Flexible heat dissipation bracket

Abstract

The utility model discloses a flexible heat dissipation support, including the heat conduction part and the flexible heat dissipation fin, the heat conduction part has the heat dissipation surface and the heat conduction surface for attaching on the electronic device of opposite setting, the heat conduction part covers in the flexible heat dissipation fin outside, the heat conduction surface and heat dissipation surface are located flexible heat dissipation fin two opposite sides respectively to form the plate body structure of flexible, when the plate body structure is bent into the support, electronic equipment is placed on the heat conduction surface, so that the heat conduction surface conducts the heat of electronic equipment to the flexible heat dissipation fin and exports from the heat dissipation surface, when bending, the flexible heat dissipation fin can be bent at will, in this way, can change and form multiple placement state, can satisfy the use requirement of different angle of user, and when the plate body structure is bent into the support, electronic equipment is placed on the heat conduction surface, so that the heat conduction surface conducts the heat of electronic equipment to the flexible heat dissipation fin and exports from the heat dissipation surface, make it can high -efficient absorption heat and export heat fast at the same time.

Description

Technical Field

[0001] This utility model relates to the field of electronic device accessories, and in particular to a flexible heat dissipation bracket. Background Technology

[0002] As electronic devices (such as smartphones and tablets) become increasingly powerful, the problem of overheating becomes more and more significant when running high-load programs such as large games and video editing software. To solve this problem, various heat dissipation brackets have emerged on the market. Traditional heat dissipation brackets usually adopt a fixed structural design, such as flat fitting brackets or fixed angle brackets. Although such brackets have a certain heat dissipation function, they have many limitations. On the one hand, the fixed shape is difficult to adapt to different usage scenarios and the diverse needs of users. For example, when watching movies, making video calls, or playing games, users need to frequently change different types of brackets to adjust the placement angle of electronic devices.

[0003] On the other hand, traditional brackets rely heavily on passive heat dissipation (such as metal heat-conducting plates and heat dissipation holes), which has limited heat dissipation efficiency and makes it difficult to quickly dissipate the heat generated by electronic devices, causing the devices to remain in a high-temperature state for a long time, which in turn leads to problems such as processor throttling and shortened battery life.

[0004] In addition, some heat dissipation brackets have a large number of components, resulting in complex structures and inconvenience in carrying them, which further limits their application range.

[0005] Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0006] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a flexible heat dissipation bracket. Through the structural design of the flexible heat sink, the flexible heat sink can be bent at will when bent, thus changing into a variety of placement states to meet the user's different angle requirements. When the plate structure is bent into a bracket, the electronic device is placed on the heat-conducting surface, so that the heat-conducting surface conducts the heat of the electronic device to the flexible heat sink and conducts it out through the heat dissipation surface, which can efficiently absorb heat and quickly dissipate heat.

[0007] A flexible heat dissipation bracket includes a heat-conducting element and a flexible heat sink. The heat-conducting element has a heat dissipation surface and a heat-conducting surface for attaching to an electronic device. The heat-conducting element covers the flexible heat sink. The heat-conducting surface and the heat dissipation surface are located on two opposite sides of the flexible heat sink to form a flexible plate structure.

[0008] When the board structure is bent into a support, the electronic device is placed on the heat-conducting surface, so that the heat-conducting surface conducts the heat of the electronic device to the flexible heat sink and is discharged from the heat dissipation surface.

[0009] As a preferred embodiment, a cavity is formed between the heat-conducting surface and the heat-dissipating surface, and a heat dissipation hole communicating with the cavity is provided on the heat dissipating surface. The flexible heat sink is disposed in the cavity and partially exposed at the heat dissipation hole, so that part of the heat of the flexible heat sink is directly dissipated through the heat dissipation hole.

[0010] As a preferred embodiment, the heat dissipation surface is provided with a plurality of first creases at parallel intervals. The first creases are used to guide the bending deformation of the plate structure and can be maintained after bending deformation, so that the plate structure is bent into a support.

[0011] As a preferred embodiment, at least two first creases are provided, which are defined as a first bending section and a second bending section, respectively. Correspondingly, the plate structure is divided into a first support section, a second support section and a third support section. The first bending section is provided at the junction of the first support section and the second support section, and the second bending section is provided at the junction of the second support section and the third support section.

