Chip pick-and-place device and testing machine

Abstract

The application relates to a chip taking and placing device and a testing machine. The chip taking and placing device is used for taking and placing a chip into a testing seat. The chip taking and placing device comprises a driving assembly, a positioning assembly, a suction nozzle assembly, a first elastic member and a second elastic member. The first elastic member is arranged between the driving assembly and the positioning assembly, and the second elastic member is arranged between the positioning assembly and the suction nozzle assembly. In a first pressing stroke, the driving assembly acts on the positioning assembly through the first elastic member, drives the positioning assembly and the suction nozzle assembly to jointly move downwards, and positions the positioning assembly on the testing seat. In a second pressing stroke, the driving assembly acts on the suction nozzle assembly, drives the suction nozzle assembly to continuously move downwards relative to the positioning assembly, and places the chip in the testing seat or takes the chip out of the testing seat. The chip taking and placing device and the testing machine provided by the application can improve the precision of chip taking and placing.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip testing technology, and in particular to a chip pick-and-place device and a testing machine. Background Technology

[0002] In the field of semiconductor chip testing, chip pick-and-place devices are key components used to achieve chip handling. Currently used chip pick-and-place devices are typically multi-station nozzle modules, which can pick up multiple chips simultaneously and have high working efficiency.

[0003] Because multi-station nozzle modules have high requirements for motion accuracy and stability, the spacing and height of each nozzle unit must be the same to ensure alignment between the nozzle and the inspection station. Therefore, debugging multi-station nozzle modules is quite difficult. Currently, one way to improve the alignment accuracy between the nozzle and the inspection station is to integrate a floating mechanism at the end of the nozzle module, so that the nozzle can better adapt to surface unevenness or positional deviations during material handling.

[0004] However, in existing solutions, the nozzle assembly must simultaneously complete the positioning and contact with the test socket and the chip placement / removal operation during a single pressing process. During this process, because the chip is inserted into the test socket before the positioning between the nozzle assembly and the test socket is complete, the chip's placement in the test socket is inaccurate, making it highly susceptible to scraping against the side of the test socket, resulting in warping or damage.

[0005] Therefore, it is necessary to propose a new technical solution to overcome the shortcomings of existing technologies. Utility Model Content

[0006] Based on this, this application provides a chip pick-and-place device and a testing machine, which can improve the accuracy of chip pick-and-place.

[0007] Therefore, this application adopts the following technical solution: a chip pick-and-place device for picking up and placing chips into a test socket. The chip pick-and-place device includes a driving component, a positioning component, a suction nozzle component, a first elastic element, and a second elastic element. The first elastic element is disposed between the driving component and the positioning component, and the second elastic element is disposed between the positioning component and the suction nozzle component. In a first downward stroke, the driving component acts on the positioning component through the first elastic element, driving the positioning component and the suction nozzle component to move downward together to position the positioning component on the test socket. In a second downward stroke, the driving component acts on the suction nozzle component, driving the suction nozzle component to continue moving downward relative to the positioning component to place the chip in the test socket or remove the chip from the test socket.

[0008] In some embodiments, the drive assembly includes a power source and an adapter driven by the power source, the adapter having a first abutment portion that abuts against the first elastic member and a second abutment portion that abuts against the nozzle assembly during a second downward stroke.

[0009] In some embodiments, the second abutment is a screw connected to the adapter.

[0010] In some embodiments, the chip pick-and-place device includes a guide post, and the first elastic member and the first abutting portion of the adapter are sleeved on the guide post.

[0011] In some embodiments, the positioning component includes a positioning base and a positioning pin disposed on the positioning base, wherein the first elastic member is clamped between the first abutting portion of the adapter and the positioning base.

[0012] In some embodiments, the positioning base is provided with a support sleeve sleeved on the outer side of the lower half of the guide post, and the first elastic element is clamped between the first abutting part and the support sleeve.

[0013] In some embodiments, the positioning component includes a mounting sleeve connected to the positioning base, the nozzle assembly is mounted in the mounting sleeve, and the second elastic element is clamped between the nozzle assembly and the mounting sleeve.

