Low-temperature deposition apparatus
By designing a low-temperature deposition device with a cooling mechanism and an isolation chamber structure, the problem of insufficient low-temperature control in existing devices has been solved, enabling precise control and efficient deposition of cluster particles, and improving deposition quality and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN KUOWEI ATOMIC NEW MATERIALS CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-06-30
AI Technical Summary
Existing deposition equipment lacks effective cryogenic control capabilities and cannot provide a stable deep cryogenic environment, resulting in difficulty in precisely controlling the size of cluster particles, a large diffusion range, low deposition efficiency, and affecting deposition quality and particle morphology control.
A cryogenic deposition apparatus was designed, comprising a cooling mechanism and an isolation chamber structure. Stable and deep cryogenic cooling of the deposition carrier is achieved through a liquid nitrogen condensation chamber, an inlet pipe, and an outlet pipe, which precisely controls the size of cluster particles. Natural airflow is generated through the design of the air inlet and outlet to reduce particle diffusion and improve deposition efficiency.
It achieves precise control and directional growth of cluster particles, reduces the diffusion range, improves deposition efficiency and quality stability, avoids condensation and frost on the outer wall of the deposition chamber, and ensures long-term stable operation.
Smart Images
Figure CN224430710U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of atomic layer deposition technology, and in particular to a low-temperature deposition apparatus. Background Technology
[0002] In the field of single-atom / cluster powder deposition, traditional deposition apparatuses suffer from a critical shortcoming in cryogenic control technology. Existing apparatuses lack effective cryogenic regulation capabilities, failing to provide a stable, deep cryogenic environment for flat sample stages. This hinders precise control of cluster particle size through cryogenic conditions, impeding the directional growth and morphology control of clusters. Furthermore, due to the inability to create an effective cryogenic deposition environment, single-atom / cluster particles diffuse extensively during deposition, making it difficult for them to concentrate on the substrate surface, resulting in low deposition efficiency. This deficiency in cryogenic control not only affects the quality stability of single-atom / cluster deposition but also limits the ability of the deposition process to meet specific particle morphology and distribution requirements, becoming a significant technical bottleneck restricting the improvement of powder deposition performance. Utility Model Content
[0003] To address the shortcomings of the existing technology, the technical problem to be solved by this invention is to provide a low-temperature deposition apparatus that can achieve stable, deep low-temperature cooling of a flat sample stage, so as to precisely control the size of cluster particles and reduce the diffusion range of single atoms / cluster particles, thereby improving deposition efficiency and deposition quality.
[0004] To solve the above-mentioned technical problems, the present invention provides a low-temperature deposition device, including a deposition chamber, wherein the deposition chamber has a deposition cavity, the deposition chamber is provided with a feed inlet for single-atom or cluster particles to enter the deposition cavity from top to bottom, the deposition cavity is provided with an installation position for placing a deposition carrier for single-atom or cluster particles to be deposited thereon, a cooling mechanism is provided between the installation position and the deposition cavity to cool the deposition carrier, and the deposition chamber is also provided with an air inlet and an air outlet for gas to enter and exit.
[0005] Furthermore, the cooling mechanism includes a condensation chamber, an inlet pipe for introducing a cooling medium into the condensation chamber, and an outlet pipe for discharging the cooling medium from the condensation chamber.
[0006] Furthermore, the mounting position is located within the deposition chamber at a position corresponding to the feed inlet so that the deposition carrier receives single-atom or cluster particles entering from the feed inlet. The condensation chamber is located between the mounting position and the bottom wall of the deposition chamber. Both the inlet pipe and the outlet pipe have one end that passes through the deposition chamber to extend into the condensation chamber and the other end that extends out of the deposition chamber and is connected to an external cooling medium delivery device.
[0007] Furthermore, both the inlet pipe and the outlet pipe penetrate the bottom wall of the condensation chamber from bottom to top to communicate with the interior of the condensation chamber. The end of the outlet pipe that penetrates the condensation chamber also has an extension pipe that communicates with the outlet pipe so that the outlet of the cooling medium is higher than the inlet of the inlet pipe.
