Battery device and electric device

Abstract

This application provides a battery device and an electrical device. The battery device includes a battery cell group, a busbar, and electrical components. The battery cell group includes multiple battery cells. The busbar is electrically connected to the electrode terminals of at least two battery cells. The electrical components include a circuit board and a voltage sampling device. The circuit board has an output terminal and a first die-cut line electrically connected to the output terminal. The voltage sampling device has a first etched line electrically connected to the busbar. The circuit board and the voltage sampling device are connected so that the first die-cut line and the first etched line are electrically connected to form a voltage sampling line to transmit the voltage signal collected at the busbar to the output terminal. A first fused segment is provided on the voltage sampling line, and the first fused segment is located on the first etched line. The technical solution provided by this application can reduce the manufacturing cost of the battery device.

Description

Technical Field

[0001] This application relates to the field of battery technology, and more specifically, to a battery device and an electrical device. Background Technology

[0002] Battery devices are widely used in electronic devices such as mobile phones, laptops, electric vehicles, electric cars, electric airplanes, electric ships, electric toy cars, electric toy ships, electric toy airplanes, and power tools, etc.

[0003] In the development of battery device technology, in addition to improving the performance of battery devices, manufacturing costs are also a crucial consideration. Therefore, how to reduce manufacturing costs while maintaining battery performance is a continuous challenge for improvement in battery device technology. Utility Model Content

[0004] This application provides a battery device and an electrical device that can reduce the manufacturing cost of the battery device.

[0005] This application is achieved through the following technical solution:

[0006] In a first aspect, embodiments of this application provide a battery device, which includes a battery cell group, a busbar, and an electrical component. The battery cell group includes multiple battery cells. The busbar is electrically connected to the electrode terminals of at least two battery cells. The electrical component includes a circuit board and a voltage sampling device. The circuit board has an output terminal and a first die-cut line electrically connected to the output terminal. The voltage sampling device has a first etched line electrically connected to the busbar. The circuit board and the voltage sampling device are connected so that the first die-cut line and the first etched line are electrically connected to form a voltage sampling line to transmit the voltage signal collected at the busbar to the output terminal. A first fused line segment is provided on the voltage sampling line, and the first fused line segment is provided on the first etched line.

[0007] In the technical solution of this application embodiment, the circuit board is provided with an output terminal and a first die-cut line electrically connected to the output terminal, that is, the circuit board is used as a die-cut circuit board. Compared with the use of etched circuit boards, the die-cut circuit board uses physical stamping or continuous cutting with a circular knife, which eliminates the multiple processes such as plate making, developing, etching, and cleaning required for the manufacturing of etched circuit boards. This reduces the number of production steps, shortens the production cycle, increases production efficiency, is suitable for mass production, and lowers the overall manufacturing cost of the circuit board. Furthermore, the die-cut circuit board adopts a subtractive and recyclable process, and waste materials can be directly recycled, resulting in less material waste. Moreover, the production of die-cut circuit boards avoids acidic etching solutions, and there is no emission of heavy metal wastewater or exhaust gas, making it more environmentally friendly. For safety reasons, a fuse circuit needs to be set on the voltage sampling line. Since the die-cutting process is not convenient to form the fuse part, a separate voltage sampling component is set. The voltage sampling component is formed by etching the first etched line, and the first fuse circuit segment is set on the first etched line of the voltage sampling component, so that the voltage sampling component has the first fuse circuit segment. When the battery device experiences thermal runaway, the first fuse circuit segment melts to cut off the voltage sampling line, thus protecting the battery device.

[0008] According to some embodiments of this application, the first etched circuit includes a first line segment, a second line segment, and a first fused line segment. The first line segment is connected to a circuit board, the second line segment is connected to a busbar, and the first fused line segment connects the first line segment and the second line segment. The minimum line width of the first fused line segment is smaller than the line width of the first line segment and the line width of the second line segment.

[0009] In the above scheme, the minimum line width of the first fuse line segment is smaller than the line width of the first line segment and the line width of the second line segment. When the battery device experiences thermal runaway, the line width of the first fuse line segment is smaller than that of the first line segment and the second line segment. The resistance of the first fuse line segment is greater and the heat generation is greater. The first fuse line segment will melt first, thereby cutting off the voltage sampling line.

[0010] According to some embodiments of this application, the minimum line width of the first die-cut line is greater than the minimum line width of the first fuse line segment.

[0011] In the above scheme, the minimum line width of the first die-cut line is greater than the minimum line width of the first fused line segment. In this way, when the battery device experiences thermal runaway, the resistance of the first fused line segment is greater than that of the first die-cut line. The first fused line segment will melt first, thereby cutting off the voltage sampling line and protecting the die-cut line on the circuit board.

[0012] According to some embodiments of this application, the minimum line width of the first die-cut line is greater than the minimum line width of the first line segment and the minimum line width of the second line segment.

[0013] In the above scheme, since the minimum line width of the first die-cut line is greater than the minimum line width of the first line segment and the minimum line width of the second line segment, even if the battery device experiences thermal runaway, the first line segment will melt before the first die-cut line, thus protecting the die-cut lines on the circuit board and making the circuit board safer.

[0014] According to some embodiments of this application, the voltage sampling device includes a first conductive layer and two first insulating layers, a first etched line is formed on the first conductive layer, and the two first insulating layers are respectively disposed on both sides of the thickness direction of the first conductive layer.

[0015] In the above scheme, by setting two first insulating layers on both sides of the thickness direction of the first conductive layer, the two first insulating layers can provide insulation protection for the first conductive layer, reducing the risk of short circuit between the first conductive layer and external components.

[0016] According to some embodiments of this application, one of the two first insulating layers facing the circuit board is provided with a first opening, and a first line segment is exposed at least partially through the first opening to form a first pad, which is used for soldering to the circuit board.

[0017] In the above scheme, by providing a first opening on the first insulating layer on the side facing the circuit board, the first opening can be exposed on the first line segment to form a first pad. In this way, the voltage sampling device is soldered to the circuit board through the first pad, resulting in high connection stability and realizing the electrical connection between the voltage sampling device and the circuit board.

[0018] According to some embodiments of this application, there are multiple first openings spaced apart along the extension direction of the first line segment, and multiple first pads are formed at the multiple first openings, at least one of the multiple first pads being used for soldering to the circuit board.

[0019] In the above scheme, by setting multiple first openings and spacing them along the extension direction of the first line segment, the number of circuit boards connected to the corresponding first pads can be selected according to the actual situation. Furthermore, the distribution direction of the multiple die-cut lines on the circuit board can be adapted to the arrangement direction of the multiple first pads. Based on the position of the die-cut lines at corresponding locations on the circuit board, at least one first pad from the multiple first pads in the voltage sampling component can be selected for soldering. This makes the connection between the circuit board and the voltage sampling component more flexible, easily achieving cross-line connections between the circuit board and the voltage sampling component, and improving versatility.

[0020] According to some embodiments of this application, each first pad is provided with at least one first through hole.

[0021] In the above scheme, by providing at least one first through hole in each first pad, when the first pad on the first line segment is soldered to the circuit board, the solder on the circuit board melts and flows and partially fills the first through hole. The operator can observe the soldering effect between the first pad on the first line segment and the circuit board through the first through hole, making the soldering effect between the voltage sampling device and the circuit board visible and making it easier to control the soldering quality between the voltage sampling device and the circuit board.

[0022] According to some embodiments of this application, the first opening is elongated, and each first pad is provided with a plurality of first through holes, which are spaced apart along the length of the elongated shape.

[0023] In the above scheme, by making the first opening into a long strip shape, and setting multiple first through holes for each first pad, and distributing the multiple first through holes at intervals along the length of the strip, when the first pad on the first line segment is soldered to the circuit board, the soldering status and effect between the first line segment and the circuit board can be judged by observing whether the solder on the circuit board extends evenly to the multiple first through holes, and by observing the flow of solder in each first through hole. This makes the soldering effect between the voltage sampling device and the circuit board visible and makes it easier to control the soldering quality between the voltage sampling device and the circuit board.

[0024] According to some embodiments of this application, the end of the first line segment connected to the circuit board is the first end, and the end of the second line segment connected to the busbar is the second end. Projected orthogonally onto a projection plane perpendicular to the thickness direction of the voltage sampling device, the voltage sampling device has an adjustment portion projected as a curved extension. When the adjustment portion is not stretched, the maximum distance between the first end and the second end is L1; when the adjustment portion is stretched, the maximum distance between the first end and the second end is L2; ​​L2 is greater than L1; the first fused line segment is located in the area of ​​the first conductive layer corresponding to the adjustment portion.

[0025] In the above scheme, the adjustment part on the voltage sampling component has an unstretched state and a stretched state. In both the unstretched and stretched states, the distance between the first end and the second end can be stretched and deformed, increasing the distance. On the one hand, when installing the voltage sampling component, there may be installation deviations in the installation position. The bending deformation of the adjustment part can be used to adjust the position of the voltage sampling component to match the position of the busbar, reducing the installation difficulty of the voltage sampling component and facilitating its precise installation. On the other hand, during the operation of the battery device, the battery cells in the battery pack will expand and deform. The adjustment part can compensate for the displacement caused by the expansion and deformation of the battery cells through its own stretchable deformation, so that the voltage sampling component is always flexibly connected to the corresponding busbar, reducing the risk of the circuit board being stretched and deformed or displaced, improving the reliability of the battery device. Furthermore, the first fused circuit segment is located in the area of ​​the adjustment part on the first conductive layer, simplifying the manufacturing process.

