Encapsulation barrier and encapsulation
By designing a perforated structure and a conformal shielding layer in the isolation wall, the problems of material deformation and electromagnetic shielding during isolation wall cutting were solved, achieving efficient cutting and excellent electromagnetic shielding effect, and improving the production efficiency and performance of the package.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JCET GROUP CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-06-19
AI Technical Summary
In existing technologies, cutting the isolation wall can easily lead to material deformation and severe tool wear, and it cannot effectively shield different cavities within the package, affecting the electromagnetic shielding effect of the package and the yield of finished products.
Design an enclosure wall with a perforated structure. During cutting, intermittent cutting is used instead of continuous cutting, and a conformal shielding layer is formed after cutting to contact the enclosure wall, thereby avoiding stress concentration and material loss.
It improves cutting efficiency and tool life, ensures the dimensional accuracy and electromagnetic shielding effect of the package, reduces production costs, and enhances the reliability and signal integrity of the package.
Smart Images
Figure CN224386141U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a packaging isolation wall and a packaging body. Background Technology
[0002] Cavity shielding technology is mainly used to suppress electromagnetic interference, improve signal integrity, and enhance product reliability. It also optimizes product heat dissipation and is widely used in various products involving high frequency, high speed, radio frequency, and electromagnetic sensitivity, such as smart wearable devices, aerospace electronic equipment, and IoT modules.
[0003] Appendix Figure 1 The diagram shows a schematic of a prior art enclosure structure for an isolation wall. The enclosure includes: a substrate 10, a chip 11 disposed on the surface of the substrate 10, and an isolation wall 12 for isolating the chip. This structure requires further molding to form the enclosure, completing its fabrication. In this structure, the isolation wall 12 can be mounted according to shielding requirements to separate different areas within the enclosure, forming an enclosure for achieving cavity shielding.
[0004] In existing technologies, the isolation wall 12 needs to extend beyond the edge of the package to expose its sidewall, and the excess portion needs to be removed by cutting the finished product. This process has significant drawbacks: during cutting, due to the high hardness of the isolation wall material (such as metal), continuous cutting of the complete cross-section by the tool can easily cause local stress concentration, resulting in processing defects such as deformation and wire drawing at the material edge, affecting the appearance and dimensional accuracy of the package; at the same time, high-frequency, high-force cutting will accelerate blade wear, causing problems such as chipping and rolling, significantly shortening the tool life and increasing production costs; in addition, the stress generated during the cutting process may be transmitted to the interior of the package, causing potential damage to the chip or substrate, reducing the yield and reliability of the finished product.
[0005] If the sidewall of the isolation wall 12 does not extend beyond the edge of the package and maintains a safe distance from the edge, the different cavities within the package that need to be isolated cannot be completely shielded by the package. Furthermore, the sidewall of the isolation wall 12 cannot make contact with the conformal shielding of the product's exterior, ultimately affecting the overall shielding effect of the product. If the sidewall of the isolation wall 12 maintains a safe distance from the edge of the package and does not extend beyond it, while avoiding material deformation and tool wear caused by cutting, it will lead to a systemic decrease in shielding effectiveness. On the one hand, because the isolation wall does not fully extend to the edge, there is an electromagnetic coupling path between different functional cavities within the package, resulting in signal crosstalk between them. On the other hand, the sidewall of the isolation wall cannot directly contact the conformal shielding structure (such as a metal shielding layer or outer shell) of the product's exterior, forming a break in the shielding layer. High-frequency signals may leak through this break, severely weakening the overall electromagnetic protection capability. This design contradiction means that the isolation wall cannot effectively isolate the physical boundary and also compromises the integrity of electromagnetic shielding. Especially in scenarios with stringent shielding requirements, such as communication and radar, this may lead to a significant degradation or even failure of equipment performance.
[0006] Therefore, how to design a package that can meet the cutting requirements is a problem that existing technologies need to solve. Summary of the Invention
[0007] The technical problem to be solved by this utility model is to provide a packaging isolation wall and packaging body that can meet the cutting requirements.
