High load flexible circuit board and LED light strip thereof
By increasing the width of the power layer and the contact area between the conductive strip and the conductive block in the flexible circuit board, the problem of insufficient load capacity of existing flexible circuit boards is solved, and stable connection of high-load flexible circuit boards and high-efficiency load performance of LED light strips are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG SHENGBANG ELECTRONICS CO LTD
- Filing Date
- 2025-04-25
- Publication Date
- 2026-06-23
AI Technical Summary
Existing multilayer flexible circuit boards have reduced load capacity due to the limited width of the conductive layer, making it impossible to install too many LED beads, which affects the load performance and ease of use of the light strip.
A high-load flexible circuit board is designed, comprising a first insulating layer, a circuit layer, a second insulating layer, a power layer, and a third insulating layer arranged sequentially from top to bottom. By setting a first conductive strip, a second conductive strip, a first conductive block, a second conductive block, and a third conductive block, the width of the power layer is expanded and the contact area between the conductive strip and the conductive block is increased. Thermosetting adhesive is used to bond the layers to ensure insulation and connection stability.
This improves the load-bearing capacity and connection stability of the flexible circuit board, avoids poor contact, and enhances the working stability and lifespan of the LED light strip.
Smart Images
Figure CN224401726U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of flexible circuit board technology, and in particular to a high-load flexible circuit board and its LED light strip. Background Technology
[0002] Flexible printed circuit boards (FPCBs) are highly reliable and extremely flexible printed circuit boards. Due to their lightweight, thinness, and flexible installation, they are widely used in the lighting industry. However, existing multilayer FPCBs, in order to ensure insulation between the insulating and conductive layers and prevent short circuits between conductive layers, limit the width of the conductive layers to a certain safe range. This reduces the load-bearing capacity of the FPCB, limiting the number of LED chips that can be installed per unit length, thus affecting the load-bearing performance and ease of use of the light strip. Summary of the Invention
[0003] To address the aforementioned issues, the present invention aims to provide a high-load flexible circuit board and its LED light strip, optimizing the structure of the flexible circuit board, effectively expanding the width of the power supply layer, and improving the load performance and ease of use of the flexible circuit board and its LED light strip.
[0004] The technical solution adopted by this utility model to solve its problem is:
[0005] In a first aspect, embodiments of this application provide a high-load flexible circuit board, comprising a first insulating layer, a circuit layer, a second insulating layer, a power layer, and a third insulating layer arranged sequentially from top to bottom; the power layer has a first conductive strip and a second conductive strip arranged parallel to each other along the length direction of the third insulating layer; the second insulating layer is fixed between the first conductive strip and the second conductive strip; the circuit layer has a first conductive block extending to the outside of the second insulating layer and connected to the first conductive strip, a second conductive block extending to the outside of the second insulating layer and connected to the second conductive strip, and a third conductive block located within the coverage area of the second insulating layer; the first insulating layer includes a plurality of sub-units connected end to end, each sub-unit having a first window adapted to the first conductive block, a second window adapted to the second conductive block, and a third window adapted to the third conductive block; the first window and the second window are both located at the beginning and end of the sub-unit, and two sets of the third windows are distributed parallel to each other between the first window and the second window, with adjacent third windows facing different third conductive blocks respectively.
[0006] The aforementioned high-load flexible circuit board has at least the following beneficial effects: By setting a first insulating layer, a circuit layer, a second insulating layer, and a power layer, the first conductive strip, the second conductive strip, and the circuit layer can be connected sequentially through a first window, a second window, and a third window. The second insulating layer is fixed between the first and second conductive strips, which not only ensures the insulation between the first and second conductive strips but also effectively expands the width of the power layer, improving the load performance and connection stability of the flexible circuit board. By setting sub-units, a first conductive block, a second conductive block, and a third conductive block, the connection stability between the circuit layer and the power layer is ensured, avoiding poor contact during use of the high-load flexible circuit board and improving its operational stability.