[0026] According to some embodiments of this application, the circuit board includes a second conductive layer and two second insulating layers. A first die-cut line is formed on the second conductive layer, and the two second insulating layers are respectively disposed on both sides of the thickness direction of the second conductive layer. One of the two second insulating layers facing the voltage sampling device is provided with a second opening, and at least a portion of the first die-cut line is exposed through the second opening to form a second pad. The second pad is used to solder with the first pad.

[0027] In the above scheme, the circuit board includes a second conductive layer and two second insulating layers. A second opening is provided on one of the two second insulating layers facing the voltage sampling device. At least a portion of the first die-cut line is exposed through the second opening to form a second pad. In this way, the circuit board can be soldered to the first pad of the voltage sampling device through the second pad on the first die-cut line, thereby realizing the electrical connection between the voltage sampling device and the circuit board. The connection is convenient, quick, and highly reliable.

[0028] According to some embodiments of this application, the electrical component further includes a temperature sampling circuit board and a temperature sampling element. The temperature sampling circuit board is provided with a second etched line electrically connected to the temperature sampling element. The temperature sampling element is used to collect the temperature signal of the bus or battery cell. The circuit board is also provided with a second die-cut line connected to the output end. The circuit board is connected to the temperature sampling circuit board so that the second die-cut line and the second etched line are electrically connected to form a temperature sampling line to transmit the temperature signal collected by the temperature sampling element to the output end. A second fused line segment is provided on the temperature sampling line. The second fused line segment is provided on the second etched line.

[0029] In the above solution, the electrical components also include a temperature sampling circuit board and a temperature sampling element. The circuit board also has a second die-cut line. The circuit board is connected to the temperature sampling circuit board so that the second die-cut line and the second etched line are electrically connected to form a temperature sampling line. The temperature signal collected by the temperature sampling element is transmitted to the output terminal, realizing the acquisition of temperature information of the battery cells. Furthermore, a second fusible link is provided on the temperature sampling line. When the battery device experiences thermal runaway, the second fusible link will melt and disconnect the temperature sampling line, thus enhancing the safety of the battery device.

[0030] According to some embodiments of this application, the second etched circuit includes a third line segment, a fourth line segment, and a second fused line segment. The third line segment is connected to the circuit board, the fourth line segment is connected to the temperature sampling device, and the second fused line segment connects the third line segment and the fourth line segment. The minimum line width of the second fused line segment is smaller than the line width of the third line segment and the line width of the fourth line segment.

[0031] In the above scheme, the minimum line width of the second fuse segment is smaller than that of the third and fourth segments. When the battery device experiences thermal runaway, the line width of the second fuse segment is smaller than that of the third and fourth segments. The resistance of the second fuse segment is greater and the heat generation is greater. The second fuse segment will melt first, thereby cutting off the temperature sampling line.

[0032] According to some embodiments of this application, the minimum line width of the second die-cut line is greater than the minimum line width of the second fuse line segment.

[0033] In the above scheme, the minimum line width of the second die-cut line is greater than the minimum line width of the second fuse line segment. In this way, when the battery device experiences thermal runaway, the resistance of the second fuse line segment is greater than that of the second die-cut line. The second fuse line segment will melt first, thereby cutting off the temperature sampling line and protecting the circuit board.

[0034] According to some embodiments of this application, the temperature sampling circuit board includes a third conductive layer and two third insulating layers. The second etched line is formed on the third conductive layer, and the two third insulating layers are respectively disposed on both sides of the thickness direction of the third conductive layer. One of the two third insulating layers facing the circuit board is provided with a third opening, and at least part of the third line segment is exposed through the third opening to form a third pad. The third pad is used for soldering to the circuit board.

[0035] In the above scheme, by setting two third insulating layers on both sides of the thickness direction of the third conductive layer, the two third insulating layers can provide insulation protection for the third conductive layer, reducing the risk of short circuit between the third conductive layer and external components. By setting a third opening on the third insulating layer facing the circuit board, the third opening can be exposed on the third line segment to form a third pad. In this way, the third pad is soldered to the circuit board, resulting in high connection stability and realizing the electrical connection between the temperature sampling circuit board and the circuit board.

[0036] According to some embodiments of this application, there are multiple third openings spaced apart along the extension direction of the third line segment, and multiple third pads are formed at the multiple third openings, at least one of the multiple third pads being used for soldering to the circuit board.

[0037] In the above solution, by setting the number of third openings to multiple and spacing them along the extension direction of the third line segment, the circuit board can be connected to the corresponding third pad according to the actual situation. Furthermore, the distribution direction of the multiple die-cut lines on the circuit board can be adapted to the arrangement direction of the multiple third pads. Based on the position of the corresponding second die-cut line on the circuit board, at least one corresponding third pad from the multiple third pads in the temperature sampling circuit board can be selected for soldering. The connection between the circuit board and the temperature sampling circuit board is more flexible, easily achieving cross-line connections between the circuit board and the temperature sampling circuit board, resulting in better versatility.

[0038] According to some embodiments of this application, each third pad is provided with at least one third through hole.

[0039] In the above scheme, by setting at least one third through hole in each third pad, when the third pad is soldered to the circuit board, the solder on the circuit board can extend and fill the third through hole. The staff can judge the soldering effect between the temperature sampling circuit board and the circuit board by the filling of the solder in the third through hole, making the soldering effect between the sampling circuit board and the circuit board visible and making it easier to control the soldering quality between the temperature sampling circuit board and the circuit board.

[0040] According to some embodiments of this application, the third opening is elongated, and each third pad is provided with multiple third through holes, which are spaced apart along the length of the elongated shape.

[0041] In the above scheme, by adopting a long strip shape for the third opening, and setting multiple third through holes for each third pad, and distributing the multiple third through holes at intervals along the length of the strip, when the third pad of the temperature sampling circuit board is soldered to the circuit board, the soldering status and effect between the temperature sampling circuit board and the circuit board can be judged by observing whether the solder on the circuit board extends evenly to the multiple third through holes and by observing the flow of solder in each third through hole. This makes the soldering effect between the temperature sampling circuit board and the circuit board visible and easier to control the soldering quality between the temperature sampling circuit board and the circuit board.

[0042] Secondly, embodiments of this application also provide an electrical device, which includes the battery device of any of the foregoing embodiments, and the electrical device is used to provide electrical energy.

[0043] The power device provided in this application embodiment has the same technical effect as the battery device provided in any of the above embodiments, and will not be described again here.

[0044] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0045] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This application provides structural schematic diagrams of vehicles for some embodiments;

[0047] Figure 2 This is an exploded view of the battery device provided in some embodiments of this application;

[0048] Figure 3 An exploded schematic diagram of a single battery cell in a battery device provided in some embodiments of this application;

[0049] Figure 4 A top view showing the connection between a circuit board and a voltage sampling element in a battery device provided in some embodiments of this application;

[0050] Figure 5 for Figure 4 Enlarged diagram of A in the middle;

[0051] Figure 6 This is a schematic diagram of the structure of a voltage sampling device provided in some embodiments of this application;

[0052] Figure 7 for Figure 6 A schematic diagram of the structure of the first conductive layer in a medium-voltage sampling device;

[0053] Figure 8 A top view showing the connection of a circuit board, voltage sampling device, and temperature sampling assembly provided in some embodiments of this application;

[0054] Figure 9 for Figure 8 Enlarged diagram of B in the diagram;

[0055] Figure 10 This is a schematic diagram of the structure of a temperature sampling component provided in some embodiments of this application;

[0056] Figure 11 A schematic diagram of a second etched circuit provided for some embodiments of this application;

[0057] Figure 12 Cross-sectional views of a circuit board provided for some embodiments of this application;

[0058] Figure 13 This is a schematic diagram showing the connection between a voltage sampling device and a line in a circuit board, as provided in some embodiments of this application.

[0059] Icons: 1000 - Vehicle; 100 - Battery Unit; 200 - Controller; 300 - Motor; 10 - Housing; 11 - First Sub-Housing; 12 - Second Sub-Housing; 20 - Battery Cell; 21 - Housing; 211 - Shell; 212 - End Cap; 213 - First Wall; 22 - Electrode Assembly; 23 - Electrode Terminal; 24 - Battery Cell Group; 30 - Busbar; 40 - Circuit Board; 41 - First Die-Cut Line; 42 - Second Die-Cut Line; 44 - Second Conductive Layer; 45 - Second Insulating Layer; 46 - First Line; 47 - Second Line; 48 - Third Line; 50 - Voltage Sampling Component; 51-First line segment; 511-First pad; 512-First via; 52-First fused line segment; 53-Second line segment; 54-First conductive layer; 55-First insulating layer; 56-First voltage sampling element; 57-Second voltage sampling element; 58-Third voltage sampling element; 59-First etched line; 60-Adjustment section; 61-Temperature sampling circuit board; 611-Third conductive layer; 612-Third insulating layer; 613-Third pad; 614-Third via; 615-Third line segment; 616-Fourth line segment; 617-Second fused line segment; 62-Temperature sampling element. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0061] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0062] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0063] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0064] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0065] In this application, "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0066] The battery apparatus mentioned in the embodiments of this application may include one or more battery cell assemblies for providing voltage and capacity. A battery cell assembly may include multiple battery cells, which are connected in series, parallel, or mixed connections via a busbar.

