High heat dissipation double-sided circuit board

Abstract

The utility model is suitable for double -sided circuit board technical field discloses a kind of high heat dissipation double -sided circuit board, and circuit board body is movably arranged on the top of mounting base, adjusting mechanism is arranged on the top of mounting base, and adjusting mechanism and circuit board body are drivingly connected, and the inside of circuit board body is provided with heat dissipation hole, and the quantity of heat dissipation hole is several groups, adjusting mechanism includes transmission screw rod and resistance screw sleeve, and supporting column is vertically fixedly installed on the top of mounting base four sides surface.The utility model technical scheme can adjust the gap between the bottom surface of circuit board body and the top surface of mounting base, avoid the gap between the bottom surface of circuit board body and the top surface of mounting base too small to affect air flow rate, so that the heat accumulated on the surface of circuit board body can be discharged when air flows, thereby improve the heat dissipation efficiency of circuit board body, avoid the accumulation of heat to affect the normal use of circuit board body.

Description

Technical Field

[0001] This utility model applies to the field of double-sided circuit board technology, and particularly relates to a high heat dissipation double-sided circuit board. Background Technology

[0002] Currently, double-sided circuit boards are a commonly used basic component in the electronics field. They consist of an insulating substrate and copper cladding on both sides. Electronic components and traces can be arranged on both sides. Compared with single-sided boards, they have significant advantages: they can utilize double-sided space layout to make circuit design more compact and reduce product size; they can achieve more complex circuit connections and improve circuit performance and functionality.

[0003] However, currently, the installation position of double-sided circuit boards cannot be quickly adjusted during installation, which alters the clearance between the board and the mounting base. This causes excessive heat to be generated on the surface of the circuit board under heavy loads. Furthermore, the small gap between the board and the mounting base also leads to insufficient ventilation and heat dissipation, affecting the normal operation of the circuit board. Therefore, we propose a high-heat-dissipation double-sided circuit board. Utility Model Content

[0004] The main objective of this invention is to provide a high heat dissipation double-sided circuit board, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A high heat dissipation double-sided circuit board includes a mounting base, a circuit board body is movably disposed on the top of the mounting base, and an adjustment mechanism is disposed on the top of the mounting base, and the adjustment mechanism and the circuit board body are connected in a driving connection.

[0007] The circuit board body has heat dissipation holes inside, and there are several groups of heat dissipation holes.

[0008] As an optional solution to the technical solution of this application, the adjustment mechanism includes a transmission screw and a stop screw sleeve. Support columns are vertically fixedly installed on the four sides of the top of the mounting base. The transmission screw is fixedly installed on the top of the support column. Movable slots are vertically opened at the four corners of the side of the circuit board. The transmission screw is slidably inserted into the movable slot. A stop screw sleeve is screwed to the outer side of the top of each transmission screw. The stop screw sleeve is movably set above the outer side of the circuit board body. A return spring is movably sleeved on the outer side of each support column. The two ends of the return spring are respectively movably attached to the bottom surface of the circuit board and the top surface of the mounting base.

[0009] By adopting the above technical solution, the gap between the bottom surface of the circuit board body and the top surface of the mounting base can be adjusted through the structural action of the transmission screw and the tightening action of the abutting screw sleeve. This avoids the gap between the bottom surface of the circuit board body and the top surface of the mounting base being too small, which would affect the air flow rate. As the air flows, the heat accumulated on the surface of the circuit board body can be discharged, thereby improving the heat dissipation efficiency of the circuit board body and preventing the accumulation of heat from affecting the normal use of the circuit board body.

[0010] As an optional solution to the technical solution of this application, the mounting base has a ventilation groove inside the middle section, and the ventilation groove is located on the lower outer side of the circuit board body.

[0011] By adopting the above technical solution, the airflow under the circuit board body is improved through the structural function of the ventilation groove, thereby further improving the heat dissipation efficiency.

[0012] As an optional solution to the technical solution of this application, a protective gasket is movably sleeved on the outer side of the top of the transmission screw, the bottom surface of the protective gasket is movably attached to the top surface of the circuit board body, and the protective gasket is movably located below the outer side of the abutting screw sleeve.

[0013] By adopting the above technical solution, the protective gasket reduces the wear caused by its bottom surface on the surface of the circuit board body when the locking screw is tightened.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] This application discloses a high-heat-dissipation double-sided circuit board. Support columns are provided on all four sides of the top of the mounting base, and transmission screws are installed on the top of the support columns. The circuit board body is movably positioned outside the transmission screws. When the operator tightens the retaining sleeve, it moves vertically upwards outside the transmission screws. Simultaneously, the bottom surface of the retaining sleeve loses its vertical resistance to the circuit board body. Combined with the reverse pushing action of the return spring, it provides a vertical pushing force to the circuit board body. This adjusts the gap between the bottom surface of the circuit board body and the top surface of the mounting base, preventing the gap from being too small and affecting airflow. This allows the airflow to dissipate the heat accumulated on the surface of the circuit board body, thereby improving the heat dissipation efficiency and preventing heat buildup that could affect the normal use of the circuit board. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a high heat dissipation double-sided circuit board according to the present invention;

[0017] Figure 2This is a top sectional view of the mounting base for a high-heat-dissipation double-sided circuit board according to the present invention.