[0008] Furthermore, a first isolation cavity is provided between the bottom wall of the condensation chamber and the deposition chamber, and the inlet pipe and the outlet pipe both pass through the deposition chamber and the first isolation cavity in sequence to extend into the condensation chamber.
[0009] Furthermore, a second isolation cavity is provided between the inlet tube and the outlet tube and the first isolation cavity to isolate at least a portion of the inlet tube or the outlet tube from the first isolation cavity.
[0010] Furthermore, the deposition chamber is provided with isolation pads around the inlet pipe and the outlet pipe at the positions where the inlet pipe and the outlet pipe pass through.
[0011] Furthermore, the deposition chamber includes a bottom wall, a side wall, and an end cap. The bottom wall, side wall, and end cap together enclose the deposition cavity. The bottom wall, side wall, and end cap are all detachably connected. The first isolation cavity and the second isolation cavity are both disposed on the bottom wall.
[0012] Furthermore, a first groove is provided on the bottom wall of the chamber for inserting the side wall of the chamber, a second groove is provided on the bottom wall of the first groove for installing the first isolation cavity, and a third groove is provided on the bottom wall of the second groove for installing the two second isolation cavities.
[0013] Furthermore, the deposition chamber is equipped with height-adjustable support legs.
[0014] The cryogenic deposition apparatus of this invention has at least the following beneficial effects: Stable, deep cryogenic cooling of the deposition carrier is achieved through a cooling mechanism (such as a liquid nitrogen condensation chamber, an inlet pipe, and an outlet pipe), with a minimum temperature reaching -120℃. This allows for precise control of cluster particle size, meeting specific particle morphology and distribution requirements, and facilitating directional cluster growth and morphology control. Simultaneously, the low-temperature environment reduces the diffusion range of single-atom / cluster particles during deposition, allowing them to be deposited more concentrated on the substrate surface, effectively improving deposition efficiency and quality stability. The apparatus isolates the cooling medium delivery structure from the deposition chamber by setting up a first isolation chamber, a second isolation chamber, and a cryogenic PTFE pad at the junction of the deposition chamber and the inlet / outlet pipe, preventing condensation and frosting on the outer wall of the deposition chamber due to low-temperature transfer, ensuring long-term stable operation. In terms of cooling medium circulation design, the inlet and outlet pipes adopt an inlet-lower-outlet structure (e.g., an extension of the outlet pipe makes the outlet higher than the inlet of the inlet pipe), ensuring that the cooling medium remains sufficiently within the condensation chamber. Old heat-absorbing medium can be completely expelled by new medium, maintaining the low-temperature stability of the condensation chamber and enhancing the cooling effect. The deposition chamber features a detachable design for its bottom wall, side walls, and end caps, facilitating sample removal, chamber cleaning, and maintenance. The deposition carrier is installed via a grooved structure with auxiliary grooves for easy placement and removal, enhancing operational convenience. Adjustable support legs, achieved through struts and nuts, ensure the device's stability and balance. Furthermore, the deposition chamber has an air inlet (lower part) and an air outlet (upper part, radially opposite), creating a bottom-up natural airflow. This ensures the protective gas fully fills the deposition chamber, effectively expelling existing air and preventing oxidation and deterioration of single-atom / cluster particles upon contact with air, further guaranteeing deposition quality. Attached Figure Description
[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the low-temperature deposition apparatus of this utility model. Figure 1 ;
[0017] Figure 2 This is an exploded view of the structure of an embodiment of the cryogenic deposition apparatus of this utility model;
[0018] Figure 3 This is a schematic diagram of the structure of an embodiment of the low-temperature deposition apparatus of this utility model. Figure 2 ;
[0019] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure of AA.
