An LED lamp

Abstract

The utility model discloses a LED lamp, including from top to bottom setting's substrate, heat conduction layer and heat dissipation subassembly, a plurality of LED chips are connected with the substrate through gold tin alloy eutectic layer, the one side of substrate to heat conduction layer is outward convex and forms a plurality of convex parts, and the one side of heat conduction layer covers the substrate to heat conduction layer, and surrounds the convex part, and the one side of heat conduction layer is opposite to the substrate and is abutted with heat dissipation subassembly, through setting LED chip on the substrate, the one side of substrate to heat conduction layer sets up convex part, significantly increases the contact area with heat conduction layer, has optimized the heat conduction path, and gold tin alloy eutectic layer not only fixes LED chip, but also directly conducts the heat that LED chip generates to the substrate, reduces the thermal resistance, promotes the heat dissipation efficiency, and heat conduction layer covers the bottom of substrate and surrounds the convex part, ensures that the heat is rapidly transferred to heat dissipation subassembly.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to an LED lamp. Background Technology

[0002] From incandescent lamps and gas discharge lamps to solid-state lighting technology, light-emitting diodes (LEDs) have become the core component of modern lighting systems due to their significant advantages such as high efficiency, energy saving, environmental friendliness, and long lifespan.

[0003] However, current commercial LED devices are limited by their multi-layer composite topology, which results in significant interface losses in their heat conduction paths. This leads to abnormal junction temperature gradients, exacerbating light decay and color temperature shifts, making it difficult to achieve stable optoelectronic performance output in high-power density applications. This has become a key technical bottleneck restricting the commercial application of high-power LEDs. Utility Model Content

[0004] In view of the above situation, it is necessary to provide an LED lamp that addresses the problem of low heat dissipation efficiency in existing LED technologies.

[0005] An LED lamp includes a substrate, a thermally conductive layer, and a heat dissipation assembly arranged from top to bottom. A plurality of LED chips are disposed on the substrate, and the LED chips are connected to the substrate via a gold-tin alloy eutectic layer. The gold-tin alloy eutectic layer is used to fix the LED chips and conduct heat generated by the LED chips. A support assembly is provided on the periphery of the top of the substrate, and the support assembly surrounds the plurality of LED chips. A plurality of protrusions are provided on the side of the substrate facing the thermally conductive layer. The thermally conductive layer covers the side of the substrate facing the thermally conductive layer and surrounds the protrusions. The side of the thermally conductive layer facing away from the substrate abuts against the heat dissipation assembly.

[0006] The beneficial effects of this utility model are:

[0007] By placing several LED chips on a substrate, and providing a protrusion on the side of the substrate facing the thermally conductive layer, the contact area with the thermally conductive layer is significantly increased, optimizing the heat conduction path. The gold-tin alloy eutectic layer not only fixes the LED chips but also directly conducts the heat generated by the LED chips to the substrate, reducing thermal resistance and improving heat dissipation efficiency. The thermally conductive layer covers the bottom of the substrate and surrounds the protrusion, ensuring that heat is quickly transferred to the heat dissipation component and avoiding local overheating. Through a multi-stage heat conduction path: LED chip → gold-tin alloy eutectic layer → substrate → thermally conductive layer → heat dissipation component, the operating temperature is effectively reduced, light decay is slowed down, and the long-term stable operation of the LED chips is ensured, making it suitable for high-power LED applications and significantly enhancing product competitiveness.

[0008] Furthermore, the support assembly includes a bowl-shaped cup support and a fluorescent adhesive layer. The bowl-shaped cup support is disposed on the substrate, with an opening at the bottom. The fluorescent adhesive layer is disposed in the bowl-shaped cup support, and the top of the bowl-shaped cup support is flush with the top of the fluorescent adhesive layer.

[0009] Furthermore, the substrate is provided with a plurality of chip fixing positions and pad groups. The chip fixing positions are located at the top of the substrate, and the LED chips are disposed on the chip fixing positions and located within the cup support. The fluorescent adhesive layer covers the plurality of LED chips. The pad groups are disposed around the plurality of chip fixing positions. The pad groups include positive pads and negative pads. The plurality of LED chips are respectively connected to the positive pads and the negative pads. The substrate is also provided with an ink layer.