[0008] To address the aforementioned problems, this utility model provides an encapsulation isolation wall, comprising a body and an end located in a cutting area, the end having a hole.
[0009] Optionally, the partition wall is made of metal. The metal is selected from one of copper, nickel, silver, and gold, or an alloy thereof.
[0010] Optionally, the shape of the hole is selected from one of square, circle and triangle.
[0011] Optionally, the holes are arranged along the cutting direction, and a portion of the edge of the holes protrudes beyond the cutting area.
[0012] Optionally, the holes are arranged perpendicular to the cutting direction, and the depth of the holes is greater than the length of the end portion located in the cutting area.
[0013] To address the aforementioned problems, this utility model provides a package comprising: a substrate; chips, wherein a plurality of chips are disposed on the upper surface of the substrate; an isolation wall disposed on the upper surface of the substrate for isolating the chips; a covering layer disposed on the upper surface of the substrate for covering the chips and the isolation wall, and exposing the top surface of the isolation wall and the sidewall of the cut end thereof; and a shielding layer covering the top surface and sidewall of the covering layer, and the shielding layer further covering the top surface of the isolation wall exposed in the covering layer and the sidewall of the cut end thereof.
[0014] Optionally, the material of the substrate is selected from any one of silicon, glass, metal and ceramic.
[0015] Optionally, the material of the covering layer is plastic.
[0016] Optionally, the shielding layer is made of metal. The shielding layer and the isolation wall are made of the same material.
[0017] Optionally, the chip is fixed to the substrate surface by mounting or soldering.
[0018] In the above technical solution, the holes can significantly reduce the amount of cutting. When cutting a traditional complete isolation wall, the tool needs to continuously cut the entire piece of material. However, the isolation wall with holes transforms continuous cutting into intermittent cutting. The tool only needs to handle a small amount of material bridging between adjacent holes, which significantly reduces the cutting path length and the amount of material removed, thereby improving cutting efficiency and shortening the production cycle.
[0019] Furthermore, during the cutting process, metallic materials are prone to plastic deformation and wire drawing due to localized stress concentration and high temperatures. The holes disrupt the continuity of the material, acting as stress relief grooves. When the tool enters the hole, stress can be dispersed through the holes, reducing the localized stress intensity of the material and preventing deformation caused by stress concentration. At the same time, intermittent cutting reduces the accumulation of cutting heat, effectively suppressing material softening and wire drawing, and ensuring the smoothness of the cut edges and the dimensional accuracy of the package.
[0020] Furthermore, the holes significantly protect the cutting tools. Continuous cutting of a solid piece of material accelerates tool wear and shortens its lifespan, while the presence of holes reduces the contact time and friction area between the tool and the material, thus reducing mechanical and thermal wear. At the same time, the stress dispersion effect reduces the impact force on the tool during cutting, avoiding serious damage such as chipping and rolling, extending the tool's service life, reducing tool replacement frequency and production costs, and enabling efficient and stable operation of the package cutting process. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0022] Appendix Figure 1 The diagram shows a schematic of the encapsulation structure of an isolation wall in the prior art.
[0023] Appendix Figure 2A The diagram shown is a structural schematic of the encapsulation isolation wall according to a specific embodiment of this utility model.
[0024] Appendix Figure 2B The image shown is a side view of the end face of the encapsulation isolation wall according to a specific embodiment of this utility model.
[0025] Appendix Figure 3A The diagram shown is a structural schematic of the package body according to a specific embodiment of this utility model.
[0026] Appendix Figure 3B The diagram shown is a structural schematic of the package body according to a specific embodiment of this utility model.
[0027] Appendix Figure 4 The figure shown is a partial top view of the packaged body after it has been formed according to a specific embodiment of this utility model.
[0028] Appendix Figure 5 The diagram shown is a structural schematic of the encapsulation isolation wall according to a specific embodiment of this utility model.
[0029] Appendix Figure 6 The diagram shown is a structural schematic of the encapsulation isolation wall according to a specific embodiment of this utility model.