[0067] In some embodiments, a battery cell assembly is typically formed by arranging multiple battery cells; as an example, a battery cell assembly can be a battery module, which is formed by arranging and fixing multiple battery cells together to form a single module. As an example, a battery module can be formed by bundling multiple battery cells together with cable ties.

[0068] In some embodiments, the battery device may be a battery pack, which includes a housing and one or more individual battery cells housed within the housing.

[0069] As an example, the battery cell assembly can be a battery module, and the battery cell assembly can be housed in the housing by fixing the battery module in the housing.

[0070] As an example, battery cell assemblies can also be housed in a housing by directly fixing multiple battery cells to the housing.

[0071] In some embodiments, the housing may be part of the vehicle's chassis structure. For example, a portion of the housing may be at least a part of the vehicle's floor, or a portion of the housing may be at least a part of the vehicle's crossbeams and longitudinal beams.

[0072] In some embodiments, the battery device may be an energy storage device. Energy storage devices include energy storage containers, energy storage cabinets, etc.

[0073] In this embodiment of the application, the battery cell can be a secondary battery, which refers to a battery cell that can be recharged to activate the active materials and continue to be used after the battery cell has been discharged.

[0074] The battery cell may be, but is not limited to, lithium-ion battery, sodium-ion battery, sodium-lithium-ion battery, lithium metal battery, sodium metal battery, lithium-sulfur battery, magnesium-ion battery, nickel-metal hydride battery, nickel-cadmium battery, lead-acid battery, etc.

[0075] A single battery cell typically includes an electrode assembly. The electrode assembly comprises a positive electrode, a negative electrode, and a separator. During the charging and discharging process of a single battery cell, active ions (such as lithium ions) repeatedly insert and extract between the positive and negative electrodes. The separator, positioned between the positive and negative electrodes, prevents short circuits while allowing active ions to pass through.

[0076] In some embodiments, the positive electrode may be a positive electrode sheet, which may include a positive electrode current collector and a positive electrode active material disposed on at least one surface of the positive electrode current collector.

[0077] As an example, the positive current collector has two surfaces opposite each other in its own thickness direction, and the positive active material is disposed on either or both of the two opposite surfaces of the positive current collector.

[0078] As an example, the positive electrode current collector can be a metal foil or a composite current collector. For example, as a metal foil, it can be made of stainless steel, copper, aluminum, carbon electrodes, carbon, nickel, or titanium with a silver-plated surface. The composite current collector may include a polymer material base layer and a metal layer. The composite current collector can be formed by forming a metal material (aluminum, aluminum alloy, nickel, nickel alloy, titanium, titanium alloy, silver and silver alloy, etc.) on a polymer material substrate (such as a substrate of polypropylene, polyethylene terephthalate, polybutylene terephthalate, polystyrene, polyethylene, etc.).

[0079] As an example, the positive electrode active material may include at least one of the following materials: lithium phosphate, lithium transition metal oxide, and their respective modified compounds. However, this application is not limited to these materials, and other conventional materials that can be used as positive electrode active materials for battery cells may also be used.

[0080] In some embodiments, the negative electrode may be a negative electrode sheet, and the negative electrode sheet may include a negative electrode current collector.

[0081] As an example, the negative electrode current collector can be a metal foil or a composite current collector. For example, as a metal foil, it can be aluminum with a silver-plated surface, stainless steel with a silver-plated surface, copper, aluminum, carbon electrode, carbon, nickel, or titanium, etc.

[0082] In some embodiments, the negative electrode current collector has two surfaces opposite each other in its own thickness direction, and the negative electrode active material is disposed on either or both of the two opposite surfaces of the negative electrode current collector.

[0083] As an example, the negative electrode active material may be a negative electrode active material known in the art for use in battery cells. As an example, the negative electrode active material may include at least one of the following materials: artificial graphite, natural graphite, soft carbon, hard carbon, silicon-based materials, tin-based materials, and lithium titanate, etc. Silicon-based materials may be selected from at least one of elemental silicon, silicon oxide compounds, silicon-carbon composites, silicon-nitrogen composites, and silicon alloys. Tin-based materials may be selected from at least one of elemental tin, tin oxide compounds, and tin alloys. However, this application is not limited to these materials, and other conventional materials that can be used as negative electrode active materials in battery cells may also be used. These negative electrode active materials may be used alone or in combination of two or more.

[0084] In some embodiments, the diaphragm is a separator membrane. This application does not impose any particular limitation on the type of separator membrane; any known porous separator membrane with good chemical and mechanical stability can be selected.

[0085] As an example, the main material of the separator can be selected from at least one of glass fiber, non-woven fabric, polyethylene, polypropylene, polyvinylidene fluoride, and ceramic. The separator can be a single-layer film or a multi-layer composite film, without particular limitation. When the separator is a multi-layer composite film, the materials of each layer can be the same or different, without particular limitation. The separator can be a separate component located between the positive and negative electrodes, or it can be attached to the surfaces of the positive and negative electrodes.

[0086] In some embodiments, the membrane is a solid electrolyte. The solid electrolyte is disposed between the positive and negative electrodes, serving both to transport ions and to isolate the positive and negative electrodes.

[0087] In some implementations, the electrode assembly is a wound structure. The positive and negative electrode sheets are wound into a wound structure.

[0088] In some implementations, the electrode assembly is a stacked structure.

[0089] In some embodiments, the battery cell may include a housing. The housing is used to encapsulate components such as electrode assemblies and electrolytes. The housing may be made of steel, aluminum, plastic (such as polypropylene), composite metal (such as copper-aluminum composite), or aluminum-plastic film, etc.

[0090] In some embodiments, the housing includes an end cap and a casing, the casing having an opening, and the end cap closing the opening to form a sealed space for accommodating substances such as electrode assemblies and electrolytes. The casing may have one or more openings. The end cap may also be provided one or more times.

[0091] In some embodiments, at least one electrode terminal is provided on the housing, and the electrode terminal is electrically connected to the tab of the electrode assembly. The electrode terminal can be directly connected to the tab or indirectly connected to the tab through a current collector. The electrode terminal can be provided on the end cap or on the housing.

[0092] In some implementations, an explosion-proof valve is provided on the housing. The explosion-proof valve is used to release the internal pressure of the battery cells.

[0093] As an example, the battery cell can be a cylindrical battery cell, a prismatic battery cell, a pouch battery cell, or a battery cell of other shapes. Prismatic battery cells include prismatic battery cells, blade-shaped battery cells, and multi-prismatic batteries, such as hexagonal prismatic batteries. There are no particular limitations in the embodiments of this application.

[0094] In battery technology, a sampling unit is typically installed within the battery device. This unit collects and monitors operational information during battery use to obtain data on the device's performance. The sampling unit includes a circuit board, which is generally divided into etched circuit boards (Flexible Printed Circuit, FPC) and die-cutting circuit boards (Flexible Die-cutting Circuit, FDC). However, etched circuit boards suffer from complex manufacturing processes and high production costs.

[0095] In view of this, in order to solve the problem of high manufacturing cost of battery devices, some embodiments of this application provide a battery device, which includes a battery cell group, a busbar and an electrical component. The battery cell group includes a plurality of battery cells; the busbar is electrically connected to the electrode terminals of at least two battery cells; the electrical component includes a circuit board and a voltage sampling device. The circuit board has an output terminal and a first die-cut line electrically connected to the output terminal. The voltage sampling device has a first etched line electrically connected to the busbar. The circuit board and the voltage sampling device are connected so that the first die-cut line and the first etched line are electrically connected to form a voltage sampling line to transmit the voltage signal collected at the busbar to the output terminal. A first fused line segment is provided on the voltage sampling line and the first fused line segment is provided on the first etched line.

[0096] The battery device provided in this application uses a die-cut circuit board as the circuit board. Compared with an etched circuit board, the die-cut circuit board uses physical stamping or continuous cutting with a circular knife, eliminating the multiple processes required for etching circuit board manufacturing, such as plate making, developing, etching, and cleaning. This reduces the number of production steps, shortens the production cycle, increases production efficiency, and is suitable for mass production, resulting in lower overall manufacturing costs. Furthermore, the die-cut circuit board uses a subtractive and recyclable process, allowing for direct recycling of waste materials and minimizing material waste. The production of the die-cut circuit board avoids acidic etching solutions, eliminating heavy metal wastewater and exhaust gas emissions, thus improving environmental friendliness. For safety reasons, a fusible circuit is required on the voltage sampling line. Since die-cutting is not convenient for forming the fusible section, a separate voltage sampling component is used. The voltage sampling component uses an etched first etched line, and a first fusible section is located on the first etched line of the voltage sampling component. This allows the voltage sampling component to have a first fusible section. When the battery device experiences thermal runaway, the first fusible section melts, cutting off the voltage sampling line and protecting the battery device.

[0097] The battery device disclosed in this application can be used, but is not limited to, in electrical equipment such as vehicles, ships, or aircraft. A power system for such electrical equipment can be constructed using the battery device disclosed in this application.

[0098] The technical solutions described in the embodiments of this application are applicable to various electrical devices that use battery cells and battery devices, such as mobile phones, portable devices, laptops, electric vehicles, electric toys, power tools, vehicles, ships and spacecraft, etc. For example, spacecraft include airplanes, rockets, space shuttles and spacecraft.

[0099] For ease of explanation, the following embodiments will use a vehicle as an example of an electrical device according to an embodiment of this application.

