A heating mechanism and its solder paste mixer

CN224422752UActive Publication Date: 2026-06-30MIAOYIN ELECTRONIC INFORMATION TECH (KUNSHAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
MIAOYIN ELECTRONIC INFORMATION TECH (KUNSHAN) CO LTD
Filing Date
2025-05-21
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

The heating mechanism of existing solder paste mixers requires the entire equipment to be disassembled for maintenance, which makes maintenance inconvenient.

Method used

A heating mechanism is designed, including a stirring cylinder, a stirring rod, a heating plate, and a heating rod. The heating plate and heating rod are respectively installed inside the stirring cylinder and the stirring rod through an installation mechanism to achieve uniform and efficient heating. The installation mechanism also simplifies the disassembly and maintenance process.

Benefits of technology

It achieves more uniform and efficient heating, can precisely control solder paste temperature, simplifies the maintenance process, improves the quality and efficiency of solder paste mixing, and is simple and convenient to operate.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224422752U_ABST
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Abstract

This utility model discloses a heating mechanism and its solder paste mixer, relating to the technical field of solder paste mixers. It includes a mixing cylinder, a stirring rod, a heating plate, a heating rod, and a mounting mechanism. The stirring rod is rotatably disposed inside the mixing cylinder. An annular groove is formed on the outside of the mixing cylinder. The heating plate is symmetrically disposed inside the annular groove, and the heating rod is disposed inside the stirring rod. The mounting mechanism is disposed inside the mixing cylinder for positioning the heating plate and the heating rod. This utility model utilizes the coordinated arrangement of the heating plate, heating rod, and mounting mechanism. The mounting mechanism installs the heating plate and heating rod inside the mixing cylinder and the stirring rod respectively, resulting in more uniform and efficient heating. This better meets the precise temperature control requirements of solder paste under different process conditions, greatly improving the quality and efficiency of solder paste mixing. Furthermore, disassembly and maintenance only require releasing the positioning of the mounting mechanism, making operation simple and convenient.
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