A chip connection point structure for an inductance loop

Abstract

The utility model belongs to the technical field of radio frequency antenna, specifically relates to a chip connecting point structure of inductance loop, the utility model discloses: Bonding Gap area is established in inductance loop, invalid circuit is established in the gap of Bonding Gap area, and invalid circuit is not communicated with the both sides of Bonding Gap area, chip is bridged in Bonding Gap area, and is not electrically connected with invalid circuit, the utility model discloses a structure for solving the existing antenna binding chip when using ACP as solidification material, and the adverse effect of the binding effect of chip is produced by the bubble of ACP in the solidification process.

Description

Technical Field

[0001] This utility model belongs to the field of radio frequency antenna technology, specifically relating to a chip connection point structure for an inductor loop. Background Technology

[0002] Anisotropic conductive adhesive (ACP) is a viscous epoxy resin adhesive that conducts vertically but not horizontally. It's used to fix and conduct RFID antennas to chips. ACP is a key material for chip bonding in the RFID (Radio Frequency Identification Tag) industry, significantly impacting the conductivity of RFID embedding. Because ACP is a viscous adhesive, it cures at high temperatures during the hot-pressing process of chip bonding, thus fixing the RFID antenna to the chip. During the hot-pressing process, air bubbles can form during ACP curing. As the efficiency of RFID bonding processes improves and hot-pressing temperatures increase, the risk of air bubble formation, especially larger ones, further increases.

[0003] The presence of air bubbles typically affects the structural strength of the bonded chip. Furthermore, if the air bubble is too large, and the bump (spot or bump) connecting the chip to the antenna is smaller than the air bubble, it can also affect electrical performance. Therefore, it is necessary to structurally reduce the probability of air bubble formation. Utility Model Content

[0004] This invention provides a chip connection point structure for an inductor loop, which solves the technical problem that when using ACP as a curing material, air bubbles are generated during the curing process of existing antenna bonding chip structures, which adversely affects the bonding effect of the chip.

[0005] This utility model includes: a Bonding Gap area, which is disposed within the inductor loop;

[0006] An invalid circuit is provided in the gap of the Bonding Gap area, and the invalid circuit is not connected to either side of the Bonding Gap area;

[0007] The chip is connected across the Bonding Gap region at both ends and is not electrically connected to the invalid circuit.

[0008] This invention incorporates an invalid circuit within the Bonding Gap region. This invalid circuit is not electrically connected to the inductor loop and can fill the gaps in the Bonding Gap region. When the chip is bonded to the Bonding Gap region, the presence of gaps is reduced, resulting in fewer bubbles generated during ACP curing.

[0009] Furthermore, the thickness of the invalid circuit is the same as the thickness of the bonding gap area. The beneficial effect of this step is that the top surface of the invalid circuit and the top surface of the bonding gap area are at the same level, which can make the bonded chip more stable, avoid chip skew, improve the quality of chip bonding, and improve product yield.

[0010] Furthermore: the invalid circuit can be a regular or irregular shape. The advantage of this step is that as long as the invalid circuit does not have an electrical connection with the Bonding Gap area and is not short-circuited, any shape is acceptable.

[0011] Furthermore: when the invalid circuit is a regular shape, the shape of the invalid circuit is square, rhomboid, circular or elliptical. The beneficial effect of this step is that invalid circuits with regular shapes are preferred, as they appear more aesthetically pleasing.

[0012] Furthermore: a groove is provided at the middle of each end of the Bonding Gap region, and the invalid circuit is provided between the two grooves. The beneficial effect of this step is that since the Bump, which is electrically connected to the antenna, is generally located near the four corners, the Bump can be bonded to the Bonding Gap region without changing the width of the Bonding Gap region.

[0013] Furthermore: the groove is arc-shaped or polygonal, and the shape of the invalid circuit is circular or square. The beneficial effect of this step is that the invalid circuit with an enlarged area serves as a base, which can more stably support the chip body.

[0014] The beneficial effects of this utility model are:

[0015] 1. The invalid circuit fills the space of the Bonding Gap area, which reduces the amount of air bubbles generated during the ACP curing process (reducing the gap on the bottom of the chip). In addition, the invalid circuit does not contact the Bonding Gap area and will not cause a short circuit.

[0016] 2. The invalid circuit can also act as a substrate, supporting the chip and making the chip more stable when connected across the bonding gap area. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the chip connection point structure of an inductor loop provided by this utility model. Figure 1 ;

[0019] Figure 2 A schematic diagram of the chip connection point structure of an inductor loop provided by this utility model. Figure 2 ;

[0020] Figure 3 A schematic diagram of the chip connection point structure of an inductor loop provided by this utility model. Figure 3 ;

[0021] Figure 4 A schematic diagram of the chip connection point structure of an inductor loop provided by this utility model. Figure 4 ;

[0022] Figure 5 This is a schematic diagram showing the structure of conductive adhesive with air bubbles after hot pressing ACP onto a chip in existing technology.

