A rapid cooling thermoplastic injection mold structure

Abstract

This utility model provides a rapid cooling thermoplastic injection mold structure, relating to the field of mold cooling technology, including a moving module, a stationary module, and a hydraulic cylinder; a uniform cooling component; the uniform cooling component is placed on the outside of the stationary module, and includes a partition frame fixedly connected to the outside of the stationary module, a support frame fixedly connected to the outside of the partition frame, and a copper plate fixedly connected to the outside of the stationary module; a circulation component; two sets of circulation components are provided; compared with the traditional single-layer straight cooling channel, this multi-layer design significantly increases the contact area between the coolant and the mold. When the coolant flows in the channel, it can more fully absorb the heat of the mold, and the copper plate has excellent thermal conductivity. After being closely attached to the surface of the mold cavity, it can quickly conduct the heat inside the cavity to the coolant, further accelerating the heat dissipation and effectively shortening the cooling time of plastic products.

Description

Technical Field

[0001] This utility model relates to the field of mold cooling technology, and in particular to a rapid cooling thermoplastic injection mold structure. Background Technology

[0002] Thermoplastic injection molds are industrial molds that inject molten thermoplastic material into a mold cavity under high pressure, which then cools and solidifies to form a product of a specific shape. They are widely used in the automotive, electronics, and home appliance industries, and offer advantages such as high production efficiency, good molding precision, and the ability to mass-produce complex structural parts.

[0003] Traditional partial designs, using single-layer cooling chambers or point-based cooling, only provide cooling channels in localized areas of the mold, resulting in limited heat dissipation area. For example, simple straight cooling channels on the upper and lower mold plates cannot cover the entire surface of the mold cavity, causing most of the heat to fail to be transferred to the coolant in time, leading to low heat dissipation efficiency.

[0004] Therefore, this utility model provides a thermoplastic injection mold structure for rapid cooling. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a rapid cooling thermoplastic injection mold structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a rapid cooling thermoplastic injection mold structure, comprising a moving module, a stationary module, and a hydraulic cylinder;

[0007] Uniform cooling assembly; the uniform cooling assembly is placed on the outside of the fixed module, the uniform cooling assembly includes a partition frame fixedly connected to the outside of the fixed module, a support frame fixedly connected to the outside of the partition frame, and a copper plate fixedly connected to the outside of the fixed module.

[0008] The circulation assembly consists of two sets, which are positioned on the outer ends of the uniform cooling assembly. Each circulation assembly includes a mounting box fixedly connected to the outside of the support frame. A water pump is installed inside the mounting box, and a water pipe is fixedly connected to the output end of the water pump. A semiconductor refrigeration chip is installed inside the mounting box.

[0009] In a preferred embodiment, an outer mounting plate is fixedly connected to the outer side of the support frame, and the bottom end of the mounting box is fixedly connected to the top end of the outer mounting plate.

[0010] In a preferred embodiment, the interior of the installation box is fixedly connected with a partition, and the interior of the installation box is provided with a water storage area and a water delivery area through the partition.

[0011] In a preferred embodiment, the outside of the mounting box is fixedly connected with inlet and outlet water pipes, and the input end of the water pump passes through the partition and extends into the water storage area.

[0012] In a preferred embodiment, a controller is mounted on the outside of the support frame, and the water pump and the semiconductor cooling chip are electrically connected to the controller.

[0013] In a preferred embodiment, one end of the hydraulic cylinder is fixedly connected to the top of the outer mounting plate, and the other end of the hydraulic cylinder is fixedly connected to the bottom of the moving module, with the bottom of the moving module engaging with the interior of the fixed module.

[0014] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0015] This invention utilizes a hydraulic cylinder to drive the moving module and the stationary module to close tightly. The circulating component then drives the coolant to flow within the multi-layered cooling channels formed by the partition frame. Simultaneously, the copper plate is in close contact with the mold cavity surface to form a three-dimensional heat dissipation surface. Compared to the traditional single-layer straight cooling channel, this multi-layer design significantly increases the contact area between the coolant and the mold. As the coolant flows within the channels, it can more fully absorb the heat from the mold. Furthermore, the copper plate has excellent thermal conductivity, and after being in close contact with the mold cavity surface, it can quickly transfer the heat inside the cavity to the coolant, further accelerating heat dissipation. This effectively shortens the cooling time of plastic products and reduces the molding cycle. At the same time, the uniform cooling effect can effectively eliminate defects such as shrinkage marks and deformation caused by uneven cooling. Attached Figure Description