[0014] In some embodiments, the nozzle assembly includes a nozzle mount, a floating nozzle, and a third elastic member mounted between the nozzle mount and the floating nozzle, the floating nozzle deforming the third elastic member to float up and down relative to the nozzle mount.

[0015] In some embodiments, the second elastic member is sleeved on the outside of the nozzle mounting base, the outside of the nozzle mounting base is provided with an upper step portion, the inside of the mounting sleeve is provided with a lower step portion, and the second elastic member is clamped between the upper step portion and the lower step portion.

[0016] This application also adopts the following technical solution: a testing machine, including a testing base and a chip pick-and-place device as described above, wherein the testing base is provided with a positioning groove that is inserted and cooperated with the positioning component, and a chip receiving groove for receiving the chip, wherein when the positioning component is inserted and cooperated with the positioning groove to achieve positioning, the suction nozzle component has not yet reached the pick-and-place position where the chip cooperates with the chip receiving groove.

[0017] The chip pick-and-place device provided in this application can realize a two-stage pressing action. In the first pressing stroke, the driving component acts on the positioning component through the first elastic element, driving the positioning component and the nozzle assembly to move downward together to position the positioning component on the test socket. At this time, the nozzle assembly has not yet picked up or placed the chip. In the second pressing stroke, the driving component acts on the nozzle assembly, driving the nozzle assembly to continue to move downward relative to the positioning component to place the chip in the test socket or remove the chip from the test socket. This ensures accurate positioning of the chip when it is placed in or picked up from the test socket, improves the accuracy of chip pick-and-place, and reduces the risk of chip knocking or damage due to scratches between the chip and the side of the test socket. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional assembly diagram of the chip pick-and-place device and test socket in the initial state of this application.

[0020] Figure 2 This is an exploded perspective view of the chip pick-and-place device and test socket of this application.

[0021] Figure 3 This is a three-dimensional assembly diagram of the chip pick-and-place device and the test stand in the positioning state of this application.

[0022] Figure 4 This is a cross-sectional view of the chip pick-and-place device and test stand in the positioning state of this application.

[0023] Figure 5 This is another cross-sectional view of the chip pick-and-place device and test stand in the positioning state of this application.

[0024] Figure 6 This is a cross-sectional view of the chip pick-and-place device and test socket in the pick-and-place state of this application.

[0025] The component reference numerals are as follows: 10, Test base; 11, Test base body; 12, Test base substrate; 101, Chip receiving slot; 102, Positioning slot; 20, Drive assembly; 21, Adapter; 210, Guide hole; 211, First abutment part; 22, Second abutment part; 30, Positioning assembly; 31, Positioning base; 32, Positioning pin; 33, Support sleeve; 34, Guide post; 35, Mounting sleeve; 40, Nozzle assembly; 41, Nozzle mounting base; 42, Floating nozzle; 421, Air connector; 422, Suction cup; 43, Third elastic element; 50, First elastic element; 60, Second elastic element. Detailed Implementation

[0026] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0027] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0031] Please see Figures 1 to 6 As shown, this application provides a chip pick-and-place device for picking up and placing chips into a test socket 10. The chip pick-and-place device includes a driving component 20, a positioning component 30, a nozzle assembly 40, and a first elastic member 50 and a second elastic member 60. The first elastic member 50 is disposed between the driving component 20 and the positioning component 30, and the second elastic member 60 is disposed between the positioning component 30 and the nozzle assembly 40. During a first downward stroke, the driving component 20 acts on the positioning component 30 through the first elastic member 50, driving the positioning component 30 and the nozzle assembly 40 to move downward together, thereby positioning the positioning component 30 on the test socket 10. During a second downward stroke, the driving component 20 acts on the nozzle assembly 40, driving the nozzle assembly 40 to continue moving downward relative to the positioning component 30, thereby placing the chip into the test socket 10 or removing the chip from the test socket 10.