[0010] Furthermore, a reflective layer is provided on the top of the substrate surrounding the LED chip, the top of the reflective layer being flush with the top of the LED chip, and the phosphor layer covering the reflective layer.

[0011] Furthermore, the thickness of the thermally conductive layer is 10um-30um.

[0012] Furthermore, the heat dissipation assembly includes a heat dissipation section and a plurality of heat dissipation fins, one side of the heat dissipation section abuts against the thermally conductive layer, and the other side of the heat dissipation section abuts against the plurality of heat dissipation fins.

[0013] Furthermore, the substrate is made of a thermally conductive material.

[0014] Furthermore, the thermally conductive layer is a semi-solid metal. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the LED lamp of this utility model;

[0016] Figure 2 This is a schematic diagram of the substrate structure of this utility model;

[0017] Figure 3 This is a top view of the substrate of this utility model.

[0018] In the figure: 1. Substrate; 11. Chip fixing position; 111. LED chip; 12. Pad group; 121. Positive electrode pad; 122. Negative electrode pad; 13. Ink layer; 14. Reflective layer; 15. Protrusion; 2. Thermal conductive layer; 3. Heat dissipation assembly; 31. Heat dissipation part; 32. Heat dissipation fins; 4. Gold-tin alloy eutectic layer; 5. Support assembly; 51. Cup support; 52. Phosphor adhesive layer. Detailed Implementation

[0019] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. Furthermore, the various embodiments of the invention, the features within those embodiments, and the features of the embodiments may be freely combined without obvious conflict or contradiction.

[0022] like Figures 1 to 3 As shown, an LED lamp includes a substrate 1, a heat-conducting layer 2, and a heat dissipation component 3 arranged from top to bottom.

[0023] Specifically, a plurality of LED chips 111 are disposed on the substrate 1. The plurality of LED chips 111 are connected to the substrate 1 through a gold-tin alloy eutectic layer 4. The gold-tin alloy eutectic layer 4 is used for the LED chips 111 and for conducting the heat generated by the LED chips 111. A support assembly 5 is provided on the periphery of the top of the substrate 1. The support assembly 5 holds the plurality of LED chips 111. A plurality of protrusions 15 are provided on the side of the substrate 1 facing the heat conduction layer 2. The heat conduction layer 2 covers the side of the substrate 1 facing the heat conduction layer 2 and surrounds the protrusions 15. The side of the heat conduction layer 2 facing away from the substrate 1 abuts against the heat dissipation assembly 3. By setting an LED chip 111 on a substrate 1, and setting multiple protrusions 15 on the side of the substrate 1 facing the heat conduction layer 2, the contact area with the heat conduction layer 2 is significantly increased, and the heat conduction path is optimized. The gold-tin alloy eutectic layer 4 not only fixes the LED chip 111, but also directly conducts the heat generated by the LED chip 111, reducing thermal resistance and improving heat dissipation efficiency. The heat conduction layer 2 covers the side of the substrate 1 facing the heat conduction layer 2 and surrounds the protrusions 15 to ensure that heat is quickly transferred to the heat dissipation component 3 and avoid local overheating. Through multi-level heat conduction paths, the operating temperature is effectively reduced, light decay is slowed down, and the long-term stable operation of the LED chip 111 is ensured.

