High-power ku-band dual-channel signal amplification device

Abstract

The utility model relates to communication technical field discloses a high -power Ku wave band double -pass signal amplification device, including first signal amplification unit module, second signal amplification unit module, control unit module, shielding structure module, first signal amplification unit module and second signal amplification unit module are connected with power synthesis network module, PLL module and power filter circuit module electric connection respectively, PLL module and public clock signal source module electric connection, first signal amplification unit module and second signal amplification unit module, PLL module are encapsulated by shielding structure module, control unit module and heat dissipation assembly electric connection. In the utility model, through the connection of first and second signal amplification unit module and power synthesis network module realizes double -pass signal independent amplification and synthesis, realizes high -power amplification efficiency promotion, the effect that power consumption reduces under the premise of guaranteeing signal quality.

Description

Technical Field

[0001] This utility model relates to the field of communication technology, and in particular to a high-power Ku-band dual-channel signal amplification device. Background Technology

[0002] The high-power Ku-band dual-channel signal amplifier is a device used in microwave communications, operating in the 12-18 GHz frequency band. It amplifies signals simultaneously through two independent channels. Its core function is to amplify weak Ku-band signals into high-power output, overcoming transmission loss and ensuring signal quality.

[0003] With the rapid development of communication technology, the demand for high-power, high-frequency signal amplifiers is increasing, especially in Ku-band (12-18GHz) applications. Traditional signal amplification devices are unable to achieve high-power amplification while ensuring signal quality, which limits the performance and coverage of communication systems. Utility Model Content

[0004] To overcome the above shortcomings, this invention provides a high-power Ku-band dual-channel signal amplification device, which aims to improve the problem of poor amplification efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-power Ku-band dual-channel signal amplification device, comprising a first signal amplification unit module, a second signal amplification unit module, a control unit module, and a shielding structure module. The first and second signal amplification unit modules are electrically connected to a power combining network module, a PLL module, and a power supply filtering circuit module, respectively. The PLL module is electrically connected to a common clock signal source module. The first and second signal amplification unit modules and the PLL module are encapsulated by the shielding structure module. The control unit module is electrically connected to a heat dissipation component.

[0006] The above technical solution achieves low-distortion amplification and synthesis of dual-channel signals through the connection between the first and second signal amplification units, the power combining network, the PLL module, and the power filter circuit. The PLL module, combined with a common clock source, generates a synchronous clock through phase-locked loop technology, reducing phase deviation. The shielding structure and the power filter circuit suppress interference and improve the reliability of the device.

[0007] Preferably, the heat dissipation assembly includes a temperature sensor module, a cooling pump module, a heat dissipation module, and a water-cooled plate module. The temperature sensor module is electrically connected to the control unit module, the control unit module is electrically connected to the cooling pump module, the cooling pump module is slidably connected to the water-cooled plate module via a pipe, the water-cooled plate module is slidably connected to the first signal amplification unit module and the second signal amplification unit module, the water-cooled plate module is slidably connected to the heat dissipation module via a pipe, and the heat dissipation module is slidably connected to the cooling pump module via a pipe.

[0008] The above technical solution involves connecting the temperature sensor module to the control unit module to provide real-time temperature feedback. The control unit module adjusts the cooling pump module accordingly. The cooling pump delivers coolant through pipes to the water-cooled plate that is thermally connected to the amplification unit. After absorbing heat, the coolant flows through pipes to the radiator for heat dissipation and then flows back to the cooling pump to form a closed loop.

[0009] Preferably, both the first and second signal amplification unit modules include multi-stage amplification circuits, matching networks, and bias circuits. The control unit module includes a microprocessor, a power monitoring sensor, a bias voltage regulation circuit, and a communication interface circuit. The power combining network module includes a microstrip line structure, isolation resistors, and impedance transformation sections. The common clock signal source module includes a crystal oscillator and a clock buffer. The PLL module includes a phase-locked loop chip, a voltage-controlled oscillator, and a loop filter. The shielding structure module includes a shielding cover and an electromagnetic sealing gasket. The power supply filtering circuit module includes an LC filter network, a voltage regulator, and a decoupling capacitor.

[0010] The above technical solutions achieve signal consistency through dual-channel independent amplification combined with a high-precision clock synchronization mechanism, reduce the temperature of core components through a liquid cooling system, and improve efficiency and reduce power consumption through dynamic gain control.