[0012] When in the bending state, the second support segment can be bent upward relative to the front end of the first support segment through the first bending part, so that the first support segment and the second support segment form an electronic device placement area. The third support segment can be bent downward relative to the rear end of the second support segment through the second bending part.

[0013] As a preferred embodiment, at least three creases are provided, defined as a first bending section, a second bending section, and a third bending section, respectively. Correspondingly, the plate structure is divided into a first support section, a second support section, a third support section, and a fourth support section. The first bending section is located at the junction of the first and second support sections, the second bending section is located at the junction of the second and third support sections, and the third bending section is located at the junction of the third and fourth support sections.

[0014] In the bent-out state, the first support segment can be bent upward relative to the front end of the second support segment through the first bending part, so that the first support segment and the second support segment form an electronic device placement area. The third support segment can be bent downward relative to the rear end of the second support segment through the second bending part. The fourth support segment can be bent forward relative to the lower end of the third support segment through the third bending part, so that the second support segment, the third support segment and the fourth support segment form a triangular support structure.

[0015] As a preferred embodiment, the heat-conducting surface and the heat-dissipating surface are respectively provided with a first adsorption element and a second adsorption element for adsorbing adsorbable objects, and the first adsorption element and the second adsorption element are arranged in a staggered manner.

[0016] As a preferred embodiment, at least five creases are provided, which are respectively defined as a first bending section, a second bending section, a third bending section, a fourth bending section, and a fifth bending section. Correspondingly, the plate structure is divided into a first support section, a second support section, a third support section, a fourth support section, a fifth support section, and a sixth support section.

[0017] The first bending section is located at the junction of the first and second support sections; the second bending section is located at the junction of the second and third support sections; the third bending section is located at the junction of the third and fourth support sections; the fourth bending section is located at the junction of the fourth and fifth support sections; and the fifth bending section is located at the junction of the fifth and sixth support sections.

[0018] When in the bending mode, the first support segment can be bent downwards relative to the front end of the second support segment via the first bending section.

[0019] The third support segment can be bent downward relative to the rear end of the second support segment via the second bending section, so that the heat dissipation surfaces of the first, second, and third support segments form a mounting position for hanging on a display screen or object. The fourth support segment can be bent forward relative to the lower end of the third bending section via the third bending section. The fifth support segment can be bent downward relative to the front end of the fourth bending section via the fourth bending section. The sixth support segment can be bent upward relative to the rear end of the fifth support segment via the fifth bending section, so that the heat conduction surfaces of the third, fifth, and sixth support segments form an electronic device placement area.

[0020] As a preferred embodiment, the heat dissipation surface is further provided with a first inclined crease and a second inclined crease, the first inclined crease and the second inclined crease extending obliquely relative to the first crease, and the two ends of the first inclined crease and the second inclined crease extending to two adjacent sides of the plate structure, respectively.

[0021] As a preferred embodiment, at least two first creases are provided, which are respectively defined as a first bending section and a second bending section, and the plate structure has a first support section, a second support section, a third support section, a fourth support section, and a fifth support section.

[0022] In the bent-use state, the second support segment can be bent downwards relative to the front end of the second support segment through the first bending section, the third support segment can be bent backwards relative to the lower end of the second support segment through the second bending section, the fourth support segment can be bent upwards relative to the left end of the third support segment through the first inclined crease, and the fifth support segment can be bent upwards relative to the right end of the third support segment through the second inclined crease, so that the upper ends of the fourth and fifth support segments respectively abut against the heat dissipation surface of the first support segment, forming a support structure between the first, second, third, fourth, and fifth support segments, wherein the heat-conducting surface of the first support segment is used for the placement of electronic devices.

[0023] As a preferred embodiment, the heat sink is made of aluminum, copper, graphene, or iron.

[0024] And / or:

[0025] The thermally conductive component is thermally conductive adhesive or thermally conductive silicone.

[0026] Compared with the prior art, this utility model has significant advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly utilizes the flexible heat sink structure design, allowing it to be bent into various placement states to meet the user's different usage requirements.

