Sound box and electronic device

Abstract

The application provides a sound box and an electronic device. The sound box comprises a mounting base, a loudspeaker module and a damping pad. The mounting base is provided with a receiving cavity. The loudspeaker module is connected with the mounting base, and at least part of the loudspeaker module is located in the receiving cavity. The damping pad has a connecting hole for connecting with the electronic device. The damping pad is fixed to the mounting base in a glued manner. In the sound box of the application, the damping pad is fixed to the mounting base in a glued manner. The glued manner adopted in the application ensures that the damping pad and the mounting base will not face the problems of loose assembly and tight assembly. In this way, after the sound box is mounted on the electronic device through fasteners, the sound box will not easily shake to produce noise due to loose assembly of the damping pad, and the sound box will not have the problem of poor damping effect due to excessive compression of the damping pad. Therefore, the technical solution in the application is beneficial to improving the damping effect of the sound box after being mounted on the electronic device.

Description

Technical Field

[0001] This application relates to the field of speaker technology, and in particular to a speaker and electronic device. Background Technology

[0002] Currently, many electronic devices with audio-visual functions (such as televisions, smart interactive whiteboards, and smart blackboards) are equipped with speakers, which convert audio electrical energy into corresponding sound energy and radiate it into the space.

[0003] Some speakers in related technologies are equipped with mounting brackets and damping pads for connecting to electronic devices. The mounting brackets have mounting holes, the damping pads are fitted into the mounting holes, and the damping pads also have connection holes. When installing the speaker, the mounting brackets are connected to the electronic device using fasteners (e.g., screws) that pass through the connection holes, thus completing the installation of the speaker and the electronic device.

[0004] However, after installing the speaker according to the above method, the vibration damping effect may sometimes be unsatisfactory. Utility Model Content

[0005] This application provides a speaker and electronic device, which aims to improve the vibration reduction effect of the speaker after it is installed in the electronic device.

[0006] The specific technical solution is as follows:

[0007] This application provides a speaker for an electronic device. The speaker includes a mounting base, a speaker module, and a vibration damping pad. The mounting base has a receiving cavity. The speaker module is connected to the mounting base. At least a portion of the speaker module is located in the receiving cavity. The vibration damping pad has a connection hole for connecting to the electronic device. The vibration damping pad is fixed to the mounting base by adhesive.

[0008] In this embodiment of the speaker, the damping pads are fixed to the mounting base by adhesive. Compared to the method used in related technologies where damping pads are assembled with mounting brackets via limiting grooves, the adhesive method used in this application avoids situations where the damping pads are too loose or too tight between the damping pads and the mounting base. Thus, when the speaker is mounted on the electronic device using fasteners, it avoids the problem of the speaker easily shaking and generating noise due to loose damping pads, and also avoids the problem of poor speaker damping effect due to excessive compression of the damping pads. Therefore, the technical solution in this application is beneficial to improving the vibration damping effect of the speaker after it is mounted on the electronic device.

[0009] In addition, the mounting base is provided with a receiving cavity, in which at least part of the speaker module is located. This allows the speaker module to be completely or partially concealed within the receiving cavity, thus enabling the mounting base to protect the speaker module, such as from dust, water, and impact, thereby improving the working stability of the speaker.

[0010] In some embodiments, the vibration damping pad includes a main body and a connecting part. The main body is an annular structure with a hollow portion, which forms the connecting hole. The connecting part is located on the outside of the annular structure and is connected to the outer wall of the annular structure. The connecting part has a first adhesive surface, which is fixed to the mounting base by adhesive.

[0011] The main body is primarily used for connection with electronic equipment. Fasteners passing through the connection holes in the main body securely connect the vibration damping pad to the electronic equipment. The connecting part is primarily used for connection with the mounting base. When assembling the vibration damping pad and the mounting base, adhesive can be applied to the first bonding surface of the connecting part, ensuring contact between the first bonding surface and the mounting base. After the adhesive cures, the connecting part is bonded to the mounting base. Therefore, by constructing the vibration damping pad including the main body and the connecting part, the speaker and electronic equipment can be mounted and secured using the vibration damping pad and the fasteners passing through the connection holes.

