A V-shaped grinding wheel for wafer thinning

Abstract

This utility model discloses a V-shaped grinding wheel for wafer thinning, belonging to the field of wafer processing technology. The grinding wheel includes a disc-shaped grinding wheel base and a grinding section located on the outer periphery of its end face. The grinding section consists of multiple V-shaped grinding teeth, each containing two symmetrical grinding blocks with an included angle between them. The ends of the grinding blocks are rounded, and all parts have smooth transitions. The openings of the V-shaped grinding teeth face the outer diameter of the grinding wheel, and chip removal grooves are provided between adjacent teeth. The grinding tooth height is 8.9-9.5 mm. The base surface has six mounting holes and three mounting holes. This invention, through its unique V-shaped grinding tooth structure, reduces the contact area between the grinding wheel and the wafer, lowers the grinding current, and enhances chip removal capability. During rotation, the grinding teeth sweep across a stable annular area, ensuring grinding consistency. The rounded corner design prevents grinding teeth from chipping or falling off, improving the grinding wheel's service life and effectively enhancing the surface finish of the wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically to a V-shaped grinding wheel for wafer thinning. Background Technology

[0002] In semiconductor manufacturing, wafer thinning is a critical process, and the performance of the wafer thinning wheel directly affects the processing quality and efficiency. Traditional wafer thinning wheels typically have a grinding section structure that is either a continuous plane or a simple raised structure. This structure presents several problems during grinding. Firstly, the large contact area between the wheel and the wafer leads to a higher current during grinding, increasing energy consumption and potentially causing thermal damage to the wafer. Secondly, chip removal is ineffective, causing grinding debris to accumulate in the grinding area, affecting grinding accuracy and surface quality. Furthermore, the annular area swept by the grinding teeth changes as the wheel rotates, which is detrimental to stable grinding.

[0003] Therefore, it is of great significance to provide a V-shaped grinding wheel for wafer thinning to solve the problems existing in the prior art. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a V-shaped grinding wheel for wafer thinning, so as to solve the problem that the grinding part structure of traditional wafer thinning wheels is mostly a continuous plane or a simple protrusion structure, which easily causes thermal damage to the wafer.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A V-shaped grinding wheel for wafer thinning includes a disc-shaped grinding wheel base and a grinding section disposed on the outer periphery of the end face of the grinding wheel base. The grinding section is composed of a plurality of V-shaped grinding teeth evenly distributed along the circumferential direction, and each V-shaped grinding tooth includes two symmetrically arranged grinding blocks, with an included angle between the two grinding blocks.

[0007] Furthermore, the end of the grinding block is set to be arc-shaped, and the included angle between the grinding blocks and the opposite side of the included angle are smoothly transitioned.

[0008] Furthermore, the opening of the V-shaped grinding teeth faces the outer diameter of the grinding wheel, and chip removal grooves are provided between adjacent V-shaped grinding teeth.

[0009] Furthermore, the height of the V-shaped grinding teeth is 8.9-9.5 mm.

[0010] Furthermore, the surface of the grinding wheel base is provided with six mounting holes one and three mounting holes two.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. Reduced contact area and current: This invention employs a V-shaped grinding tooth structure, which significantly reduces the contact area between the grinding wheel and the wafer compared to traditional flat or simple raised structures. During grinding, the reduced contact area directly leads to a decrease in grinding current, thereby effectively reducing energy consumption and lowering the risk of thermal damage to the wafer due to excessive current, thus improving the safety and stability of wafer processing.

[0013] 2. Enhanced chip removal capability: The openings of the V-shaped grinding teeth face the outer diameter of the grinding wheel, and chip removal grooves are provided between adjacent V-shaped grinding teeth. During the grinding process, this unique structural design allows the grinding chips generated to be quickly discharged from the grinding area through the chip removal grooves, avoiding the impact of chip accumulation on grinding accuracy and surface quality, and effectively improving the surface finish of the wafer.

[0014] 3. Ensuring stable annular area: During the rotation of the grinding wheel, the special design of the V-shaped grinding teeth ensures that the entire annular area swept by the grinding teeth remains unchanged. This stable annular area guarantees the stability and consistency of the grinding process, which is beneficial to improving the accuracy and quality of wafer thinning.

[0015] 4. Preventing Grinding Teeth from Chipping or Falling Off: The ends of the grinding blocks are rounded, and the angles between the grinding blocks and the opposite sides of the angles are smoothly transitioned. This rounded corner design can effectively disperse stress when the grinding teeth are impacted, avoiding the problem of grinding teeth chipping or falling off due to stress concentration, and significantly improving the service life of the grinding wheel and the reliability of the machining process.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the preferred embodiments of this application are described in detail below with reference to the accompanying drawings.

[0017] The above and other objects, advantages and features of this application will become more apparent to those skilled in the art from the following detailed description of specific embodiments in conjunction with the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a cross-sectional view of the present invention.

[0021] Figure 3 This is a structural diagram of the V-shaped grinding teeth in this utility model.