[0027] Secondly, the bending, unfolding and closing operation of the plate structure is simple. When in use, the flexible heat sink material properties are used to bend it, so that the heat conduction surface and the heat dissipation surface together form a support structure. When not in use, it is a flat structure or folded up, making it easy to store and carry.

[0028] At least a portion of the heat dissipation surface is exposed outside the flexible heat sink, allowing the heat-conducting surface to conduct heat from the electronic device to the flexible heat sink and then dissipate it through the heat dissipation surface. Thus, when the heat-conducting surface is in close contact with the electronic device, the heat-conducting surface conducts heat from the electronic device to the flexible heat sink and dissipates it through the portion of the flexible heat dissipation surface exposed outside the flexible heat sink. In this way, the large heat dissipation area and good thermal conductivity of the flexible heat sink can efficiently absorb and disperse heat, effectively reduce the operating temperature of the electronic device, reduce problems such as device performance degradation and battery loss caused by high temperature, and extend the service life of the electronic device.

[0029] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0030] Figure 1 This is a perspective view of an embodiment of the present utility model;

[0031] Figure 2 This is a cross-sectional view of an embodiment of the present utility model;

[0032] Figure 3 This is an exploded view of an embodiment of the present utility model;

[0033] Figure 4 This is another exploded view of an embodiment of the present invention;

[0034] Figure 5 yes Figure 2 A magnified view of a section at point A in the middle;

[0035] Figure 6 This is a schematic diagram of the first usage state of an embodiment of this utility model;

[0036] Figure 7 This is a schematic diagram of the second usage state of an embodiment of this utility model;

[0037] Figure 8 This is a schematic diagram of the third usage state of an embodiment of this utility model;

[0038] Figure 9 This is a schematic diagram of the fourth usage state of an embodiment of this utility model;

[0039] Figure 10 This is a schematic diagram of the fifth usage state of an embodiment of this utility model;

[0040] Figure 11 This is a diagram showing the storage state of an embodiment of the present invention (the plate structure is in a semi-rolled shape);

[0041] Figure 12 This is a diagram showing the storage state of an embodiment of this utility model (the plate structure is in a fully rolled shape).

[0042] Explanation of reference numerals in the attached diagram:

[0043] 10. Thermal conductive components 11. Heat dissipation surface

[0044] 10A. Plate structure

[0045] 101A, First Support Section; 102A, Second Support Section

[0046] 103A, third support section; 104A, fourth support section

[0047] 105A, fifth support section; 106A, sixth support section

[0048] 111. Heat dissipation holes; 12. Thermal conductive surface

[0049] 131. First suction cup 132. Second suction cup

[0050] 14. Receptacle cavity 15. First crease

[0051] 151. First bend section 152. Second bend section

[0052] 153. Third bend section 154. Fourth bend section

[0053] 155. Fifth section bend

[0054] 16. Electronic equipment placement area 17. Mounting positions

[0055] 18. First slanted crease 19. Second slanted crease

[0056] 20. Heat sink. Detailed Implementation

[0057] Please refer to Figures 1 to 12 As shown, it illustrates the specific structure of an embodiment of the present invention.

[0058] In the description of this utility model, it should be noted that the directional terms such as "up", "down", "front", "back", "left", and "right" indicate the orientation and positional relationship based on the accompanying drawings or the orientation or positional relationship shown when wearing and using the device normally. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0059] A flexible heat dissipation bracket includes a heat-conducting element 10 and a flexible heat sink 20.

[0060] The heat-conducting component 10 has a heat dissipation surface 11 and a heat-conducting surface 12 for attaching to the electronic device. The heat-conducting component 10 covers the flexible heat sink 20. The heat-conducting surface 12 and the heat dissipation surface 11 are located on opposite sides of the flexible heat sink to form a flexible plate structure 10A. When the plate structure 10A is bent into a bracket, the electronic device is placed on the heat-conducting surface 12, so that the heat-conducting surface 12 conducts the heat of the electronic device to the flexible heat sink 20 and is discharged by the heat dissipation surface 11.

[0061] A cavity 14 is formed between the heat-conducting surface 12 and the heat-dissipating surface 11. A heat dissipation hole 111 communicating with the cavity is provided on the heat dissipating surface 11. The flexible heat sink 20 is disposed in the cavity 14 and partially exposed at the heat dissipation hole 111, so that part of the heat of the flexible heat sink is directly discharged through the heat dissipation hole 111. The heat is quickly discharged by using both the heat dissipating surface and the heat dissipation hole, thereby achieving good heat dissipation effect.

