A copper-nickel composite ceramic copper clad substrate

Abstract

The utility model relates to electronic packaging technical field especially, and it is a kind of copper nickel composite material ceramic copper-clad plate;Aiming at the problems, such as interface delamination caused by thermal stress concentration, insufficient corrosion resistance, poor electrical connection stability and other problems of ceramic copper-clad plate in prior art, provide a kind of copper nickel composite material ceramic copper-clad plate, including ceramic substrate body, the ceramic substrate body is surrounded with support frame around, support frame and ceramic substrate body form patch area, copper nickel composite sheet is distributed in multiple rows and multiple columns in patch area, ceramic substrate body includes but is not limited to aluminum nitride substrate, alumina substrate, copper nickel composite sheet is fixed on the surface of ceramic substrate body, the spacing between adjacent copper nickel composite sheet is 0.1-0.5mm;The reliability and service life of substrate under complex working conditions are improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, and in particular to a copper-nickel composite ceramic copper-clad substrate. Background Technology

[0002] As electronic devices become smaller and more powerful, higher demands are placed on the heat dissipation performance, electrical reliability, and mechanical strength of the substrate. Traditional ceramic copper-clad substrates suffer from problems such as thermal stress concentration leading to interface delamination, insufficient corrosion resistance, and poor electrical connection stability. For example, under high and low temperature cycling environments, the ceramic and metal layers are prone to cracking due to the difference in their coefficients of thermal expansion; a single copper cladding layer is easily oxidized in humid or corrosive environments, affecting conductivity. To address these issues, a copper-nickel composite ceramic copper-clad substrate is proposed. Utility Model Content

[0003] This invention aims to provide a copper-nickel composite ceramic copper-clad substrate, which solves problems such as thermal stress concentration, poor corrosion resistance, and unstable electrical connection of existing substrates through material matching, structural optimization, and process improvement, thereby improving the reliability and service life of the substrate under complex working conditions.

[0004] The technical solution adopted by this utility model to solve the above problems is as follows:

[0005] A copper-nickel composite ceramic copper-clad substrate includes a ceramic substrate body, a support frame surrounding the ceramic substrate body, the support frame and the ceramic substrate body enclosing a patch area, and copper-nickel composite sheets distributed in multiple rows and columns within the patch area. The ceramic substrate body includes, but is not limited to, an aluminum nitride substrate and an alumina substrate. The copper-nickel composite sheets are bonded and fixed to the surface of the ceramic substrate body, and the spacing between adjacent copper-nickel composite sheets is 0.1-0.5 mm.

[0006] Furthermore, the copper-nickel composite sheet is fixed to the surface of the ceramic substrate by a silver-based brazing layer.

[0007] Furthermore, the thickness of the silver-based brazing layer is 5-50 μm, the thickness of the copper-nickel composite sheet is 0.05-0.5 mm, the thickness of the ceramic substrate body is 0.5-2.0 mm, and the surface roughness Ra≤0.3 μm.

[0008] Furthermore, the support frame is made of a metal material whose coefficient of thermal expansion matches that of the ceramic substrate, including Kovar alloy or titanium alloy.

[0009] Furthermore, the support frame has a groove on the side facing the patch area, and the groove is filled with thermally conductive silicone.

[0010] Furthermore, the support frame is fixedly connected to the ceramic substrate body through a sintering process.

[0011] Furthermore, the top surface of the support frame is 0.02-0.1 mm higher than the top surface of the copper-nickel composite sheet.

[0012] Furthermore, the number of rows and columns of copper-nickel composite sheets in the patch area is not less than 2, and they are symmetrically distributed along the length and width directions of the ceramic substrate.

[0013] Compared with the prior art, this utility model has the following advantages:

[0014] By sintering a support frame with a matching coefficient of thermal expansion to an aluminum nitride ceramic substrate, arranging copper-nickel composite sheets in a matrix, and fixing them with silver-based brazing, thermal stress elimination and efficient heat dissipation are achieved; low-resistance and stable electrical connections and anti-interference performance are provided; a high-strength vibration- and impact-resistant structure is provided; and corrosion resistance and environmental adaptability are combined. At the same time, standardized processes ensure consistency, reduce costs, and meet the stringent requirements of high-power electronic devices. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main body of this utility model.