[0012] In some embodiments, the mounting base has a slot, the connecting part includes a support part and a snap-fit ​​block, the support part is connected to the main body part, the snap-fit ​​block is located at the end of the support part away from the main body part, the snap-fit ​​block is connected to the support part, the snap-fit ​​block can be engaged in the slot, the side of the snap-fit ​​block away from the main body part forms the first adhesive surface, and the first adhesive surface is connected to the bottom surface of the slot by adhesive.

[0013] When assembling the vibration damping pad and the mounting base, adhesive can be applied to the first bonding surface. Then, the snap-fit ​​block is fitted into the slot of the mounting base, allowing it to engage. During the adhesive curing process, the snap-fit ​​between the snap-fit ​​block and the slot ensures that the first bonding surface and the bottom surface of the slot remain in contact. This results in an adhesive layer that fully contacts both the first bonding surface and the bottom surface of the slot after the adhesive has cured, thus improving bond strength. Furthermore, the snap-fit ​​between the snap-fit ​​block and the slot also allows for pre-positioning of the vibration damping pad, ensuring positional accuracy after the pad is connected to the mounting base.

[0014] In some embodiments, the slot is constructed as a long, narrow groove, with an assembly opening at one end along its length, through which the snap-fit ​​block can enter the slot.

[0015] When assembling the vibration damping pad and the mounting base, after applying adhesive to the first bonding surface, the snap-fit ​​block can slide from the assembly port into the slot and slide along the slot to a preset position. The snap-fit ​​block remains in the preset position until the adhesive cures. By providing an assembly port at one end of the slot, the snap-fit ​​block can easily enter the slot to establish an engagement relationship between the snap-fit ​​block and the slot. This reduces the installation difficulty between the snap-fit ​​block and the slot, thereby improving installation efficiency. In addition, the slot is constructed as a long, narrow groove, allowing the snap-fit ​​block to slide along the slot after entering the assembly port. In this way, the slot acts as a motion guide, allowing the snap-fit ​​block to reach the preset position more accurately and quickly under the guidance of the slot, thus improving the installation accuracy of the vibration damping pad.

[0016] In some embodiments, the mounting base is further formed with a connecting groove; a portion of the support is located within the connecting groove, and the portion of the support within the connecting groove is adhesively connected to the wall of the connecting groove.

[0017] In addition to the adhesive bonding between the first bonding surface and the bottom surface of the slot, the support portion of the damping pad is also adhesively bonded to the connecting groove of the mounting base. This provides multiple bonding points between the damping pad and the mounting base, increasing the bonding area and thus improving the connection strength between them. This design also reduces the risk of separation between the mounting base and electronic equipment when the speaker is mounted on top of the electronic device, thereby improving the installation reliability of the speaker and electronic equipment.

[0018] In some embodiments, the mounting base has a corner portion, the wall surface of which includes an arc-shaped area and a flat area, the slot is located in the flat area, the connecting groove is located in the arc-shaped area, and the connecting groove is constructed as an arc-shaped groove; the portion of the support portion located within the connecting groove is constructed as an arc-shaped structure.

[0019] The corner section is constructed with both an arc-shaped surface area and a flat surface area. The connecting groove is located in the arc-shaped surface area, forming an arc-shaped groove. Compared to constructing a straight groove, this method, along with the arc-shaped structure of the support portion within the groove, allows for a larger contact area between the support and the groove wall. This improves the bonding area between the support and the groove, further enhancing the connection strength between the vibration damping pad and the mounting base. Furthermore, the slot is located in the flat surface area, making it a straight slot. This prevents the locking block from getting stuck when sliding within the slot, improving its smoothness and thus increasing the installation efficiency of the vibration damping pad.

[0020] In some embodiments, the connecting part further includes a positioning part, which is connected to both the main body and the support part. The positioning part has an arc-shaped positioning surface, which abuts against the arc-shaped surface area.

[0021] When the vibration damping pad is installed on the mounting base, the arc-shaped positioning surface on the positioning part abuts against the arc-shaped surface area on the mounting base. This increases the contact area between the vibration damping pad and the mounting base, which helps to further improve the vibration damping effect of the speaker after it is installed on the electronic equipment.

[0022] In some embodiments, the number of positioning parts is two, and the two positioning parts are located on both sides of the support part along a first direction, which is parallel to the central axis of the connecting hole.