[0030] Appendix Figure 7A The diagram shown is a structural schematic of the package body according to a specific embodiment of this utility model.
[0031] Appendix Figure 7B The diagram shown is a structural schematic of the package body according to a specific embodiment of this utility model.
[0032] Appendix Figure 8 The diagram shown is a structural schematic of the encapsulation isolation wall according to a specific embodiment of this utility model.
[0033] Appendix Figure 9 The diagram shown is a structural schematic of the encapsulation isolation wall according to a specific embodiment of this utility model.
[0034] Appendix Figure 10The diagram shown is a structural schematic of the encapsulation isolation wall according to a specific embodiment of this utility model. Detailed Implementation
[0035] The specific embodiments of the encapsulation isolation wall and encapsulation body provided by this utility model are described in detail below with reference to the accompanying drawings.
[0036] Appendix Figure 2A The diagram shown is a structural schematic of the encapsulation isolation wall according to a specific embodiment of this utility model. Figure 2B The image shows a side view of the aforementioned enclosure wall. The enclosure wall 20 includes a body 201 and an end portion 202 located in the cutting area, the end portion 202 having holes 203. In this specific embodiment, the cross-sectional shape of the holes 203 is selected from square, circular, and triangular, and in this specific embodiment, it is circular. These holes can also be partially or completely set as non-penetrating blind holes. This characteristic allows external force to be evenly distributed to the edges of the holes 203 during the cutting process. When the cutting tool acts on the enclosure wall 20, it avoids excessive local stress on the material, thereby preventing edge cracking, debris shedding, and other problems. The circular holes 203 can prevent excessive stress accumulation at specific locations, effectively reducing the possibility of cracks or damage to the edges of the enclosure wall 20 during the cutting process, ensuring the integrity of the enclosure wall 20 structure, and thus improving the yield and reliability of the package.
[0037] In this specific embodiment, the packaging isolation wall 20 is disposed on the surface of the substrate 24, and the surface of the substrate 24 further includes a chip 25. The chip 25 is fixed to a designated position on the substrate 24 by processes such as flip-chip bonding and wire bonding.
[0038] In this specific embodiment, the material of the substrate 24 is selected from silicon, glass, metal, and ceramic. Silicon substrate 24 has excellent semiconductor compatibility, making it suitable for integration with chip 25 to achieve high-density interconnection, and is commonly used in advanced packaging such as system-in-package (SiP). Glass substrate 24 has good insulation, high flatness, and lower cost than silicon, making it suitable for packaging RF devices or display driver chips, reducing signal loss. Metal substrate 24 (such as copper) has extremely high thermal conductivity, quickly dissipating heat from chip 25, and is commonly used in high-heat applications such as power devices or automotive electronics. Ceramic substrate 24 (such as alumina or aluminum nitride) combines high insulation, high reliability, and high-temperature resistance, with a high degree of thermal expansion matching with the chip, making it suitable for harsh environments such as aerospace and military applications. Different materials are combined with chip 25 and isolation wall 20 through processes such as lamination and bonding, which can specifically address core issues such as heat dissipation, signal integrity, or environmental protection.
[0039] In this specific embodiment, chip 25 includes a logic chip responsible for data processing, a memory chip for data storage, a power chip for power conversion, a sensor chip for sensing environmental signals, a radio frequency chip for supporting wireless communication, and a photonic chip integrating optical devices. The various types of chips have different requirements for electrical shielding, heat dissipation performance, mechanical stability, and environmental protection of the package. They need to be specifically optimized through the collaborative design of the isolation wall 20 and the substrate 24 to meet the diverse technical requirements of logic control, data storage, power conversion, sensing and detection, wireless communication, and optoelectronic integration.
[0040] In this specific embodiment, in the assembly structure of the packaging isolation wall 20, substrate 24, and chip 25, the assembly of chip 25 and substrate 24 mainly employs technologies such as flip-chip bonding, wire bonding, chip-on-bump bonding, and chip stacking. Flip-chip bonding achieves electrical connection between the chip and the pads on substrate 24 through solder bumps, requiring steps such as bump preparation, substrate 24 pretreatment, and reflow soldering. Wire bonding utilizes metal wires for connection, including chip bonding, bonding operations, and protective treatment. For high-density integration requirements, chip-on-bump and chip stacking technologies can achieve multi-layer chip interconnection.