[0016] Figure 1 A perspective view of a rapid cooling thermoplastic injection mold structure provided by this utility model;

[0017] Figure 2 A schematic diagram of the internal structure of a partition frame in a rapid cooling thermoplastic injection mold provided by this utility model;

[0018] Figure 3 A schematic diagram of a uniform cooling component structure for a rapid cooling thermoplastic injection mold provided by this utility model;

[0019] Figure 4 A schematic diagram of the mounting box structure for a rapid cooling thermoplastic injection mold provided by this utility model;

[0020] Figure 5 A schematic diagram of the circulating component structure of a rapid cooling thermoplastic injection mold provided by this utility model.

[0021] Legend:

[0022] 1. Moving module; 2. Stationary module; 3. Hydraulic cylinder;

[0023] 4. Uniform cooling assembly; 41. Partition frame; 42. Support frame; 43. External mounting plate; 44. Copper plate;

[0024] 5. Circulation assembly; 51. Mounting box; 52. Water pump; 53. Water supply pipe; 54. Baffle plate; 55. Inlet and outlet water pipes; 56. Semiconductor cooling chip;

[0025] 6. Controller. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] like Figure 1 As shown, this embodiment provides a technical solution: a rapid cooling thermoplastic injection mold structure, including a moving module 1, a fixed module 2 and a hydraulic cylinder 3. One end of the hydraulic cylinder 3 is fixedly connected to the top of the outer mounting plate 43, and the other end of the hydraulic cylinder 3 is fixedly connected to the bottom end of the moving module 1. The bottom end of the moving module 1 is engaged with the interior of the fixed module 2.

[0028] The moving module 1 and the fixed module 2 work together to form the injection mold cavity, which contains thermoplastic material. The moving module 1 is movable, which facilitates mold opening and demolding. The fixed module 2 is fixed and has a uniform cooling component 4 on the outside to achieve uniform cooling. One end of the hydraulic cylinder 3 is connected to the outer mounting plate 43 and the other end is connected to the moving module 1, which drives the moving module 1 to open and close the mold. The precise position control ensures the stable movement of the moving module 1 and the precise position control ensures the mold closing accuracy.

[0029] like Figure 1 - Figure 3 As shown, a uniform cooling component 4 is placed on the outside of the fixed module 2. The uniform cooling component 4 includes a partition frame 41 fixedly connected to the outside of the fixed module 2, a support frame 42 fixedly connected to the outside of the partition frame 41, an outer mounting plate 43 fixedly connected to the outside of the support frame 42, and a copper plate 44 fixedly connected to the outside of the fixed module 2.

[0030] The partition frame 41 is fixed to the outside of the fixed module 2 to form a partition space for coolant flow, increase the contact area, improve heat dissipation efficiency, expand the heat dissipation area, accelerate mold cooling, shorten the molding cycle, and improve production efficiency. The support frame 42 is fixed to the outside of the partition frame 41 to support the partition frame 41 and other components, enhance structural stability, rationally arrange the cooling system components, and ensure cooling effect and mold strength. The outer mounting plate 43 is fixed to the outside of the support frame 42 to provide an installation base, making the cooling system layout reasonable and compact. The copper plate 44 is fixed to the outside of the fixed module 2, using the thermal conductivity of copper to conduct heat, accelerate heat transfer, improve cooling speed, ensure uniform mold temperature, and improve product quality.

[0031] like Figure 1 , Figure 2 and Figure 5 As shown, the circulation component 5 is provided in two sets. The circulation component 5 is placed on both sides of the outer side of the uniform cooling component 4. The circulation component 5 includes a mounting box 51 fixedly connected to the outside of the support frame 42. The bottom end of the mounting box 51 is fixedly connected to the top end of the outer mounting plate 43. A water pump 52 is installed inside the mounting box 51. A water supply pipe 53 is fixedly connected to the output end of the water pump 52. A partition 54 is fixedly connected inside the mounting box 51. A water storage area and a water supply area are provided inside the mounting box 51 through the partition 54. The input end of the water pump 52 passes through the partition 54 and extends to the water storage area. An inlet and outlet water pipe 55 is fixedly connected to the outside of the mounting box 51. A semiconductor cooling chip 56 is installed inside the mounting box 51. A controller 6 is installed on the outside of the support frame 42. The water pump 52 and the semiconductor cooling chip 56 are connected to the controller 6 through an electrical connection.