[0023] In one embodiment, there are two positioning parts, located on either side of the support part along a first direction parallel to the central axis of the connecting hole. This arrangement further increases the contact area between the damping pad and the mounting base, thereby further improving the vibration damping effect of the speaker after it is installed in the electronic device. Furthermore, with two positioning parts, the connection strength between the support part and the main body can be further enhanced, thereby further improving the service life and operational stability of the damping pad itself.

[0024] In some embodiments, there are multiple vibration damping pads arranged around the speaker module.

[0025] Multiple vibration damping pads are arranged around the speaker module, with each pad forming a connection point between the speaker and the electronic equipment. This allows the speaker to be mounted to the electronic equipment through multiple connection points, thereby improving the connection stability between the speaker and the electronic equipment. Furthermore, the arrangement of the vibration damping pads around the speaker module, meaning the connection point between the speaker and the electronic equipment is located around the speaker module, helps reduce the vibration amplitude of the speaker relative to the electronic equipment, thus improving the speaker's operational stability and reducing noise during electronic equipment operation.

[0026] An embodiment of the second aspect of this application provides an electronic device, the electronic device including the speaker in any of the above embodiments.

[0027] The electronic device in this application includes a speaker with a mounting base and a vibration damping pad. The vibration damping pad is fixed to the mounting base by adhesive. Compared to the method in related technologies where the vibration damping pad is assembled with the mounting bracket through a limiting groove, the adhesive method used in this application avoids situations where the vibration damping pad and the mounting base are too loose or too tight. Thus, when the speaker is installed on the electronic device using fasteners, it will not cause the speaker to wobble and generate noise due to an overly loose vibration damping pad, nor will it cause poor vibration damping performance due to excessive compression of the vibration damping pad. Therefore, the technical solution in this application is beneficial for improving the vibration damping effect of the speaker after it is installed on the electronic device. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the speaker structure provided in one embodiment of this application;

[0029] Figure 2 for Figure 1 An enlarged schematic diagram of part A in the middle;

[0030] Figure 3 This is a schematic diagram of the structure of a vibration damping pad provided in an embodiment of this application;

[0031] Figure 4 This is a schematic diagram of the vibration damping pad provided in one embodiment of this application from another perspective.

[0032] Figure 5 A top view schematic diagram of a speaker provided in an embodiment of this application;

[0033] Figure 6 for Figure 5 Cross-sectional view along the middle BB direction;

[0034] Figure 7 This is a partially exploded view of a speaker provided in one embodiment of this application;

[0035] Figure 8 for Figure 7 An enlarged schematic diagram of section C.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Speakers;

[0038] 10. Mounting base; 11. Slot; 111. Assembly port; 12. Connecting groove; 13. Corner; 131. Curved surface area; 132. Flat surface area; 14. Receiving cavity;

[0039] 20. Speaker module;

[0040] 30. Vibration damping pad; 301. Connecting hole;

[0041] 31. Main body;

[0042] 32. Connecting part; 3201. First adhesive surface; 321. Supporting part; 322. Snap-fit ​​block; 323. Positioning part; 3231. Arc-shaped positioning surface. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0044] In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] As mentioned in the background section, some speakers in the related art are equipped with mounting brackets and damping pads for connecting to electronic devices. The mounting brackets have mounting holes, the damping pads are fitted into the mounting holes, and the damping pads have connection holes. When installing the speaker, the mounting brackets are connected to the electronic device using fasteners (e.g., screws) that pass through the connection holes, thus completing the installation of the speaker and the electronic device. However, after installation using the above method, the vibration damping effect of the speaker is sometimes unsatisfactory.

[0048] The applicant of this application has conducted an in-depth study on the reasons why the above-mentioned installation method results in poor vibration damping of the speaker, and found the reasons as follows:

[0049] In the related technology, the vibration damping pad has a limiting groove in the middle of its circumference. When assembling the vibration damping pad with the mounting bracket, the vibration damping pad needs to be compressed radially and then squeezed into the mounting hole of the mounting bracket. After that, the vibration damping pad is released to restore its original shape. At this time, part of the structure of the mounting bracket will be stuck in the limiting groove, thereby realizing the installation of the vibration damping pad.

