Pin shaping device for electronic components

Abstract

The utility model discloses a kind of pin shaping devices for electronic components, including support seat, the top outer wall of support seat is evenly distributed with matching groove, the inside of matching groove is provided with electronic component body, the top of support seat is provided with mounting plate, the bottom outer wall of mounting plate is fixed with pressing plate one, the top of mounting plate is provided with top plate, the top outer wall of top plate is fixed with electric telescopic handle, the output end of electric telescopic handle is fixed with mounting plate, the bottom of mounting plate is provided with pressing mechanism. The utility model is driven by electric telescopic handle and carries out down pressure to mounting plate, so that the pin of multiple electronic component bodies can be bent and shaped by pressing plate one of mounting plate bottom, realize the higher effect when the pin of electronic component is shaped.

Description

Technical Field

[0001] This utility model relates to the field of electronic component processing technology, specifically to a pin shaping device for electronic components. Background Technology

[0002] Electronic components are the basic units that make up electronic devices. They are a general term for electronic components and devices and play an important role in electronic devices.

[0003] Electronic components such as resistors and diodes typically have leads. To facilitate soldering, these leads often need to be shaped into bent forms. Currently, lead shaping for electronic components like resistors and diodes is usually done individually, resulting in low lead shaping efficiency. Therefore, there is an urgent need to design a lead shaping device for electronic components to solve this problem. Utility Model Content

[0004] The purpose of this invention is to provide a pin shaping device for electronic components to address the aforementioned shortcomings in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A pin shaping device for electronic components includes a support base. The top outer wall of the support base has evenly distributed mating grooves. An electronic component body is disposed inside the mating grooves. A mounting plate is disposed on the top of the support base. A pressure plate is fixed to the bottom outer wall of the mounting plate. A top plate is disposed on the top of the mounting plate. An electric telescopic rod is fixed to the top outer wall of the top plate. The output end of the electric telescopic rod is fixed to the mounting plate. A clamping mechanism is disposed at the bottom of the mounting plate.

[0007] Furthermore, the clamping mechanism includes a second pressure plate, a vertical rod fixed to the top outer wall of the second pressure plate, a guide sleeve fixed to the top outer wall of the mounting plate, the vertical rod inserted into the inside of the guide sleeve, a spring sleeved on the outside of the vertical rod between the second pressure plate and the mounting plate, and a stop block fixed to the top of the vertical rod.

[0008] Furthermore, a rubber layer is fixed to the side wall of the first pressure plate, and a protective layer is fixed to the bottom outer wall of the second pressure plate.

[0009] Furthermore, the top outer wall of the support base has a groove that communicates with the mating groove, and the inside of the groove is provided with a rounded corner.

[0010] Furthermore, the bottom of the support base is provided with a base plate, a support leg is fixed between the base plate and the support base, a support rod is fixed between the top plate and the base plate, and a clearance opening adapted to the guide sleeve is provided on the top outer wall of the top plate.

[0011] Furthermore, a guide rod is fixed to the top outer wall of the mounting plate, and a sliding bearing is fixed to the top outer wall of the top plate, with the guide rod movably inserted into the interior of the sliding bearing.

[0012] In the above technical solution, the lead shaping device for electronic components provided by this utility model has the following advantages: the mounting plate is pressed down by the electric telescopic rod, so that the pressure plate at the bottom of the mounting plate can bend and shape the leads of multiple electronic components, thereby achieving a higher efficiency in the lead shaping process; when the mounting plate moves downward, the pressure plate can press the electronic component body tightly by the spring force, thereby preventing the electronic component body from moving during lead shaping, making the lead shaping process more stable. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0014] Figure 1 This is a side view of an embodiment of the pin shaping device for electronic components according to the present invention.

[0015] Figure 2 This is an enlarged structural diagram of point A provided in an embodiment of the pin shaping device for electronic components according to this utility model.

[0016] Figure 3 This is an enlarged structural diagram of point B provided in an embodiment of the pin shaping device for electronic components according to this utility model.

