A power device package structure

Abstract

This utility model relates to the field of semiconductor packaging technology, and provides a power device packaging structure, including a substrate. A bottom heat dissipation structure is fixed to the bottom end of the substrate, and a power device body is disposed at the top end of the substrate. A packaging cover is fixed to the top end of the substrate outside the power device body. Sealing components are fixed to both sides of the bottom end of the packaging cover, and limiting structures are uniformly fixed to the inner walls of both sides of the packaging cover. This utility model, by setting the limiting structure, and using limiting plates and buffer silicone, can limit and fix the power device body, preventing the power device body from shifting due to vibration or thermal expansion, avoiding lead breakage. The buffer silicone can absorb thermal stress, reducing deformation damage to the power device body. This device achieves the function of conveniently limiting the power device body, improving the stability of the power device packaging structure during use.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a power device packaging structure. Background Technology

[0002] Power devices play a role in power conversion and control in power electronic systems. Their operating environment is characterized by high voltage and high current. If power devices are exposed to air during use, it will affect their service life. Therefore, it is necessary to design a power device packaging structure.

[0003] To address this issue, patent CN215815849U discloses a power device packaging structure, including a substrate, feet, a heat sink, a base, and leads. The leads are mounted on the side of the base, and several feet are fixed around the heat sink. The feet are fixed to the base, and the heat sink, feet, and base form a heat dissipation cavity. The substrate is mounted in the heat dissipation cavity through a mechanism for heat dissipation and buffering thermal stress. This invention effectively improves the heat dissipation efficiency of the packaging structure and the bonding force between the molding compound and the frame, thus solving the problem of low heat dissipation efficiency and poor heat dissipation performance caused by the fully enclosed structure of the packaging structure in the prior art.

[0004] While the power device packaging structure described above can improve the heat dissipation efficiency of the packaging structure during use, the power device is prone to shaking when subjected to shaking or collision after packaging. Therefore, it is necessary to design a power device packaging structure. Utility Model Content

[0005] The purpose of this invention is to provide a power device packaging structure to solve the defect that existing power device packaging structures are prone to shaking after being shaken or impacted.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a power device packaging structure, including a substrate;

[0007] The bottom end of the substrate is fixed with a bottom heat dissipation structure, the top end of the substrate is provided with a power device body, the top end of the substrate outside the power device body is fixed with an encapsulation cover, and sealing components are fixed on both sides of the bottom end of the encapsulation cover.

[0008] Limiting structures are uniformly fixed on the inner walls of both sides of the encapsulation cover. The limiting structures include limiting blocks uniformly fixed on the inner walls of both sides of the encapsulation cover. A limiting plate is fixed at one end of each limiting block near the power device body. Buffer silicone is fixed on one side of each limiting plate.

[0009] The top of the power device body is provided with a top heat dissipation structure.

[0010] Furthermore, the bottom heat dissipation structure includes an adhesive layer, a heat-conducting plate, and heat dissipation fins. The adhesive layer is fixed to the bottom end of the substrate, the heat-conducting plate is fixed to the bottom end of the adhesive layer, and heat dissipation fins are uniformly fixed to the bottom end of the heat-conducting plate.

[0011] Furthermore, the heat dissipation fins are evenly distributed at the bottom end of the heat-conducting plate.

[0012] Furthermore, the sealing assembly includes a sealing groove, a sealing ring, and an inner groove. The sealing groove is uniformly formed on the top of the substrate, the sealing ring is uniformly fixed to the bottom of the encapsulation cover, and the inner groove is formed inside each sealing ring.

[0013] Furthermore, the sealing rings are symmetrically distributed on both sides of the encapsulation cover, and the sealing rings and the substrate are connected by an interference fit through a sealing groove.

[0014] Furthermore, the top heat dissipation structure includes an external heat dissipation plate, thermal conductive pins, and a thermal conductive sheet. The thermal conductive sheet is disposed at the top of the power device body, and thermal conductive pins are uniformly fixed at the top of the thermal conductive sheet. The top of the thermal conductive pins extends to the outside of the package cover and is fixed with the external heat dissipation plate.

[0015] Furthermore, the heat-conducting pins are evenly spaced at the top of the heat-conducting sheet.

[0016] Furthermore, the limiting blocks are symmetrically distributed on both sides of the encapsulation cover, and one side of the buffer silicone abuts against the outer side of the power device body.