[0007] In some embodiments, the subunit is further provided with a fourth window adapted to the first conductive block and a fifth window adapted to the second conductive block; the first conductive block is electrically connected to the third conductive block through the fourth window and the first window; the second conductive block is electrically connected to the third conductive block through the fifth window and the first window. By providing the fourth and fifth windows, it is convenient for the first conductive block to be electrically connected to the third conductive block through the fourth and third windows, and for the second conductive block to be electrically connected to the third conductive block through the fifth and third windows, thus ensuring the connection stability and ease of use of the load flexible circuit board.
[0008] In some embodiments, the first window, the second window, the third window, the fourth window, and the fifth window are all oblong. This structure ensures that electronic devices can be stably soldered onto the circuit layer through the third, fourth, and fifth windows, and also facilitates the connection of an external power supply to the first and second conductive strips through the first and second windows, thereby improving the stability and lifespan of the high-load flexible circuit board.
[0009] In some embodiments, the upper end of the first conductive block extends to the upper end of the first conductive strip; the lower end of the second conductive block extends to the lower end of the second conductive strip. This structure increases the contact area between the first conductive block and the first conductive strip, and the contact area between the second conductive block and the second conductive strip, ensuring the connection stability between the circuit layer and the power layer, preventing the first and second conductive blocks from detaching from the power layer during use, and improving the connection stability of the high-load flexible circuit board.
[0010] In some embodiments, the width of the first conductive strip is greater than or equal to the width of the first conductive block; the width of the second conductive strip is greater than or equal to the width of the second conductive block. This structure effectively increases the width of the first and second conductive strips, improves the current intensity flowing through the power layer, increases the number of electronic devices on the flexible circuit board, and enhances the load performance and operational stability of the high-load flexible circuit board.
[0011] In some embodiments, the width of the second insulating layer is greater than the distance between adjacent third openings, and the width of the second insulating layer is less than the distance between adjacent first and second openings. This structure ensures that the second insulating layer can effectively insulate the first and second conductive strips, and also ensures the connection stability between the first conductive block and the first conductive strip, and between the second conductive block and the second conductive strip, thereby improving the working stability and safety of the high-load flexible circuit board.
[0012] In some embodiments, the first insulating layer, the circuit layer, the second insulating layer, the power layer, and the third insulating layer are bonded together using thermosetting adhesives. Thermosetting adhesives have the advantages of low cost and strong adhesion, and the bonding with thermosetting adhesives ensures the connection stability of each layer of the high-load flexible circuit board.
[0013] In some embodiments, the circuit layer and the power layer are any one of copper foil, aluminum foil, aluminum-copper-plated foil, iron foil, and iron-copper-plated foil. Using any one of copper foil, aluminum foil, aluminum-copper-plated foil, iron foil, and iron-copper-plated foil for the circuit layer and power layer ensures that different conductive materials can be selected for the circuit layer and power layer according to the application scenario and requirements, thus reducing the manufacturing cost of high-load flexible circuit boards.
[0014] Secondly, this application provides an LED light strip, characterized in that it includes electronic devices and a high-load flexible circuit board as described above; the pins of the electronic devices pass through the upper and lower adjacent third windows and are electrically connected to the third conductive block, or the pins of the electronic devices pass through the third windows to conduct the third conductive block and the first conductive block, or the pins of the electronic devices pass through the third windows to conduct the third conductive block and the second conductive block.
[0015] The beneficial effects of the aforementioned LED light strip are as follows: By setting a first insulating layer, a circuit layer, a second insulating layer, and a power layer, the first conductive strip, the second conductive strip, and the circuit layer can be connected sequentially through the first, second, and third openings. The second insulating layer is fixed between the first and second conductive strips, ensuring the insulation between them and effectively expanding the width of the power layer, thereby improving the load performance and connection stability of the LED light strip. By setting sub-units, a first conductive block, a second conductive block, and a third conductive block, the connection stability between the circuit layer and the power layer is ensured, avoiding poor contact during use of the high-load flexible circuit board and improving the working stability of the LED light strip. By setting a fourth and fifth opening, the first conductive block can be electrically connected to the third conductive block through the fourth and third openings, and the second conductive block can be electrically connected to the third conductive block through the fifth and third openings, ensuring the connection stability and ease of use of the LED light strip.