[0020] The meanings of the labels in the attached diagram are as follows:
[0021] Deposition chamber 1, chamber side wall 11, chamber bottom wall 12, first groove 121, second groove 122, third groove 123, end cap 13, first fixing hole 131, sealing ring 132, assembly ring 14, deposition chamber 2, feed inlet 3, cooling mechanism 4, condensation chamber 41, inlet pipe 42, outlet pipe 43, extension pipe 44, first isolation chamber 45, second isolation chamber 46, isolation pad 47, air inlet 5, air outlet 6, mounting platform 7, fourth groove 71, fifth groove 72, support leg 8, support rod 81, base foot 82, limit block 83, nut 84, thread 85, deposition carrier 9. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0023] The following disclosure provides various embodiments or examples of different features for implementing this utility model. Specific examples of components and arrangements will be described below to simplify the utility model. Of course, these are merely examples and are not intended to limit the utility model. For example, in the following description, forming a first component above or on a second component may include embodiments where the first and second components are in direct contact, or embodiments where other components may be formed between the first and second components such that the first and second components are not in direct contact. Additionally, reference numerals and / or characters may be repeated in various instances of the utility model. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations.
[0024] Furthermore, spatial relation terms such as "below," "under," "below," "above," and "above" may be used herein to readily describe the relationship between one element or component and another element (or component) or component (or component) as shown in the figure. In addition to the orientations shown in the figure, spatial relation terms will encompass various different orientations of the device in use or operation. The device may be positioned in other ways (rotated 90 degrees or in other orientations) and will be interpreted accordingly through the spatial relation descriptors used herein.
[0025] Furthermore, the technical parts described in this utility model and the appended claims are mainly the improved technical parts of this utility model, and do not limit the object protected by this utility model to only having these technical parts. Other known necessary components (structures and / or methods) and / or non-essential components of the protected object, other than the technical parts described in this utility model and the appended claims, are not included in this utility model and the appended claims because they do not involve the improvement scope of this utility model. However, this does not mean that the object protected by this utility model does not possess these known components.
[0026] The present invention will be further described below with reference to the accompanying drawings.
[0027] Please refer to Figure 1 and Figure 2 The low-temperature deposition apparatus of this utility model includes a deposition chamber 1, which has a deposition cavity 2 inside. The deposition chamber 1 is provided with a feed inlet 3 for single-atom or cluster particles to enter the deposition cavity 2 from top to bottom. The deposition cavity 2 is provided with a mounting position for placing a deposition carrier 9 for depositing single-atom or cluster particles thereon. A cooling mechanism 4 is provided between the mounting position and the deposition cavity 2 to cool the deposition carrier 9. The deposition chamber 1 is also provided with an air inlet 5 and an air outlet 6 for gas to enter and exit.
[0028] The deposition chamber 1 has a sidewall 11, a bottom wall 12, and an end cap 13, which together enclose the deposition cavity 2. To facilitate assembly of the sidewall 11, bottom wall 12, and end cap 13, they are detachably connected. For example, the bottom wall 12 is configured as a platform, with a first groove 121 recessed downwards at its upper end for inserting the sidewall 11. The inner diameter of the first groove 121 matches the outer diameter of the sidewall 11, allowing for an interference fit between the sidewall 11 and the first groove 121. The sidewall 11 has an opening at its upper end, and the end cap 13 is fitted to the opening via an assembly ring 14 to cover it, thus forming a sealed deposition cavity 2. The inner diameter of the assembly ring 14 matches the outer diameter of the chamber sidewall 11 for a sealing fit. The end cap 13 is located at the upper end of the assembly ring 14, and a first fixing hole 131 is provided between the end cap 13 and the assembly ring 14. Several first fixing holes 131 are spaced apart around the assembly ring 14, and each first fixing hole 131 can be fitted with a first fixing bolt (not shown in the figure) to connect the end cap 13 and the assembly ring 14. A sealing ring 132 is provided between the end cap 13 and the assembly ring 14 to increase the sealing performance between them, thereby improving the sealing performance of the deposition chamber 1. This removable deposition chamber 1 facilitates the removal of the deposited sample by the user and also facilitates cleaning or maintenance of the deposition chamber 1.