[0050] However, the mounting bracket and damping pad will have certain tolerances after processing. Due to the influence of processing tolerances, after the damping pad is assembled into the mounting bracket, there may be obvious gaps between the side wall of the limiting groove and the mounting bracket. This makes the damping pad too loosely assembled with the mounting bracket. As a result, when the speaker is installed on the electronic device with fasteners, the installation stability of the speaker will be relatively poor, and it will be easy to shake and produce noise.

[0051] To avoid this situation, manufacturers sometimes make the limiting groove of the damping pad slightly smaller to prevent the damping pad from being too loosely fitted to the mounting bracket. However, this also makes it easy for the damping pad to become too tight with the mounting bracket due to insufficient limiting groove size. When the fit is too tight, the damping pad is excessively compressed, resulting in reduced deformation capacity. When the speaker is mounted to the electronic device using fasteners, the speaker's vibration damping effect will be less than ideal.

[0052] Based on the above, the applicant proposed the technical solution in this application, which changes the installation method of the vibration damping pad in the speaker. Specifically, the mounting bracket is eliminated, and the vibration damping pad is directly fixed to the speaker mounting base by adhesive. With this connection method, the vibration damping pad and the mounting base will not face the problem of being too loose or too tight. When the speaker is installed on the electronic device using fasteners, it will not cause the speaker to wobble and generate noise due to an overly loose vibration damping pad, nor will it cause poor vibration damping performance due to excessive compression of the vibration damping pad. Therefore, the technical solution in this application is beneficial to improving the vibration damping effect of the speaker after it is installed on the electronic device.

[0053] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0054] like Figure 1 , Figure 2 As shown, an embodiment of the first aspect of this application provides a speaker 1, which can be used in an electronic device. The speaker 1 includes a mounting base 10, a speaker module 20, and a vibration damping pad 30. The mounting base 10 has a receiving cavity 14, the speaker module 20 is connected to the mounting base 10, at least a portion of the speaker module 20 is located in the receiving cavity 14, and the vibration damping pad 30 has a connection hole 301 for connecting to an electronic device. The vibration damping pad 30 is fixed to the mounting base 10 by adhesive.

[0055] Specifically, the speaker module 20 is the core sound-generating component in the speaker 1, responsible for converting electrical signals into sound. The mounting base 10 provides a mounting foundation for the speaker module 20, that is, the speaker module 20 is installed and fixed by connecting to the mounting base 10.

[0056] The vibration damping pad 30 is used to provide vibration damping for the speaker 1 after it is mounted on the electronic device. The vibration damping pad 30 has a connection hole 301, through which fasteners (such as screws) pass to connect the vibration damping pad 30 to the electronic device, thereby enabling the mounting of the speaker 1 and the electronic device. The vibration damping pad 30 can be made of materials such as natural rubber, nitrile rubber, silicone, polyurethane, EVA foam (ethylene-vinyl acetate copolymer), or high-density foam.

[0057] In this embodiment of the speaker 1, the vibration damping pad 30 is fixed to the mounting base 10 by adhesive. Compared to the method in related technologies where the vibration damping pad 30 is assembled with the mounting bracket via a limiting groove, the adhesive method used in this application prevents the vibration damping pad 30 from being too loose or too tight from being assembled with the mounting base 10. Thus, when the speaker 1 is installed on the electronic device using fasteners, it will not cause the speaker 1 to wobble and generate noise due to an overly loose fit of the vibration damping pad 30, nor will it result in poor vibration damping performance due to excessive compression of the vibration damping pad 30. Therefore, the technical solution in this application is beneficial for improving the vibration damping effect of the speaker 1 after it is installed on the electronic device.

[0058] In addition, the mounting base 10 is provided with a receiving cavity 14, and at least part of the speaker module 20 is located in the receiving cavity 14. This allows the speaker module 20 to be completely or partially concealed in the receiving cavity 14. In this way, the mounting base 10 can protect the speaker module 20, such as dustproof, waterproof and impact-proof protection, thereby improving the working stability of the speaker 1.

[0059] like Figure 3 , Figure 4 As shown, in some embodiments, the vibration damping pad 30 includes a main body 31 and a connecting part 32. The main body 31 is an annular structure with a hollow portion, wherein the hollow portion forms a connecting hole 301. The connecting part 32 is located on the outside of the annular structure and is connected to the outer wall of the annular structure. The connecting part 32 forms a first adhesive surface 3201, which is fixed to the mounting base 10 by adhesive.

