Chip liquid cooling phase change heat dissipation device with capillary core structure

Abstract

The utility model relates to a kind of chip liquid cooling phase change heat sink with capillary core structure, belong to the technical field of heat dissipation, and it include: heat dissipation substrate;Heat dissipation cover, the heat dissipation cover with the heat dissipation substrate enclose and form heat dissipation chamber, the heat dissipation cover still be equipped with a pair of liquid cooling connector that intercommunicate heat dissipation chamber;Capillary core, the capillary core is in heat dissipation chamber, and the capillary core includes capillary core board and the microstructure on the capillary core board.And prior art compared to, utility model through the structure design and assembly of heat dissipation substrate, heat dissipation cover, liquid cooling connector and capillary core, improve the contact area of this heat dissipation device and CPU / GPU and the contact area of working medium and bottom plate, improve the heat exchange rate and heat dissipation efficiency of heat dissipation device and the working efficiency and life of CPU / GPU.

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