[0100] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a vehicle 1000 provided in some embodiments of this application. The vehicle 1000 can be a gasoline-powered vehicle, a natural gas-powered vehicle, or a new energy vehicle. New energy vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles, etc. A battery device 100 is provided inside the vehicle 1000, and the battery device 100 can be located at the bottom, front, or rear of the vehicle 1000. The battery device 100 can be used to power the vehicle 1000; for example, the battery device 100 can serve as the operating power source for the vehicle 1000's electrical system, such as meeting the power requirements for starting, navigation, and operation of the vehicle 1000.

[0101] The vehicle 1000 may also include a controller 200 and a motor 300. The controller 200 is used to control the battery device 100 to supply power to the motor 300, for example, for the power needs of the vehicle 1000 during startup, navigation and driving.

[0102] In some embodiments of this application, the battery device 100 can not only serve as the operating power source for the vehicle 1000, but also as the driving power source for the vehicle 1000, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1000.

[0103] Please refer to Figure 2 , Figure 2This is an exploded view of the structure of a battery device 100 provided in some embodiments of this application. The battery device 100 includes a housing 10 and a battery cell 20, with the battery cell 20 housed within the housing 10. The housing 10 provides a space for the battery cell 20 and can have various structures. In some embodiments, the housing 10 may include a first sub-housing 11 and a second sub-housing 12, which overlap each other, jointly defining a space for accommodating the battery cell 20. The second sub-housing 12 may be a hollow structure with one open end, while the first sub-housing 11 may be a plate-like structure, covering the open side of the second sub-housing 12 so that the first sub-housing 11 and the second sub-housing 12 jointly define the space. Alternatively, both the first sub-housing 11 and the second sub-housing 12 may be hollow structures with one open side, with the open side of the first sub-housing 11 covering the open side of the second sub-housing 12.

[0104] In the battery device 100, there can be multiple battery cells 20. These multiple battery cells 20 can be connected in series, in parallel, or in a mixed configuration. A mixed configuration means that multiple battery cells 20 are connected in both series and parallel configurations. Multiple battery cells 20 can be directly connected in series, in parallel, or in a mixed configuration, and then the entire assembly of the multiple battery cells 20 is housed within the housing 10. Alternatively, the battery device 100 can also be composed of multiple battery cells 20 first connected in series, in parallel, or in a mixed configuration to form a battery module, and then multiple battery modules are connected in series, in parallel, or in a mixed configuration to form a whole, which is then housed within the housing 10.

[0105] The battery device 100 may also include other structures, such as a busbar for electrical connection between multiple battery cells 20.

[0106] Please refer to Figure 3 , Figure 3 This is an exploded view of the battery cell 20 provided in an embodiment of this application. The battery cell 20 includes a housing 21, an electrode assembly 22, and electrode terminals 23. The housing 21 includes a shell 211 and an end cap 212. The shell 211 has an opening, and the end cap 212 closes the opening to isolate the internal environment of the battery cell 20 from the external environment. The end cap 212 includes a first wall 213, and the electrode terminals 23 are disposed on the first wall 213.

[0107] The housing 211 is a component used to cooperate with the end cap 212 to form the internal environment of the battery cell 20, wherein the formed internal environment can accommodate the electrode assembly 22, electrolyte, and other components. The housing 211 and the end cap 212 can be independent components. The housing 211 can have various shapes and sizes. Specifically, the shape of the housing 211 can be determined according to the specific shape and size of the electrode assembly 22. The housing 211 can be made of various materials, such as copper, iron, aluminum, stainless steel, aluminum alloy, and plastic.

[0108] End cap 212 refers to a component that covers the opening of housing 211 to isolate the internal environment of battery cell 20 from the external environment. The shape of end cap 212 can be adapted to the shape of housing 211 to fit it. Optionally, end cap 212 can be made of a material with certain hardness and strength (such as aluminum alloy), so that end cap 212 is not easily deformed under pressure and impact, giving battery cell 20 higher structural strength and improved reliability. Functional components such as electrode terminals 23 can be provided on end cap 212. Electrode terminals 23 can be used for electrical connection with electrode assembly 22 to output or input electrical energy to battery cell 20. The material of end cap 212 can also be various, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc., and this application embodiment does not impose special limitations on this.

[0109] Electrode assembly 22 is a component in the battery cell 20 where electrochemical reactions occur. The housing 211 may contain one or more electrode assemblies 22.

[0110] This application provides a battery device; please refer to... Figures 4 to 7 , Figure 4 A top view showing the connection between a circuit board and a voltage sampling element in a battery device provided in some embodiments of this application; Figure 5 for Figure 4 Enlarged diagram of A in the middle; Figure 6 This is a schematic diagram of the structure of a voltage sampling device provided in some embodiments of this application; Figure 7 for Figure 6A schematic diagram of the structure of the first conductive layer in the medium voltage sampling device. The battery device 100 includes a battery cell group 24, a busbar 30, and electrical components. The battery cell group 24 includes multiple battery cells 20. The busbar 30 is electrically connected to the electrode terminals 23 of at least two battery cells 20. The electrical components include a circuit board 40 and a voltage sampling device 50. The circuit board 40 has an output terminal and a first die-cut line 41 electrically connected to the output terminal. The voltage sampling device 50 has a first etched line 59 electrically connected to the busbar 30. The circuit board 40 and the voltage sampling device 50 are connected so that the first die-cut line 41 and the first etched line 59 are electrically connected to form a voltage sampling line to transmit the voltage signal collected at the busbar 30 to the output terminal. A first fused line segment 52 is provided on the voltage sampling line and is disposed on the first etched line 59.

[0111] The busbar 30 electrically connects to the electrode terminals 23 of at least two battery cells 20, thus enabling series or parallel connection of different battery cells 20. Optionally, the busbar 30 can connect electrode terminals of two battery cells 20 with the same polarity to achieve parallel connection of the battery cells 20, or the busbar 30 can connect electrode terminals 23 of two battery cells with opposite polarities to achieve series connection of the battery cells 20.

[0112] The circuit board 40 has an output terminal and a first die-cut line 41 electrically connected to the output terminal. The output terminal is used for electrical connection with the battery management system. The circuit board 40 is a flexible die-cut circuit board. The flexible die-cut circuit board uses precision die-cutting (rotary blade / flat blade / laser) to replace the chemical etching and electroplating of etched circuit boards, and physically forms the flexible interconnects of conductive lines. Due to its manufacturing process, the flexible die-cut circuit board is less expensive than etched circuit boards.

[0113] The voltage sampling device 50 is provided with a first etched line 59 electrically connected to the busbar 30. The first etched line 59 of the voltage sampling device 50 can be formed by etching. The circuit board 40 is connected to the voltage sampling device 50 so that the first die-cut line 41 and the first etched line 59 are electrically connected to form a voltage sampling line, so as to transmit the voltage signal collected at the busbar 30 to the output terminal, thereby making the first etched line 59 of the voltage sampling device 50 electrically connected to the first die-cut line 41 of the circuit board 40. The voltage sampling device 50 can collect the voltage information of the battery cell 20.

[0114] The first fused line segment 52 on the first etched line 59 refers to the fuse segment, which can also be understood as a fuse or a fused part (Fusible Link, FUSE). When the voltage of the voltage sampling line is too high or there is an abnormal situation such as a short circuit, the first fused line segment 52 melts, thereby cutting off the voltage sampling line between the bus 30 and the circuit board 40, and protecting the battery device 100.

[0115] It should be noted that when the traditional circuit board 40 is an etched circuit board, the circuit board 40 itself has a voltage sampling component 50 and a fuse. The fuse is integrated on the circuit board 40, and the circuit board 40 and the bus 30 are soldered together with nickel sheets to achieve voltage sampling.

[0116] In the technical solution of this application embodiment, the circuit board 40 is provided with an output terminal and a first die-cutting line 41 electrically connected to the output terminal. That is, the circuit board 40 is continuously cut by physical stamping or circular knife, which eliminates the multiple processes such as plate making, developing, etching, and cleaning required for etching circuit board manufacturing. This reduces the production steps of the circuit board 40, shortens the production cycle, increases production efficiency, and is suitable for mass production. The overall manufacturing cost of the circuit board 40 is also lower. Furthermore, the die-cut circuit board adopts a material reduction and recyclable process, and waste materials can be directly recycled, resulting in less material waste. Moreover, the production of the die-cut circuit board avoids acidic etching solutions, and there is no emission of heavy metal wastewater or exhaust gas, making it more environmentally friendly. For safety reasons, a fuse circuit needs to be set on the voltage sampling line. Since the die-cutting process is inconvenient to form the fuse part, a separate voltage sampling component 50 is set. The voltage sampling component 50 is formed by etching the first etched line 59. The first fuse circuit segment 52 is set on the first etched line 59 of the voltage sampling component 50, so that the voltage sampling component 50 has the first fuse circuit segment 52. When the battery device 100 experiences thermal runaway, the first fuse circuit segment 52 melts to cut off the voltage sampling line, thereby protecting the battery device 100.

[0117] According to some embodiments of this application, please refer to Figure 7 The first etched line 59 includes a first line segment 51, a second line segment 53 and a first fused line segment 52. The first line segment 51 is connected to the circuit board 40, the second line segment 53 is connected to the bus 30, and the first fused line segment 52 connects the first line segment 51 and the second line segment 53. The minimum line width of the first fused line segment 52 is smaller than the line width of the first line segment 51 and the line width of the second line segment 53.