[0017] Figure 4 This is an enlarged structural diagram of point C provided in an embodiment of the pin shaping device for electronic components according to this utility model.

[0018] Figure 5 This is a schematic diagram of the support structure provided in an embodiment of the lead shaping device for electronic components according to this utility model.

[0019] Explanation of reference numerals in the attached figures:

[0020] 1 Support base, 2 Mating groove, 3 Electronic component body, 4 Mounting plate, 5 Pressure plate one, 6 Top plate, 7 Electric telescopic rod, 8 Groove, 9 Rounded corner, 10 Rubber layer, 11 Vertical rod, 12 Pressure plate two, 13 Protective layer, 14 Spring, 15 Guide sleeve, 16 Stop block, 17 Clearance opening, 18 Support leg, 19 Base plate, 20 Support rod, 21 Guide rod, 22 Sliding bearing. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0022] like Figure 1-5 As shown in the figure, an embodiment of the present invention provides a pin shaping device for electronic components, including a support base 1. The top outer wall of the support base 1 has uniformly distributed mating grooves 2. An electronic component body 3 is disposed inside the mating grooves 2. A mounting plate 4 is disposed on the top of the support base 1. A pressure plate 5 is fixed on the bottom outer wall of the mounting plate 4. A top plate 6 is disposed on the top of the mounting plate 4. An electric telescopic rod 7 is fixed on the top outer wall of the top plate 6. The output end of the electric telescopic rod 7 is fixed to the mounting plate 4. A clamping mechanism is disposed at the bottom of the mounting plate 4.

[0023] Specifically, in this embodiment, a support base 1 is included. The top outer wall of the support base 1 has evenly distributed mating grooves 2. An electronic component body 3 is disposed inside the mating grooves 2. The electronic component body 3 is cylindrical in shape and has pins at both ends, such as a cylindrical resistor and a cylindrical diode. A mounting plate 4 is disposed on the top of the support base 1. A pressure plate 5 is fixed on the bottom outer wall of the mounting plate 4. The length of the pressure plate 5 is equal to that of the support base 1, and there are two pressure plates 5. The distance between the two pressure plates 5 is slightly greater than the width of the support base 1. A top plate 6 is disposed on the top of the mounting plate 4. An electric telescopic rod 7 is fixed on the top outer wall of the top plate 6. The output end of the electric telescopic rod 7 is fixed to the mounting plate 4. The electric telescopic rod 7 drives the mounting plate 4 to move up and down. A clamping mechanism is disposed at the bottom of the mounting plate 4. The clamping mechanism can clamp and fix the electronic component body 3.

[0024] This utility model provides a pin shaping device for electronic components. The device uses an electric telescopic rod 7 to drive the mounting plate 4 to press down, so that the pressure plate 5 at the bottom of the mounting plate 4 can bend and shape the pins of multiple electronic component bodies 3, thereby achieving a higher efficiency in shaping the pins of electronic components.