[0024] Specifically, the support assembly 5 includes a bowl and cup support 51 and a fluorescent adhesive layer 52. The bowl and cup support 51 is disposed on the substrate 1. The bottom of the bowl and cup support 51 has an opening. The fluorescent adhesive layer 52 is disposed in the bowl and cup support 51. The top of the fluorescent adhesive layer 52 is flush with the top of the bowl and cup support 51. The LED chip 111 is directly connected to the top of the substrate 1 through the gold-tin alloy eutectic layer 4. Heat is quickly conducted through the substrate 1 to the heat-conducting layer 2 and heat dissipation component 3 below, avoiding the accumulation of thermal resistance caused by multi-layer interfaces in traditional bracket structures. The cup bracket 51 is set on the substrate 1. The phosphor layer 52 and the cup bracket 51 together absorb the thermal stress caused by temperature changes, reducing the shear force between the LED chip 111 and the substrate 1, preventing solder joint cracking or interface delamination. The flush structure reduces the refractive index difference caused by uneven thickness of the phosphor layer 52, thereby improving luminous efficacy and color temperature uniformity, and avoiding local light spots or color deviation. The flush structure can reduce the interface abrupt change at the edge of the phosphor layer 52 and the cup bracket 51, reducing light scattering and Fresnel reflection loss, and improving light extraction efficiency. The flush design makes it easier to coordinate the difference in thermal expansion coefficients between the phosphor layer 52 and the cup bracket 51, ensuring that the LED chip 111 can effectively dissipate heat through the phosphor layer 52, reducing the risk of delamination between the phosphor layer 52 and the cup bracket 51 under temperature cycling, and improving long-term reliability.

[0025] Specifically, the substrate 1 has multiple chip fixing positions 11 and pad groups 12. The chip fixing positions 11 are located at the top of the substrate 1, and LED chips 111 are mounted on the chip fixing positions 11 and located within the cup-shaped support 51. A phosphor layer 52 covers the multiple LED chips 111. Pad groups 12 are arranged around the multiple chip fixing positions 11. The pad groups 12 include positive pads 121 and negative pads 122. The multiple LED chips 111 are respectively connected to the positive pads 121 and negative pads 122. The substrate 1 also has an ink layer 13. The LED chips 111 are placed within the cup-shaped support 51, and the phosphor layer 52 completely covers the chips. Precise control of the adhesive ensures uniform coverage and avoids color difference or uneven light spots. The pad groups 12 surround the chip fixing positions 11, shortening the lead distance between the LED chips 111 and the pads, reducing the risk of gold wire bending or breakage. The ink layer 13 covers the non-pad area of ​​the substrate 1, providing electrical insulation to prevent short circuits; at the same time, it blocks ambient moisture, slows down the oxidation of metal pads, and extends device life.

[0026] Specifically, a reflective layer 14 is provided on the top of the substrate 1, surrounding the LED chip 111. The top of the reflective layer 14 is flush with the top of the LED chip, and a phosphor layer 52 covers the reflective layer. The light emitted by the LED chip 111 is reflected by the reflective layer 14 to the phosphor layer 52, and then emitted through the phosphor layer 52. The reflective layer 14 prevents the light from being absorbed by the substrate 1, thereby improving the brightness of the LED chip 111.

[0027] Specifically, the heat dissipation component 3 includes a heat dissipation section 31 and multiple heat dissipation fins 32. One side of the heat dissipation section 31 abuts against the heat-conducting layer 2, and the other side of the heat dissipation section 31 abuts against the multiple heat dissipation fins 32. By increasing the heat dissipation area through the heat dissipation section 31 and the heat dissipation fins 32, the heat of the heat-conducting layer 2 is dissipated.

[0028] Specifically, in this embodiment, the substrate 1 is diamond. Utilizing the high bending strength and high thermal conductivity of diamond, the heat from the LED chip 111 can be conducted away more quickly, thereby increasing the power per unit area of ​​the LED chip 111. In other embodiments, preferably, the substrate 1 is graphene.

[0029] Specifically, the thickness of the thermally conductive layer 2 is 12µm, and the thermally conductive layer 2 is a semi-solid metal. Utilizing its high thermal conductivity and fast heat dissipation characteristics, in this embodiment, the LED chip can achieve a power density of 0.3031 W / mm². 2 -1.3134W / mm 2 Such high power will inevitably generate a large amount of heat. The thermally conductive layer 2 is made of metallic copper, with a thermal conductivity of 400-413 W / (m·K). The thermally conductive layer 2 can fully cover the side of the substrate 1 facing the thermally conductive layer 2 and enclose the protrusion 15, thereby further improving the heat conduction efficiency. In other embodiments, preferably, the thermally conductive layer 2 is made of silver paste.