[0029] The feed inlet 3 is located in the middle of the end cap 13 and communicates with the deposition chamber 2. The feed inlet 3 is used to feed single-atom or cluster particles. The air inlet 5 and the air outlet 6 are both located on the chamber sidewall 11 and communicate with the deposition chamber 2. In order to facilitate the formation of a natural upward airflow in the deposition chamber 1, so that the gas entering the deposition chamber 2 through the air inlet 5 can more thoroughly push the original gas in the deposition chamber 2 out from the bottom up through the air outlet 6, the air inlet 5 is located in the lower part of the chamber sidewall 11 to allow protective gas to be introduced into the deposition chamber 2 from bottom to top, and the air outlet 6 is located in the upper part of the chamber sidewall 11 to allow gas to flow out. The air inlet 5 and the air outlet 6 are arranged radially opposite to each other to form a more natural airflow path.
[0030] Please continue to refer to Figure 3 and Figure 4The cooling mechanism 4 is disposed on the bottom wall 12 of the chamber and includes a condensation chamber 41, an inlet pipe 42 for introducing cooling medium into the condensation chamber 41, and an outlet pipe 43 for discharging the cooling medium from the condensation chamber 41. A first isolation chamber 45 is also disposed between the condensation chamber 41 and the bottom wall 12 of the chamber. For example, a second groove 122 is formed on the bottom wall of the first groove 121, and the inner diameter of the second groove 122 matches the outer diameter of the first isolation chamber 45 so that the first isolation chamber 45 can be inserted into it. The condensation chamber 41 is disposed at the upper end of the first isolation chamber 45 and is not in communication with the first isolation chamber 45. The inlet pipe 42 extends from bottom to top through the bottom wall 12 of the chamber, then through the first isolation cavity 45, and connects to the condensing cavity 41. The outlet pipe 43 extends from bottom to top through the bottom wall 12 of the chamber, then through the first isolation cavity 45, and connects to the condensing cavity 41. Furthermore, an extension pipe 44 is provided at one end of the inlet pipe 42 that extends into the condensing cavity 41. The lower end of the extension pipe 44 connects to the outlet pipe 43, and the upper end of the extension pipe 44 extends upward above the upper end of the inlet pipe 42. The height difference between the inlet pipe 42 and the outlet pipe 43 allows the cooling medium entering through the inlet pipe 42 to remain in the condensing cavity 41 for a sufficient time. It also allows the new cooling medium entering through the inlet pipe 42 to more thoroughly push out the remaining old cooling medium that has absorbed heat from the bottom to the top through the extension pipe 44, thereby better maintaining a low temperature inside the condensing cavity 41.
[0031] A second isolation cavity 46 is also provided between the inlet pipe 42 and the outlet pipe 43 and the first isolation cavity 45, respectively. The second isolation cavity 46 isolates at least a portion of the inlet pipe 42 or the outlet pipe 43 from the first isolation cavity 45. For example, in this embodiment, the bottom wall of the second groove 122 is recessed downwards to form two third grooves 123, respectively corresponding to the positions where the inlet pipe 42 and the outlet pipe 43 penetrate the bottom wall 12 of the chamber. Each third groove 123 contains a second isolation cavity 46. The arrangement of the first isolation cavity 45 and the second isolation cavity 46 ensures that the cooling medium in the inlet pipe 42, the outlet pipe 43, and the condensation cavity 41 maintains a greater distance from the inner wall of the deposition chamber 2, thus effectively preventing frost formation on the outer wall of the deposition chamber 1. At the location where the inlet tube 42 and the outlet tube 43 pass through, the bottom wall 12 of the chamber is provided with an isolation pad 47 around the inlet tube 42 and the outlet tube 43, respectively. The isolation pad 47 is used to increase the sealing between the inlet tube 42 or the outlet tube 43 and the second isolation cavity 46.