[0062] Alternatively, the heat-conducting surface 12 and the heat-dissipating surface 11 are connected to form a cavity 14. The heat-dissipating surface 11 is provided with heat dissipation holes 111 communicating with the cavity 14. The flexible heat sink 20 is disposed within the cavity 14, so that the heat-conducting surface 12 conducts the heat of the electronic device to the flexible heat sink 20 and discharges it through the heat dissipation holes 111. When the board structure 10A is bent, it bends into a support.

[0063] Preferably, a plurality of first creases 15 are provided at parallel intervals on the heat dissipation surface 11. The plurality of first creases 15 are used to guide the bending deformation of the plate structure 10A and to maintain it after bending deformation. The plate structure 10A has a non-working state and a bending use state. In the non-working state, the plate structure 10A is flat. In the bending use state, the plate structure 10A can be bent along the first creases 15 so that the plate structure forms a support.

[0064] The heat-conducting surface 12 and the heat-dissipating surface 11 are respectively provided with a first adsorption element and a second adsorption element for adsorbing adsorbable objects. The first adsorption element and the second adsorption element are staggered. The first adsorption element is a first suction cup 131 and the second adsorption element is a second suction cup 132.

[0065] like Figure 6 As shown, this is the first usage state of the plate structure 10A. At least two first creases 15 are provided, defined as a first bending section 151 and a second bending section 152, respectively. The plate structure 10A is divided into a first support section 101A, a second support section 102A, and a third support section 103A. The first bending section 151 is located at the junction of the first support section 101A and the second support section 102A, and the second bending section 152 is located at the junction of the second support section 102A and the third support section 103A.

[0066] When in the bending state, the second support 101A can be bent upward relative to the front end of the first support 102A through the first bending part 151, so that the first support 101A and the second support 102A form an electronic device placement area 16 (at this time, the second suction cup 132 on the heat dissipation surface 11 of the first support 101A is attached to the table). The third support 103A can be bent downward relative to the rear end of the second support 102A through the second bending part 152. The design of the second suction cup 132 on the heat dissipation surface 11 of the first support 101A is to prevent it from loosening when it is bent.

[0067] The first support segment 101A is used to support the electronic device, the second support segment 102A is used to support the back of the electronic device, and the third support segment 103A forms support for the second support segment 102A to ensure stability during use.

[0068] like Figure 7 As shown, this is the second usage state of the plate structure 10A. At least three first creases 15 are provided, defined as a first bending section 151, a second bending section 152, a third bending section 153, and a fourth bending section 154. The plate structure 10A is divided into a first support section 101A, a second support section 102A, a third support section 103A, a fourth support section 104A, and a fifth support section 105A. The first bending section 151 is located at the junction of the first support section 101A and the second support section 102A; the second bending section 152 is located at the junction of the second support section 102A and the third support section 103A; and the third bending section 153 is located at the junction of the third support section 103A and the fourth support section 104A.

[0069] In the bent-out state, the second support segment 101A can be bent upward relative to the front end of the first support segment 102A via the first bending portion 151, so that the first support segment 101A and the second support segment 102A form an electronic device placement area 16 (at this time, the second suction cup 132 of the heat dissipation surface 11 of the first support segment 101A is attached to the table). The electronic device placement area 16 is set at an obtuse angle, forming a primary support. The third support segment 103A can be bent downward relative to the rear end of the second support segment 102A via the second bending portion 152. The fourth support segment 104A can be bent forward relative to the lower end of the third support segment 103A via the third bending portion 153, so that the second support segment 102A... A triangular support structure is formed between the third support 103A and the fourth support 104A, thus forming a secondary support. The fifth support 105A can be bent upward relative to the front end of the fourth support 104A through the fourth bending part 154, so that the front end of the fifth support 105A abuts against the rear end face of the second support 102A, further forming support for the second support 102A. The second support 102A and the third support 103A are both inclined. When the mobile phone is placed in the electronic device placement area 16, the non-screen side of the electronic device is attached to the heat-conducting surface 12 of the second support 102A, and the charging interface end of the electronic device abuts against the heat-conducting surface 12 of the first support 101A.