[0016] In some embodiments, the electronic device includes LED chips and a current-limiting resistor. By setting the LED chips and the current-limiting resistor, which are connected to the power supply layer through a first conductive block, a third conductive block, and a second conductive block, the current-limiting resistor can effectively limit the current passing through the LED chips within a safe range, ensuring the working stability and safety of the LED light strip.
[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0018] The above and additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0019] Figure 1 This is a partial perspective view of a high-load flexible circuit board according to an embodiment of the present invention;
[0020] Figure 2 for Figure 1 Planar structural diagram of the first insulating layer;
[0021] Figure 3 for Figure 1 Planar structure diagram of the middle circuit layer;
[0022] Figure 4 for Figure 1 Planar structural diagram of the second insulating layer;
[0023] Figure 5 for Figure 1 Planar structure diagram of the middle power layer;
[0024] Figure 6 for Figure 1 Planar structure diagram of the third insulating layer. Detailed Implementation
[0025] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0026] Reference Figures 1 to 6This utility model provides a high-load flexible circuit board, comprising, from top to bottom, a first insulating layer 100, a circuit layer 200, a second insulating layer 300, a power layer 400, and a third insulating layer 500; the power layer 400 has a first conductive strip 410 and a second conductive strip 420 arranged parallel to each other along the length direction of the third insulating layer 500; the second insulating layer 300 is fixed between the first conductive strip 410 and the second conductive strip 420; the circuit layer 200 has a first conductive block 210 extending to the outside of the second insulating layer 300 and connected to the first conductive strip 410, and a first conductive block 210 extending to the outside of the second insulating layer 300 and connected to the second conductive strip 420. The second conductive block 220 and the third conductive block 230 are located within the coverage area of the second insulating layer 300. The first insulating layer 100 includes a plurality of sub-units 110 connected end to end. Each sub-unit 110 is provided with a first window 111 adapted to the first conductive block 210, a second window 112 adapted to the second conductive block 220, and a third window 113 adapted to the third conductive block 230. The first window 111 and the second window 112 are both located at the beginning and end of the sub-unit 110. Two sets of third windows 113 are distributed parallel to each other between the first window 111 and the second window 112. The adjacent third windows 113 are respectively facing different third conductive blocks 230.
[0027] By setting a first insulating layer 100, a circuit layer 200, a second insulating layer 300, and a power layer 400, the first conductive strip 410, the second conductive strip 420, and the circuit layer 200 can be connected sequentially through the first window 111, the second window 112, and the third window 113. The second insulating layer 300 is fixed between the first conductive strip 410 and the second conductive strip 420, which not only ensures the insulation between the first conductive strip 410 and the second conductive strip 420, but also effectively expands the width of the power layer 400, improving the load performance and connection stability of the flexible circuit board. By setting a sub-unit 110, a first conductive block 210, a second conductive block 220, and a third conductive block 230, the connection stability between the circuit layer 200 and the power layer 400 is ensured, avoiding poor contact during use of the high-load flexible circuit board and improving the working stability of the high-load flexible circuit board.
[0028] In another embodiment, the subunit 110 is further provided with a fourth window 114 adapted to the first conductive block 210 and a fifth window 115 adapted to the second conductive block 220; the first conductive block 210 is electrically connected to the third conductive block 230 through the fourth window 114 and the first window 111; the second conductive block 220 is electrically connected to the third conductive block 230 through the fifth window 115 and the first window 111. By providing the fourth window 114 and the fifth window 115, it is convenient for the first conductive block 210 to be electrically connected to the third conductive block 230 through the fourth window 114 and the third window 113, and for the second conductive block 220 to be electrically connected to the third conductive block 230 through the fifth window 115 and the third window 113, thus ensuring the connection stability and ease of use of the load flexible circuit board.