[0022] In the diagram: 1. Grinding wheel base; 2. V-shaped grinding teeth; 21. Grinding block; 3. Mounting hole one; 4. Mounting hole two. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. In the following description, specific details such as specific configurations and components are provided merely to help fully understand the embodiments of this application. Therefore, those skilled in the art should understand that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this application. In addition, for clarity and brevity, descriptions of known functions and structures are omitted in the embodiments.

[0024] Furthermore, reference numerals and / or letters may be repeated in different examples within this application. Such repetition is for the purpose of simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or settings discussed.

[0025] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist simultaneously. The term " / and" in this article describes another type of relationship between related objects, indicating that two relationships can exist. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the related objects before and after it are in an "or" relationship.

[0026] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion.

[0027] Please see Figure 1-3 This utility model provides a technical solution for a V-shaped grinding tooth wafer thinning wheel:

[0028] A V-shaped grinding wheel for wafer thinning includes a disc-shaped grinding wheel base 1 and a grinding section disposed on the outer periphery of the end face of the grinding wheel base 1.

[0029] The grinding section consists of multiple V-shaped grinding teeth 2 evenly distributed along the circumference. Each V-shaped grinding tooth 2 includes two symmetrically arranged grinding blocks 21, with an included angle of 60°-120° between the two grinding blocks 21.

[0030] The end of the grinding block 21 is set to be arc-shaped with a radius of 0.5-1.5mm, and the corner between the two grinding blocks 21 is rounded with a radius of 0.3-0.8mm.

[0031] The opening of the V-shaped grinding teeth 2 faces the outer diameter of the grinding wheel, and a chip removal groove with a width of 1.2-2.0mm is provided between adjacent V-shaped grinding teeth 2.

[0032] The axial height of the V-shaped grinding teeth 2 is 8.9-9.5mm, and the height deviation of all V-shaped grinding teeth 2 does not exceed ±0.05mm.

[0033] The surface of the grinding wheel base 1 has six mounting holes 3 and three mounting holes 4 evenly distributed along the circumference. The diameter of the mounting holes 3 is 6.0-6.5 mm, and the diameter of the mounting holes 4 is 4.0-4.5 mm.

[0034] In practical use, the V-shaped grinding teeth 2 of this invention are mounted on a wafer thinning device through six mounting holes 3 and three mounting holes 4 on the surface of the grinding wheel base 1. After installation, the device is started, and the grinding wheel rotates at high speed. During wafer grinding, the two symmetrical grinding blocks 21 of the V-shaped grinding teeth 3 contact the wafer surface. Due to its unique V-shaped structure, the contact area is small, resulting in a low grinding current. At the same time, the annular area swept by the grinding teeth 2 remains stable, ensuring the consistency of the grinding process. As grinding proceeds, the generated chips are smoothly discharged through the chip removal grooves between adjacent V-shaped grinding teeth 2 under the centrifugal force of the rotating grinding wheel. The arc-shaped design at the end of the grinding block 21 and the smooth transition of each part of the grinding teeth 2 enable the grinding teeth 2 to effectively resist stress when subjected to impact, preventing chipping and breakage, thereby ensuring the long-term stable use of the grinding wheel and achieving efficient and high-quality wafer thinning processing.

[0035] The above description is merely a preferred embodiment of this utility model and does not limit the scope of protection of this utility model. For those skilled in the art, this utility model can have various modifications and variations. Any changes, modifications, substitutions, integrations, and parameter alterations made to these embodiments within the spirit and principles of this utility model, through conventional substitutions or methods that achieve the same function without departing from the principles and spirit of this utility model, fall within the scope of protection of this utility model.

Claims

1. A V-shaped grinding wheel for wafer thinning, comprising a disc-shaped grinding wheel base (1) and a grinding portion disposed on the outer periphery of the end face of the grinding wheel base (1), characterized in that: The grinding section is composed of multiple V-shaped grinding teeth (2) evenly distributed along the circumference. Each V-shaped grinding tooth (2) includes two symmetrically arranged grinding blocks (21), and there is an included angle between the two grinding blocks (21).

2. The wafer thinning grinding wheel with V-shaped grinding teeth as described in claim 1, characterized in that: The end of the grinding block (21) is set to be arc-shaped, and the included angle between the grinding blocks (21) and the opposite side of the included angle are smoothly transitioned.

3. The wafer thinning grinding wheel with V-shaped grinding teeth as described in claim 1, characterized in that: The opening of the V-shaped grinding teeth (2) faces the outer diameter of the grinding wheel, and chip removal grooves are provided between adjacent V-shaped grinding teeth (2).

4. The wafer thinning grinding wheel with V-shaped grinding teeth as described in claim 1, characterized in that: The height of the V-shaped grinding teeth (2) is 8.9-9.5 mm.

5. The wafer thinning grinding wheel with V-shaped grinding teeth as described in claim 1, characterized in that: The surface of the grinding wheel base (1) is provided with six mounting holes (3) and three mounting holes (4).

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