the vacuum turntable 51 are perpendicular to each other; the semi-circular support 42 can be selectively moved to be directly above or directly below the vacuum turntable 51.
[0044] A universal hand crank 53 is movably connected to the worktable 11; a connecting rod assembly 54 for transmission is provided between the universal hand crank 53 and the first-stage rotating part 55 and the second-stage rotating part 56; a flat rotating motor 52 that is transmissionally connected to the vacuum turntable 51 is provided on the second-stage rotating part 56.
[0045] The worktable 11 is rotatably connected to a lead screw 23 that is threadedly connected to the box carrier 21; the worktable 11 is equipped with a progressive motor 22 that is driven by the lead screw 23; and multiple sets of positioning blocks 24 are detachably connected to the upper end of the box carrier 21.
[0046] The upper end of the workbench 11 is provided with a wafer cassette placement area 12; the carrier stage 21 is slidably connected within the wafer cassette placement area 12; the front end of the workbench 11 is provided with a control panel 13 facing the wafer cassette placement area 12.
[0047] Working process: Place the opened wafer cassette on the upper end of the cassette stage 21 with the wafer cassette opening facing the automatic wafer transfer section. The advance motor 22 drives the lead screw 23 to rotate. The rotation of the lead screw 23 causes the cassette stage 21 to slide upward. Each time the advance motor 22 works, it causes the cassette stage 21 to move upward a specified distance (the distance between two adjacent wafers in the wafer cassette).
[0048] Two pairs of insert plates are designated as insert plate A and insert plate B. The horizontal moving plate 31 and the vertical moving plate 32 move synchronously or sequentially, causing insert plate A to extend into the lower end of the uppermost wafer in the wafer cassette. The negative pressure hole 341 adsorbs the wafer, and insert plate A then moves out of the wafer cassette. The stage 21 moves upward a specified distance. The rotating plate 33 rotates 180°, and insert plate A delivers the wafer to and places it in the testing equipment for inspection. Then, insert plate B extends into the wafer cassette to retrieve the next wafer.
[0049] Insertor A removes the completed wafer from the testing equipment. Rotating plate 33 rotates 180°, and insertor B places the wafer into the testing equipment for testing. Insertor A places the wafer onto the semi-circular support 42, where it is held by suction cup 43. The semi-circular support 42 first moves upward under the drive of lifting motor 45, then rotates half a turn under the drive of flipping motor 44. Insertor A then adheres to the lower end of the wafer, removing it. Flipping motor 44 drives the semi-circular support 42 to rotate half a turn in the opposite direction and descend to its original position. Then, insertor B removes the wafer from the testing equipment. Rotating plate 33 rotates 180°, and insertor A places the flipped wafer into the testing equipment for testing. Insertor B places the wafer onto the semi-circular support 42 for flipping.
[0050] After both sides of the wafer have been inspected, inserter A removes the wafer from the inspection equipment and inserts it back into its original position in the wafer cassette. Then, inserter A removes the wafer from the next adjacent wafer, and so on.
[0051] When wafer defects are found in the testing equipment, they can be manually re-inspected; alternatively, manual inspection can be performed on wafers detected by the testing equipment. The wafer, placed on the semi-circular support 42, slides downwards under the drive of the lifting motor 45, bringing it against the upper end of the vacuum turntable 51, which then adsorbs the wafer. After the suction cup 43 releases the wafer, the semi-circular support 42 continues to slide downwards until it no longer interferes with the wafer. The universal hand crank 53 is then operated to rotate the wafer on the vacuum turntable 51 on a horizontal plane for manual observation. After manual inspection is completed, the vacuum turntable 51 is kept horizontal, and the semi-circular support 42 slides upwards under the drive of the lifting motor 45, removing the wafer from the vacuum turntable 51.
[0052] The above description is only a specific embodiment of the present utility model, but the technical features of the present utility model are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present utility model are covered by the patent scope of the present utility model.