[0032] The chip pick-and-place device provided in this application can realize a two-stage pressing action. During the first pressing stroke, the drive component 20 acts on the positioning component 30 through the first elastic element 50, driving the positioning component 30 and the nozzle component 40 to move downward together, so as to position the positioning component 30 on the test socket 10. At this time, the nozzle component 40 has not yet been picked up or placed. During the second pressing stroke, the drive component 20 acts on the nozzle component 40, driving the nozzle component 40 to continue to move downward relative to the positioning component 30, so as to place the chip in the test socket 10 or remove the chip from the test socket 10. This ensures that the chip is accurately placed in the test socket 10, improves the accuracy of chip pick-and-place, and prevents the chip from scraping against the side of the test socket 10, thus avoiding chip lifting or damage.

[0033] The chip pick-and-place device provided in this application significantly improves the accuracy of chip pick-and-place through a unique two-stage pressing action design, effectively avoiding the chip rubbing against the test socket 10 caused by chip pick-and-place operations before positioning is completed in traditional devices. The chip pick-and-place device provided in this application includes a drive assembly 20, a positioning assembly 30, a suction nozzle assembly 40, a first elastic element 50, and a second elastic element 60. The components included in one embodiment of the chip pick-and-place device provided in this application will be described in detail below.

[0034] Please see Figures 1 to 3As shown, in this embodiment, the drive assembly 20 includes a power source and an adapter 21 driven by the power source. The adapter 21 is provided with a first abutting portion 211 that abuts against the first elastic member 50, and a second abutting portion 22 that can abut against the nozzle assembly 40 during the second pressing stroke.

[0035] Specifically, the drive assembly 20 serves as the power source for the entire device, and its core components include a power source (not shown in the figure) and a converter 21 driven by the power source. In some embodiments, the drive assembly 20 may further include a transmission assembly disposed between the power source and the converter 21. The power source may be a cylinder, a motor, etc., and this application does not limit the specific form of the power source.

[0036] In this embodiment, the adapter 21 is specifically an adapter plate, which has a vertically extending vertical plate and a horizontally extending horizontal plate. The vertical plate has a connecting hole for connecting to a power source, and the horizontal plate is used to contact the positioning assembly 30 and the suction nozzle assembly 40 to drive the positioning assembly 30 or the suction nozzle assembly 40 to move. In this embodiment, the horizontal plate has a pair of guide holes 210 and a screw hole located between the pair of guide holes 210. The portion surrounding the pair of guide holes 210 forms a first abutment portion 211 for contacting the first elastic member 50. In this embodiment, a screw is connected to the screw hole, with the lower end of the screw protruding from the horizontal plate to contact the suction nozzle assembly 40. In this embodiment, the screw forms a second abutment portion 22, which acts directly on the suction nozzle assembly 40 during the second pressing stroke, driving it to perform the second stage of pressing action.

[0037] In this embodiment, the second abutment 22 is specifically a screw connected to the adapter 21. This design is not only simple in structure and easy to implement, but also allows for fine adjustment of the contact position between the second abutment 22 and the nozzle assembly 40 by adjusting the extension length of the screw, thereby achieving precise control of the downward stroke. Of course, the second abutment 22 can also take other forms, such as a cam, push rod, or protrusion, as long as it can achieve contact with the nozzle assembly 40 and transmit downward pressure.

[0038] Please see Figures 1 to 4 As shown, in this embodiment, the positioning component 30 includes a positioning base 31 and a positioning pin 32 disposed on the positioning base 31. The first elastic member 50 is sandwiched between the first abutment portion 211 of the adapter 21 and the positioning base 31. To achieve motion guidance and ensure smooth and stable movement in the up and down directions, the chip picking and placing device also includes a guide post 34, on which the first elastic member 50 and the first abutment portion 211 of the adapter 21 are sleeved.

[0039] Specifically, in this embodiment, the positioning component 30 includes a positioning base 31, a positioning pin 32 disposed on the positioning base 31, a support sleeve 33 for supporting the first elastic member 50, and an mounting sleeve 35 for mounting the nozzle assembly 40. In this embodiment, the positioning base 31 is plate-shaped and located at the lower end of the positioning component 30, and has holes for mounting the positioning pin 32. The lower end of the positioning pin 32 protrudes from the positioning base 31 to cooperate with the positioning groove 102 on the test base 10 to achieve precise positioning between the chip pick-and-place device and the test base 10. The positioning groove 102 is a pin hole that matches the positioning pin 32. In other embodiments, the positioning pin 32 may also be a pin structure integrally formed on the positioning base 31.