[0029] In another embodiment, the first window 111, the second window 112, the third window 113, the fourth window 114, and the fifth window 115 are all oblong. This structure ensures that electronic components can be stably soldered onto the circuit layer 200 through the third window 113, the fourth window 114, and the fifth window 115. It also facilitates the connection of external power supplies to the first conductive strip 410 and the second conductive strip 420 through the first window 111 and the second window 112, thereby improving the stability and lifespan of the high-load flexible circuit board.
[0030] In another embodiment, the upper end of the first conductive block 210 extends to the upper end of the first conductive strip 410; the lower end of the second conductive block 220 extends to the lower end of the second conductive strip 420. This structure increases the contact area between the first conductive block 210 and the first conductive strip 410, and the contact area between the second conductive block 220 and the second conductive strip 420, ensuring the connection stability between the circuit layer 200 and the power layer 400, preventing the first conductive block 210 and the second conductive block 220 from detaching from the power layer during use, and improving the connection stability of the high-load flexible circuit board.
[0031] In another embodiment, the width of the first conductive strip 410 is greater than or equal to the width of the first conductive block 210; the width of the second conductive strip 420 is greater than or equal to the width of the second conductive block 220. This structure effectively increases the width of the first conductive strip 410 and the second conductive strip 420, improves the current intensity flowing through the power layer 400, increases the number of electronic devices on the flexible circuit board, and enhances the load performance and operational stability of the high-load flexible circuit board.
[0032] In another embodiment, the width of the second insulating layer 300 is greater than the distance between adjacent third openings 113, and the width of the second insulating layer 300 is less than the distance between adjacent first openings 111 and second openings 112. This structure ensures that the second insulating layer 300 can effectively insulate the first conductive strip 410 and the second conductive strip 420, and also ensures the connection stability between the first conductive block 210 and the first conductive strip 410, and between the second conductive block 220 and the second conductive strip 420, thereby improving the working stability and safety of the high-load flexible circuit board.
[0033] In another embodiment, the first insulating layer 100, circuit layer 200, second insulating layer 300, power layer 400, and third insulating layer 500 are bonded together with thermosetting adhesive. Thermosetting adhesive has the advantages of low cost and strong adhesion, and the bonding of each layer of the high-load flexible circuit board is ensured by using thermosetting adhesive.
[0034] In another embodiment, the circuit layer 200 and the power layer 400 are any one of copper foil, aluminum foil, aluminum-copper-plated foil, iron foil, or iron-copper-plated foil. Using any one of these materials ensures that the circuit layer and power layer can be made of different conductive materials depending on the application scenario and requirements, thus reducing the manufacturing cost of high-load flexible circuit boards.
[0035] In another embodiment, the subunit 110 is provided with at least two sets of third windows 113. This structure ensures that at least two electronic devices are connected to the third conductive block 230 through adjacent third windows 113, and that the subunit 110 contains at least one current-limiting resistor, thus ensuring the operational stability of other electronic devices.
[0036] This application embodiment also provides an LED light strip, including electronic devices and a high-load flexible circuit board as described above; the pins of the electronic devices pass through the upper and lower adjacent third windows 113 and are electrically connected to the third conductive block 230, or the pins of the electronic devices pass through the third windows 113 to conduct the third conductive block 230 and the first conductive block 210, or the pins of the electronic devices pass through the third windows 113 to conduct the third conductive block 230 and the second conductive block 220.
[0037] In another embodiment, the electronic components include LED chips and a current-limiting resistor. By setting the LED chips and the current-limiting resistor, which are connected to the power layer 400 through a first conductive block 210, a third conductive block 230, and a second conductive block 220, the current-limiting resistor can effectively limit the current passing through the LED chips within a safe range, ensuring the working stability and safety of the LED light strip.
[0038] The working principle of this utility model will be further explained below.
