Laser processing equipment suitable for beam combining

Abstract

This utility model relates to a laser processing device suitable for beam combining, wherein the femtosecond laser has an output wavelength of 343nm and the nanosecond laser has an output wavelength of 355nm. The output end of the femtosecond laser is reflected sequentially by a first, second, and third reflecting mirror before entering the first incident surface of the beam combiner. The exit surface of the third reflecting mirror points towards the first incident surface of the beam combiner. The output end of the nanosecond laser is sequentially aligned with the incident surfaces of a fourth and fifth reflecting mirror, with the exit surface of the fifth reflecting mirror pointing towards the second incident surface of the beam combiner. The exit surface of the beam combiner is aligned with the incident surface of a sixth reflecting mirror, and the exit surface of the sixth reflecting mirror is aligned with the incident surface of the processing head entrance reflecting mirror. This device can combine 343nm and 355nm wavelength lasers, avoiding optical path cross-blocking and ensuring the stability of independent transmission of the two lasers.

Description

Technical Field

[0001] This utility model relates to a laser processing device, and more particularly to a laser processing equipment suitable for beam combining processing. Background Technology

[0002] Laser beam combining technology, by integrating laser sources with different characteristics, can simultaneously leverage the advantages of high power from pulsed lasers and the stability of continuous-wave lasers, making it valuable for applications in precision machining and additive manufacturing. However, existing dual-laser beam combining equipment is typically designed for fixed wavelengths, making it difficult to be compatible with emerging ultrashort-pulse lasers, thus limiting multi-wavelength collaborative processing capabilities. Existing dual-laser beam combining equipment often only combines laser sources of fixed wavelengths; for example, in common models, the beam combiner mirror can only combine lasers with a wavelength of 355nm. However, most femtosecond lasers today are large and have a wavelength of 343nm, making it impossible for conventional equipment structures to combine ordinary femtosecond lasers with nanosecond or picosecond lasers.

[0003] Meanwhile, existing technology CN113199140A provides a method for parallel finishing and polishing of nano-, pico-, and femtosecond laser beams. It proposes combining nanosecond, picosecond, and femtosecond laser beams for metal additive manufacturing. However, this scheme only achieves "pseudo-beam combining" through time-division multiplexing, failing to address the abrupt change in reflectivity of the beam combiner mirror caused by wavelength differences (e.g., 343nm vs. 355nm) in the spatial optical path, and does not address the compact optical path layout of large-volume femtosecond lasers.

[0004] In view of the above-mentioned shortcomings, the designer has actively researched and innovated in order to create a laser processing equipment suitable for beam combining processing, making it more valuable for industrial applications. Utility Model Content

[0005] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a laser processing equipment suitable for beam combining processing.

[0006] This utility model discloses a laser processing equipment suitable for beam combining, comprising an installation platform, wherein: a femtosecond laser is mounted on the installation platform, and a docking device is mounted on the installation platform at the output end of the femtosecond laser, with a first reflecting mirror mounted on the docking device; a lifting bracket is also mounted on the installation platform, with a nanosecond laser mounted on the lifting bracket, and a fourth reflecting mirror mounted on the lifting bracket, with a guide plate mounted on one side of the fourth reflecting mirror; a third reflecting mirror, a second reflecting mirror, a fifth reflecting mirror, and a beam combining mirror are respectively mounted on the guide plate; a displacement adjustment device is mounted on the lifting bracket, with a sixth reflecting mirror mounted on the displacement adjustment device; and a processing head is also mounted on the lifting bracket. The system includes a beam combiner and a nanosecond laser. The femtosecond laser has an output wavelength of 343 nm, and the nanosecond laser has an output wavelength of 355 nm. The output of the femtosecond laser is reflected sequentially by a first, second, and third mirror before entering the first incident surface of the beam combiner. The exit surface of the third mirror points towards the first incident surface of the beam combiner. The output of the nanosecond laser is sequentially aligned with the incident surfaces of a fourth and fifth mirror. The exit surface of the fifth mirror points towards the second incident surface of the beam combiner. The exit surface of the beam combiner is aligned with the incident surface of a sixth mirror, which in turn aligns with the incident surface of the processing head inlet mirror. The incident surface of the beam combiner is arranged at a 45° angle to the horizontal plane.

[0007] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, in the light output path of the femtosecond laser, the exit surface of the first reflecting mirror is arranged opposite to the incident surface of the second reflecting mirror, and the exit surface of the second reflecting mirror is arranged opposite to the incident surface of the third reflecting mirror; in the light output path of the nanosecond laser, the exit surface of the fourth reflecting mirror is arranged opposite to the incident surface of the fifth reflecting mirror.

