A diamond wire saw thickening electroplating device

Abstract

This invention provides a thickened electroplating device for diamond wire saws, comprising: a frame, an electroplating tank, a lifting device, a spacing adjustment assembly, cathode conductive guide wheels, and an anode conductive device. The electroplating tank is mounted on the frame, the cathode conductive guide wheels are correspondingly mounted on the frame above the electroplating tank, and the anode conductive device is correspondingly mounted inside the tank. The electroplating tank is composed of several detachable and connectable tank sections, mounted on the frame via the lifting device, and forms an electrolytic circuit with the anode conductive device inside the electroplating tank. The cathode conductive guide wheels are mounted on the frame above the electroplating tank via the spacing adjustment assembly, which allows adjustment of the spacing between adjacent cathode conductive guide wheels. This invention achieves adjustment of the electroplating tank length through detachable and connectable tank sections, and, combined with the adjustment function of the spacing adjustment assembly, precisely controls the spacing of the cathode conductive guide wheels, thereby adapting to the electroplating needs of diamond wire saws of different specifications and improving adaptability to diverse production tasks.

Description

Technical Field

[0001] This utility model relates to the field of wire saw production, and in particular to a thickening electroplating device for diamond wire saws. Background Technology

[0002] Diamond wire saws (or diamond wire for short) are high-efficiency cutting tools for hard and brittle materials. Their core manufacturing process involves bonding diamond abrasive particles to a metal base via electroplating or resin bonding. Among these processes, the embedded abrasive electroplating method is widely used in high-end diamond wire production due to its high bonding strength and uniform distribution. This process mainly consists of three stages: pre-plating, abrasive coating, and thickening. The thickening electroplating stage directly determines the degree of diamond particle coverage and the service life of the wire saw. Currently, the industry commonly uses fixed-length electroplating tanks for thickening. The technical bottleneck lies in the fact that when increasing the coating thickness is required, traditional fixed-length thickening electroplating tanks cannot adapt to different coating thickness requirements. This necessitates reducing the wire saw's operating speed, significantly extending the production cycle of the diamond wire saw and leading to a sharp decline in production efficiency.

[0003] Existing technology CN201621362051.X discloses a reciprocating thickening device for electroplating diamond wire saws; it includes at least two plating solution thickening tanks arranged sequentially, with a rear reciprocating guide wheel positioned behind the rearmost plating solution thickening tank and a forward reciprocating guide wheel positioned in front of the foremost plating solution thickening tank; the outlet end of the rear reciprocating guide wheel is flush with the inlet end of the forward reciprocating guide wheel; the movement trajectory of the diamond wire saw is a serpentine trajectory under the guidance and limitation of the rear reciprocating guide wheel and the forward reciprocating guide wheel. Although this solution extends the effective stroke of the wire saw in the plating solution through a serpentine path, it still has the following problems:

[0004] 1. In a serpentine path, the wire saw needs to change its direction of movement multiple times by using multiple guide wheels. When the wire saw turns between the guide wheels, the local tension may increase or decrease suddenly. This can cause the wire saw to vibrate and affect the uniformity of the coating, or even cause the metal baseline to break, increasing the scrap rate.

[0005] 2. The existing serpentine path of the device relies on the fixed position of the guide wheels to extend the stroke. When the coating thickness needs to be adjusted, the machine must be stopped to recalibrate the guide wheel spacing or increase or decrease the number of tanks. This operation is cumbersome, and the adjustment accuracy is limited by the mechanical structure. For baselines with different diameters and tensile strengths, or diamond abrasives of different specifications, it is difficult to match personalized electroplating process requirements by dynamically adjusting the path parameters. This results in the production line having extremely poor adaptability to multi-variety, small-batch products and failing to meet the diversified customization needs of diamond wire in the high-end precision machining field. Utility Model Content

[0006] In view of this, the purpose of this utility model is to provide a thickening electroplating device for diamond wire saws. Through the design of a detachable and splicable tank, the length of the electroplating tank can be flexibly adjusted. Combined with the dynamic adjustment function of the pitch adjustment component, the spacing of the cathode conductive guide wheel can be precisely controlled, thereby adapting to the electroplating needs of diamond wire saws of different specifications. This significantly improves the adaptability to diverse production tasks and avoids the problem of reducing the wire saw running speed and extending the production cycle when increasing the coating thickness in traditional fixed-length electroplating tanks.