[0032] The deposition carrier 9 is mounted on the upper end of the condensation chamber 41 at a position corresponding to the feed inlet 3 via a mounting platform 7, so as to receive single-atom or cluster particles entering through the feed inlet 3. The mounting platform 7 is fixedly disposed on the upper end of the condensation chamber 41 or is disposed on the upper end of the condensation chamber 41 by snap-fit. Those skilled in the art should understand that the connection method between the mounting platform 7 and the upper end of the condensation chamber 41 is not limited to fixed disposal or snap-fit, as long as the connection between the mounting platform 7 and the upper end of the condensation chamber 41 can be achieved. The upper end face of the mounting platform 7 is recessed downward to form a fourth groove 71. The inner diameter of the fourth groove 71 should match the outer diameter of the deposition carrier 9 so that the deposition carrier 9 can be inserted therein. The upper end face of the mounting platform 7 is recessed downward at the periphery of the fourth groove 71 to form a fifth groove 72. Several fifth grooves 72 are arranged at intervals around the fourth groove 71, and each fifth groove 72 communicates with the fourth groove 71 and the bottom wall of the fifth groove 72 is connected to it. When the deposition carrier 9 is inserted into the fourth groove 71, the lower end face of the deposition carrier 9 contacts the bottom wall of the fourth groove 71, and at the same time, the lower end face of the deposition carrier 9 forms a gap with the bottom surface of the fifth groove 72 so that the user can remove the deposition carrier 9 from the fourth groove 71 through the fifth groove 72.
[0033] The sedimentation chamber 1 is also equipped with height-adjustable support legs 8, which are configured to be several located on the bottom wall 12 of the chamber at positions around the outer periphery of the side wall 11. Each support leg 8 includes a support rod 81, a base 82, a limiting block 83, and a nut 84. The bottom wall 12 of the chamber has a vertical through hole corresponding to the installation position of the support leg 8, the inner diameter of which matches the outer diameter of the support rod 81 for the support rod 81 to pass through. The base 82 is fixedly installed at the lower end of the support rod 81 to provide support, and the outer diameter of the base 82 is larger than the outer diameter of the support rod 81 to make the support more stable. The outer periphery of the support rod 81 is machined with threads 85, and the nut 84 is screwed onto the threads 85, and the bottom wall 12 of the chamber is supported by several nuts 84. The limiting block 83 is fixedly installed on the support rod 81 at a position corresponding to the lower part of the thread 85 to limit the nut 84 and prevent the nut 84 from coming down out of the thread 85.
[0034] One embodiment of the cryogenic deposition apparatus of this invention operates as follows: Initially, all components of the apparatus are assembled together. When a reaction is required, the single-atom generator or cluster generator is first connected to the feed port 3, and then protective gas is introduced into the deposition chamber 2 through the gas inlet 5. As the protective gas is continuously introduced, the air originally in the deposition chamber 2 is discharged from the gas outlet 6. When the protective gas fills the deposition chamber 2, the gas inlet 5 is closed. Next, single atoms or clusters are fed into the deposition chamber 2 through the protective gas from the feed port 3, and the single atoms / clusters then fall onto the deposition carrier 9.
[0035] During the deposition process, both the inlet pipe 42 and the outlet pipe 43 are connected to an external cooling device (not shown in the figure) so that the cooling medium enters the condensation chamber 41 through the inlet pipe 42 and exits through the outlet pipe 43, thus maintaining the temperature inside the condensation chamber 41 at the target temperature. By adjusting the cooling device to change the temperature of the cooling medium, the temperature inside the condensation chamber 41 is changed, further altering the temperature of the deposition carrier 9, thereby cultivating clusters of particles of a specific size.