[0118] The first etched circuit 59 includes a first line segment 51, a second line segment 53, and a first fused line segment 52. The first line segment 51 is connected to the circuit board 40, the second line segment 53 is connected to the busbar 30, and the first fused line segment 52 connects the first line segment 51 and the second line segment 53. That is, the first fused line segment 52 is located between the first line segment 51 and the second line segment 53 in the first etched circuit 59. The minimum line width of the first fused line segment 52 is smaller than the line width of the first line segment 51 and the second line segment 53. In other words, the minimum wire diameter of the first fused line segment 52 is smaller than that of the first line segment 51 and the second line segment 53. When the battery device 100 experiences abnormal phenomena such as thermal runaway or short circuit, the first fused line segment 52, with its smaller line width, will melt before the line width of the first line segment 51 and the second line segment 53, cutting off the voltage sampling line between the busbar 30 and the circuit board 40, thus protecting the battery device 100.

[0119] In the above scheme, the minimum line width of the first fuse line segment 52 is smaller than the line width of the first line segment 51 and the line width of the second line segment 53. When the battery device 100 experiences thermal runaway, the line width of the first fuse line segment 52 is smaller than the line width of the first line segment 51 and the second line segment 53. The resistance of the first fuse line segment 52 is greater and the heat generation is greater. The first fuse line segment 52 will melt first, thereby cutting off the voltage sampling line.

[0120] According to some embodiments of this application, the minimum line width of the first die-cut line 41 is greater than the minimum line width of the first fused line segment 52.

[0121] The minimum line width of the first die-cut line 41 is greater than the minimum line width of the first fuse line segment 52. This means that the minimum line width of the first fuse line segment 52 is less than the minimum line width of the first die-cut line 41. When the battery device 100 experiences abnormal phenomena such as thermal runaway or short circuit, the first fuse line segment 52 with a smaller line width will melt before the first die-cut line 41 on the circuit board 40, cutting off the voltage sampling line between the bus 30 and the circuit board 40, thus protecting the battery device 100.

[0122] In the above scheme, the minimum line width of the first die-cut line 41 is greater than the minimum line width of the first fuse line segment 52. In this way, when the battery device experiences thermal runaway, the resistance of the first fuse line segment 52 is greater than that of the first die-cut line 41. The first fuse line segment 52 will melt first, thereby cutting off the voltage sampling line and protecting the die-cut line on the circuit board 40.

[0123] According to some embodiments of this application, the minimum line width of the first die-cut line 41 is greater than the minimum line width of the first line segment 51 and the minimum line width of the second line segment 53.

[0124] The minimum linewidth of the first die-cut line 41 is greater than the minimum linewidth of the first line segment 51 and the minimum linewidth of the second line segment 53. This means that the minimum linewidth of the first line segment 51 is less than the minimum linewidth of the first die-cut line 41, and the minimum linewidth of the second line segment 53 is less than the minimum linewidth of the first die-cut line 41. When the battery device experiences abnormal phenomena such as thermal runaway or short circuit, the smaller linewidths of the first line segment 51 and the second line segment 53 will melt before the first die-cut line 41 on the circuit board 40, cutting off the voltage sampling line between the bus 30 and the circuit board 40, thus protecting the battery device 100.

[0125] In the above scheme, since the minimum line width of the first die-cut line 41 is greater than the minimum line width of the first line segment 51 and the minimum line width of the second line segment 53, even if the battery device experiences thermal runaway, the first line segment 51 will melt before the first die-cut line 41, thus protecting the die-cut lines on the circuit board 40 and making the circuit board 40 safer.

[0126] According to some embodiments of this application, please refer to Figure 6 and Figure 7 The voltage sampling device 50 includes a first conductive layer 54 and two first insulating layers 55. A first etched line 59 is formed on the first conductive layer 54, and the two first insulating layers 55 are respectively disposed on both sides of the thickness direction of the first conductive layer 54.

[0127] Two first insulating layers 55 are respectively disposed on both sides of the first conductive layer 54 in the thickness direction, and the two first insulating layers 55 can provide insulation for the first conductive layer 54. The first conductive layer 54 can be made of copper foil, and the first insulating layer 55 can be made of polyimide (PI) or polyester (PET). In this embodiment, the first insulating layer 55 is made of PI film. The first etched line 59 is formed on the first conductive layer 54, that is, the first etched line 59 is formed on the first conductive layer 54, and the first etched line 59 belongs to the first conductive layer 54.

[0128] In the above scheme, by providing two first insulating layers 55 on both sides of the thickness direction of the first conductive layer 54, the two first insulating layers 55 can provide insulation protection for the first conductive layer 54, reducing the risk of short circuit between the first conductive layer 54 and external components.

[0129] According to some embodiments of this application, please refer to Figure 6 One of the two first insulating layers 55 facing the circuit board 40 has a first opening, and a first line segment 51 is exposed at least partially through the first opening to form a first pad 511, which is used for soldering to the circuit board 40.

[0130] One of the two first insulating layers 55 facing the circuit board 40 has a first opening, meaning that the first opening is provided on the one of the two first insulating layers 55 closer to the circuit board 40. The number of first openings can be one or more. A first pad 511 is formed on the first line segment 51 through the first opening, and the voltage sampling component 50 is soldered to the circuit board 40 through the exposed first pad 511 on the first line segment 51.

[0131] In the above scheme, by providing a first opening on the first insulating layer 55 facing the circuit board 40, the first opening can be exposed on the first line segment 51 to form a first pad 511. In this way, the voltage sampling device 50 is soldered to the circuit board 40 through the first pad 511, which has high connection stability and realizes the electrical connection between the voltage sampling device 50 and the circuit board 40.

[0132] According to some embodiments of this application, please refer to Figure 6 The first opening has multiple openings and is spaced apart along the extension direction of the first line segment 51. Multiple first pads 511 are formed at the multiple first openings, and at least one of the multiple first pads 511 is used for soldering to the circuit board 40.

[0133] Circuit board 40 is a flexible die-cut circuit board, and the arrangement direction of multiple die-cut lines in the flexible die-cut circuit board can be the same as the extension direction of the first line segment 51. Please refer to... Figure 13 The circuit board 40 has multiple first die-cut lines 41, including a first line 46, a second line 47, and a third line 48. There are multiple voltage sampling elements 50, spaced apart along the arrangement direction of the multiple battery cells. These multiple voltage sampling elements 50 include a first voltage sampling element 56, a second voltage sampling element 57, and a third voltage sampling element 58. The normal routing of the voltage sampling elements 50 to the circuit board 40 is as follows: the first line 46 is soldered to the corresponding first pad 511 on the nearest first voltage sampling element 56, and the second line 47 is soldered to the corresponding first pad 511 on the nearest second voltage sampling element 57. Please refer to the diagram. A cross-line connection means that the first line 46 passes through the first voltage sampling element 56 and the second voltage sampling element 57 and can be connected to the voltage sampling element 50 at the end (e.g., the third voltage sampling element 58). The second line 47 passes through the first voltage sampling element 56 and is electrically connected to the second voltage sampling element 57. The third line 48 is electrically connected to the first voltage sampling element 56. At this time, the first line 46 spans across the first voltage sampling element 56 and the second voltage sampling element 57. Because when the first line 46 passes through the first voltage sampling element 56 and the second voltage sampling element 57, there is no window opened in the corresponding area of ​​the first line 46 and the first voltage sampling element 56 and the second voltage sampling element 57 on the circuit board 40. Therefore, the first line 46 will not be short-circuited with the first voltage sampling element 56 and the second voltage sampling element 57.

[0134] In the above scheme, by setting the number of first openings to multiple and spaced apart along the extension direction of the first line segment 51, the number of circuit boards 40 connected to the corresponding first pads 511 can be selected according to the actual situation. Furthermore, the distribution direction of the multiple die-cut lines on the circuit board 40 can be adapted to the arrangement direction of the multiple first pads 511. Based on the position of the die-cut lines at corresponding positions on the circuit board 40, at least one corresponding first pad 511 among the multiple first pads 511 in the voltage sampling component 50 can be selected for soldering. The connection between the circuit board 40 and the voltage sampling component 50 is more flexible, and cross-line connections between the circuit board 40 and the voltage sampling component 50 can be easily achieved, resulting in better versatility.

[0135] According to some embodiments of this application, please refer to Figure 6 Each first pad 511 is provided with at least one first through hole 512.

[0136] The first through-hole 512 refers to a through-hole structure that penetrates the thickness direction of the first line segment 51 of the first conductive layer 54. The shape of the first through-hole 512 can be various, such as circular, rectangular, or strip-shaped. In this embodiment, the shape of the first through-hole 512 is circular. Each first pad 511 has at least one first through-hole 512, meaning that each first pad 511 can have one first through-hole 512, although the number of first through-holes 512 can also be multiple, depending on the specific circumstances.

[0137] Before soldering the circuit board 40, solder is applied to the solderable area on the circuit board 40. When the first pad 511 on the first line segment 51 is soldered to the circuit board 40, the solder on the circuit board 40 can gradually fill the first through hole 512. The first through hole 512 can be used to observe the soldering effect between the first line segment 51 and the circuit board 40.