[0011] Preferably, the water-cooled plate module includes a water-cooled plate and thermal paste, the cooling pump module includes a DC brushless pump and a flow controller, the heat dissipation module uses a heat sink, the temperature sensor module includes a thermistor and a temperature acquisition circuit, and the DC brushless pump and the flow controller are both slidably connected to the water-cooled plate module through pipes and slidably connected to the heat dissipation module through pipes.

[0012] The above technical solution involves a water-cooled plate module connected to an amplification unit via thermal paste, a DC brushless pump from a cooling pump module driving coolant circulation, a cooling fan from a heat dissipation module assisting in heat dissipation, and a thermistor from a temperature sensor module monitoring the temperature in real time. Together, these components form a liquid cooling system that reduces the temperature of the core components.

[0013] Preferably, the multi-stage amplifier circuit is electrically connected to the matching network, the matching network is electrically connected to the power combining network module, the bias circuit is electrically connected to each pin in the multi-stage amplifier circuit, the power monitoring sensor is electrically connected to the microprocessor, the bias voltage adjustment circuit is electrically connected to the microprocessor, the output terminal of the bias voltage adjustment circuit is electrically connected to the input terminals of the bias circuits of the first signal amplification unit module and the second signal amplification unit module, respectively, and the input terminal of the microstrip line structure is electrically connected to the output terminals of the first signal amplification unit module and the second signal amplification unit module, respectively.

[0014] The above technical solution achieves phase deviation within a controllable range and reduces the temperature and power consumption of core components by using dual-channel independent amplification combined with a PLL synchronization mechanism, along with a liquid cooling system and dynamic gain control.

[0015] Preferably, the output of the crystal oscillator is electrically connected to the input of the clock buffer, the output of the clock buffer is electrically connected to the reference clock input pin of the PLL module, and the output of the PLL module is electrically connected to the clock input interfaces of the first signal amplification unit module and the second signal amplification unit module, respectively.

[0016] The above technical solution achieves dual-channel signal phase synchronization by connecting the output of the crystal oscillator to the PLL module via a clock buffer, and then having the PLL output to the clock interface of the amplification unit.

[0017] Preferably, the reference clock input terminal of the phase-locked loop (PLL) chip is electrically connected to the output terminal of the common clock signal source module, the control input terminal of the PLL chip is electrically connected to the output terminal of the loop filter, the input terminal of the loop filter is electrically connected to the error signal output terminal of the PLL chip, and the output terminal of the voltage-controlled oscillator (VCO) is electrically connected to the feedback signal input terminal of the PLL chip, and also serves as the output terminal of the PLL module connected to the amplification unit.

[0018] The above technical solution involves receiving a common clock signal through a phase-locked loop chip, forming a closed loop with a loop filter and a voltage-controlled oscillator, and outputting a synchronization signal to the amplification unit to reduce the phase deviation of the dual-channel signal.

[0019] Preferably, the signal output terminal of the thermistor is electrically connected to the input terminal of the temperature acquisition circuit, and the output terminal of the temperature acquisition circuit is electrically connected to the microprocessor input terminal of the control unit module.

[0020] The above technical solution involves the thermistor transmitting temperature signals to the temperature acquisition circuit via electrical connection. After processing, the signals are input to the microprocessor to provide data for heat dissipation control.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, the independent amplification and synthesis of dual-channel signals is achieved by connecting the first and second signal amplification unit modules with the power combining network module. The electrical connection between the PLL module and the common clock signal source module forms a clock synchronization mechanism, which reduces the phase deviation of the dual-channel signals. The control unit module achieves dynamic gain control by connecting the power monitoring sensor with the bias voltage adjustment circuit. Combined with the shielding structure module for the encapsulation of core components and the noise suppression of the power filter circuit module, the high power amplification efficiency is improved and the power consumption is reduced while ensuring signal quality.