[0023] Figure label:

[0024] 1-Bonding Gap area; 2-Inductor loop; 3-Invalid circuit; 4-Chip; 5-ACP; 6-Bubble. Detailed Implementation

[0025] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0026] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0027] Implementation of this application, for example Figures 1-5 As shown, this utility model provides a chip connection point structure for an inductor loop, which can reduce the volume and number of air bubbles in the conductive adhesive after hot pressing, thereby improving product quality.

[0028] This utility model includes: a Bonding Gap area 1, which is disposed within an inductor loop 2;

[0029] Invalid circuit 3 is located in the gap of the Bonding Gap area 1, and invalid circuit 3 is not connected to either side of the Bonding Gap area 1;

[0030] Chip 4 is connected across the Bonding Gap region 1 at both ends, and is bonded to the Bonding Gap region 1 via a bump, but is not electrically connected to the invalid circuit 3.

[0031] This invention provides an invalid circuit 3 within the Bonding Gap area 1. The invalid circuit 3 is not electrically connected to the inductor loop 2, and it can fill the gap in the Bonding Gap area 1. When the chip 4 is bonded to the Bonding Gap area 1, it can reduce the presence of gaps (there is air in the gaps, and after ACP5 is hot-pressed and cured, the air will form bubbles 6 in ACP5), thus reducing the number of bubbles 6 generated during ACP5 curing.

[0032] Based on the above technical solution, the thickness of the invalid circuit 3 is the same as the thickness of the bonding gap area 1, and the top surface of the invalid circuit 3 is at the same level as the top surface of the bonding gap area 1. This improves the flatness of the antenna below the chip 4, makes the bonded chip 4 more stable, avoids chip tilting or offset, improves the bonding quality of the chip 4, and improves the product yield.

[0033] Based on the above technical solution, the invalid circuit 3 can be a regular or irregular shape. As long as the invalid circuit 3 is not electrically connected to the Bonding Gap area 1 and is not short-circuited, any shape and size are acceptable.

[0034] Based on the above technical solution, when the invalid circuit 3 is a regular shape, the shape of the invalid circuit 3 is square, rhombus, circle or ellipse. In this embodiment, the invalid circuit 3 with a regular shape is preferred, as it looks more aesthetically pleasing.

[0035] Based on the above technical solution, the Bonding Gap region 1 has grooves at the middle of both ends, and the invalid circuit 3 is provided between the two grooves. Since the Bump that is electrically connected to the Bonding Gap region 1 is generally located near the four corners, the Bump can bond with the Bonding Gap region 1 without changing the width of the Bonding Gap region 1.

[0036] Based on the above technical solution, the groove is arc-shaped or polygonal, and the shape of the invalid circuit 3 is circular or square. The invalid circuit 3 with an enlarged area serves as a base, which can more stably support the chip body.

[0037] In the above embodiments, the chip 4 and the inductor loop 2 of the antenna in this application adopt the Flip Bonding process, that is, the flip chip process. The antenna is also preferably produced by printing process on the substrate. The printed antenna surface is coated with protective ink on the lines that need to be retained (including effective circuits such as inductor loop 2 and invalid circuits 3). Then, the unprotected lines are removed by strong acid etching, so that the antenna structure in this application can be obtained. Therefore, it can be ensured that the invalid circuit 3 is not electrically connected to the effective circuit, and the position of the invalid circuit 3 is accurate. Moreover, the height of the invalid circuit 3 is consistent with the height of the effective circuit.

[0038] Furthermore, the reason for not directly reducing the gap width of the Bonding Gap area 1 is to prevent a small distance from affecting the electrical performance of the product.

[0039] Numerous specific details are set forth in this specification. However, it will be understood that embodiments of this invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification. In the description of this specification, references to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.

Claims

1. A chip connection point structure for an inductor loop, characterized in that, include: The bonding gap area is located within the inductor loop; An invalid circuit is provided in the gap of the Bonding Gap area, and the invalid circuit is not connected to either side of the Bonding Gap area; The chip is connected across the Bonding Gap region at both ends and is not electrically connected to the invalid circuit.

2. The chip connection point structure of the inductor loop according to claim 1, characterized in that, The thickness of the invalid circuit is the same as the thickness of the Bonding Gap region.

3. The chip connection point structure of the inductor loop according to claim 2, characterized in that, The invalid circuit is a regular or irregular shape.

4. The chip connection point structure of the inductor loop according to claim 3, characterized in that, When the invalid circuit is a regular shape, the shape of the invalid circuit is square, rhombus, circle or ellipse.

5. The chip connection point structure of the inductor loop according to claim 2, characterized in that, The Bonding Gap area has grooves at the middle of its two ends, and the invalid circuit is located between the two grooves.

6. The chip connection point structure of the inductor loop according to claim 5, characterized in that, The groove is arc-shaped or polygonal, and the invalid circuit is circular or square.

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