[0138] In the above scheme, by providing at least one first through hole 512 in each first pad 511, when the first pad 511 on the first line segment 51 is soldered to the circuit board 40, the solder on the circuit board 40 melts and flows and partially fills the first through hole 512. The operator can observe the soldering effect between the first pad 511 on the first line segment 51 and the circuit board 40 through the first through hole 512, making the soldering effect between the voltage sampling device 50 and the circuit board 40 visible and making it easier to control the soldering quality between the voltage sampling device 50 and the circuit board 40.

[0139] According to some embodiments of this application, the first opening is elongated, and each first pad 511 is provided with a plurality of first through holes 512, which are spaced apart along the length of the elongated shape.

[0140] The number of first vias 512 within each first pad 511 can be two, three, or four, depending on the specific circumstances. In this embodiment, the number of first vias 512 within each first pad 511 is three, and the three first vias 512 are spaced apart.

[0141] In the above scheme, by adopting a long strip shape for the first opening, and providing multiple first through holes 512 for each first pad 511, and distributing the multiple first through holes 512 at intervals along the length of the long strip, when the first pad 511 on the first line segment 51 is soldered to the circuit board 40, the soldering status and effect between the first line segment 51 and the circuit board 40 can be judged by observing whether the solder on the circuit board 40 extends evenly to the multiple first through holes 512, and by observing the flow of solder in each first through hole 512. This makes the soldering effect between the voltage sampling device 50 and the circuit board 40 visible and makes it easier to control the soldering quality between the voltage sampling device 50 and the circuit board 40.

[0142] According to some embodiments of this application, please refer to Figure 7 The end of the first line segment 51 connected to the circuit board 40 is the first end, and the end of the second line segment 53 connected to the bus 30 is the second end. Projected orthogonally on a projection plane perpendicular to the thickness direction of the voltage sampling element 50, the voltage sampling element 50 has an adjustment portion 60 projected as a curved extension. When the adjustment portion 60 is not stretched, the maximum distance between the first end and the second end is L1; when the adjustment portion 60 is stretched, the maximum distance between the first end and the second end is L2; ​​L2 is greater than L1; the first fused line segment 52 is located on the first conductive layer 54 in the area corresponding to the adjustment portion 60.

[0143] The first end refers to the end of the first line segment 51 that connects to the circuit board 40, and the second end refers to the end of the second line segment 53 that connects to the busbar 30. The adjustment part 60 refers to the part of the voltage sampling element 50 that extends in a curved manner on its thickness direction projection surface. The adjustment part 60 can be bent and deformed under the action of external force, thereby increasing the distance between the first end and the second end.

[0144] In the above scheme, the adjustment part 60 on the voltage sampling component 50 has an unstretched state and a stretched state. In the unstretched state and the stretched state, the distance between the first end and the second end can be stretched and deformed, increasing the distance. On the one hand, when installing the voltage sampling component 50, there may be installation deviations in the installation position of the voltage sampling component 50. The bending deformation of the adjustment part 60 can be used to adjust the position of the voltage sampling component 50 to match the position of the busbar 30, reducing the installation difficulty of the voltage sampling component 50 and facilitating its precise installation. On the other hand, during the operation of the battery device, the battery cells in the battery cell group 24 will expand and deform. The adjustment part 60 can compensate for the displacement caused by the expansion and deformation of the battery cells through its own stretchable deformation, so that the voltage sampling component 50 is always flexibly connected to the corresponding busbar 30. This reduces the risk of the circuit board 40 being stretched and deformed or displaced, improving the reliability of the battery device. Furthermore, the first fused line segment 52 is located in the area of ​​the first conductive layer 54 corresponding to the adjustment part 60, simplifying the manufacturing process.

[0145] According to some embodiments of this application, please refer to Figure 12 The circuit board 40 includes a second conductive layer 44 and two second insulating layers 45. A first die-cut line 41 is formed on the second conductive layer 44. The two second insulating layers 45 are respectively disposed on both sides of the second conductive layer 44 in the thickness direction. One of the two second insulating layers 45 facing the voltage sampling member 50 is provided with a second opening. At least a portion of the first die-cut line 41 is exposed through the second opening to form a second pad. The second pad is used to solder with the first pad 511.

[0146] The second conductive layer 44 refers to the conductive component in the circuit board 40 that performs a conductive function. The first die-cut line 41 mentioned above belongs to the second conductive layer 44. Two second insulating layers 45 are respectively disposed on both sides of the thickness direction of the second conductive layer 44. The one of the two second insulating layers 45 facing the voltage sampling device 50 is provided with a second opening. That is, the one of the two second insulating layers 45 closer to the voltage sampling device 50 is provided with a second opening. At least a part of the first die-cut line 41 is exposed through the second opening to form a second pad. That is, the area of ​​the second pad of the second conductive layer 44 is not provided with a second insulating layer 45. The first die-cut line 41 is soldered to the first pad 511 of the voltage sampling device 50 through the second pad, thereby realizing the electrical connection between the circuit board 40 and the voltage sampling device 50.

[0147] Of course, when there are multiple voltage sampling elements 50, there are also multiple second pads, and the number of second pads is not less than the number of voltage sampling elements 50. The position of the second pad on the circuit board 40 corresponds to the position of the voltage sampling element 50. That is, the circuit board 40 opens a second opening at the position corresponding to the voltage sampling element 50, and the first pad 511 is soldered to the second pad to realize the electrical connection between the voltage sampling element 50 and the circuit board 40.

[0148] In the above scheme, the circuit board 40 includes a second conductive layer 44 and two second insulating layers 45. A second opening is provided on one of the two second insulating layers 45 facing the voltage sampling element 50. At least a portion of the first die-cut line 41 is exposed through the second opening to form a second pad. In this way, the circuit board 40 can be soldered to the first pad 511 of the voltage sampling element 50 through the second pad on the first die-cut line 41, thereby realizing the electrical connection between the voltage sampling element 50 and the circuit board 40. The connection is convenient, quick and reliable.

[0149] According to some embodiments of this application, please refer to Figures 8 to 13 The electrical components also include a temperature sampling circuit board 61 and a temperature sampling element 62. The temperature sampling circuit board 61 is provided with a second etched line electrically connected to the temperature sampling element 62. The temperature sampling element 62 is used to collect the temperature signal of the bus 30 or the battery cell. The circuit board 40 is also provided with a second die-cut line 42 connected to the output end. The circuit board 40 is connected to the temperature sampling circuit board 61 so that the second die-cut line 42 and the second etched line are electrically connected to form a temperature sampling line to transmit the temperature signal collected by the temperature sampling element 62 to the output end. A second fused line segment 617 is provided on the temperature sampling line. The second fused line segment 617 is provided on the second etched line.

[0150] The temperature sampling circuit board 61 is electrically connected to the temperature sampling component 62 and the circuit board 40. The temperature sampling circuit board 61 integrates a second etched circuit, which can be shaped by etching. The second fuse segment 617 refers to the fuse segment set on the second etched circuit. The principle is the same as that of the first fuse segment, so it will not be described in detail here.

[0151] The second etched circuit includes a third line segment 615, a fourth line segment 616, and a second fused line segment 617. The third line 615 is connected to the circuit board 40, and the fourth line segment 616 is connected to the temperature sampling element 62. The second fused line segment connects the third line segment 615 and the fourth line segment 616, meaning that the second fused line segment 617 is located between the third line segment 615 and the fourth line segment 616 in the second etched circuit. The minimum line width of the second fused line segment 617 is smaller than the line width of the third line segment 615 and the line width of the fourth line segment 616. In other words, the minimum line diameter of the second fused line segment 617 is smaller than that of the third line segment 615 and the fourth line segment 616. When the battery device experiences abnormal phenomena such as thermal runaway or short circuit, the smaller-line-width second fused line segment 617 will melt before the line width of the third line segment 615 and the fourth line segment 616, severing the temperature sampling line between the temperature sampling element 62 and the circuit board 40, thus protecting the battery device.

[0152] In the above scheme, the electrical components also include a temperature sampling circuit board 61 and a temperature sampling element 62. A second die-cut line 42 is also provided on the circuit board 40. The circuit board 40 is connected to the temperature sampling circuit board 61 so that the second die-cut line 42 is electrically connected to the second etched line to form a temperature sampling line. The temperature signal collected by the temperature sampling element 62 is transmitted to the output terminal to realize the acquisition of temperature information of the battery cell. Furthermore, a second fuse segment 617 is provided on the temperature sampling line. When the battery device experiences thermal runaway, the second fuse segment 617 will melt and disconnect the temperature sampling line, thus improving the safety of the battery device.

[0153] According to some embodiments of this application, please refer to Figure 11 The second etched circuit includes a third line segment 615, a fourth line segment 616, and a second fused line segment 617. The third line segment 615 is connected to the circuit board 40, the fourth line segment 616 is connected to the temperature sampling component 62, and the second fused line segment connects the third line segment 615 and the fourth line segment 616. The minimum line width of the second fused line segment 617 is smaller than the line width of the third line segment 615 and the line width of the fourth line segment 616.

[0154] According to some embodiments of this application, the minimum line width of the second die-cut line 42 is greater than the minimum line width of the second fuse line segment 617.

[0155] The minimum line width of the second die-cutting line 42 is greater than the minimum line width of the second fuse segment 617. This means that the minimum line width of the second fuse segment 617 is less than the minimum line width of the second die-cutting line 42. When the battery device experiences abnormal phenomena such as thermal runaway or short circuit, the second fuse segment 617, which has a smaller line width, will melt before the second die-cutting line 42 on the circuit board 40, cutting off the voltage sampling line between the temperature sampling component 62 and the circuit board 40, thus protecting the battery device.