[0023] 2. In this utility model, the temperature sensor module is connected to the control unit module to achieve real-time temperature monitoring. The cooling pump module, water-cooled plate module and heat dissipation module form a liquid cooling cycle through pipes. The water-cooled plate module is connected to the signal amplification unit module with the help of thermal paste. The control unit adjusts the cooling pump flow rate according to the temperature feedback to form dynamic heat dissipation and improve heat dissipation efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0025] Figure 2 This is a block diagram of the first and second signal amplification unit modules of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0026] Figure 3 This is a block diagram of the control unit module of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0027] Figure 4 This is a block diagram of the power combining network module of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0028] Figure 5 This is a block diagram of the common clock signal source module of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0029] Figure 6 This is a block diagram of the PLL module of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0030] Figure 7 This is a block diagram of the shielding structure module of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0031] Figure 8 This is a block diagram of the power supply filter circuit module of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0032] Figure 9 This is a block diagram of a water-cooled plate module for a high-power Ku-band dual-channel signal amplification device proposed in this utility model.

[0033] Figure 10 This is a block diagram of the cooling pump module of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0034] Figure 11 This is a block diagram of the temperature sensor module of a high-power Ku-band dual-channel signal amplification device proposed in this utility model;

[0035] Figure 12 This is a block diagram of the heat dissipation component of a high-power Ku-band dual-channel signal amplification device proposed in this utility model. Detailed Implementation

[0036] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0037] Reference Figures 1-3 The present invention provides an embodiment of a high-power Ku-band dual-channel signal amplification device, comprising a first signal amplification unit module, a second signal amplification unit module, a control unit module, and a shielding structure module. The first signal amplification unit module and the second signal amplification unit module are electrically connected to a power combining network module, a PLL module, and a power supply filtering circuit module, respectively. The PLL module is electrically connected to a common clock signal source module. The first signal amplification unit module, the second signal amplification unit module, and the PLL module are encapsulated by the shielding structure module. The control unit module is electrically connected to a heat dissipation component.

[0038] Specifically, the multi-stage amplification circuits within the first and second signal amplification unit modules utilize high-performance transistors to achieve graded amplification of Ku-band signals. Matching networks optimize signal impedance matching, and bias circuits maintain the linear operating point of the amplification circuits. Combined with the microstrip line structure, isolation resistors, and impedance transformation sections of the power combining network module, low-loss synthesis and high-power output of dual-channel signals are achieved, effectively avoiding signal distortion issues associated with single-channel amplification. The PLL module is electrically connected to the common clock signal source module. The crystal oscillator of the common clock signal source module generates a reference clock, which is input to the PLL module via a clock buffer. The PLL module's phase-locked loop chip, voltage-controlled oscillator, and loop filter form a closed loop, generating a synchronous, in-phase oscillating signal that is input to the amplification unit, ensuring reduced phase deviation between the two channels and improved signal consistency. The first and second signal amplification unit modules and the PLL module are encapsulated in a shielded structure module. Combined with the LC filter network, voltage regulator, and decoupling capacitors of the power supply filter circuit module, electromagnetic interference and power supply noise are suppressed, ensuring signal quality. The control unit module, through the connection of a power monitoring sensor and a bias voltage adjustment circuit, collects the power signal of the amplification unit in real time and adjusts the bias voltage to maintain the amplifier's operating state, thereby improving overall amplification efficiency and reducing power consumption.

[0039] Reference Figures 10-12 The heat dissipation assembly includes a temperature sensor module, a cooling pump module, a heat dissipation module, and a water-cooled plate module. The temperature sensor module is electrically connected to the control unit module, the control unit module is electrically connected to the cooling pump module, the cooling pump module is slidably connected to the water-cooled plate module via pipes, the water-cooled plate module is slidably connected to the first signal amplification unit module and the second signal amplification unit module, the water-cooled plate module is slidably connected to the heat dissipation module via pipes, and the heat dissipation module is slidably connected to the cooling pump module via pipes. The water-cooled plate module includes a water-cooled plate and thermal paste, the cooling pump module includes a DC brushless pump and a flow controller, the heat dissipation module uses a heat sink, the temperature sensor module includes a thermistor and a temperature acquisition circuit, and both the DC brushless pump and the flow controller are slidably connected to the water-cooled plate module via pipes and to the heat dissipation module via pipes.