[0060] The main body 31 is primarily used for connecting to electronic devices. Fasteners (e.g., screws) passing through the connection holes 301 on the main body 31 can securely connect the damping pad 30 to the electronic devices. The connecting part 32 is primarily used for connecting to the mounting base 10. When assembling the damping pad 30 and the mounting base 10, adhesive can be applied to the first adhesive surface 3201 of the connecting part 32, and the first adhesive surface 3201 should be kept in contact with the mounting base 10. After the adhesive cures, the connecting part 32 will be bonded to the mounting base 10. Therefore, by constructing the damping pad 30 including the main body 31 and the connecting part 32, the speaker 1 and the electronic devices can be mounted and fixed using the damping pad 30 and the fasteners passing through the connection holes 301.

[0061] Furthermore, the main body 31 and the connecting part 32 are integrally molded structures, meaning that the main body 31 and the connecting part 32 are made of the same material, manufactured using the same process, and are interconnected after molding. Compared to manufacturing the two parts separately and then connecting them, the manufacturing process is reduced, thereby improving production efficiency.

[0062] like Figure 2 , Figure 3 , Figure 5 as well as Figure 6 As shown, in some embodiments, the mounting base 10 has a slot 11, and the connecting part 32 includes a support part 321 and a snap-fit ​​block 322. The support part 321 is connected to the main body part 31, and the snap-fit ​​block 322 is located at the end of the support part 321 away from the main body part 31. The snap-fit ​​block 322 is connected to the support part 321 and can be snapped into the slot 11. A first adhesive surface 3201 is formed on the side of the snap-fit ​​block 322 away from the main body part 31. The first adhesive surface 3201 is connected to the bottom surface of the slot 11 by adhesive.

[0063] The mounting base 10 has a slot 11, and the connecting part 32 includes a support part 321 and a snap-fit ​​block 322. The snap-fit ​​block 322 can engage with the slot 11, and a first adhesive surface 3201 is formed on the snap-fit ​​block 322. When assembling the vibration damping pad 30 with the mounting base 10, adhesive can be applied to the first adhesive surface 3201, and then the snap-fit ​​block 322 is assembled into the slot 11 of the mounting base 10, so that the snap-fit ​​block 322 engages with the slot 11. Thus, during the adhesive curing process, through the snap-fit ​​action between the snap-fit ​​block 322 and the slot 11, the first adhesive surface 3201 and the bottom surface of the slot 11 can maintain contact. In this way, after the adhesive cures, an adhesive layer can be formed that fully contacts both the first adhesive surface 3201 and the bottom surface of the slot 11, thereby improving the bonding strength. In addition, the locking action between the locking block 322 and the slot 11 can also pre-position the vibration damping pad 30, which helps to ensure the positional accuracy of the vibration damping pad 30 after it is connected to the mounting base 10.

[0064] like Figure 2 As shown, in one embodiment, the slot 11 is constructed as a long strip, and an assembly port 111 is formed at one end of the slot 11 along its own length direction, through which the snap-fit ​​block 322 can enter the slot 11.

[0065] When assembling the vibration damping pad 30 with the mounting base 10, after applying adhesive to the first bonding surface 3201, the snap-fit ​​block 322 can be slid from the assembly port 111 into the slot 11 and slid along the slot 11 to a preset position. Then, the snap-fit ​​block 322 is held in the preset position until the adhesive cures.

[0066] By providing an assembly port 111 at one end of the slot 11, the snap-fit ​​block 322 can easily enter the slot 11, thereby establishing an engagement relationship between the snap-fit ​​block 322 and the slot 11. This reduces the installation difficulty between the snap-fit ​​block 322 and the slot 11, thus improving installation efficiency. Furthermore, the slot 11 is constructed as a long, narrow groove, allowing the snap-fit ​​block 322 to slide along the slot 11 after entering the assembly port 111. In this way, the slot 11 acts as a motion guide, enabling the snap-fit ​​block 322 to reach the preset position more accurately and quickly under the guidance of the slot 11, thereby improving the installation accuracy of the vibration damping pad 30.