[0040] The support sleeve 33 is fitted onto the outer side of the lower half of the guide post 34, and its upper end is used to contact the first elastic member 50. The first elastic member 50 is sandwiched between the first abutment portion 211 and the support sleeve 33. The support sleeve 33 can reduce the length of the first elastic member 50. Of course, in other embodiments, the support sleeve 33 may not be present, and the first elastic member 50 may be directly sandwiched between the adapter 21 and the positioning base 31.

[0041] In this embodiment, the first elastic element 50 is a helical spring, which is sleeved on the guide post 34 and located between the adapter 21 and the positioning assembly 30. Specifically, it is sandwiched between the first abutment portion 211 of the adapter 21 and the support sleeve 33 above the positioning base 31. In other embodiments, the first elastic element 50 may also be a rubber pad or other elastic element. During the first downward stroke, the drive assembly 20 acts on the positioning assembly 30 through the first elastic element 50, driving the positioning assembly 30 and the suction nozzle assembly 40 to move downward together. At this time, the first elastic element 50 is in a compressed state, and its elasticity allows the positioning assembly 30 to fit tightly against the test seat 10, thereby ensuring the accuracy of positioning.

[0042] Please see Figures 4 to 6 As shown, the nozzle assembly 40 is the component that directly contacts the chip and performs chip pick-and-place operations. In this embodiment, the nozzle assembly 40 is installed in the mounting sleeve 35 of the positioning assembly 30, and the second elastic member 60 is clamped between the nozzle assembly 40 and the mounting sleeve 35. During the first pressing stroke, the nozzle assembly 40 and the positioning assembly 30 move downward synchronously as a whole to achieve positioning; when the second abutment portion 22 of the driving assembly 20 directly acts on the nozzle assembly 40 during the second pressing stroke, the positioning assembly 30 remains stationary while the nozzle assembly 40 continues to move downward independently to complete the chip pick-and-place process.

[0043] In this embodiment, the suction nozzle assembly 40 includes a suction nozzle mounting base 41, a floating suction nozzle 42, and a third elastic member 43. The suction nozzle mounting base 41 is sleeve-shaped and is installed inside the mounting sleeve 35 of the positioning assembly 30. The upper end of the floating suction nozzle 42 is fitted into the suction nozzle mounting base 41, and the lower end extends out of the suction nozzle mounting base 41. The floating suction nozzle 42 is rod-shaped, and its lower end is provided with a suction cup 422 for adsorbing chips. The floating suction nozzle 42 has an internal air passage. One end of the air passage is connected to the suction cup 422, and the other end is connected to an air passage connector 421. The air passage connector 421 can be connected to a suction device to create a negative pressure at the suction cup 422 through the air passage, thereby generating an adsorption force to adsorb chips. The side walls of the suction nozzle mounting base 41 and the mounting sleeve 35 are provided with elongated grooves to allow the air passage connector 421 to extend out and to allow the air passage connector 421 to move up and down within a certain range.

[0044] The third elastic element 43 is installed between the nozzle mounting base 41 and the floating nozzle 42, allowing the floating nozzle 42 to float up and down relative to the nozzle mounting base 41, thus providing a buffering effect. During chip handling, if there are foreign objects in the chip receiving slot 101 of the test socket 10, the floating nozzle 42 can compress the third elastic element 43 upwards, causing it to float upwards and preventing rigid pressure between the floating nozzle 42 and the foreign objects, which could damage the chip or the floating nozzle 42. In this embodiment, the third elastic element 43 is a helical spring, which is compressed and deformed between the lower surface of the top wall of the nozzle mounting base 41 and the upper surface of the floating nozzle 42.