[0156] In the above scheme, the minimum line width of the second die-cut line 42 is greater than the minimum line width of the second fuse line segment 617. In this way, when the battery device 100 experiences thermal runaway, the resistance of the second fuse line segment 617 is greater than that of the second die-cut line 42. The second fuse line segment 617 will melt first, thereby cutting off the temperature sampling line and protecting the circuit board 40.

[0157] According to some embodiments of this application, please refer to Figure 10 and Figure 11 The temperature sampling circuit board 61 includes a third conductive layer 611 and two third insulating layers 612. The second etched line is formed on the third conductive layer 611. The two third insulating layers 612 are respectively disposed on both sides of the thickness direction of the third conductive layer 611. One of the two third insulating layers 612 facing the circuit board 40 is provided with a third opening. At least part of the third line segment 615 is exposed through the third opening to form a third pad 613. The third pad 613 is used for soldering to the circuit board 40.

[0158] The third conductive layer 611 is made of a metallic conductive material, for example, copper. Two third insulating layers 612 are respectively disposed on both sides of the thickness direction of the third conductive layer 611, meaning that a third insulating layer 612 is disposed on both sides of the thickness direction of the third conductive layer 611. The third insulating layers 612 provide insulation and protection for the third conductive layer 611. The material of the third insulating layer 612 can be polyimide (PI) or polyester (PET). In this embodiment, the material of the third insulating layer 612 is a PI film.

[0159] One of the two third insulating layers 612 facing the circuit board 40 has a third opening. At least part of the third line segment 615 is exposed through the third opening to form a third pad 613. This means that the third opening is provided on the one of the two third insulating layers 612 closer to the circuit board 40. The number of third openings can be one or more. The third line segment 615 can be exposed through the third opening to form the third pad 613. The temperature sampling circuit board 61 is soldered to the circuit board 40 through the exposed third pad 613 on the third line segment 615.

[0160] In the above scheme, by providing two third insulating layers 612 on both sides of the thickness direction of the third conductive layer 611, the two third insulating layers 612 can provide insulation protection for the third conductive layer 611, reducing the risk of short circuit between the third conductive layer 611 and external components. By providing a third opening on the third insulating layer 612 facing the circuit board 40, the third opening can be exposed on the third line segment 615 to form a third pad 613. In this way, the third pad 613 is soldered to the circuit board 40, resulting in high connection stability and realizing the electrical connection between the temperature sampling circuit board 61 and the circuit board 40.

[0161] According to some embodiments of this application, there are multiple third openings and they are spaced apart along the extension direction of the third line segment 615. Multiple third pads 613 are formed at the multiple third openings, and at least one of the multiple third pads 613 is used for soldering to the circuit board 40.

[0162] The circuit board 40 is a flexible die-cut circuit board, and the arrangement direction of the plurality of second die-cut lines 42 in the flexible die-cut circuit board can be the same as the extension direction of the third line segment 615. This allows the distribution direction of the plurality of second die-cut lines 42 on the circuit board 40 to be adapted to the arrangement direction of the plurality of third pads 613, thereby selecting at least one third pad 613 from the plurality of third pads 613 in the temperature sampling circuit board 61 to be soldered to the circuit board 40.

[0163] The third via 614 refers to a through-hole structure that penetrates the thickness direction of the third line segment 615 of the third conductive layer 611. The shape of the third via 614 can be various, such as circular, rectangular, or strip-shaped. In this embodiment, the shape of the third via 614 is circular. Each third pad 613 has at least one third via 614, meaning that each third pad 613 can have one third via 614, although the number of third vias 614 can also be multiple, depending on the specific circumstances.

[0164] In the above scheme, by setting the number of multiple third openings to multiple and arranging them at intervals along the extension direction of the third line segment 615, the circuit board 40 can be connected to the corresponding third pad 613 according to the actual situation. Furthermore, the distribution direction of the multiple die-cut lines on the circuit board 40 can be adapted to the arrangement direction of the multiple third pads 613. Based on the position of the corresponding second die-cut line 42 on the circuit board 40, at least one of the multiple third pads 613 in the temperature sampling circuit board 61 can be selected for soldering. The connection between the circuit board 40 and the temperature sampling circuit board 61 is more flexible, and cross-line connections between the circuit board 40 and the temperature sampling circuit board 61 can be easily achieved, resulting in better versatility.

[0165] According to some embodiments of this application, please refer to Figure 10 Each third pad 613 is provided with at least one third through hole 614.

[0166] The number of third through holes 614 within each third pad 613 can be two, three, or four, and the specific number of third through holes 614 can be determined according to the actual situation.

[0167] In the above scheme, by providing at least one third through hole 614 in each third pad 613, when the third pad 613 is soldered to the circuit board 40, the solder on the circuit board 40 can extend and fill the third through hole 614. The operator can judge the soldering effect between the temperature sampling circuit board 61 and the circuit board 40 by observing the filling status of the solder in the third through hole 614, making the soldering effect between the sampling circuit board and the circuit board 40 visible and making it easier to control the soldering quality between the temperature sampling circuit board 61 and the circuit board 40.

[0168] According to some embodiments of this application, the third opening is elongated, and each third pad 613 is provided with a plurality of third through holes 614, which are spaced apart along the length of the elongated shape.

[0169] In the above scheme, by adopting a long strip shape for the third opening, and providing multiple third through holes 614 for each third pad 613, and distributing the multiple third through holes 614 at intervals along the length of the strip, when the third pad 613 of the temperature sampling circuit board 61 is soldered to the circuit board 40, the soldering status and effect between the temperature sampling circuit board 61 and the circuit board 40 can be judged by observing whether the solder on the circuit board 40 extends evenly to the multiple third through holes 614, and by observing the flow of solder in each third through hole 614. This makes the soldering effect between the temperature sampling circuit board 61 and the circuit board 40 visible and easier to control the soldering quality between the temperature sampling circuit board 61 and the circuit board 40.

[0170] In some embodiments, please refer to Figures 4 to 13The battery device 100 includes a battery cell group 24, a busbar 30, and electrical components. The battery cell group 24 includes multiple battery cells 20. The busbar 30 is electrically connected to the electrode terminals 23 of at least two battery cells 20. The electrical components include a circuit board 40 and a voltage sampling device 50. The circuit board 40 has an output terminal and a first die-cut line 41 electrically connected to the output terminal. The voltage sampling device 50 has a first etched line 59 electrically connected to the busbar 30. The circuit board 40 and the voltage sampling device 50 are connected so that the first die-cut line 41 and the first etched line 59 are electrically connected to form a voltage sampling line to transmit the voltage signal collected at the busbar 30 to the output terminal. A first fused line segment 52 is provided on the voltage sampling line and is provided on the first etched line 59. The first etched line 59 includes a first line segment 51, a second line segment 53, and a first fused line segment 52. The first line segment 51 is connected to the circuit board 40, the second line segment 53 is connected to the bus 30, and the first fused line segment 52 connects the first line segment 51 and the second line segment 53. The minimum line width of the first fused line segment 52 is smaller than the line width of the first line segment 51 and the line width of the second line segment 53.

[0171] Using a die-cut circuit board for circuit board 40, compared to using an etched circuit board, eliminates the multiple processes required for etching circuit board manufacturing, such as plate making, developing, etching, and cleaning. This reduces the number of production steps for circuit board 40, resulting in a shorter production cycle, higher production efficiency, and suitability for mass production. The overall manufacturing cost of circuit board 40 is also lower. Furthermore, the die-cut circuit board utilizes subtractive and recyclable processes, allowing for direct recycling of waste materials, minimizing material waste. Additionally, the die-cut circuit board completely avoids acidic etching solutions, resulting in no heavy metal wastewater or exhaust gas emissions, thus improving environmental friendliness. For safety reasons, a fusible link is required on the voltage sampling line. Since die-cutting is inconvenient for forming the fusible link, a separate voltage sampling component 50 is used. The voltage sampling component 50 is formed by etching a first etched line 59. A first fusible link segment 52 is located on the first etched line 59 of the voltage sampling component 50, so that the voltage sampling component 50 has a first fusible link segment 52. When the battery device 100 experiences thermal runaway, the first fusible link segment 52 melts to cut off the voltage sampling line, protecting the battery device 100. When the battery device 100 experiences thermal runaway, the line width of the first fusible link segment 52 is smaller than that of the first line segment 51 and the second line segment 53. The first fusible link segment 52 has a higher resistance and generates more heat, so it will melt first, thus cutting off the voltage sampling line. Each first pad 511 is provided with at least one first through-hole 512.

[0172] In some embodiments, the minimum linewidth of the first die-cut line 41 is greater than the minimum linewidth of the first fused line segment 52. The minimum linewidth of the first die-cut line 41 is greater than the minimum linewidth of the first line segment 51 and the minimum linewidth of the second line segment 53. The voltage sampling element 50 includes a first conductive layer 54 and two first insulating layers 55. A first etched line 59 is formed on the first conductive layer 54, and the two first insulating layers 55 are respectively disposed on both sides of the thickness direction of the first conductive layer 54. One of the two first insulating layers 55 facing the circuit board 40 has a first opening, and the first line segment 51 is exposed at least partially through the first opening to form a first pad 511. The first pad 511 is used for soldering to the circuit board 40. There are multiple first openings and they are spaced apart along the extension direction of the first line segment 51. Multiple first pads 511 are formed corresponding to the multiple first openings, and at least one of the multiple first pads 511 is used for soldering to the circuit board 40.