[0041] In this specific embodiment, the material of the isolation wall 20 is a metal, selected from copper, nickel, silver, and gold, or an alloy thereof. In this specific embodiment, the material of the isolation wall 20 is copper. From an electrical performance perspective, copper has extremely high conductivity, second only to silver, which can improve the shielding effect of signals between chips 25, making it particularly suitable for high-frequency circuit packaging with stringent signal integrity requirements. In terms of heat dissipation, copper has excellent thermal conductivity, which, in addition to the shielding effect, can quickly conduct the heat generated by the chip 25 during operation to the outside of the package, avoiding localized overheating and improving the operational stability and lifespan of the chip 25. Mechanically, copper has good strength and ductility, is not easily deformed or broken, and can withstand the pressure and stress during the packaging process. Furthermore, compared to precious metals such as gold and silver, copper is cheaper, which is beneficial for large-scale production; compared to metals such as nickel, copper performs better in terms of oxidation and corrosion resistance, maintaining the structural and performance stability of the isolation wall 20 in complex environments for a long time, ensuring the reliability of the package.
[0042] Appendix Figure 3A and attached Figure 3B The diagram shown is a structural schematic of the package body according to a specific embodiment of this utility model, using an appendix. Figure 2A The encapsulation barrier 20 shown further includes an overlay layer 36 and a shielding layer 37.
[0043] In this specific embodiment, refer to the appendix. Figure 3AAs shown, the covering layer 36 is disposed on the surface of the substrate 24 to cover the chip 25. The sidewalls of the covering layer 36 expose the holes 203 on the end 202 for subsequent cutting. FAM molding can be used, or the upper surface of the package can be ground after molding to expose the upper surface of the isolation wall 20. In this specific embodiment, the material of the covering layer 36 is plastic. Plastic raw materials are abundant and inexpensive, and the molding process is simple, making it suitable for large-scale mass production and effectively reducing packaging costs.
[0044] In another embodiment, the covering layer 36 is disposed on the surface of the substrate 24 to cover the chip 25 and the isolation wall 20. The holes 203 of the isolation wall 20 are located in the dicing area to be subsequently cut, and the dicing area is filled with the covering layer 36. The isolation wall 20 is completely covered by the covering layer 36, and the holes 203 of the isolation wall 20 are filled with the covering layer 36.
[0045] In this specific embodiment, please continue to refer to the appendix. Figure 3B As shown, the isolation wall 20 is further cut, and the shielding layer 37 continues to form, covering the top surface and sidewalls of the covering layer 36. After cutting, the covering layer 36 exposes the sidewalls of the end 202 of the isolation wall 20. After forming the shielding layer 37, the shielding layer 37 also covers the top surface and the sidewalls of the end of the isolation wall 20 exposed by the covering layer 36, and the shielding layer 37 forms a conformal shielding contact with the isolation wall 20. The cutting is carried out along the hole, and the hole at the cut end retains the remaining part. The top surface of the isolation wall 20 and the sidewalls of the cut end are both in contact with the shielding layer on the surface of the covering layer 36, achieving the shielding function. Conformal shielding emphasizes the tight fit between the shielding layer 37 and the isolation wall 20. The seamless connection between the two forms a continuous shielding layer, effectively blocking external electromagnetic interference and preventing internal signal leakage. A uniformly thick shielding layer 37 is preferably formed on the surface of the cladding layer 36 using a sputtering process. This sputtering process also ensures that the shielding layer 37 is uniformly formed on the surface of the isolation wall 20 exposed above the cladding layer. This design is particularly important in fields sensitive to electromagnetic environments, such as high-frequency signal processing and 5G communication. It not only reduces signal crosstalk and ensures stable operation of the chip 25, but also improves the package's resistance to electromagnetic pulses. Furthermore, the conformal shielding structure, in conjunction with the substrate 24 and the chip 25, further enhances the mechanical protection performance of the package, resisting external physical impacts and environmental corrosion.