[0045] Please continue reading. Figures 4 to 6 As shown, the second elastic element 60 is disposed between the positioning component 30 and the nozzle assembly 40, specifically sandwiched between the nozzle mounting base 41 and the mounting sleeve 35. The mounting sleeve 35 is connected to the positioning base 31, and its inner hole mates with the outer circle of the nozzle mounting base 41 to guide the movement of the nozzle assembly 40. The second elastic element 60 is sleeved on the outside of the nozzle mounting base 41, which has an upper stepped portion on its outer side and a lower stepped portion on its inner side. The second elastic element 60 is sandwiched between the upper and lower stepped portions. The second elastic element 60 can also be a spring, a rubber pad, or other elastic element. During the second downward stroke, the drive component 20 acts directly on the nozzle mounting base 41 of the nozzle assembly 40, driving the nozzle assembly 40 to continue moving downward relative to the positioning component 30 and compressing the second elastic element 60 to deform, thereby achieving further downward movement of the floating nozzle 42 to complete the chip pick-up and drop operation.

[0046] This application also provides a testing machine, which includes a test socket 10 and the chip pick-and-place device described above. The test socket 10 is provided with a positioning groove 102 that engages with a positioning component 30, and a chip receiving groove 101 for receiving chips. When the positioning component 30 engages with the positioning groove 102 to achieve positioning, the suction nozzle component 40 has not yet reached the pick-and-place position where the chip engages with the chip receiving groove 101. In this embodiment, the test socket 10 includes a test socket body 11 and a test socket substrate 12, which are fixed together by bolts. The test socket body 11 is located below the test socket substrate 12, and the chip pick-and-place device engages with the test socket substrate 12 from above to achieve positioning.

[0047] The chip pick-and-place device provided in this application operates as follows: the chip pick-and-place device picks up and places chips into the test socket 10.

[0048] In the initial state, such as Figure 1 As shown, the chip pick-and-place device is located above the test base 10. At this time, the adapter 21 is in a position that is flush with the tapered protrusion at the upper end of the guide post 34 due to the elastic force of the first elastic member 50. The positioning component 30 and the positioning groove 102 on the test base 10 have not yet been positioned, and the suction nozzle component 40 has not yet come into contact with the chip.

[0049] When a chip pick-and-place operation is required, the drive assembly 20 starts working, driving the adapter 21 to move downwards. During the first downward stroke, the adapter 21 acts on the positioning assembly 30 through the first elastic element 50, driving the positioning assembly 30 and the nozzle assembly 40 to move downwards together. During this process, the positioning pin 32 on the positioning assembly 30 gradually inserts into the positioning groove 102 on the test holder 10. As the adapter 21 continues to press down, the positioning pin 32 is finally inserted into the positioning groove 102, achieving precise positioning between the chip pick-and-place device and the test holder 10. During this process, the screw on the adapter 21, which serves as the second abutment 22, has not yet contacted the nozzle assembly 40. This forms a... Figures 3 to 5 The state shown. Alternatively, in some embodiments, during the first pressing stroke, the second abutment portion 22 may have already contacted the nozzle assembly 40, but the nozzle assembly 40 has not yet moved to a position where chip picking and placing can be completed.

[0050] After the positioning component 30 completes the positioning, the drive component 20 continues to work and enters the second pressing stroke, such as... Figure 6As shown. At this time, the second abutment portion 22 on the adapter 21 contacts the nozzle assembly 40 and directly acts on the nozzle assembly 40, driving it to continue moving downward relative to the positioning component 30. During this process, since the positioning component 30 has been installed in place and no longer moves, the nozzle assembly 40 compresses the second elastic member 60 and continues to move downward until the suction cup 422 of the nozzle assembly 40 reaches the position in the chip receiving slot 101 of the test holder 10 where the chip can be picked up and placed, thus completing the chip picking and placing.

[0051] During the chip placement and removal process, if there are foreign objects in the chip receiving slot 101, the floating nozzle 42 can compress the third elastic element 43 and float upward. This floating allows the nozzle assembly 40 to better adapt to the height difference between the chip and the test socket 10, preventing the floating nozzle 42 from rigidly pressing against the foreign objects and causing damage to the chip or the floating nozzle 42.