[0039] In the production process of high-load flexible circuit boards, firstly, according to the size and power requirements of the product, appropriately sized circuit layers 200 and power layers 400 are cut from copper material with transfer film. For example, the width of the first conductive strip 410 and the second conductive strip 420 is 2.6mm. The circuit layer 200 has a first conductive block 210 and a second conductive block 220 at both ends of a corresponding area of a sub-unit 110, and multiple sets of third conductive blocks 230 are provided between the two sets of first conductive blocks 210 and second conductive blocks 220. A first insulating layer 100 is cut from the insulating material, and the sub-unit 110 is correspondingly provided with two first windows 111, two second windows 112, one fourth window 114, and one fifth window 115. 15 and twelve third windows 113 are provided to ensure that seven electronic devices can be installed in the subunit 110, and that the first window 111 and the second window 112 at the same end can be connected to the two poles of an external power supply respectively; a second insulating layer 300 is cut from the insulating material, and the width of the second insulating layer 300 is greater than the distance between the upper and lower adjacent third windows 113, and less than the distance between the upper and lower adjacent first windows 111 and second windows 112; a third insulating layer 500 with the same width as the first insulating layer 100 is cut from the insulating material; then, the first insulating layer 100, the circuit layer 200, the second insulating layer 300, the power layer 400, and the third insulating layer 500 are assembled. First, the power layer 400 is bonded to the third insulating layer 500 using thermosetting adhesive to form the first conductive strip 410 and the second conductive strip 420. Next, the second insulating layer 300 is bonded between the first conductive strip 410 and the second conductive strip 420, so that the second insulating layer 300 covers the gap between the first conductive strip 410 and the second conductive strip 420, achieving an insulating protection effect. Then, after removing waste from the cut circuit layer 200, the circuit layer 200 is bonded to the third insulating layer 500 containing the power layer 400 and the second insulating layer 300, so that the first conductive block 210 extends to the outside of the second insulating layer 300 and connects to the first conductive strip 410, and the second conductive block 220 extends to... The outer side of the second insulating layer 300 is connected to the second conductive strip 420, and the third conductive block 230 is fixed on the third insulating layer 500. Next, the transfer film located at the upper end of the circuit layer 200 is separated so that the circuit layer 200 is transferred completely, quickly and accurately to the upper end of the power layer 400 and the second insulating layer 300. Finally, the first insulating layer 100 is bonded to the upper end of the circuit layer 200 so that the first window 111 is directly opposite the first conductive block 210, the second window 112 is directly opposite the second conductive block 220, the third window 113 is directly opposite the third conductive block 230, the fourth window 114 is directly opposite the first conductive block 210 at the first position, and the fifth window 115 is directly opposite the last conductive block 220, thus obtaining a high-load flexible circuit board.
[0040] During the assembly of the LED light strip, the solder feet of the LED beads are passed through the adjacent third windows 113 and electrically connected to the third conductive block 230. The pins of the current-limiting resistors are passed through the fourth window 114 and the first third window 113 to connect the first conductive block 210 and the third conductive block 230. The pins of the current-limiting resistors are passed through the fourth window 114 and the last third window 113 to connect the second conductive block 220 and the third conductive block 230. This ensures that multiple LED beads and corresponding current-limiting resistors are installed in the subunit 110. The first conductive strip 410 is connected to the positive terminal of the external power supply through the first window 111, and the second conductive strip 420 is connected to the negative terminal of the external power supply through the second window 112, so that the LED beads and current-limiting resistors can work stably. Because a second insulating layer 300 is provided between the power layer 400 and the circuit layer 200, the first conductive block 210 and the second conductive block 220 extend outward, which can effectively increase the width of the first conductive strip 410 and the second conductive strip 420, improve the current intensity flowing through the power layer 400, and enable the sub-unit 110 to carry electronic devices with higher power, ensuring the load capacity of the high-load flexible circuit board and improving the load performance and service life of the LED light strip.