[0017] The power device packaging structure provided by this utility model has the following advantages:

[0018] By setting a limiting structure, the power device body can be limited and fixed by the limiting plate and the buffer silicone, preventing the power device body from shifting due to vibration or thermal expansion and avoiding lead breakage. The buffer silicone can absorb thermal stress and reduce the damage of deformation to the power device body. This device has the function of conveniently limiting the power device body and improves the stability of the power device packaging structure during use.

[0019] By incorporating a bottom heat dissipation structure, the heat from the bottom of the substrate can be dissipated outwards through the adhesive layer and heat-conducting plate, and the heat generated by the power device body can be quickly conducted to the external environment. This enables the device to dissipate heat from the bottom of the power device body, improving the safety and durability of the power device packaging structure during use.

[0020] With a top heat dissipation structure, the external heat sink can work in conjunction with the heat sink fins to form a bidirectional heat dissipation path, reducing thermal resistance. The heat-conducting pins can conduct heat, accelerating the dissipation of heat outwards. This enables the device to dissipate heat from the top of the power device body, improving the convenience and applicability of the power device packaging structure during use. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0022] Figure 2 This is a three-dimensional structural schematic diagram of the main cross-section of this utility model;

[0023] Figure 3 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0024] Figure 4 This is a three-dimensional structural schematic diagram of the main cross-section of this utility model;

[0025] Figure 5 This is a side view cross-sectional three-dimensional structural schematic diagram of the present invention;

[0026] Figure 6 This is a top-view cross-sectional three-dimensional structural diagram of the present invention.

[0027] The reference numerals in the figure are as follows: 1. Substrate; 2. Bottom heat dissipation structure; 21. Adhesive layer; 22. Heat-conducting plate; 23. Heat dissipation fins; 3. Sealing assembly; 31. Sealing groove; 32. Sealing ring; 33. Inner groove; 4. Encapsulation cover; 5. Top heat dissipation structure; 51. Outer heat dissipation plate; 52. Heat-conducting pin; 53. Heat-conducting sheet; 6. Power device body; 7. Limiting structure; 71. Limiting block; 72. Limiting plate; 73. Buffer silicone. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figures 1-6 The present invention provides a power device packaging structure, including a substrate 1.

[0030] Reference Figures 1-6The bottom end of the substrate 1 is fixed with a bottom heat dissipation structure 2, which includes an adhesive layer 21, a heat-conducting plate 22, and heat dissipation fins 23. The adhesive layer 21 is fixed to the bottom end of the substrate 1, and the heat-conducting plate 22 is fixed to the bottom end of the adhesive layer 21. Heat dissipation fins 23 are uniformly fixed to the bottom end of the heat-conducting plate 22. The heat dissipation fins 23 are evenly distributed at the bottom end of the heat-conducting plate 22. The top end of the substrate 1 is provided with a power device body 6. The top end of the substrate 1 outside the power device body 6 is fixed with a package cover 4. Both sides of the bottom end of the package cover 4 are fixed with sealing components 3. The sealing components 3 include a sealing groove 31, a sealing ring 32, and an inner groove 33. The sealing groove 31 is uniformly opened on the top of the substrate 1. The sealing ring 32 is uniformly fixed to the bottom end of the package cover 4. The inner groove 33 is opened inside the sealing ring 32. The sealing ring 32 is symmetrically distributed on both sides of the package cover 4. The sealing ring 32 and the substrate 1 are connected by an interference fit through the sealing groove 31.

[0031] The substrate 1 is tightly bonded to the heat-conducting plate 22 through the adhesive layer 21 to reduce the interfacial thermal resistance. The heat-conducting plate 22 is made of copper, which can diffuse heat laterally to the heat dissipation fins 23. The heat dissipation fins 23 are evenly distributed at the bottom of the heat-conducting plate 22, which can increase the heat dissipation area and accelerate heat dissipation through natural convection. The sealing ring 32 and the inner groove 33 can improve the airtightness of the connection between the substrate 1 and the encapsulation cover 4 and prevent external contaminants from entering.