[0070] Alternatively, the fifth support 105A can be bent downward relative to the front end of the fourth support 104A through the fourth bending part 154, so that the second suction cup on the heat dissipation surface of the fifth support 105A can be attached to the desktop to improve its stability.

[0071] like Figure 8 As shown, this is the third usage state of the plate structure 10A (wall bracket). When the wall bracket is used, it only needs to be equipped with a first suction cup 131 and a second suction cup 132 on the heat-conducting surface 12 and the heat-dissipating surface 11, respectively. The heat-conducting surface 12 is attached to the electronic device through the first suction cup 131 to form a connection, and the heat-dissipating surface 11 is attached to the object (wall or mirror) through the second suction cup 132. This allows the plate structure 10A to be used as a wall bracket without any bending.

[0072] like Figure 9 As shown, this is the fourth usage state (wall-mounted bracket) of the plate structure 10A. At least five first creases 15 are provided, defined as a first bending section 151, a second bending section 152, a third bending section 153, a fourth bending section 154, and a fifth bending section 155. The plate structure 10A is divided into a first support section 101A, a second support section 102A, a third support section 103A, a fourth support section 104A, a fifth support section 105A, and a sixth support section 106A. The first bending section 151... The second bending portion 152 is located at the junction of the first support segment 101A and the second support segment 102A; the second bending portion 152 is located at the junction of the second support segment 102A and the third support segment 103A; the third bending portion 153 is located at the junction of the third support segment 103A and the fourth support segment 104A; the fourth bending portion 154 is located at the junction of the fourth support segment 104A and the fifth support segment 105A; and the fifth bending portion 155 is located at the junction of the fifth support segment 105A and the sixth support segment 106A.

[0073] In the bending mode, the first support segment 101A can be bent downwards relative to the front end of the second support segment 102A via the first bending part 151.

[0074] The third support segment 103A can be bent downwards relative to the rear end of the second support segment 102A via the second bending portion 152, thereby forming a mounting position 17 for hanging on a display screen or object between the heat dissipation surfaces 11 of the first support segment 101A, the second support segment 102A, and the third support segment 103A. Furthermore, the display screen or object is attracted by the second suction cup 132 on the heat dissipation surface 11 of the first support segment 101A to prevent it from falling off.

[0075] The fourth support segment 104A can be bent forward relative to the lower end of the third bending portion 153 via the third bending portion 153. The fifth support segment 105A can be bent downward relative to the front end of the fourth bending portion 154 via the fourth bending portion 154. The sixth support segment 106A is bent upward relative to the rear end of the fifth support segment 105A via the fifth bending portion 155. This allows the heat-conducting surfaces 12 of the third support segment 103A, the fifth support segment 105A, and the sixth support segment 106A to form an electronic device placement area 16. When a mobile phone is placed in the electronic device placement area 16, the bent sixth support segment 106A can limit the mobile phone and prevent it from sliding out.

[0076] The heat dissipation surface 11 is also provided with a first inclined crease 18 and a second inclined crease 19. The first inclined crease 18 and the second inclined crease 19 extend obliquely relative to the first crease 15, and the two ends of the first inclined crease 18 and the second inclined crease 19 extend to two adjacent sides of the plate structure 10A, respectively.

[0077] like Figure 10 As shown, this is the fifth usage state of the plate structure 10A. At least two first creases 15 are provided, defined as a first bending section 151 and a second bending section 152, respectively. The plate structure 10A is divided into a first support section 101A, a second support section 102A, a third support section 103A, a fourth support section 104A, and a fifth support section 105A.

[0078] In the bent-out state, the second support segment 102A can be bent downwards relative to the front end of the second support segment 102A via the first bending portion 151; the third support segment 103A can be bent backwards relative to the lower end of the second support segment 102A via the second bending portion 152; the fourth support segment 104A can be bent upwards relative to the left end of the third support segment 103A via the first inclined crease 18; and the fifth support segment 105A can be bent upwards via the second inclined crease 19. The upper ends of the third support 103A and the fourth support 104A and the fifth support 105A are bent upwards, so that the upper ends of the fourth support 104A and the fifth support 105A respectively abut against the heat dissipation surface 11 of the first support 101A, so that the first support 101A, the second support 102A, the third support 103A, the fourth support 104A and the fifth support 105A form a support structure. The heat-conducting surface 12 of the first support 101A is used for the placement of electronic equipment.