[0041] As can be seen from the above description, the high-load flexible circuit board and its LED light strip of this utility model, by setting a first insulating layer 100, a circuit layer 200, a second insulating layer 300, and a power layer 400, can sequentially connect a first conductive strip 410, a second conductive strip 420, and a circuit layer 200 through a first opening 111, a second opening 112, and a third opening 113. The second insulating layer 300 is fixed between the first conductive strip 410 and the second conductive strip 420, which not only ensures the insulation between the first conductive strip 410 and the second conductive strip 420, but also effectively expands the width of the power layer 400, improving the load performance and connection stability of the LED light strip; by setting... The placement of sub-unit 110, first conductive block 210, second conductive block 220, and third conductive block 230 ensures the connection stability between circuit layer 200 and power layer 400, avoids poor contact during use of high-load flexible circuit boards, and improves the working stability of LED light strips. By setting fourth window 114 and fifth window 115, it is convenient for the first conductive block 210 to be electrically connected to the third conductive block 230 through fourth window 114 and third window 113, and for the second conductive block 220 to be electrically connected to the third conductive block 230 through fifth window 115 and third window 113, ensuring the connection stability and ease of use of LED light strips.
[0042] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.
Claims
1. A high-load flexible circuit board, characterized in that, It includes, from top to bottom, a first insulating layer, a circuit layer, a second insulating layer, a power supply layer, and a third insulating layer; The power layer is provided with a first conductive strip and a second conductive strip parallel to each other along the length direction of the third insulating layer; the second insulating layer is fixed between the first conductive strip and the second conductive strip; the circuit layer is provided with a first conductive block extending to the outside of the second insulating layer and connected to the first conductive strip, a second conductive block extending to the outside of the second insulating layer and connected to the second conductive strip, and a third conductive block located within the coverage area of the second insulating layer; The first insulating layer includes a plurality of sub-units connected end to end. Each sub-unit is provided with a first window adapted to the first conductive block, a second window adapted to the second conductive block, and a third window adapted to the third conductive block. The first window and the second window are located at the beginning and end of the sub-unit, and two sets of the third windows are distributed parallel to each other between the first window and the second window. The adjacent third windows face different third conductive blocks.
2. The high-load flexible circuit board according to claim 1, characterized in that, The subunit is further provided with a fourth window adapted to the first conductive block and a fifth window adapted to the second conductive block; the first conductive block is electrically connected to the third conductive block through the fourth window and the first window; the second conductive block is electrically connected to the third conductive block through the fifth window and the first window.
3. A high-load flexible circuit board according to claim 2, characterized in that, The first window, the second window, the third window, the fourth window, and the fifth window are all oblong.
4. A high-load flexible circuit board according to claim 1, characterized in that, The upper end of the first conductive block extends to the upper end of the first conductive strip; the lower end of the second conductive block extends to the lower end of the second conductive strip.
5. A high-load flexible circuit board according to claim 4, characterized in that, The width of the first conductive strip is greater than or equal to the width of the first conductive block; the width of the second conductive strip is greater than or equal to the width of the second conductive block.
6. A high-load flexible circuit board according to claim 5, characterized in that, The width of the second insulating layer is greater than the distance between the upper and lower adjacent third openings, and the width of the second insulating layer is less than the distance between the upper and lower adjacent first openings and the second opening.
7. A high-load flexible circuit board according to claim 1, characterized in that, The first insulating layer, the circuit layer, the second insulating layer, the power layer, and the third insulating layer are bonded together with thermosetting adhesive.
8. A high-load flexible circuit board according to claim 1, characterized in that, The circuit layer and the power layer are any one of copper foil, aluminum foil, aluminum-plated copper foil, iron foil, and iron-plated copper foil.
9. An LED light strip, characterized in that, Includes electronic devices and a high-load flexible circuit board as described in any one of claims 1 to 8; the pins of the electronic devices pass through the upper and lower adjacent third openings and are electrically connected to the third conductive block, or the pins of the electronic devices pass through the third openings to conduct the third conductive block and the first conductive block, or the pins of the electronic devices pass through the third openings to conduct the third conductive block and the second conductive block.
10. An LED light strip according to claim 9, characterized in that, The electronic components include LED beads and current-limiting resistors.