[0016] Figure 2 This is a side view of the present invention.

[0017] The labels in the diagram are as follows: 1. Ceramic substrate body; 2. Copper-nickel composite sheet; 3. Support frame; 4. Silver-based brazing layer. Detailed Implementation

[0018] The following are specific embodiments of the present invention, and the technical solution of the present invention will be further described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0019] like Figure 1-2 As shown, this utility model provides a copper-nickel composite ceramic copper-clad substrate, including a ceramic substrate body 1. A support frame 3 is provided around the ceramic substrate body 1. The support frame 3 and the ceramic substrate body 1 enclose a patch area. Copper-nickel composite sheets 2 are distributed in multiple rows and columns in the patch area. The ceramic substrate body 1 includes, but is not limited to, an aluminum nitride substrate and an alumina substrate. The copper-nickel composite sheets 2 are bonded and fixed to the surface of the ceramic substrate body 1. The spacing between adjacent copper-nickel composite sheets 2 is 0.1-0.5 mm.

[0020] The ceramic substrate body 1 forms the main body, surrounded by a support frame 3. Together, they form a regular mounting area, providing space for the arrangement of the copper-nickel composite sheets 2. Within this area, the copper-nickel composite sheets 2 are precisely distributed in multiple rows and columns, adhered and fixed to the surface of the ceramic substrate, forming a highly efficient conductive and thermally conductive structure. The ceramic substrate body 1 includes, but is not limited to, aluminum nitride substrates and alumina substrates. Compared to ordinary ceramic substrates, it can quickly conduct the heat generated by the copper-nickel composite sheets, effectively reducing the substrate's operating temperature and preventing performance degradation or damage to electronic components due to overheating, thus improving heat dissipation efficiency. The support frame 3 significantly enhances the mechanical strength and stability of the substrate, effectively resisting external impacts and vibrations and reducing the risk of substrate breakage. The copper-nickel composite sheets 2 combine the high conductivity of copper and the strong corrosion resistance of nickel, ensuring stable signal and current transmission and enabling long-term use in complex environments without easily corroding, greatly improving the substrate's reliability and lifespan, meeting the demands of modern electronic devices for high-performance substrates. The copper-nickel composite sheets 2 are arranged in a matrix, with adjacent spacing controlled at 0.1-0.5mm, representing a deep optimization design from both structural layout and functional implementation perspectives. Structurally, the matrix arrangement provides a regular spatial layout for the surface mount area, facilitating circuit design and component assembly, and improving the standardization and modularity of substrate manufacturing. The 0.1-0.5mm spacing avoids electrical interference or short-circuit risks between adjacent composite sheets due to excessively close spacing, while also preventing insufficient conductive area and reduced current transmission efficiency due to excessively large spacing. From an effectiveness perspective, this design ensures that the copper-nickel composite sheet 2 achieves efficient conductivity and heat dissipation while maintaining the overall electrical insulation performance and structural compactness of the substrate. This allows the substrate to meet the stability requirements of high-frequency signal transmission within a limited space, while also promoting air convection through reasonable spacing, assisting the ceramic substrate in improving heat dissipation efficiency. This significantly enhances the substrate's applicability and reliability in high-power, high-density integrated electronic devices.

[0021] The copper-nickel composite sheet 2 is fixed to the surface of the ceramic substrate by a silver-based brazing layer 4.

[0022] A silver-based brazing layer 4 is used to fix the copper-nickel composite sheet 2 to the surface of the ceramic substrate. The silver-based brazing layer 4, as an intermediate medium, forms a dense metallurgical bonding layer at high temperature, tightly filling the microscopic gaps between the copper-nickel composite sheet 2 and the ceramic substrate, achieving a seamless connection between the two. On the one hand, the silver-based brazing layer 4, with its excellent electrical and thermal conductivity, constructs an efficient current and heat conduction channel, significantly reducing the interface contact resistance and improving the overall electrical performance of the substrate. On the other hand, its high-strength bonding characteristics provide the substrate with excellent structural stability, effectively resisting the stress under conditions such as temperature cycling and mechanical vibration, preventing the composite sheet from falling off or the interface from delaminating. At the same time, the good oxidation resistance and corrosion resistance of the silver-based brazing filler further enhance the long-term reliability of the substrate in complex environments, providing a solid guarantee for the stable operation of high-frequency, high-power electronic devices.