[0079] The thermally conductive component 10 is thermally conductive adhesive or thermally conductive silicone. Preferably, the heat sink is made of aluminum, copper, graphene, or iron. It mainly utilizes the thermal conductivity of the thermally conductive silicone itself, which is generally around 1-10 W / (m·K).

[0080] Aluminum has a thermal conductivity of approximately 237 W / (m·K), which is much higher than that of most materials. When the two are combined, heat can first be transferred to aluminum through the thermally conductive silicone, and then the excellent thermal conductivity of aluminum can be used to quickly dissipate the heat, thereby achieving efficient heat dissipation.

[0081] Secondly, it offers excellent interface adhesion. The thermally conductive silicone has good flexibility and adhesion, allowing it to adhere tightly to the aluminum surface, filling in the tiny unevenness and reducing air gaps. Since air is a poor conductor of heat, reducing air gaps effectively lowers thermal resistance, allowing heat to be transferred more smoothly from the heat source to the aluminum through the thermally conductive silicone.

[0082] Furthermore, thermally conductive silicone exhibits stable performance during long-term use, can adapt to a certain temperature range, and is not easily affected by aging, deformation, or other issues, thus ensuring long-term stable thermal conductivity.

[0083] like Figures 11 to 12 As shown, it demonstrates the folded state of the panel structure when not in use, showing the panel structure in a semi-rolled or fully rolled shape, making it easy to store and carry.

[0084] The key design feature of this invention lies in its flexible heat sink structure, which allows for various placement configurations when bent, catering to different user needs from different angles.

[0085] Secondly, the bending, unfolding and closing operation of the plate structure is simple. When in use, the flexible heat sink material properties are used to bend it, so that the heat conduction surface and the heat dissipation surface together form a support structure. When not in use, it is a flat structure or folded up, making it easy to store and carry.

[0086] At least a portion of the heat dissipation surface is exposed outside the flexible heat sink, allowing the heat-conducting surface to conduct heat from the electronic device to the flexible heat sink and then dissipate it through the heat dissipation surface. Thus, when the heat-conducting surface is in close contact with the electronic device, the heat-conducting surface conducts heat from the electronic device to the flexible heat sink and dissipates it through the portion of the flexible heat dissipation surface exposed outside the flexible heat sink. In this way, the large heat dissipation area and good thermal conductivity of the flexible heat sink can efficiently absorb and disperse heat, effectively reduce the operating temperature of the electronic device, reduce problems such as device performance degradation and battery loss caused by high temperature, and extend the service life of the electronic device.

[0087] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A flexible heat dissipation bracket, characterized in that: It includes a heat-conducting component and a flexible heat sink. The heat-conducting component has a heat dissipation surface and a heat-conducting surface for attaching to an electronic device. The heat-conducting component covers the flexible heat sink. The heat-conducting surface and the heat dissipation surface are located on two opposite sides of the flexible heat sink to form a flexible plate structure. When the board structure is bent into a support, the electronic device is placed on the heat-conducting surface, so that the heat-conducting surface conducts the heat of the electronic device to the flexible heat sink and is discharged from the heat dissipation surface.

2. The flexible heat dissipation bracket according to claim 1, characterized in that: A cavity is formed between the heat-conducting surface and the heat-dissipating surface. A heat dissipation hole communicating with the cavity is provided on the heat dissipating surface. The flexible heat sink is disposed in the cavity and partially exposed at the heat dissipation hole, so that part of the heat of the flexible heat sink is directly dissipated through the heat dissipation hole.

3. The flexible heat dissipation bracket according to claim 1, characterized in that: The heat dissipation surface is provided with a plurality of first creases at parallel intervals. The first creases are used to guide the bending deformation of the plate structure and can be maintained after bending deformation, so that the plate structure is bent into a support.