[0046] In this specific embodiment, the material of the shielding layer 37 is metal. Preferably, the shielding layer 37 and the isolation wall 20 are made of the same material. In this specific embodiment, the shielding layer 37 and the isolation wall 20 are made of the same metal material (such as copper). In terms of manufacturing process, electroplating the shielding layer 37 with the same material is easier, eliminating interfacial barriers between different materials, simplifying the process flow, reducing the risk of interfacial reactions, and improving connection strength and reliability. Regarding performance consistency, matching thermal expansion coefficients of the same materials can effectively reduce stress concentration caused by expansion differences during temperature changes, avoiding problems such as warping and cracking of the package; at the same time, the uniformity of the metal material ensures the synergy of the shielding layer 37 and the isolation wall 20 in electromagnetic shielding, heat dissipation, and other functions, optimizing the overall performance of the package and ensuring the stable operation of the chip 25 in complex environments.
[0047] Appendix Figure 4 The diagram shown is a partial top view of the encapsulated body after its formation according to a specific embodiment of this utility model. Multiple holes 203 are sequentially arranged along the cutting direction on the edge of the isolation wall 20 to reduce the amount of material removed during cutting, prevent material deformation, wire drawing, and other abnormalities, and also improve the service life of the cutting tool. Multiple holes 203 are arranged along the cutting direction on the edge of the isolation wall 20.
[0048] Holes 203 can significantly reduce the amount of material removed. When cutting a traditional complete partition wall 20, the tool needs to continuously cut the entire piece of material. However, the partition wall 20 with holes 203 transforms continuous cutting into intermittent cutting. The tool only needs to handle a small amount of material bridging between adjacent holes 203, which significantly reduces the cutting path length and the amount of material removed, thereby improving cutting efficiency and shortening the production cycle.
[0049] Furthermore, during the cutting process, metallic materials are prone to plastic deformation and wire drawing due to localized stress concentration and high temperatures. The hole 203 breaks the continuity of the material, acting as a stress relief groove. When the tool cuts in, the stress can be dispersed through the hole 203, reducing the localized stress intensity of the material and preventing deformation caused by stress concentration. At the same time, intermittent cutting reduces the accumulation of cutting heat, effectively suppressing material softening and wire drawing, and ensuring the smoothness of the cut edge and the dimensional accuracy of the package.
[0050] Furthermore, the pore 203 provides significant protection for the cutting tool. Continuous cutting of a solid piece of material accelerates tool wear and shortens its service life. The presence of the pore 203 reduces the contact time and friction area between the tool and the material, thus reducing mechanical and thermal wear. At the same time, the stress dispersion effect reduces the impact force on the tool during cutting, preventing serious damage such as chipping and rolling, extending the tool's service life, reducing tool replacement frequency and production costs, and enabling efficient and stable operation of the package cutting process.
[0051] In this specific embodiment, a portion of the edge of the hole 203 protrudes beyond the cutting area, meaning that the dimension of the hole 203 in the direction perpendicular to the cutting surface is greater than the width of the cutting path. This configuration ensures that the edge of the cutting tool only cuts a small amount of metal during cutting, further suppressing material softening and wire drawing issues, and ensuring the smoothness of the cutting edge and the dimensional accuracy of the package.