[0040] Specifically, the temperature sensor module consists of a thermistor and a temperature acquisition circuit. The thermistor monitors the temperature of the signal amplification unit housing or the surface of the water-cooled plate in real time and converts it into an electrical signal. After processing by the temperature acquisition circuit, the signal is electrically connected to the control unit module to provide data for heat dissipation control. The control unit module is electrically connected to the cooling pump module and adjusts the coolant circulation flow rate by controlling the speed of the DC brushless pump and the opening of the flow controller based on the temperature feedback signal. The cooling pump module is connected to the water-cooled plate module through pipes to deliver coolant to the water-cooled plate module. The water-cooled plate in the water-cooled plate module is connected to the housings of the first and second signal amplification unit modules through thermal paste to directly absorb the heat generated by the amplification circuit. The heated coolant flows into the heat dissipation module through pipes. The heat dissipation module increases the heat dissipation area through a finned structure and accelerates airflow with a cooling fan to dissipate heat into the environment. The cooled coolant is then connected to the cooling pump module through pipes to form a circulation, solving the heat dissipation problem of the device and ensuring the stable operation of the device for a long time.

[0041] Reference Figures 7-9 The first and second signal amplification unit modules each include multi-stage amplification circuits, matching networks, and bias circuits. The control unit module includes a microprocessor, a power monitoring sensor, a bias voltage regulation circuit, and a communication interface circuit. The power combining network module includes a microstrip line structure, isolation resistors, and impedance transformation sections. The common clock signal source module includes a crystal oscillator and a clock buffer. The PLL module includes a phase-locked loop chip, a voltage-controlled oscillator, and a loop filter. The shielding structure module includes a shielding cover and an electromagnetic sealing gasket. The power supply filtering circuit module includes an LC filter network, a voltage regulator, and a decoupling capacitor.

[0042] Specifically, the multi-stage amplifier circuit uses high-performance transistors to form a multi-stage amplification link, amplifying Ku-band signals in stages to achieve high power output. The matching network reduces signal reflection loss through impedance matching design, and the bias circuit provides precise bias voltages to each stage of the transistors to maintain linear operation. The collaborative work of multiple components reduces signal distortion and improves amplification efficiency. A power monitoring sensor collects the input and output power of the amplification unit in real time through a directional coupler and detector. The microprocessor dynamically adjusts the transistor bias based on the collected data through a bias voltage adjustment circuit, forming a closed-loop control to stabilize the output power. The communication interface circuit supports external parameter configuration, enabling adaptive adjustment of the amplification device. The microstrip line structure, based on a low-loss transmission line design, achieves high power output for both amplified signals. The system employs a multi-channel power supply system: isolation resistors ensure high isolation between channels to prevent mutual interference; impedance transformation sections match the output impedance to improve power transmission efficiency; a crystal oscillator generates a highly stable reference clock; a clock buffer enhances the driving capability before inputting to the PLL module; a phase-locked loop chip achieves phase locking based on the reference clock and feedback signal from the voltage-controlled oscillator; a loop filter removes error signal noise; and the three components form a closed loop to generate an in-phase oscillation signal with the same frequency, ensuring reduced phase deviation between the two channels; a shielding cover encloses the core circuitry; electromagnetic sealing gaskets fill the seams to suppress the impact of external electromagnetic interference on the clock and amplified signals; an LC filter network removes power supply ripple; a voltage regulator provides a stable DC voltage; and decoupling capacitors suppress high-frequency noise, providing a clean power supply for each module and ensuring the stability of the device's operation.

[0043] Reference Figures 4-6The multi-stage amplifier circuit is electrically connected to the matching network, which is electrically connected to the power combining network module. The bias circuit is electrically connected to each pin in the multi-stage amplifier circuit. The power monitoring sensor is electrically connected to the microprocessor. The bias voltage adjustment circuit is electrically connected to the microprocessor. The output of the bias voltage adjustment circuit is electrically connected to the input of the bias circuits of the first and second signal amplification unit modules, respectively. The input of the microstrip line structure is electrically connected to the output of the first and second signal amplification unit modules, respectively. The output of the crystal oscillator is electrically connected to the input of the clock buffer, and the output of the clock buffer is electrically connected to the reference clock input of the PLL module. The output terminals of the PLL module are electrically connected to the clock input interfaces of the first and second signal amplification unit modules, respectively. The reference clock input terminal of the phase-locked loop (PLL) chip is electrically connected to the output terminal of the common clock signal source module. The control input terminal of the PLL chip is electrically connected to the output terminal of the loop filter. The input terminal of the loop filter is electrically connected to the error signal output terminal of the PLL chip. The output terminal of the voltage-controlled oscillator (VCO) is electrically connected to the feedback signal input terminal of the PLL chip, and also serves as the output terminal of the PLL module, connecting to the amplification unit. The signal output terminal of the thermistor is electrically connected to the input terminal of the temperature acquisition circuit. The output terminal of the temperature acquisition circuit is electrically connected to the microprocessor input terminal of the control unit module.