[0032] Reference Figure 5 and Figure 6 Limiting structures 7 are uniformly fixed on the inner walls of both sides of the encapsulation cover 4. The limiting structures 7 include limiting blocks 71 uniformly fixed on the inner walls of both sides of the encapsulation cover 4. A limiting plate 72 is fixed at one end of the limiting block 71 near the power device body 6. A buffer silicone 73 is fixed on one side of the limiting plate 72. The limiting blocks 71 are symmetrically distributed on both sides of the encapsulation cover 4. One side of the buffer silicone 73 abuts against the outer side of the power device body 6.

[0033] Limiting block 71 and limiting plate 72 limit the power device body 6 and restrict its lateral movement. Buffer silicone 73 has a certain elasticity and can clamp the power device body 6 through elastic deformation, while relieving the stress generated by thermal expansion and contraction or mechanical impact.

[0034] Reference Figures 1-6 The top of the power device body 6 is provided with a top heat dissipation structure 5. The top heat dissipation structure 5 includes an outer heat dissipation plate 51, heat conduction pins 52 and heat conduction sheet 53. The heat conduction sheet 53 is provided at the top of the power device body 6. The top of the heat conduction sheet 53 is uniformly fixed with heat conduction pins 52. The top of the heat conduction pins 52 extends to the outside of the package cover 4 and is fixed with the outer heat dissipation plate 51. The heat conduction pins 52 are evenly distributed at the top of the heat conduction sheet 53.

[0035] The heat-conducting sheet 53 directly contacts the top of the power device body 6 to collect heat, and conducts the heat to the external heat sink 51 through the heat-conducting pin 52. The external heat sink 51 dissipates heat to the outside through the air.

[0036] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A power device packaging structure, comprising a substrate (1); Its features are: The bottom end of the substrate (1) is fixed with a bottom heat dissipation structure (2), the top end of the substrate (1) is provided with a power device body (6), the top end of the outer substrate (1) of the power device body (6) is fixed with a packaging cover (4), and the bottom ends of the packaging cover (4) are fixed with sealing components (3) on both sides. Limiting structures (7) are uniformly fixed on the inner walls of both sides of the encapsulation cover (4). The limiting structures (7) include limiting blocks (71) uniformly fixed on the inner walls of both sides of the encapsulation cover (4). A limiting plate (72) is fixed at one end of the limiting block (71) near the power device body (6). A buffer silicone (73) is fixed on one side of the limiting plate (72). The top of the power device body (6) is provided with a top heat dissipation structure (5).

2. The power device packaging structure according to claim 1, characterized in that: The bottom heat dissipation structure (2) includes an adhesive layer (21), a heat-conducting plate (22), and heat dissipation fins (23). The adhesive layer (21) is fixed to the bottom end of the substrate (1). The heat-conducting plate (22) is fixed to the bottom end of the adhesive layer (21). Heat dissipation fins (23) are uniformly fixed to the bottom end of the heat-conducting plate (22).

3. The power device packaging structure according to claim 2, characterized in that: The heat dissipation fins (23) are evenly distributed at the bottom end of the heat-conducting plate (22).

4. The power device packaging structure according to claim 1, characterized in that: The sealing assembly (3) includes a sealing groove (31), a sealing ring (32) and an inner groove (33). The sealing groove (31) is evenly opened on the top of the substrate (1), and the sealing ring (32) is evenly fixed to the bottom of the encapsulation cover (4). The inner groove (33) is opened inside the sealing ring (32).

5. The power device packaging structure according to claim 4, characterized in that: The sealing rings (32) are symmetrically distributed on both sides of the encapsulation cover (4), and the sealing rings (32) and the substrate (1) are connected by an interference fit through the sealing groove (31).

6. The power device packaging structure according to claim 1, characterized in that: The top heat dissipation structure (5) includes an external heat dissipation plate (51), heat-conducting pins (52) and a heat-conducting sheet (53). The heat-conducting sheet (53) is disposed at the top of the power device body (6). The top of the heat-conducting sheet (53) is uniformly fixed with heat-conducting pins (52). The top of the heat-conducting pins (52) extends to the outside of the package cover (4) and is fixed with the external heat dissipation plate (51).

7. A power device packaging structure according to claim 6, characterized in that: The heat-conducting pins (52) are evenly distributed at the top of the heat-conducting sheet (53).

8. The power device packaging structure according to claim 1, characterized in that: The limiting blocks (71) are symmetrically distributed on both sides of the encapsulation cover (4), and one side of the buffer silicone (73) and the outside of the power device body (6) abut against each other.

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