[0018] Figure 3 This is a side cross-sectional view of the support column structure of a high heat dissipation double-sided circuit board according to the present invention.

[0019] Reference numerals: 1. Mounting base; 11. Circuit board body; 12. Ventilation groove; 2. Support column; 21. Transmission screw; 22. Movable groove; 23. Abutting screw sleeve; 24. Return spring; 3. Heat dissipation hole; 4. Protective pad. Detailed Implementation

[0020] like Figure 1-3 As shown, this utility model provides a technical solution: a high heat dissipation double-sided circuit board, with a circuit board body 11 movably disposed on the top of the mounting base 1, support columns 2 vertically fixedly installed on the four sides of the top of the mounting base 1, and transmission screws 21 fixedly installed on the top of the support columns 2. Movable slots 22 are vertically opened on the four corners of the side of the circuit board, and the transmission screws 21 are slidably inserted into the movable slots 22.

[0021] In this technical solution (through Figure 1 , Figure 2 and Figure 3 As shown, each transmission screw 21 has a retaining sleeve 23 screwed onto its outer top via threads, and the retaining sleeve 23 is movably positioned above the outer side of the circuit board body 11. A protective gasket is movably fitted onto the outer top of the transmission screw 21, and the bottom surface of the protective gasket is movably attached to the top surface of the circuit board body 11, and the protective gasket is movably positioned below the outer side of the retaining sleeve 23.

[0022] In this technical solution (through Figure 1 , Figure 2 and Figure 3 As shown, each support column 2 is movably sleeved with a reset spring 24 on its outer side, and the two ends of the reset spring 24 are respectively movably attached to the bottom surface of the circuit board and the top surface of the mounting base 1.

[0023] In this technical solution (through Figure 1 , Figure 2 and Figure 3 As shown), the mounting base 1 has a ventilation groove 12 inside the middle, and the ventilation groove 12 is located on the lower outer side of the circuit board body 11. The circuit board body 11 has heat dissipation holes 3 inside, and the number of heat dissipation holes 3 is several groups.

[0024] During operation, when the circuit board is connected to a high-load circuit, the circuit board body 11 can be ventilated and cooled to improve the heat dissipation efficiency. After the abutment sleeve 23 is tightened, the four sets of abutment sleeves 23 can be vertically lifted and moved from the outside of the transmission screw 21. After the bottom surface of the abutment sleeve 23 loses its vertical abutment force on the circuit board body 11, combined with the reverse pushing action of the return spring 24 and the vertical guiding action of the movable groove 22 on the transmission screw 21, a vertical pushing force can be provided to the circuit board body 11. This allows the circuit board body 11 to move vertically on the outside of the transmission screw 21 simultaneously. This adjusts the gap between the bottom surface of the circuit board body 11 and the top surface of the mounting base 1. Combined with the ventilation groove 12 and the heat dissipation hole 3, the gap between the bottom surface of the circuit board body 11 and the top surface of the mounting base 1 is not too small, which would affect the air flow rate. This allows the heat accumulated on the surface of the circuit board body 11 to be discharged when the air flows.

Claims

1. A high heat dissipation double-sided circuit board, comprising a mounting base (1), characterized in that: The mounting base (1) has a circuit board body (11) movably mounted on its top. The mounting base (1) has an adjustment mechanism on its top, and the adjustment mechanism and the circuit board body (11) are connected in a transmission manner. The circuit board body (11) has heat dissipation holes (3) inside, and the number of heat dissipation holes (3) is several groups.

2. The high heat dissipation double-sided circuit board according to claim 1, characterized in that: The adjustment mechanism includes a transmission screw (21) and an abutment screw sleeve (23). The four sides of the top of the mounting base (1) are vertically fixed with support columns (2). The top of the support columns (2) is fixed with a transmission screw (21). The four corners of the side of the circuit board are vertically provided with movable slots (22), and the transmission screw (21) slides through and is inserted into the movable slot (22).

3. The high heat dissipation double-sided circuit board according to claim 2, characterized in that: Each of the transmission screws (21) has a locking sleeve (23) screwed onto its outer top via a thread, and the locking sleeve (23) is movably positioned above the outer side of the circuit board body (11).

4. The high heat dissipation double-sided circuit board according to claim 2, characterized in that: Each of the support columns (2) is movably sleeved with a reset spring (24) on its outer side, and the two ends of the reset spring (24) are respectively movably attached to the bottom surface of the circuit board and the top surface of the mounting base (1).

5. The high heat dissipation double-sided circuit board according to claim 1, characterized in that: The mounting base (1) has a ventilation groove (12) inside the middle.

6. The high heat dissipation double-sided circuit board according to claim 2, characterized in that: The transmission screw (21) has a protective gasket (4) movably sleeved on the outer side of its top.

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