[0044] Specifically, the multi-stage amplifier circuit amplifies the Ku-band signal in stages through a multi-stage amplification link composed of high-performance transistors. The matching network optimizes the signal transmission path and reduces signal reflection loss through impedance matching design. The two work together to reduce the signal distortion rate during amplification. Then, through the connection of the matching network and the power combining network module, the amplified signal is input into the microstrip line structure of the power combining network module. Combined with isolation resistors and impedance transformation sections, low-loss combining of the two signals and high-power output are achieved. The output of the bias circuit is connected to the pins of each stage transistor in the multi-stage amplifier circuit to provide bias voltage to the transistors. The voltage is adjusted to maintain linear operation and ensure stable operation of the amplifier circuit. A power monitoring sensor, connected to the microprocessor's ADC interface via a circuit consisting of a directional coupler and a detector, collects the input and output power signals of the amplifier unit in real time and transmits them to the microprocessor. The microprocessor dynamically adjusts the input voltage of the bias circuit through an electrically connected bias voltage adjustment circuit, forming a closed-loop control to stabilize the output power, thereby improving amplification efficiency and reducing power consumption. The two input terminals of the microstrip line structure are connected to the first and second signal amplification unit modules respectively. Through the low-loss transmission characteristics of the microstrip line and the high isolation design of the isolation resistor, it avoids... The dual-channel signals interfere with each other. An impedance transformation section is used to achieve output impedance matching, improving power combining efficiency. A high-stability reference clock generated by a crystal oscillator is enhanced by a clock buffer. The reference clock is then input to the PLL module via the buffer's output. The PLL module's phase-locked loop (PLL) chip's reference clock input is connected to the output of a common clock signal source module. The PLL chip's control input is connected to the loop filter's output, and the loop filter's input is connected to the PLL chip's error signal output. The voltage-controlled oscillator's output is connected to the PLL chip's feedback signal input and serves as the PLL module's output, connecting to the amplifier unit's clock input interface. This forms a closed-loop phase-locked mechanism, generating a local oscillation signal with the same frequency and phase, which is input to the amplifier unit, ensuring the dual-channel signal phase deviation remains within a very small range. The thermistor's signal output is connected to the temperature acquisition circuit's input. The real-time monitored temperature signal is processed by the temperature acquisition circuit and then transmitted to the microprocessor of the control unit module. This data provides the control unit with a basis for dynamically adjusting the cooling pump flow, achieving reduced core component temperature and extended device lifespan.

[0045] Working principle: The first and second signal amplification unit modules amplify the Ku-band signal in multiple stages. Their output terminals are electrically connected to the microstrip line structure of the power combining network module. Low-loss combining is achieved through isolation resistors and impedance transformation sections to improve the overall output power. The crystal oscillator of the common clock signal source module generates a reference clock, which is input to the PLL module through a clock buffer. The phase-locked loop chip, voltage-controlled oscillator, and loop filter form a closed loop to generate an in-phase oscillation signal with the same frequency and input to the amplification unit, ensuring that the phase deviation of the dual-channel signal is reduced. The control unit module collects the power signal of the amplification unit in real time through a power monitoring sensor. After processing by the microprocessor, the bias voltage adjustment circuit dynamically adjusts the bias voltage of the amplification circuit to reduce nonlinear distortion. The shielding structure module encloses the amplification unit and the PLL module. Together with the LC network of the power supply filter circuit and the voltage regulator, it suppresses electromagnetic interference and power supply noise to achieve the effects of improved signal consistency and reduced amplification power consumption.

[0046] The thermistor of the temperature sensor module monitors the temperature of the amplifier unit or water-cooled plate in real time. The signal is input to the control unit through the temperature acquisition circuit. The microprocessor adjusts the DC brushless pump speed and flow controller parameters of the cooling pump module according to the temperature feedback. The cooling pump delivers coolant to the water-cooled plate module through pipes. The water-cooled plate is connected to the housing of the amplifier unit through thermal paste, which removes the heat from the transistor heat source. The hot coolant flows into the heat dissipation module through pipes, and after heat dissipation, it flows back to the cooling pump, forming a closed loop of heat absorption-circulation-heat dissipation.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-power Ku-band dual-channel signal amplification device, comprising a first signal amplification unit module, a second signal amplification unit module, a control unit module, and a shielding structure module, characterized in that: The first signal amplification unit module and the second signal amplification unit module are electrically connected to the power combining network module, the PLL module and the power filtering circuit module, respectively. The PLL module is electrically connected to the common clock signal source module. The first signal amplification unit module, the second signal amplification unit module and the PLL module are encapsulated by a shielded structure module. The control unit module is electrically connected to the heat dissipation component.