4. The flexible heat dissipation bracket according to claim 3, characterized in that: At least two first creases are provided, which are defined as a first bending section and a second bending section, respectively. Correspondingly, the plate structure is divided into a first support section, a second support section and a third support section. The first bending section is provided at the junction of the first support section and the second support section, and the second bending section is provided at the junction of the second support section and the third support section. When in the bending state, the second support segment can be bent upward relative to the front end of the first support segment through the first bending part, so that the first support segment and the second support segment form an electronic device placement area. The third support segment can be bent downward relative to the rear end of the second support segment through the second bending part.

5. The flexible heat dissipation bracket according to claim 3, characterized in that: The first crease is provided in at least three parts, which are respectively defined as a first bending section, a second bending section, and a third bending section. Correspondingly, the plate structure is divided into a first support section, a second support section, a third support section, and a fourth support section. The first bending section is provided at the junction of the first support section and the second support section, the second bending section is provided at the junction of the second support section and the third support section, and the third bending section is provided at the junction of the third support section and the fourth support section. In the bent-out state, the first support segment can be bent upward relative to the front end of the second support segment through the first bending part, so that the first support segment and the second support segment form an electronic device placement area. The third support segment can be bent downward relative to the rear end of the second support segment through the second bending part. The fourth support segment can be bent forward relative to the lower end of the third support segment through the third bending part, so that the second support segment, the third support segment and the fourth support segment form a triangular support structure.

6. The flexible heat dissipation bracket according to claim 1, characterized in that: The heat-conducting surface and the heat-dissipating surface are respectively provided with a first adsorption element and a second adsorption element for adsorbing adsorbable objects, and the first adsorption element and the second adsorption element are arranged in a staggered manner.

7. The flexible heat dissipation bracket according to claim 3, characterized in that: The first crease has at least five sections, which are respectively defined as the first bending section, the second bending section, the third bending section, the fourth bending section, and the fifth bending section. Correspondingly, the plate structure is divided into the first support section, the second support section, the third support section, the fourth support section, the fifth support section, and the sixth support section. The first bending section is located at the junction of the first and second support sections; the second bending section is located at the junction of the second and third support sections; the third bending section is located at the junction of the third and fourth support sections; the fourth bending section is located at the junction of the fourth and fifth support sections; and the fifth bending section is located at the junction of the fifth and sixth support sections. When in the bending mode, the first support segment can be bent downwards relative to the front end of the second support segment via the first bending section. The third support segment can be bent downward relative to the rear end of the second support segment via the second bending section, so that the heat dissipation surfaces of the first, second, and third support segments form a mounting position for hanging on a display screen or object. The fourth support segment can be bent forward relative to the lower end of the third bending section via the third bending section. The fifth support segment can be bent downward relative to the front end of the fourth bending section via the fourth bending section. The sixth support segment can be bent upward relative to the rear end of the fifth support segment via the fifth bending section, so that the heat conduction surfaces of the third, fifth, and sixth support segments form an electronic device placement area.

8. The flexible heat dissipation bracket according to claim 1, characterized in that: The heat dissipation surface is also provided with a first inclined crease and a second inclined crease. The first inclined crease and the second inclined crease extend obliquely relative to the first crease, and the two ends of the first inclined crease and the second inclined crease extend to two adjacent sides of the plate structure, respectively.

9. The flexible heat dissipation bracket according to claim 8, characterized in that: The first crease is provided in at least two parts, which are defined as the first bending section and the second bending section, respectively. The plate structure is divided into a first support section, a second support section, a third support section, a fourth support section, and a fifth support section. In the bent-use state, the second support segment can be bent downwards relative to the front end of the second support segment through the first bending section, the third support segment can be bent backwards relative to the lower end of the second support segment through the second bending section, the fourth support segment can be bent upwards relative to the left end of the third support segment through the first inclined crease, and the fifth support segment can be bent upwards relative to the right end of the third support segment through the second inclined crease, so that the upper ends of the fourth and fifth support segments respectively abut against the heat dissipation surface of the first support segment, forming a support structure between the first, second, third, fourth, and fifth support segments, wherein the heat-conducting surface of the first support segment is used for the placement of electronic devices.

10. The flexible heat dissipation bracket according to claim 1, characterized in that: The heat sink is made of aluminum, copper, graphene, or iron. And / or: The thermally conductive component is thermally conductive adhesive or thermally conductive silicone.

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