[0052] After the chip pick-and-place operation is completed, the drive component 20 starts to work in reverse, driving the adapter 21 to move upward. At this time, under the elastic force of the first elastic element 50 and the second elastic element 60, the positioning component 30 and the suction nozzle component 40 are reset to their initial state, waiting for the next chip pick-and-place operation.

[0053] As can be seen from the above description of the specific embodiments, the chip pick-and-place device provided in this application achieves precise positioning of the positioning component 30 and the test socket 10, and smooth contact between the nozzle component 40 and the chip through a unique two-stage pressing action design. This design not only improves the accuracy of chip pick-and-place and effectively avoids the problem of chip rubbing against the side of the test socket 10, but also improves the working stability and reliability of the device.

[0054] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A chip pick-and-place device for picking and placing a chip into a test socket (10), characterized in that, The chip pick-and-place device includes a driving component (20), a positioning component (30), a suction nozzle component (40), a first elastic element (50), and a second elastic element (60). The first elastic element (50) is disposed between the driving component (20) and the positioning component (30), and the second elastic element (60) is disposed between the positioning component (30) and the suction nozzle component (40). During the first downward stroke, the driving component (20) acts on the positioning component (30) through the first elastic element (50), driving the positioning component (30) and the suction nozzle component (40) to move downward together, so as to position the positioning component (30) on the test socket (10). During the second downward stroke, the driving component (20) acts on the suction nozzle component (40), driving the suction nozzle component (40) to continue to move downward relative to the positioning component (30), so as to place the chip in the test socket (10) or remove the chip from the test socket (10).

2. The chip pick-and-place apparatus of claim 1, wherein The drive assembly (20) includes a power source and an adapter (21) driven by the power source. The adapter (21) has a first abutting portion (211) that abuts against the first elastic member (50) and a second abutting portion (22) that abuts against the nozzle assembly (40) during the second pressing stroke.

3. The chip pick-and-place apparatus of claim 2, wherein The second abutment (22) is a screw connected to the adapter (21).

4. The chip pick-and-place apparatus of claim 2, wherein The chip pick-and-place device includes a guide post (34), and the first elastic member (50) and the first abutting part (211) of the adapter (21) are sleeved on the guide post (34).

5. The chip pick-and-place apparatus of claim 4, wherein The positioning component (30) includes a positioning base (31) and a positioning pin (32) disposed on the positioning base (31), and the first elastic member (50) is sandwiched between the first abutting part (211) of the adapter (21) and the positioning base (31).

6. The chip pick-and-place device as described in claim 5, characterized in that, The positioning base (31) is provided with a support sleeve (33) sleeved on the outer side of the lower half of the guide post (34), and the first elastic element (50) is sandwiched between the first abutting part (211) and the support sleeve (33).

7. The chip pick-and-place device as described in claim 5 or 6, characterized in that, The positioning component (30) includes a mounting sleeve (35) connected to the positioning base (31), the suction nozzle component (40) is installed in the mounting sleeve (35), and the second elastic member (60) is sandwiched between the suction nozzle component (40) and the mounting sleeve (35).

8. The chip pick-and-place device as described in claim 7, characterized in that, The nozzle assembly (40) includes a nozzle mount (41), a floating nozzle (42), and a third elastic member (43) mounted between the nozzle mount (41) and the floating nozzle (42). The floating nozzle (42) deforms the third elastic member (43) by pressing it to float up and down relative to the nozzle mount (41).

9. The chip pick-and-place device as described in claim 8, characterized in that, The second elastic member (60) is sleeved on the outside of the nozzle mounting base (41). The outside of the nozzle mounting base (41) is provided with an upper step portion, and the inside of the mounting sleeve (35) is provided with a lower step portion. The second elastic member (60) is clamped between the upper step portion and the lower step portion.

10. A testing machine, characterized in that, The device includes a test base (10) and a chip pick-and-place device as described in any one of claims 1 to 9. The test base (10) is provided with a positioning groove (102) that engages with the positioning component (30) and a chip receiving groove (101) for receiving the chip. When the positioning component (30) engages with the positioning groove (102) to achieve positioning, the suction nozzle component (40) has not yet reached the pick-and-place position where the chip engages with the chip receiving groove (101).

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