[0008] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, the docking device includes a plurality of raised blocks connected to the mounting platform, a placement frame is mounted on the raised blocks, and the first reflector is mounted inside the placement frame; the placement frame has a plurality of light guide holes.

[0009] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, both the first and fourth reflectors include a mounting base, on which a reflector body is connected. The surface of the reflector body is coated with a high-reflectivity film. During implementation, a high-reflectivity film of a suitable wavelength band can be selected based on the type of laser being reflected.

[0010] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, the guide plate has several adjustment holes, and locking screws are distributed in the adjustment holes. The locking screws are connected to the lifting bracket. Several connecting grooves are also distributed on both sides of the guide plate. The third reflector, the second reflector, the fifth reflector, and the beam combiner are embedded in the corresponding connecting grooves and locked with screws. The connecting grooves are filled with thermally conductive silicone pads.

[0011] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, the displacement adjustment device is a lead screw motor and integrates a grating ruler feedback system.

[0012] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, the femtosecond laser and the nanosecond laser are each equipped with several gap adjustment bases at their bottoms, and vertical adjustment bolts are distributed on the gap adjustment bases.

[0013] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, the reflective surface of the sixth reflector is coated with a dual-band high-reflectivity film layer of 343nm and 355nm.

[0014] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, the beam combiner is an ultraviolet beam combiner manufactured by Layertec.

[0015] Furthermore, in the aforementioned laser processing equipment suitable for beam combining, the mounting platform is a marble base, and the front of the marble base has several mounting holes distributed throughout, with internally threaded connecting sleeves distributed within the mounting holes.

[0016] By means of the above solution, this utility model has at least the following advantages:

[0017] 1. It can combine 343nm and 355nm laser beams to avoid optical path cross-blocking and ensure the stability of independent transmission of the two lasers.

[0018] 2. By utilizing the cooperation of various reflectors and beam combiners, the shortest reflection path can be formed, reducing optical path loss and significantly improving the beam combining efficiency of the 343nm / 355nm dual-band beam.

[0019] 3. By combining the shims and the placement frame, the output height of the femtosecond laser can be adapted to ensure zero offset of horizontal incident light.

[0020] 4. The overall structure is simple and can be applied to conventional laser processing equipment or to modify existing optical systems, resulting in low implementation costs.

[0021] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a laser processing equipment suitable for beam combining.

[0023] The meanings of the labels in the figures are as follows.

[0024] Detailed Implementation

[0025] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0026] like Figure 1 A laser processing device suitable for beam combining includes a mounting platform 1, which is unique in that: a femtosecond laser 2 is mounted on the mounting platform 1, and a docking device is installed at the output end of the femtosecond laser 2 on the mounting platform 1, with a first reflecting mirror 3 mounted on the docking device. This allows for the guiding and redirection of the output beam of the femtosecond laser 2. Simultaneously, to achieve a dual-beam path layout and avoid beam obstruction, a lifting bracket 4 is also mounted on the mounting platform 1, on which a nanosecond laser 5 is mounted. Considering the beam path planning of the nanosecond laser 5, a fourth reflecting mirror 6 is also mounted on the lifting bracket 4. During implementation, a guide plate 7 is installed on one side of the lifting bracket 4 near the fourth reflecting mirror 6, with a third reflecting mirror 8, a second reflecting mirror 9, a fifth reflecting mirror 10, and a beam combiner 11 mounted on the guide plate 7. This ensures that the beam paths of the femtosecond laser 2 and the nanosecond laser 5 are ultimately combined.

[0027] To ensure effective beam combining of lasers at different power levels, a displacement adjustment device 12 is installed on the lifting bracket 4, and a sixth reflecting mirror 13 is mounted on the displacement adjustment device 12. Simultaneously, a processing head inlet reflecting mirror 14 is also installed on the lifting bracket 4. This allows the processing head to smoothly receive the laser beam for processing the workpiece in its processing area. Specifically, the femtosecond laser 2 has an output wavelength of 343nm, and the nanosecond laser 5 has an output wavelength of 355nm, which can meet the requirements for individual processing as well as synchronous beam combining. Furthermore, to achieve successful beam combining of the 343nm and 355nm laser paths, the incident surface of the beam combiner 11 is arranged at a 45° angle to the horizontal plane.