[0023] The support frame 3 is made of a metal material whose coefficient of thermal expansion matches that of the ceramic substrate body 1. The metal material includes a Kovar alloy frame or a titanium alloy frame.

[0024] A support frame 3, made of Kovar alloy or titanium alloy with a coefficient of thermal expansion matching that of the ceramic substrate 1, is used. Structurally, the support frame 3 tightly surrounds the ceramic substrate, forming a stable overall frame structure that directly bears external mechanical stress. In terms of performance, the coefficients of thermal expansion of Kovar alloy and titanium alloy are highly compatible. During temperature changes, the expansion and contraction of the support frame 3 and the ceramic substrate are similar, which greatly reduces thermal stress caused by differences in thermal expansion and effectively prevents problems such as cracking, deformation, or delamination at the interface with the copper-nickel composite sheet 2. At the same time, the high strength of the metal material itself further enhances the mechanical strength of the substrate, enabling it to maintain structural integrity under complex working conditions such as vibration and impact, significantly improving the long-term reliability and service life of the substrate under high and low temperature cycling and harsh environments.

[0025] The thickness of the silver-based brazing layer 4 is 5-50 μm, the thickness of the copper-nickel composite sheet 2 is 0.05-0.5 mm, the thickness of the ceramic substrate body 1 is 0.5-2.0 mm, and the surface roughness Ra≤0.3 μm.

[0026] This invention sets precise parameters for the thickness of the silver-based brazing layer 4, the copper-nickel composite sheet 2, the ceramic substrate body 1, and the surface roughness of the ceramic substrate, achieving multi-dimensional optimization from both structural and performance perspectives. The thickness of the silver-based brazing layer 4 is controlled between 5-50 μm. If it is too thin, it will lead to insufficient bonding force, while if it is too thick, it will introduce thermal stress. This thickness range can ensure that the copper-nickel composite sheet 2 and the ceramic substrate body 1 achieve a high-strength metallurgical bond, while avoiding performance degradation caused by improper thickness. The thickness of the copper-nickel composite sheet 2 is 0.05-0.5 mm, which ensures high conductivity and corrosion resistance while taking into account the need for lightweighting. It can also be flexibly adjusted according to the actual current carrying capacity of the circuit. The thickness of the ceramic substrate body 1 is designed to be 10.5-2.0 mm, which optimizes the overall thermal conductivity of the substrate while ensuring good mechanical strength, so as to meet the heat dissipation needs of different power devices. The surface roughness Ra of the ceramic substrate body 1 is Ra≤0.3 μm, which effectively reduces the micro-undulations of the surface, allowing the silver-based brazing layer 4 to fill and adhere more uniformly and tightly, greatly improving the brazing bond strength, reducing contact thermal resistance and resistance, and thus improving the stability of the electrical and thermal conductivity of the substrate, ensuring reliable operation under complex working conditions.

[0027] The support frame 3 is fixedly connected to the ceramic substrate through a sintering process.

[0028] The use of sintering to fix the support frame 3 to the ceramic substrate is a choice based on material properties and structural stability requirements. From the perspective of the connection method, the sintering process uses high temperature to cause the atoms on the surface of the support frame 3 and the ceramic substrate to diffuse and fuse, forming a tight metallurgical bond. Compared with traditional mechanical connections or simple adhesives, this connection method can achieve molecular-level bonding strength. In terms of function and effect, on the one hand, high-temperature sintering promotes a tight fit between the support frame 3 and the ceramic substrate, eliminating interface gaps and significantly improving the overall structure's vibration and impact resistance, effectively preventing the support frame 3 from loosening or falling off. On the other hand, the stable connection formed by the sintering process ensures that the support frame 3 always works in tandem with the ceramic substrate during long-term use, fully utilizing the advantages of matching thermal expansion coefficients, avoiding thermal stress concentration caused by connection failure, and greatly enhancing the reliability and service life of the substrate under complex operating conditions such as high and low temperature cycles and mechanical vibration, providing a solid guarantee for the stable operation of electronic components.