[0032] Mounting box 51 is fixed to the outside of support frame 42 to protect internal components. Partition 54 divides the space to optimize the coolant path. Water pump 52 is installed inside mounting box 51 and delivers coolant through water pipe 53 to provide circulation power, ensure continuous flow of coolant, remove heat, and enhance cooling effect. Water pipe 53 is connected to the output end of water pump 52 to deliver coolant, ensuring efficient flow of coolant, optimizing flow rate, and improving cooling effect. Partition 54 is fixed inside mounting box 51 to divide it into water storage area and water delivery area. Inlet and outlet water pipes 55 are used to replace the liquid inside mounting box 51. Semiconductor cooling chip 56 is installed inside mounting box 51 to cool coolant using semiconductor properties. Controller 6 is installed outside support frame 42 and electrically connects water pump 52 and semiconductor cooling chip 56 to control the cooling system.

[0033] Working principle:

[0034] like Figure 1 - Figure 5 As shown:

[0035] In use: First, the hydraulic cylinder 3 is activated, driving the moving module 1 to move towards the stationary module 2 until the bottom of the moving module 1 is tightly engaged with the interior of the stationary module 2, completing the mold closing action. Then, the controller 6 is activated, controlling the water pump 52 and the semiconductor cooling chip 56 in the circulation component 5 to start working. The water pump 52 draws coolant from the water storage area through the water pipe 53 and delivers it to the cooling channel formed by the partition frame 41 on the outside of the stationary module 2. At the same time, the semiconductor cooling chip 56 cools the coolant in the water storage area, reducing the temperature of the coolant. The coolant flows in the cooling channel of the partition frame 41, making full contact with the outside of the stationary module 2 and the copper plate 44, absorbing the heat generated by the mold during the injection molding process. Finally, the coolant after heat exchange flows back to the water storage area of ​​the mounting box 51 through the circulation component 5 on the other side, completing one cooling cycle. Throughout the entire injection molding process, the cooling system works continuously to ensure stable control of the mold temperature and achieve a rapid and uniform cooling effect.

[0036] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A rapid cooling thermoplastic injection mold structure, comprising a moving module (1), a stationary module (2), and a hydraulic cylinder (3), characterized in that... ； Uniform cooling component (4); The uniform cooling component (4) is placed on the outside of the fixed module (2). The uniform cooling component (4) includes a partition frame (41) fixedly connected to the outside of the fixed module (2). A support frame (42) is fixedly connected to the outside of the partition frame (41). A copper plate (44) is fixedly connected to the outside of the fixed module (2). Circulation component (5); There are two sets of circulation components (5). The circulation components (5) are placed on both sides of the outer side of the uniform cooling component (4). The circulation components (5) include a mounting box (51) fixedly connected to the outside of the support frame (42). A water pump (52) is installed inside the mounting box (51). A water pipe (53) is fixedly connected to the output end of the water pump (52). A semiconductor cooling chip (56) is installed inside the mounting box (51).

2. The rapid cooling thermoplastic injection mold structure according to claim 1, characterized in that: An outer mounting plate (43) is fixedly connected to the outside of the support frame (42), and the bottom end of the mounting box (51) is fixedly connected to the top end of the outer mounting plate (43).

3. The rapid cooling thermoplastic injection mold structure according to claim 1, characterized in that: The installation box (51) is fixedly connected to a partition (54), and the installation box (51) is provided with a water storage area and a water conveyance area through the partition (54).

4. The rapid cooling thermoplastic injection mold structure according to claim 3, characterized in that: The outer side of the mounting box (51) is fixedly connected with inlet and outlet water pipes (55), and the input end of the water pump (52) passes through the partition (54) and extends into the water storage area.

5. The rapid cooling thermoplastic injection mold structure according to claim 1, characterized in that: A controller (6) is installed on the outside of the support frame (42), and the water pump (52) and the semiconductor cooling chip (56) are connected to the controller (6) by electrical connection.

6. The rapid cooling thermoplastic injection mold structure according to claim 1, characterized in that: One end of the hydraulic cylinder (3) is fixedly connected to the top of the outer mounting plate (43), and the other end of the hydraulic cylinder (3) is fixedly connected to the bottom of the moving module (1). The bottom of the moving module (1) is engaged with the interior of the fixed module (2).

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