2. The high-power Ku-band dual-channel signal amplification device according to claim 1, characterized in that: The heat dissipation assembly includes a temperature sensor module, a cooling pump module, a heat dissipation module, and a water-cooled plate module. The temperature sensor module is electrically connected to the control unit module, the control unit module is electrically connected to the cooling pump module, the cooling pump module is slidably connected to the water-cooled plate module via pipes, the water-cooled plate module is slidably connected to the first signal amplification unit module and the second signal amplification unit module, the water-cooled plate module is slidably connected to the heat dissipation module via pipes, and the heat dissipation module is slidably connected to the cooling pump module via pipes.

3. The high-power Ku-band dual-channel signal amplification device according to claim 1, characterized in that: Both the first and second signal amplification unit modules include multi-stage amplification circuits, matching networks, and bias circuits. The control unit module includes a microprocessor, a power monitoring sensor, a bias voltage regulation circuit, and a communication interface circuit. The power combining network module includes a microstrip line structure, isolation resistors, and impedance transformation sections. The common clock signal source module includes a crystal oscillator and a clock buffer. The PLL module includes a phase-locked loop chip, a voltage-controlled oscillator, and a loop filter. The shielding structure module includes a shielding cover and an electromagnetic sealing gasket. The power supply filtering circuit module includes an LC filter network, a voltage regulator, and a decoupling capacitor.

4. A high-power Ku-band dual-channel signal amplification device according to claim 2, characterized in that: The water-cooled plate module includes a water-cooled plate and thermal paste; the cooling pump module includes a DC brushless pump and a flow controller; the heat dissipation module uses a heat sink; the temperature sensor module includes a thermistor and a temperature acquisition circuit; the DC brushless pump and the flow controller are both slidably connected to the water-cooled plate module through pipes, and are also slidably connected to the heat dissipation module through pipes.

5. A high-power Ku-band dual-channel signal amplification device according to claim 3, characterized in that: The multi-stage amplifier circuit is electrically connected to the matching network, the matching network is electrically connected to the power combining network module, the bias circuit is electrically connected to each pin in the multi-stage amplifier circuit, the power monitoring sensor is electrically connected to the microprocessor, the bias voltage adjustment circuit is electrically connected to the microprocessor, the output terminal of the bias voltage adjustment circuit is electrically connected to the input terminals of the bias circuits of the first signal amplification unit module and the second signal amplification unit module, respectively, and the input terminal of the microstrip line structure is electrically connected to the output terminals of the first signal amplification unit module and the second signal amplification unit module, respectively.

6. A high-power Ku-band dual-channel signal amplification device according to claim 3, characterized in that: The output of the crystal oscillator is electrically connected to the input of the clock buffer, the output of the clock buffer is electrically connected to the reference clock input pin of the PLL module, and the output of the PLL module is electrically connected to the clock input interfaces of the first signal amplification unit module and the second signal amplification unit module, respectively.

7. A high-power Ku-band dual-channel signal amplification device according to claim 3, characterized in that: The reference clock input terminal of the phase-locked loop (PLL) chip is electrically connected to the output terminal of the common clock signal source module. The control input terminal of the PLL chip is electrically connected to the output terminal of the loop filter. The input terminal of the loop filter is electrically connected to the error signal output terminal of the PLL chip. The output terminal of the voltage-controlled oscillator (VCO) is electrically connected to the feedback signal input terminal of the PLL chip and also serves as the output terminal of the PLL module, connecting to the amplification unit.

8. A high-power Ku-band dual-channel signal amplification device according to claim 4, characterized in that: The signal output terminal of the thermistor is electrically connected to the input terminal of the temperature acquisition circuit, and the output terminal of the temperature acquisition circuit is electrically connected to the microprocessor input terminal of the control unit module.

Images