Claims
1. An automated wafer handling device for wafer inspection, characterized in that: The device includes a worktable, a wafer carrier stage for placing wafer cassettes that is slidably connected to the worktable, a manual wafer flipping unit disposed on the worktable, and an automatic wafer transfer unit disposed on the worktable. The automatic wafer transfer unit includes a horizontal sliding plate that is slidably connected to the worktable, a vertical sliding plate that is slidably connected to the horizontal sliding plate, a rotating plate that is rotatably connected to the vertical sliding plate and has a rotating shaft arranged longitudinally, and two pairs of insert plates disposed on the rotating plate. Each insert plate has a plurality of evenly distributed negative pressure holes at its upper end. The vertical sliding plate has an interface post arranged longitudinally at its upper end. The rotating plate has a gear ring that is rotatably connected to the outer circumference of the interface post. The upper end of the interface post has two vacuum connectors, which are respectively connected to the negative pressure holes on the two pairs of insert plates.
2. The wafer handling equipment as described in claim 1, characterized in that: A lifting plate is slidably connected longitudinally to the workbench; a semi-circular bracket is rotatably connected to the upper end of the lifting plate; a plurality of evenly distributed support arms extending toward the center of the semi-circular bracket are provided on the semi-circular bracket; and suction cups are provided at the ends of the support arms.
3. The wafer handling equipment as described in claim 2, characterized in that: The manual wafer flipping unit includes a primary rotating part rotatably connected to the worktable, a secondary rotating part rotatably connected to the primary rotating part, and a vacuum turntable for negative pressure adsorption of wafers rotatably connected to the secondary rotating part; the rotation axes of the primary rotating part, the secondary rotating part, and the vacuum turntable are perpendicular to each other; the semi-circular support can be selectively moved to directly above or below the vacuum turntable.
4. The wafer handling equipment as described in claim 3, characterized in that: A universal hand crank is movably connected to the worktable; a connecting rod assembly for transmission is provided between the universal hand crank and the first-stage rotating part and the second-stage rotating part; a horizontal rotating motor that is connected to the vacuum turntable is provided on the second-stage rotating part.
5. The wafer handling equipment as described in any one of claims 1-4, characterized in that: A detection device is provided on the side of the workbench away from the cassette stage; the manual flipping section is located between the cassette stage and the detection device.
6. The wafer handling equipment as described in any one of claims 1-4, characterized in that: A rack is longitudinally arranged on the longitudinal transfer plate; a longitudinal transfer motor is arranged on the transverse transfer plate, and a longitudinal transfer gear connected to the rack is arranged on the output shaft of the longitudinal transfer motor.
7. The wafer handling equipment as described in claim 6, characterized in that: The transverse plate is provided with a swing arm at one end rotatably connected to the transverse plate, and a pressure roller is rotatably connected to the other end of the swing arm; a torsion spring is provided between the swing arm and the transverse plate, and the elastic force of the torsion spring is used to make the pressure roller abut against the side wall of the longitudinal plate.
8. The wafer handling equipment as described in claim 7, characterized in that: The longitudinal plate is provided with a slide rail; the transverse plate is provided with a slider that is slidably connected to the slide rail; the slider and the swing arm are respectively located on both sides of the longitudinal gear.
9. The wafer handling equipment as described in any one of claims 1-4, characterized in that: The worktable is rotatably connected to a lead screw that is threadedly connected to the carrier platform; multiple sets of positioning blocks are detachably connected to the upper end of the carrier platform.
10. The wafer handling equipment as described in any one of claims 1-4, characterized in that: A horizontal plate is horizontally arranged at the upper end of the longitudinal transfer plate; the gear ring is rotatably connected to the end of the horizontal plate away from the longitudinal transfer plate; a shifting motor is arranged on the longitudinal transfer plate; a first belt is arranged between the shifting motor and the gear ring.