[0030] It should be noted that there is microscopic unevenness between the thermal conductive layer 2 and the heat dissipation component 3. Silicon oil needs to be added to the semi-solid metal to fill the gaps and form a reliable connection between the thermal conductive layer 2 and the heat dissipation component 3. This invention utilizes a cup-shaped bracket 51 fixed on a substrate 1 to reduce installation deviations by marking the area. A reflective layer 14 is provided on the substrate 1 to prevent light absorption and improve the brightness of the LED chip 111. Multiple protrusions 15 are provided on the side of the substrate 1 facing the heat-conducting layer 2, significantly increasing the contact area with the heat-conducting layer 2 and optimizing the heat conduction path. The gold-tin alloy eutectic layer 4 not only fixes the LED chip 111 but also directly conducts the heat generated by the LED chip 111 to the substrate 1, reducing thermal resistance and improving heat dissipation efficiency. The heat-conducting layer 2 covers the side of the substrate 1 facing the heat-conducting layer 2 and surrounds the protrusions 15 to ensure that heat is quickly transferred to the heat dissipation component 3, preventing local overheating. Through a multi-stage heat conduction path: LED chip 111 → gold-tin alloy eutectic layer 4 → substrate 1 → heat-conducting layer 2 → heat dissipation part 31 → heat dissipation fins 32, the operating temperature is effectively reduced, light decay is slowed down, and the long-term stable operation of the LED chip 111 is ensured, making it suitable for high-power LED chip 111 applications and significantly improving product competitiveness.

[0031] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0032] The embodiments described above are merely illustrative of the implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED light, characterized in that: The device includes a substrate, a thermally conductive layer, and a heat dissipation assembly arranged from top to bottom. A plurality of LED chips are disposed on the substrate, and the plurality of LED chips are connected to the substrate through a gold-tin alloy eutectic layer. The gold-tin alloy eutectic layer is used to fix the LED chips and conduct the heat generated by the LED chips. A support assembly is provided on the periphery of the top of the substrate, and the support assembly surrounds the plurality of LED chips. A plurality of protrusions are provided on the side of the substrate facing the thermally conductive layer. The thermally conductive layer covers the side of the substrate facing the thermally conductive layer and surrounds the protrusions. The side of the thermally conductive layer facing away from the substrate abuts against the heat dissipation assembly.

2. The LED lamp according to claim 1, characterized in that: The support assembly includes a bowl-shaped cup support and a fluorescent adhesive layer. The bowl-shaped cup support is disposed on the substrate. The bottom of the bowl-shaped cup support has an opening. The fluorescent adhesive layer is disposed in the bowl-shaped cup support. The top of the bowl-shaped cup support is flush with the top of the fluorescent adhesive layer.

3. The LED lamp according to claim 2, characterized in that: The substrate is provided with a plurality of chip fixing positions and pad groups. The chip fixing positions are located at the top of the substrate. The LED chips are disposed on the chip fixing positions and are located inside the cup support. The fluorescent adhesive layer covers the plurality of LED chips. The pad groups are disposed around the plurality of chip fixing positions. The pad groups include positive pads and negative pads. The plurality of LED chips are respectively connected to the positive pads and the negative pads. The substrate is also provided with an ink layer.

4. The LED lamp according to claim 3, characterized in that: The substrate has a reflective layer surrounding the LED chip on its top, the top of the reflective layer being flush with the top of the LED chip, and the phosphor layer covering the reflective layer.

5. The LED lamp according to claim 1, characterized in that: The thickness of the thermally conductive layer is 10um-30um.

6. The LED lamp according to claim 1, characterized in that: The heat dissipation assembly includes a heat dissipation section and a plurality of heat dissipation fins. One side of the heat dissipation section abuts against the thermally conductive layer, and the other side of the heat dissipation section abuts against the plurality of heat dissipation fins.

7. The LED lamp according to claim 1, characterized in that: The substrate is made of a thermally conductive material.

8. The LED lamp according to claim 1, characterized in that: The thermally conductive layer is a semi-solid metal.

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