[0052] Appendix Figure 5 The diagram shows a schematic representation of the encapsulation isolation wall according to a specific embodiment of the present invention. The isolation wall 50 includes a body 501 and an end portion 502 located in the cutting area, the end portion 502 having holes 503. In this specific embodiment, the cross-sectional shape of the holes 503 is triangular. The triangles are arranged in an alternating pattern, further reducing the amount of material removed during the cutting of the finished product while ensuring strength. Triangles have natural structural stability, and compared to other shapes, their rigidity and load-bearing capacity are stronger. Even after holes are made in the isolation wall 50, the alternating triangular holes can still maintain good overall strength, avoiding the impact on the protective performance of the encapsulation due to structural weakening. In terms of the cutting process, the alternating triangular holes create a unique sawtooth cutting path for the isolation wall 50. Compared to traditional continuous cutting, this design significantly reduces the contact area between the tool and the material. During cutting, the tool only needs to process a small amount of material between adjacent triangular holes, significantly reducing the amount of material removed. This not only improves cutting efficiency but also reduces cutting heat and stress concentration, effectively avoiding problems such as material deformation and wire drawing. Furthermore, due to the reduction in cutting volume, the tool wear rate is slowed down, and the service life is extended, thereby reducing the production cost of the package and achieving a dual optimization of structural strength and processing efficiency.
[0053] Appendix Figure 6The diagram shows a schematic representation of the encapsulation isolation wall according to a specific embodiment of this invention. The isolation wall 60 includes a body 601 and an end portion 602 located in the cutting area, the end portion 602 having a hole 603. In this specific embodiment, the isolation wall 60 is L-shaped, with its ends exposed on two adjacent sides of the encapsulation body. Its unique spatial configuration exposes its ends on two adjacent sides of the encapsulation body. The L-shaped wall extends along the corner of the encapsulation body, forming a three-dimensional protective barrier, which can more effectively resist mechanical impacts from different directions, protecting the interior and substrate from external damage. In terms of electrical performance, the L-shaped structure increases the shielding area. Compared with a straight isolation wall, it has a longer and wider blocking path for electromagnetic interference, achieving multi-dimensional electromagnetic shielding, effectively reducing signal crosstalk, and ensuring stable transmission of high-frequency signals. Furthermore, the L-shaped wall design, with its exposed ends on adjacent sides, facilitates the cutting process, allowing for precise separation of the package and reducing the impact of cutting stress on the internal structure. Simultaneously, the exposed ends also facilitate subsequent inspection and maintenance, enabling rapid positioning of the isolation wall and improving the efficiency of package production and maintenance. In this structure, the exposed sides need to be modified to reduce the amount of material removed during final product cutting.
[0054] Appendix Figure 7A and attached Figure 7B The diagram shown is a structural schematic of the package body according to a specific embodiment of this utility model, using an appendix. Figure 6 The encapsulation isolation wall 60 shown, and attached Figure 7A The middle further includes a coating layer 76, which is attached to the middle. Figure 7B The chip is further cut and a shielding layer 77 is formed. The encapsulation layer 76 and the shielding layer 77 are configured in the same way as in the aforementioned specific implementation: the encapsulation layer 76 is made of plastic and is tightly wrapped around the chip on the substrate surface using FAM molding or post-molding grinding processes, providing mechanical protection while isolating external moisture, dust, and other contaminants; the shielding layer 77 is made of the same metal material as the isolation wall 60, covering the top surface and sidewalls of the encapsulation layer 76, and seamlessly connecting with the two exposed ends of the L-shaped isolation wall 60 through conformal shielding contact, forming a continuous electromagnetic shielding layer that effectively blocks electromagnetic interference and signal leakage. This continuous design retains the advantages of the previous solution in terms of protection, shielding, and process adaptability, and further improves the space utilization and overall performance of the package through the structural innovation of the L-shaped isolation wall.
[0055] Appendix Figure 8The diagram shows a schematic representation of the end face structure of the encapsulation isolation wall according to a specific embodiment of this utility model. The isolation wall 80 includes a body 801 and an end portion 802 located in the cutting area, the end portion 802 having a hole 803. In this embodiment, the hole 803 is circular, and the hole size near the upper and lower edges is smaller than the hole size in the central area. In other embodiments, the size of the hole 803 is not limited to a circle. Based on the stress distribution of the isolation wall, this embodiment uses large-sized holes in non-critical areas far from stress concentration points in the central part, and small-sized holes or denser arrangements in critical load-bearing areas at the edges. Furthermore, the hole density and size can be further optimized through simulation and experimentation to ensure that the stress distribution is balanced while reducing the overall cutting amount.