[0036] Compared with existing technologies, this novel cryogenic deposition apparatus achieves stable, deep cryogenic cooling of the deposition carrier through a cooling mechanism (such as a liquid nitrogen condensation chamber, an inlet pipe, and an outlet pipe), with a minimum temperature reaching -120°C. This allows for precise control of cluster particle size, meeting specific particle morphology and distribution requirements, and facilitating directional cluster growth and morphology control. Simultaneously, the low-temperature environment reduces the diffusion range of single-atom / cluster particles during deposition, allowing them to deposit more concentratedly on the substrate surface, effectively improving deposition efficiency and quality stability. The apparatus isolates the cooling medium delivery structure from the deposition chamber by incorporating a first isolation chamber, a second isolation chamber, and a cryogenic PTFE pad at the junction of the deposition chamber and the inlet / outlet pipe. This prevents condensation and frosting on the outer wall of the deposition chamber due to low-temperature transfer, ensuring long-term stable operation. In terms of cooling medium circulation design, the inlet and outlet pipes employ an inlet-lower-outlet structure (e.g., an extension of the outlet pipe makes the outlet higher than the inlet of the inlet pipe), ensuring sufficient residence of the cooling medium within the condensation chamber. Old endothermic media can be completely expelled by new media, maintaining the low-temperature stability of the condensation chamber and enhancing the cooling effect. The deposition chamber features a detachable design for its bottom wall, side walls, and end caps, facilitating sample removal, chamber cleaning, and maintenance. The deposition carrier is installed via a grooved structure with auxiliary grooves for easy placement and removal, enhancing operational convenience. Adjustable support legs, achieved through struts and nuts, ensure the device's stability and balance. Furthermore, the deposition chamber has an air inlet (lower part) and an air outlet (upper part, radially opposite), creating a bottom-up natural airflow. This ensures the protective gas fully fills the deposition chamber, effectively expelling existing air and preventing oxidation and deterioration of single-atom / cluster particles upon contact with air, further guaranteeing deposition quality.
[0037] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A low temperature deposition apparatus comprising a deposition chamber, characterized in that: The deposition chamber has a deposition cavity inside. The deposition chamber is provided with a feed inlet for single-atom or cluster particles to enter the deposition cavity from top to bottom. The deposition cavity is provided with a mounting position for placing the deposition carrier on which the single-atom or cluster particles are deposited. A cooling mechanism is provided between the mounting position and the deposition cavity to cool the deposition carrier. The deposition chamber is also provided with an air inlet and an air outlet for gas to enter and exit.
2. The low temperature deposition apparatus of claim 1, wherein: The cooling mechanism includes a condensation chamber, an inlet pipe for introducing a cooling medium into the condensation chamber, and an outlet pipe for discharging the cooling medium from the condensation chamber.
3. The low temperature deposition apparatus of claim 2, wherein: The mounting position is located inside the deposition chamber at a position corresponding to the feed inlet so that the deposition carrier can receive single-atom or cluster particles entering from the feed inlet. The condensation chamber is located between the mounting position and the bottom wall of the deposition chamber. The inlet pipe and the outlet pipe both have one end that passes through the deposition chamber and extends into the condensation chamber, and the other end that extends out of the deposition chamber and is connected to an external cooling medium delivery device.
4. The low temperature deposition apparatus of claim 3, wherein: Both the inlet pipe and the outlet pipe penetrate the bottom wall of the condensing chamber from bottom to top to communicate with the interior of the condensing chamber. The outlet pipe also has an extension pipe at one end that communicates with the outlet pipe so that the outlet of the cooling medium is higher than the inlet of the inlet pipe.
5. The low temperature deposition apparatus of claim 3, wherein: A first isolation chamber is also provided between the bottom wall of the condensation chamber and the deposition chamber. The inlet pipe and the outlet pipe both pass through the deposition chamber and the first isolation chamber in sequence to extend into the condensation chamber.
6. The low temperature deposition apparatus of claim 5, wherein: A second isolation cavity is also provided between the inlet tube and the outlet tube and the first isolation cavity to isolate at least a portion of the inlet tube or the outlet tube from the first isolation cavity.
7. The low temperature deposition apparatus of claim 3, wherein: The deposition chamber is further provided with isolation pads around the inlet pipe and the outlet pipe at the location where the inlet pipe and the outlet pipe pass through.
8. The low temperature deposition apparatus of claim 6, wherein: The deposition chamber includes a bottom wall, a side wall, and an end cap. The bottom wall, side wall, and end cap together form the deposition cavity. The bottom wall, side wall, and end cap are all detachably connected. The first isolation cavity and the second isolation cavity are both located on the bottom wall.
9. The low temperature deposition apparatus of claim 8, wherein: The bottom wall of the chamber has a first groove for inserting the side wall of the chamber. The bottom wall of the first groove has a second groove for installing the first isolation cavity. The bottom wall of the second groove has a third groove for installing the two second isolation cavities.
10. The low-temperature deposition apparatus as described in claim 1, characterized in that: The sedimentation chamber is equipped with height-adjustable support legs.