[0029] The support frame 3 has a groove on the side facing the patch area, and the groove is filled with thermally conductive silicone.

[0030] The support frame 3 has a groove on the side facing the mounting area and is filled with thermally conductive silicone. This allows the silicone to adhere tightly to the surface of the copper-nickel composite sheet and the ceramic substrate, forming a continuous heat conduction channel. This quickly conducts the heat generated by the copper-nickel composite sheet during operation, assists in heat dissipation of the ceramic substrate, and reduces the operating temperature of the components. At the same time, the flexibility of the silicone can buffer the mechanical stress between the support frame and the substrate, preventing damage to the ceramic substrate caused by thermal expansion and contraction or external impacts. This further improves the structural stability and heat dissipation efficiency of the substrate under complex operating conditions, ensuring the long-term reliable operation of electronic components.

[0031] The top surface of the support frame 3 is 0.02-0.1 mm higher than the top surface of the copper-nickel composite sheet 2.

[0032] The top surface of the support frame is set 0.02-0.1mm higher than the top surface of the copper-nickel composite sheet, forming a three-dimensional protective structure for the copper-nickel composite sheet. When the substrate is subjected to external pressure or collision, the support frame can withstand the external force first, avoiding direct damage to the copper-nickel composite sheet and ensuring the integrity of its electrical connection structure.

[0033] The number of rows and columns of the copper-nickel composite sheets 2 in the patch area is not less than 2, and they are symmetrically distributed along the length and width directions of the ceramic substrate body 1.

[0034] The copper-nickel composite sheets in the surface mount area are symmetrically distributed in an array of no less than 2 rows and 2 columns. The multi-row and column layout significantly increases the conductive area, reduces the current transmission resistance, meets the current carrying requirements of high-power circuits, and the symmetrical distribution makes the current path uniform, avoids local current concentration, and improves the stability and consistency of signal transmission.

[0035] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

Claims

1. A copper-nickel composite ceramic copper-clad substrate, comprising a ceramic substrate body (1), characterized in that: The ceramic substrate body (1) is surrounded by a support frame (3), and the support frame (3) and the ceramic substrate body (1) enclose a patch area. Copper-nickel composite sheets (2) are distributed in multiple rows and columns in the patch area. The ceramic substrate body (1) includes, but is not limited to, aluminum nitride substrate and aluminum oxide substrate. The copper-nickel composite sheets (2) are bonded and fixed on the surface of the ceramic substrate body (1), and the spacing between adjacent copper-nickel composite sheets (2) is 0.1-0.5 mm.

2. The copper-nickel composite ceramic copper-clad substrate as described in claim 1, characterized in that: The copper-nickel composite sheet (2) is fixed to the surface of the ceramic substrate by a silver-based brazing layer (4).

3. The copper-nickel composite ceramic copper-clad substrate as described in claim 2, characterized in that: The thickness of the silver-based brazing layer (4) is 5-50 μm, the thickness of the copper-nickel composite sheet (2) is 0.05-0.5 mm, the thickness of the ceramic substrate body (1) is 0.5-2.0 mm, and the surface roughness Ra≤0.3 μm.

4. The copper-nickel composite ceramic copper-clad substrate as described in claim 1, characterized in that: The support frame (3) is a metal frame, and the thermal expansion coefficient of the metal frame matches the thermal expansion coefficient of the ceramic substrate body (1). The metal frame can be a Kovar alloy frame or a titanium alloy frame.

5. The copper-nickel composite ceramic copper-clad substrate as described in claim 4, characterized in that: The support frame (3) has a groove on the side facing the patch area, and the groove is filled with thermally conductive silicone.

6. The copper-nickel composite ceramic copper-clad substrate as described in claim 1, characterized in that: The support frame (3) is fixedly connected to the ceramic substrate body (1) by a sintering process.

7. The copper-nickel composite ceramic copper-clad substrate as described in claim 6, characterized in that: The top surface of the support frame (3) is 0.02-0.1 mm higher than the top surface of the copper-nickel composite sheet (2).

8. The copper-nickel composite ceramic copper-clad substrate as described in claim 1, characterized in that: The number of rows and columns of the copper-nickel composite sheet (2) in the patch area is not less than 2, and they are symmetrically distributed along the length and width of the ceramic substrate body (1).

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