Wafer centering device

By using a ring-shaped clamping assembly and a servo motor drive system, combined with a rubber sleeve and spring structure, the problems of multi-model compatibility and insufficient protection in traditional wafer alignment devices are solved, achieving high-precision alignment and efficient production.

CN224386100UActive Publication Date: 2026-06-19SHANGHAI XINGNA ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI XINGNA ELECTRONIC TECH CO LTD
Filing Date
2025-05-26
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Traditional wafer alignment devices have shortcomings in terms of multi-model compatibility and wafer protection. The clamping component design lacks flexibility and is difficult to adapt to wafers of different sizes and shapes. The clamping force is not precisely controlled, which can easily cause damage to the wafer surface.

Method used

The first and second clamping assemblies are arranged in a ring, and the transmission method is combined with servo motors, synchronous pulleys and synchronous belts. With rubber sleeves and spring structures, high-precision centering of multiple wafer models can be achieved. The design of lifting mechanism and tensioning assembly ensures the adaptability and stability of clamping force.

Benefits of technology

It achieves high compatibility and high-precision alignment of multiple wafer models, avoids wafer damage, improves production efficiency and product yield, and ensures the smooth progress of subsequent processes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of wafer centering devices, include: fixed bracket, drive mechanism, at least two first clamping components and at least one second clamping component;Wherein, drive mechanism is connected with fixed bracket;First clamping component is connected with drive mechanism;Second clamping component is connected with drive mechanism;First clamping component and second clamping component are annularly arranged in fixed bracket in sequence, drive mechanism can drive first clamping component and second clamping component clamping wafer, so that wafer is centered.The utility model effectively solves the problem that traditional device is poor in compatibility of multiple models of wafer and insufficient protection of wafer, realizes the high-precision centering of different models of wafer, simultaneously avoids wafer to be damaged in centering process, improves the production efficiency and product yield of semiconductor manufacturing.
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