[0028] During actual implementation, the light-emitting end of the femtosecond laser 2 is reflected sequentially by the first reflecting mirror 3, the second reflecting mirror 9, and the third reflecting mirror 8 before being incident on the first incident surface of the beam combiner 11. The exit surface of the third reflecting mirror 8 points towards the first incident surface of the beam combiner 11. Simultaneously, the light-emitting end of the nanosecond laser 5 is sequentially aligned with the incident surfaces of the fourth reflecting mirror 6 and the fifth reflecting mirror 10. The exit surface of the fifth reflecting mirror 10 points towards the second incident surface of the beam combiner 11. Furthermore, the exit surface of the beam combiner 11 is aligned with the incident surface of the sixth reflecting mirror 13, and the exit surface of the sixth reflecting mirror 13 is aligned with the incident surface of the processing head inlet reflecting mirror 14.

[0029] In a preferred embodiment of this invention, in the light output path of the femtosecond laser 2, the exit surface of the first reflecting mirror 3 is positioned opposite to the incident surface of the second reflecting mirror 9, and the exit surface of the second reflecting mirror 9 is positioned opposite to the incident surface of the third reflecting mirror 8. Simultaneously, in the light output path of the nanosecond laser 5, the exit surface of the fourth reflecting mirror 6 is positioned opposite to the incident surface of the fifth reflecting mirror 10. This arrangement minimizes angular deviations during debugging and improves the accuracy of the optical path.

[0030] Furthermore, the docking device used in this invention includes several raised blocks 15 connected to the mounting platform 1, with a placement frame 16 mounted on each raised block 15. The first reflector 3 is installed within the placement frame 16. This allows for effective height adjustment and docking based on the optical path output angle of the femtosecond laser 2, achieving horizontal reception. Simultaneously, to avoid optical path obstruction, the placement frame 16 is provided with several light guide holes. Of course, for certain special application requirements, to meet the single-band transmittance requirements of the optical path, glass coated with an anti-reflection film can be added to the light guide holes.

[0031] In practical implementation, to ensure correct optical path allocation and to select appropriate mirror bodies according to the actual wavelength, both the first mirror 3 and the fourth mirror 6 include a mounting base 17, on which the mirror body is connected. Considering optimal reflection performance, a high-reflectivity film is coated on the surface of the mirror body. A dual-wavelength dedicated film is preferred to reduce loss in the 343nm / 355nm wavelength band. Simultaneously, the guide plate 7 has several adjustment holes with locking screws connected to the lifting bracket 4. Furthermore, several connecting grooves are distributed on both sides of the guide plate 7, into which the third mirror 8, second mirror 9, fifth mirror 10, and beam combiner 11 are embedded and locked with screws. This allows the corresponding mirrors to be positioned appropriately during installation and debugging, and enables fine-tuning of distance and angle during installation, satisfying precise optical path adjustment. Furthermore, considering that the laser transmission process may generate additional heat for the corresponding reflector, this invention fills the connecting groove with a thermally conductive silicone pad. Preferably, the thermal conductivity is ≥3W / (m·K), which can maintain the lens temperature of the corresponding reflector ≤35 degrees Celsius.

[0032] Meanwhile, to achieve rapid response and precise positioning, the displacement adjustment device 12 used in this invention is a lead screw motor, which works in conjunction with a servo motor and integrates a grating ruler feedback system. This ensures a positioning accuracy of ±3μm, compensates for errors caused by thermal offset in the beam combining optical path, and improves adjustment precision. Furthermore, considering the need for leveling and calibration during installation, several gap adjustment bases 18 are installed at the bottom of both the femtosecond laser 2 and the nanosecond laser 5. Vertical adjustment bolts are distributed on the gap adjustment bases 18 to adjust the horizontal angle after the gap adjustment bases 18 are combined with the mounting platform 1. For stability, the gap adjustment bases 18 are made of cast iron, and counterweights are used to suppress potential operational vibrations.

[0033] Furthermore, to achieve synchronous reflection of the dual optical paths, the reflective surface of the sixth reflecting mirror 13 is coated with a dual-band high-reflectivity film layer of 343nm and 355nm. Preferably, the beam combiner 11 uses ultraviolet band beam combiners, preferably products manufactured by Layertec. Considering the need for leveling during use and initial commissioning, the mounting platform 1 is a marble base. The front of the marble base has several mounting holes 19 distributed throughout, each containing an internally threaded connecting sleeve. This allows for direct tightening of the various devices and components using the corresponding screws.

