Lead frame, package structure and dual-base island package structure

By introducing a dual-base island structure with isolation grooves separating and connecting the leadframes, the heat dissipation and stability issues of the leadframes in power device packaging are solved, achieving higher structural stability and heat dissipation performance, and optimizing the packaging process.

CN224386127UActive Publication Date: 2026-06-19JCET SEMICON (SUQIAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JCET SEMICON (SUQIAN) CO LTD
Filing Date
2025-06-19
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing lead frames have issues with insufficient heat dissipation performance and structural stability in power device packaging. They are particularly prone to warping and adhesive overflow during the molding process, which affects the heat dissipation capacity and reliability of the device.

Method used

The primary base island is divided into two regions by an isolation groove, and the two regions are connected by the bottom of the isolation groove to increase structural stability. Combined with the head and tail frame connecting ribs, a dual base island packaging structure is formed to avoid warping and deformation and optimize the packaging process.

Benefits of technology

It improves the stability and heat dissipation performance of the packaging structure, avoids warping and glue overflow, enhances the reliability and appearance consistency of the device, and reduces the difficulty of the process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224386127U_ABST
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Abstract

The utility model provides a kind of lead frame, packaging structure and double base island packaging structure, the lead frame includes multiple frame units, each described frame unit includes a primary base island, the primary base island has isolation groove in the middle, the isolation groove separates the primary base island into first area and second area, the first area and the second area are used to carry a chip respectively. The primary base island of each frame unit is separated into two regions for carrying chips by isolation groove, the two regions are connected by the bottom of isolation groove, increase the structural stability of two regions, can avoid the deformation or the phenomenon of " crooked head " of the two regions in transmission and process operation, reduce the process difficulty, and not easy to warp in plastic package process, further can prevent overflow glue, can optimize power device package under the premise of guaranteeing heat dissipation performance.
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