[0025] In another embodiment of this utility model, the clamping mechanism includes a second pressure plate 12, the length of which is equal to that of the support base 1. A vertical rod 11 is fixed to the top outer wall of the second pressure plate 12, and a guide sleeve 15 is fixed to the top outer wall of the mounting plate 4. The vertical rod 11 is inserted into the inside of the guide sleeve 15, and a spring 14 is sleeved on the outside of the vertical rod 11 between the second pressure plate 12 and the mounting plate 4. A stop block 16 is fixed to the top of the vertical rod 11. The structure consisting of the vertical rod 11, the guide sleeve 15, and the spring 14 has two members and is symmetrically arranged on the second pressure plate 12. At both ends, when the mounting plate 4 moves downward, the pressure plate 2 12, through the elastic force of the spring 14, can press the electronic component body 3, thereby preventing the electronic component body 3 from moving during pin shaping, making its pin shaping more stable; the side wall of the pressure plate 1 5 is fixed with a rubber layer 10, and the horizontal gap between the rubber layer 10 and the support base 1 is smaller than the diameter of the pin, so that the rubber layer 10 can squeeze the pin of the electronic component body 3, thereby making its pin shaping effect better; the bottom of the pressure plate 2 12 A protective layer 13, also made of rubber, is fixed to the outer wall to prevent damage to the component body 3. A groove 8, communicating with the mating groove 2, is opened on the top outer wall of the support base 1. The leads of the component body 3 extend from the groove 8 to the outside of the support base 1. An arc angle 9 is provided inside the groove 8, which ensures that the leads of the electronic component body 3 have a smooth transition after shaping, preventing breakage during shaping. A base plate 19 is provided at the bottom of the support base 1, and the base plate 19 is fixed to the support base 1. The mounting plate 4 has a support leg 18, and a support rod 20 is fixed between the top plate 6 and the bottom plate 19. The top outer wall of the top plate 6 is provided with a clearance opening 17 that is adapted to the guide sleeve 15. During the up and down movement of the mounting plate 4, the clearance opening 17 can prevent the guide sleeve 15 from interfering with the top plate 6. A guide rod 21 is fixed to the top outer wall of the mounting plate 4, and a sliding bearing 22 is fixed to the top outer wall of the top plate 6. The guide rod 21 is movably inserted into the sliding bearing 22. Through the guide rod 21 and the sliding bearing 22, the up and down movement of the mounting plate 4 is more stable.

[0026] Working principle: When in use, the electronic component body 3 is placed inside the mating groove 2, and then the mounting plate 4 is pressed down by the electric telescopic rod 7. First, the second pressure plate 12 presses and fixes the electronic component body 3 inside the mating groove 2. As the first pressure plate 5 is pressed down, the first pressure plate 5 can bend the pins of the electronic component, thereby achieving the effect of shaping the pins of the electronic component.

[0027] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A pin shaping device for electronic components, characterized by comprising: The device includes a support base (1), the top outer wall of which has uniformly distributed mating grooves (2), the interior of which is provided an electronic component body (3), the top of which is provided with a mounting plate (4), the bottom outer wall of which is fixed with a pressure plate (5), the top of which is provided with a top plate (6), the top outer wall of which is fixed with an electric telescopic rod (7), the output end of which is fixed to the mounting plate (4), and the bottom of which is provided with a pressing mechanism.

2. The pin shaping device for electronic components according to claim 1, wherein The clamping mechanism includes a second pressure plate (12), a vertical rod (11) is fixed to the top outer wall of the second pressure plate (12), a guide sleeve (15) is fixed to the top outer wall of the mounting plate (4), the vertical rod (11) is inserted into the inside of the guide sleeve (15), a spring (14) located between the second pressure plate (12) and the mounting plate (4) is sleeved on the outside of the vertical rod (11), and a stop block (16) is fixed to the top of the vertical rod (11).

3. The lead shaping device for electronic components according to claim 2, characterized in that, The side wall of the first pressure plate (5) is fixed with a rubber layer (10), and the bottom outer wall of the second pressure plate (12) is fixed with a protective layer (13).

4. The lead shaping device for electronic components according to claim 1, characterized in that, The top outer wall of the support base (1) has a groove (8) that communicates with the mating groove (2), and the inside of the groove (8) is provided with a rounded corner (9).

5. The lead shaping device for electronic components according to claim 2, characterized in that, The bottom of the support base (1) is provided with a base plate (19), and a support leg (18) is fixed between the base plate (19) and the support base (1). A support rod (20) is fixed between the top plate (6) and the base plate (19). The top outer wall of the top plate (6) is provided with a clearance opening (17) that is compatible with the guide sleeve (15).

6. The lead shaping device for electronic components according to claim 1, characterized in that, The top outer wall of the mounting plate (4) is fixed with a guide rod (21), and the top outer wall of the top plate (6) is fixed with a sliding bearing (22). The guide rod (21) is movably inserted into the sliding bearing (22).

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