[0067] like Figure 3 , Figure 7 as well as Figure 8 As shown, in one embodiment, the mounting base 10 also has a connecting groove 12, a portion of the support portion 321 is located in the connecting groove 12, and the portion of the support portion 321 located in the connecting groove 12 is connected to the wall of the connecting groove 12 by adhesive.

[0068] Based on the adhesive bonding between the first bonding surface 3201 and the bottom surface of the slot 11, the support portion 321 of the damping pad 30 and the connecting groove 12 of the mounting base 10 are also adhesively bonded. This provides multiple bonding points between the damping pad 30 and the mounting base 10, increasing the bonding area and improving the connection strength. Therefore, when the speaker 1 is mounted on electronic equipment, the risk of separation between the mounting base 10 and the electronic equipment is reduced, thereby improving the installation reliability of the speaker 1 and the electronic equipment.

[0069] like Figure 1 , Figure 7 as well as Figure 8 As shown, in one embodiment, the mounting base 10 has a corner portion 13. The wall surface of the corner portion 13 includes an arc-shaped surface area 131 and a flat surface area 132. The slot 11 is located in the flat surface area 132, and the connecting groove 12 is located in the arc-shaped surface area 131. The connecting groove 12 is constructed as an arc-shaped groove. The portion of the support portion 321 located within the connecting groove 12 is constructed as an arc-shaped structure.

[0070] The corner portion 13 is constructed to include an arc-shaped surface region 131 and a flat surface region 132. The connecting groove 12 is located in the arc-shaped surface region 131, so that the connecting groove 12 is formed as an arc-shaped groove. Compared with the method of constructing the connecting groove 12 as a straight groove, constructing the connecting groove 12 as an arc-shaped groove, and constructing the part of the support portion 321 located in the connecting groove 12 as an arc-shaped structure, can provide a larger contact area between the support portion 321 and the wall of the connecting groove 12. This is beneficial to obtain a larger bonding area between the support portion 321 and the connecting groove 12, thereby further improving the connection firmness between the vibration damping pad 30 and the mounting base 10.

[0071] In addition, the slot 11 is set in the planar area 132, which makes the slot 11 a straight slot 11. This makes it less likely for the snap-fit ​​block 322 to get stuck when sliding in the slot 11, thereby improving the smoothness of the snap-fit ​​block 322 sliding in the slot 11. This is beneficial to improving the installation efficiency of the vibration damping pad 30.

[0072] like Figure 3 , Figure 4 As shown, in one embodiment, the connecting part 32 further includes a positioning part 323, which is connected to both the main body part 31 and the support part 321. The positioning part 323 has an arc-shaped positioning surface 3231, which abuts against the arc-shaped surface area 131.

[0073] When the vibration damping pad 30 is installed on the mounting base 10, the arc-shaped positioning surface 3231 on the positioning part 323 abuts against the arc-shaped surface area 131 on the mounting base 10. This increases the contact area between the vibration damping pad 30 and the mounting base 10, which helps to further improve the vibration damping effect of the speaker 1 after it is installed on the electronic device.

[0074] In addition, the positioning part 323 is connected to both the main body part 31 and the support part 321. This also helps to improve the connection strength between the support part 321 and the main body part 31, thereby reducing the risk of local breakage of the vibration damping pad 30 and improving the service life and working stability of the vibration damping pad 30.

[0075] like Figure 3 , Figure 4As shown, in one embodiment, there are two positioning parts 323, located on both sides of the support part 321 along a first direction parallel to the central axis R of the connecting hole 301. This arrangement further increases the contact area between the damping pad 30 and the mounting base 10, thereby further improving the vibration damping effect of the speaker 1 after installation in the electronic device. Furthermore, with two positioning parts 323, the connection strength between the support part 321 and the main body 31 can be further enhanced, thereby further improving the service life and operational stability of the damping pad 30.

[0076] like Figure 5 , Figure 6 As shown, in some embodiments, there are multiple damping pads 30, which are arranged around the speaker module 20.

[0077] Multiple vibration damping pads 30 are arranged around the speaker module 20. Each vibration damping pad 30 constitutes a connection point between the speaker 1 and the electronic device. This allows the speaker 1 to be mounted to the electronic device through multiple connection points, thereby improving the connection stability between the speaker 1 and the electronic device. Furthermore, the arrangement of the vibration damping pads around the speaker module 20, meaning the connection point between the speaker 1 and the electronic device is located around the speaker module 20, helps reduce the vibration amplitude of the speaker 1 relative to the electronic device, thus improving the operating stability of the speaker 1 and reducing noise during the operation of the electronic device.