[0034] The working principle of this invention is as follows: The femtosecond laser 2 emits light at a wavelength of 343nm. After emission, the light is guided by the first reflecting mirror 3, the second reflecting mirror 9, and the third reflecting mirror 8 before reaching the beam combiner 11. Simultaneously, the nanosecond laser 5 emits light at a wavelength of 355nm. After emission, the light passes through the fourth reflecting mirror 6 and the fifth reflecting mirror 10 before reaching the beam combiner 11. The two beams are then combined and reach the sixth reflecting mirror 13. Finally, the light enters the processing head through the processing head inlet reflecting mirror 14 to process the corresponding workpiece.

[0035] During this period, the position of the sixth reflector 13 can be finely adjusted by the adjustment device 12 to ensure that the two beams of light can reach the optimal reflection area of ​​the sixth reflector 13 smoothly.

[0036] It should be noted that during the implementation of this application, the model of the femtosecond laser and the nanosecond laser and the actual output wavelength can be adjusted according to the implementation needs. The two wavelengths provided in this application are relatively optimized solutions that can achieve beam combining.

[0037] Furthermore, the directions or positional relationships described in this utility model are based on the directions or positional relationships shown in the accompanying drawings. They are only for the purpose of facilitating the description of this utility model and simplifying the description, and are not intended to indicate or imply that the device or structure referred to must have a specific orientation, or to operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A laser processing device suitable for beam combining, comprising a mounting platform, characterized in that: A femtosecond laser is mounted on the mounting platform. A docking device is installed at the output end of the femtosecond laser on the mounting platform, and a first reflecting mirror is mounted on the docking device. A lifting bracket is also mounted on the mounting platform, on which a nanosecond laser is mounted. A fourth reflecting mirror is also mounted on the lifting bracket, and a guide plate is mounted on one side of the fourth reflecting mirror. A third, second, fifth, and beam combiner mirrors are respectively mounted on the guide plate. A displacement adjustment device is mounted on the lifting bracket, on which a sixth reflecting mirror is mounted. A processing head inlet reflecting mirror is also mounted on the lifting bracket. The output wave of the femtosecond laser... The length is 343nm, and the output wavelength of the nanosecond laser is 355nm. The output end of the femtosecond laser is reflected sequentially by the first, second, and third reflecting mirrors and then incident on the first incident surface of the beam combiner. The exit surface of the third reflecting mirror points to the first incident surface of the beam combiner. The output end of the nanosecond laser is sequentially aligned with the incident surfaces of the fourth and fifth reflecting mirrors. The exit surface of the fifth reflecting mirror points to the second incident surface of the beam combiner. The exit surface of the beam combiner is aligned with the incident surface of the sixth reflecting mirror, and the exit surface of the sixth reflecting mirror is aligned with the incident surface of the processing head inlet reflecting mirror. The incident surface of the beam combiner is arranged at a 45° angle to the horizontal plane.

2. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: In the light output path of the femtosecond laser, the exit surface of the first reflector is arranged opposite to the incident surface of the second reflector, and the exit surface of the second reflector is arranged opposite to the incident surface of the third reflector; in the light output path of the nanosecond laser, the exit surface of the fourth reflector is arranged opposite to the incident surface of the fifth reflector.

3. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: The docking device includes several raised blocks connected to the installation platform, and a placement frame is installed on the raised blocks. The first reflector is installed in the placement frame. The placement frame has several light guide holes.

4. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: Both the first and fourth reflectors include a mounting base, and a reflector body is connected to the mounting base. The surface of the reflector body is coated with a high-reflectivity film.

5. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: The guide plate has several adjustment holes, and locking screws are distributed in the adjustment holes. The locking screws are connected to the lifting bracket. Several connecting grooves are also distributed on both sides of the guide plate. The third reflector, the second reflector, the fifth reflector, and the beam combiner are embedded in the corresponding connecting grooves and locked with screws. The connecting grooves are filled with thermally conductive silicone pads.

6. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: The displacement adjustment device is a lead screw motor and integrates a grating ruler feedback system.

7. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: The femtosecond laser and nanosecond laser are each equipped with several gap adjustment bases at their bottoms, and vertical adjustment bolts are distributed on the gap adjustment bases.

8. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: The reflective surface of the sixth mirror is coated with a dual-band high-reflectivity film of 343nm and 355nm.

9. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: The beam combiner is an ultraviolet beam combiner manufactured by Layertec.

10. The laser processing equipment suitable for beam combining processing according to claim 1, characterized in that: The installation platform is a marble base, and several installation holes are distributed through the front of the marble base, with internally threaded connecting sleeves distributed in the installation holes.

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