[0173] By providing a first opening on the first insulating layer 55 facing the circuit board 40, the first opening can expose a first pad 511 on the first line segment 51. In this way, the voltage sampling component 50 is soldered to the circuit board 40 through the first pad 511, resulting in high connection stability and achieving electrical connection between the voltage sampling component 50 and the circuit board 40. By setting multiple first openings spaced apart along the extension direction of the first line segment 51, the number of circuit boards 40 connected to corresponding first pads 511 can be selected according to actual needs. Furthermore, the distribution direction of multiple die-cut lines on the circuit board 40 can be adapted to the arrangement direction of multiple first pads 511. Based on the position of the die-cut lines at corresponding locations on the circuit board 40, at least one corresponding first pad 511 among the multiple first pads 511 in the voltage sampling component 50 can be selected for soldering. This makes the connection between the circuit board 40 and the voltage sampling component 50 more flexible, easily achieving cross-line connections between the circuit board 40 and the voltage sampling component 50, and improving versatility. There are multiple third openings, which are spaced apart along the extension direction of the third line segment 615. Multiple third pads 613 are formed at the multiple third openings, and at least one of the multiple third pads 613 is used for soldering to the circuit board 40.

[0174] In some embodiments, the electrical components further include a temperature sampling circuit board 61 and a temperature sampling element 62. The temperature sampling circuit board 61 is provided with a second etched line electrically connected to the temperature sampling element 62. The temperature sampling element 62 is used to collect the temperature signal of the bus 30 or the battery cell. The circuit board 40 is also provided with a second die-cut line 42 connected to the output end. The circuit board 40 is connected to the temperature sampling circuit board 61 so that the second die-cut line 42 and the second etched line are electrically connected to form a temperature sampling line to transmit the temperature signal collected by the temperature sampling element 62 to the output end. A second fused line segment 617 is provided on the temperature sampling line. The second fused line segment 617 is provided on the second etched line. The second etched circuit includes a third line segment 615, a fourth line segment 616, and a second fused line segment 617. The third line segment 615 is connected to the circuit board 40, the fourth line segment 616 is connected to the temperature sampling element 62, and the second fused line segment connects the third line segment 615 and the fourth line segment 616. The minimum linewidth of the second fused line segment 617 is smaller than the linewidths of the third line segment 615 and the fourth line segment 616. The minimum linewidth of the second die-cut circuit 42 is greater than the minimum linewidth of the second fused line segment 617. The temperature sampling circuit board 61 includes a third conductive layer 611 and two third insulating layers 612. The second etched circuit is formed on the third conductive layer 611, and the two third insulating layers 612 are respectively disposed on both sides of the thickness direction of the third conductive layer 611. One of the two third insulating layers 612 facing the circuit board 40 has a third opening, and at least part of the third line segment 615 is exposed through the third opening to form a third pad 613, which is used for soldering to the circuit board 40.

[0175] The electrical components also include a temperature sampling circuit board 61 and a temperature sampling element 62. A second die-cut line 42 is also provided on the circuit board 40. The circuit board 40 is connected to the temperature sampling circuit board 61 so that the second die-cut line 42 is electrically connected to the second etched line to form a temperature sampling line. The temperature signal collected by the temperature sampling element 62 is transmitted to the output terminal to realize the acquisition of temperature information of the battery cell. Furthermore, a second fusible link segment 617 is provided on the temperature sampling line. When the battery device experiences thermal runaway, the second fusible link segment 617 will melt and cut off the temperature sampling line, thus improving the safety of the battery device 100. The minimum linewidth of the second die-cut line 42 is greater than the minimum linewidth of the second fusible link segment 617. Therefore, when the battery device 100 experiences thermal runaway, the resistance of the second fusible link segment 617 is greater than that of the second die-cut line 42. The second fusible link segment 617 will melt first, thus cutting off the temperature sampling line and protecting the circuit board 40.

[0176] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A battery device, characterized in that, include: A battery cell pack consists of multiple battery cells; A busbar that electrically connects the electrode terminals of at least two of the battery cells; An electrical component includes a circuit board and a voltage sampling device. The circuit board has an output terminal and a first die-cut line electrically connected to the output terminal. The voltage sampling device has a first etched line electrically connected to the busbar. The circuit board is connected to the voltage sampling device so that the first die-cut line and the first etched line are electrically connected to form a voltage sampling line, so as to transmit the voltage signal collected at the busbar to the output terminal. The voltage sampling line is provided with a first fuse line segment, which is located on the first etched line.

2. The battery device according to claim 1, characterized in that, The first etched circuit includes a first line segment, a second line segment, and a first fused line segment. The first line segment is connected to the circuit board, the second line segment is connected to the bus, and the first fused line segment connects the first line segment and the second line segment. The minimum line width of the first fused line segment is smaller than the line width of the first line segment and the line width of the second line segment.

3. The battery device according to claim 2, characterized in that, The minimum line width of the first die-cut line is greater than the minimum line width of the first fuse line segment.

4. The battery device according to claim 3, characterized in that, The minimum line width of the first die-cut line is greater than the minimum line width of the first line segment and the minimum line width of the second line segment.

5. The battery device according to claim 2 or 3, characterized in that, The voltage sampling device includes a first conductive layer and two first insulating layers. The first etched line is formed on the first conductive layer, and the two first insulating layers are respectively disposed on both sides of the thickness direction of the first conductive layer.

6. The battery device according to claim 5, characterized in that, One of the two first insulating layers facing the circuit board has a first opening, and at least part of the first line segment is exposed through the first opening to form a first pad, which is used for soldering to the circuit board.

7. The battery device according to claim 6, characterized in that, The first opening has multiple openings and is spaced apart along the extension direction of the first line segment. Multiple first pads are formed at the multiple first openings, and at least one of the multiple first pads is used for soldering to the circuit board.

8. The battery device according to claim 6, characterized in that, Each of the first pads is provided with at least one first through-hole.

9. The battery device according to claim 6, characterized in that, The first opening is elongated, and each first pad is provided with multiple first through holes, which are spaced apart along the length of the elongated shape.

10. The battery device according to claim 5, characterized in that, The end of the first line segment connected to the circuit board is the first end, and the end of the second line segment connected to the busbar is the second end. In the orthographic projection onto a plane perpendicular to the thickness direction of the voltage sampling element, the voltage sampling element has an adjustment portion projected as a curved extension. When the adjusting part is not stretched, the maximum distance between the first end and the second end is L1; when the adjusting part is stretched, the maximum distance between the first end and the second end is L2; ​​L2 is greater than L1. The first fused circuit segment is located on the first conductive layer in the region corresponding to the adjustment part.

11. The battery device according to claim 6, characterized in that, The circuit board includes a second conductive layer and two second insulating layers. The first die-cut line is formed on the second conductive layer, and the two second insulating layers are respectively disposed on both sides of the thickness direction of the second conductive layer. One of the two second insulating layers facing the voltage sampling element has a second opening, through which at least a portion of the first die-cut line is exposed to form a second pad, which is used to solder to the first pad.

12. The battery device according to claim 1, characterized in that, The electrical components also include: The circuit board includes a temperature sampling circuit board and a temperature sampling element. The temperature sampling circuit board has a second etched line electrically connected to the temperature sampling element. The temperature sampling element is used to collect the temperature signal of the busbar or the battery cell. The circuit board also has a second die-cut line connected to the output terminal. The circuit board is connected to the temperature sampling circuit board so that the second die-cut line and the second etched line are electrically connected to form a temperature sampling line, so as to transmit the temperature signal collected by the temperature sampling element to the output terminal. The temperature sampling line is provided with a second fused line segment, which is located on the second etched line.

13. The battery device according to claim 12, characterized in that, The second etched circuit includes a third line segment, a fourth line segment, and a second fused line segment. The third line segment is connected to the circuit board, the fourth line segment is connected to the temperature sampling device, and the second fused line segment connects the third line segment and the fourth line segment. The minimum line width of the second fused line segment is smaller than the line width of the third line segment and the line width of the fourth line segment.

14. The battery device according to claim 13, characterized in that, The minimum line width of the second die-cutting line is greater than the minimum line width of the second fuse line segment.

15. The battery device according to claim 13 or 14, characterized in that, The temperature sampling circuit board includes a third conductive layer and two third insulating layers. The second etched line is formed on the third conductive layer. The two third insulating layers are respectively disposed on both sides of the thickness direction of the third conductive layer. One of the two third insulating layers facing the circuit board has a third opening. At least part of the third line segment is exposed through the third opening to form a third pad. The third pad is used for soldering to the circuit board.

16. The battery device according to claim 15, characterized in that, The third opening has multiple openings and is spaced apart along the extension direction of the third line segment. Multiple third pads are formed at the multiple third openings, and at least one of the multiple third pads is used for soldering to the circuit board.

17. The battery device according to claim 15, characterized in that, Each of the third pads is provided with at least one third through hole.

18. The battery device according to claim 15, characterized in that, The third opening is elongated, and each third pad is provided with multiple third through holes, which are spaced apart along the length of the elongated shape.

19. An electrical appliance, characterized in that, The device includes a battery device as described in any one of claims 1-18, wherein the power supply device is used to provide electrical energy.

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