[0078] An embodiment of the second aspect of this application provides an electronic device, which includes the speaker 1 in any of the above embodiments. Exemplarily, the electronic device may be a television, a smart interactive flat panel, a smart blackboard, or other device with audiovisual functions.

[0079] The electronic device in this embodiment includes a speaker 1 comprising a mounting base 10 and a vibration damping pad 30. The vibration damping pad 30 is fixed to the mounting base 10 by adhesive. Compared to the method in related technologies where the vibration damping pad 30 is assembled with a mounting bracket via a limiting groove, the adhesive method used in this application prevents the vibration damping pad 30 from being too loose or too tight from being assembled with the mounting base 10. Thus, when the speaker 1 is installed on the electronic device using fasteners, it will not cause the speaker 1 to wobble and generate noise due to an overly loose fit of the vibration damping pad 30, nor will it result in poor vibration damping performance due to excessive compression of the vibration damping pad 30. Therefore, the technical solution in this application is beneficial for improving the vibration damping effect of the speaker 1 after it is installed on the electronic device.

[0080] In addition, the mounting base 10 of the speaker 1 is provided with a receiving cavity 14, and at least part of the speaker module 20 is located in the receiving cavity 14. This allows the speaker module 20 to be completely or partially concealed in the receiving cavity 14. In this way, the mounting base 10 can protect the speaker module 20, such as dustproof, waterproof and impact-proof protection, thereby improving the working stability of the speaker 1.

[0081] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A speaker for use in electronic devices, characterized in that, The speaker includes: Mounting base, wherein the mounting base is provided with a receiving cavity; A speaker module, the speaker module being connected to the mounting base, at least a portion of the speaker assembly being located within the receiving cavity; and A vibration damping pad having a connection hole for connecting to the electronic device, the vibration damping pad being fixed to the mounting base by adhesive.

2. The speaker according to claim 1, characterized in that, The vibration damping pad includes: The main body is an annular structure with a hollow portion, the hollow portion forming the connecting hole; The connecting part is located on the outside of the annular structure and is connected to the outer wall of the annular structure. The connecting part has a first adhesive surface, which is fixed to the mounting base by adhesive.

3. The speaker according to claim 2, characterized in that, The mounting base has a slot, and the connecting part includes a support part and a snap-fit ​​block. The support part is connected to the main body part, and the snap-fit ​​block is located at the end of the support part away from the main body part. The snap-fit ​​block is connected to the support part and can be snapped into the slot. The side of the snap-fit ​​block away from the main body part forms the first adhesive surface, and the first adhesive surface is connected to the bottom surface of the slot by adhesive.

4. The speaker according to claim 3, characterized in that, The slot is constructed as a long, narrow groove, with an assembly opening at one end along its length, through which the snap-fit ​​block can enter the slot.

5. The speaker according to claim 3, characterized in that, The mounting base also has a connecting groove; A portion of the support is located within the connecting groove, and the portion of the support located within the connecting groove is adhesively connected to the wall of the connecting groove.

6. The speaker according to claim 5, characterized in that, The mounting base has a corner section, the wall surface of which includes an arc-shaped area and a flat area. The slot is located in the flat area, and the connecting groove is located in the arc-shaped area. The connecting groove is constructed as an arc-shaped groove. The portion of the support located within the connecting groove has an arc-shaped structure.

7. The speaker according to claim 6, characterized in that, The connecting part further includes a positioning part, which is connected to both the main body and the support part. The positioning part has an arc-shaped positioning surface, and the arc-shaped positioning surface abuts against the arc-shaped surface area.

8. The speaker according to claim 7, characterized in that, The number of positioning parts is two, and the two positioning parts are located on both sides of the support part along a first direction, which is parallel to the central axis of the connecting hole.

9. The speaker according to any one of claims 1 to 8, characterized in that, The number of vibration damping pads is multiple, and the multiple vibration damping pads are arranged around the speaker module.

10. An electronic device, characterized in that, The speaker includes any one of claims 1 to 9.

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