[0056] Appendix Figure 9 The diagram shows a structural schematic of the encapsulation body according to a specific embodiment of the present invention. The isolation wall 90 includes a body 901 and an end 902 located in the cutting area, the end 902 having a hole 903. In this specific embodiment, the isolation wall 90 is L-shaped and includes two ends on two adjacent sides, with the holes 903 at the two ends having different sizes. Based on the stress distribution of the isolation wall, the larger side exerts a stronger restraining force on the end, thus using a larger hole reduces the cutting amount; the smaller side exerts a weaker restraining force on the end, thus using a smaller hole increases mechanical strength and reduces deformation. The ends of two adjacent sides are designed with targeted holes due to their different stress states. The larger side exerts a stronger restraining force on the end, resulting in a more uniform stress distribution; therefore, using a larger hole 903 can significantly reduce the cutting amount, reduce tool wear, and increase cutting speed. Conversely, the smaller side has weaker support stiffness on the end, so using a smaller hole 903 increases material continuity, improves mechanical strength, and effectively suppresses the risk of deformation during the cutting process.
[0057] Appendix Figure 10 The diagram shows a schematic of the encapsulation isolation wall according to a specific embodiment of the present invention. The isolation wall 100 includes a body 1001 and an end portion 1002 located in the cutting area, the end portion 1002 having holes 1003. Unlike the previous embodiments, in this embodiment, the holes 1003 are arranged along the perpendicular cutting direction, and the depth of the holes is greater than the length of the end portion located in the cutting area. These holes 1003 are circular in this embodiment, but can also be partially or entirely circular, triangular, or other shapes as shown in the previous embodiments. This characteristic allows external force to be evenly distributed to the edges of the holes 1003 during the cutting process. When the cutting tool acts on the isolation wall 100, it avoids excessive local stress on the material, thus preventing problems such as edge chipping and debris shedding.
[0058] It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context; it should be understood that such use of data can be interchanged where appropriate. The term "one or more" depends at least in part on the context and can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, also at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the various embodiments described above, each embodiment focuses on the differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.
[0059] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A sealing barrier, comprising a body and an end located in a cut area, characterized in that, The end has a hole.
2. The enclosure wall according to claim 1, characterized in that, The isolation wall is made of metal.
3. The enclosure wall according to claim 2, characterized in that, The metal is selected from one of copper, nickel, silver and gold or an alloy thereof.
4. The enclosure wall according to claim 1, characterized in that, The shape of the hole is selected from one of square, circle and triangle.
5. The enclosure wall according to claim 1, characterized in that, The holes are arranged along the cutting direction, and part of the edges of the holes protrude outside the cutting area.
6. The enclosure wall according to claim 5, characterized in that, Each hole is independently selected from either a through hole or a blind hole.
7. The enclosure wall according to claim 1, characterized in that, The holes are arranged perpendicular to the cutting direction, and the depth of the holes is greater than the length of the end portion located in the cutting area.
8. A package comprising: substrate; Chips, and a plurality of said chips are disposed on the upper surface of the substrate; An isolation wall is disposed on the upper surface of the substrate to isolate the chip, wherein the isolation wall is a packaging isolation wall as described in any one of claims 1 to 7; A covering layer is disposed on the upper surface of the substrate to cover the chip and the isolation wall, and exposes the top surface of the isolation wall and the sidewall of the cut end; A shielding layer that covers the top surface and sidewalls of the covering layer, and the shielding layer also covers the top surface of the isolation wall exposed in the covering layer and the sidewalls of the cut end.
9. The package according to claim 8, characterized in that, The substrate material is selected from any one of silicon, glass, metal, and ceramic.
10. The package according to claim 8, characterized in that, The material of the coating layer is a molding compound.
11. The package according to claim 8, characterized in that, The material of the shielding layer is metal.
12. The package according to claim 8, characterized in that, The shielding layer and the isolation wall are made of the same material.
13. The package according to claim 8, characterized in that, The chip is fixed to the substrate surface by mounting or soldering.