[0007] The technical solution adopted by this utility model to solve its technical problem is:

[0008] A thickening electroplating device for diamond wire saws is provided, comprising: a frame, an electroplating tank, a lifting device, a spacing adjustment component, a cathode conductive guide wheel, and an anode conductive device. The electroplating tank is disposed on the frame, the cathode conductive guide wheel is disposed on the frame above the electroplating tank and can be used to wind diamond wire saws, and the anode conductive device is disposed in the tank.

[0009] The electroplating tank is composed of several detachable and splicable tank bodies, which are mounted on the frame via a lifting device. The electroplating tank can be raised and lowered by the lifting device to allow the cathode conductive guide wheel to enter the electroplating tank and form an electrolytic circuit with the anode conductive device in the electroplating tank. The cathode conductive guide wheel is mounted on the frame above the electroplating tank via a spacing adjustment component, and the spacing between adjacent cathode conductive guide wheels can be adjusted by the spacing adjustment component.

[0010] It should be noted that the frame is the basic supporting structure of the entire diamond wire saw thickening electroplating device. It provides installation and fixing positions for various components such as the electroplating tank, lifting device, and distance adjustment assembly, ensuring the stability of the relative spatial positions of each component and enabling the entire device to operate in an orderly manner. The electroplating tank is the main container for electroplating operations, composed of several detachable and splicable tanks. This allows the device to flexibly adjust the length and capacity of the electroplating tank according to actual production needs. When processing diamond wire saws of different specifications, the number of tanks can be easily increased or decreased, improving the adaptability of the device to diverse production tasks. The tank contains the electrolyte required for electroplating. The anode conductive device is located inside the tank and connected to the positive terminal of the power supply, participating in the electrolytic reaction as the anode. The cathode conductive guide wheel is used to wind around the diamond wire saw, providing a conductive path for the diamond wire saw and ensuring the normal formation of the electrolytic circuit. The lifting device automates the contact and separation of the cathode conductive guide wheel from the electrolyte in the electroplating tank during the electroplating process. Operators only need to control the lifting device to precisely control the start and end of electroplating, avoiding errors and instability that may be caused by manual operation and improving production efficiency. The drive mechanism of the spacing adjustment component drives the sliding part to slide on the guide rail, thereby causing the position of the cathode conductive guide wheel connected to the sliding part to move, realizing the adjustment of the spacing between adjacent cathode conductive guide wheels, improving the versatility and adaptability of the device. It can flexibly adjust the spacing between adjacent cathode conductive guide wheels according to the width of diamond wire saws of different specifications and electroplating process requirements, ensuring the stability and electroplating quality of the diamond wire saw during the electroplating process; the electroplating tank is composed of...

[0011] Preferably, the adjusting assembly includes a drive motor, a guide rail, and a sliding sleeve. The guide rail is arranged on a frame above the electroplating tank along the length of the electroplating tank. The drive motor is located in the middle of the guide rail. The sliding sleeve is symmetrically arranged on the guide rails on both sides of the drive motor and is connected to the drive motor via a screw. The sliding sleeve can slide on the guide rail through the cooperation between the drive motor and the screw. The cathode conductive guide wheel is vertically arranged at the lower end of the sliding sleeve via a connecting rod.

[0012] It should be noted that the drive motor, as the power source, provides stable and controllable power to the pitch adjustment assembly. The guide rail is set on the frame above the electroplating tank along the length of the tank, providing a precise movement trajectory for the sliding sleeve. The screw is connected to the output shaft of the drive motor, converting the rotational motion of the drive motor into the linear motion of the sliding sleeve. It is a key component in the pitch adjustment assembly that realizes motion conversion. The connecting rod connects the cathode conductive guide wheel to the sliding sleeve. When the sliding sleeve slides on the guide rail, the connecting rod drives the cathode conductive guide wheel to move synchronously. The operator can precisely adjust the moving speed and direction of the sliding sleeve on the guide rail by controlling the speed, direction and other parameters of the drive motor, thereby precisely adjusting the spacing between adjacent cathode conductive guide wheels to meet the electroplating requirements of diamond wire saws of different specifications.

[0013] Preferably, the guide rail of the adjusting component is provided with stroke limiting blocks at both ends, and the stroke limiting blocks can prevent the sliding sleeve from disengaging from the guide rail during the sliding process.

[0014] It should be noted that the travel limit blocks are installed at both ends of the guide rail of the adjustable distance component. When the drive motor drives the screw to rotate, causing the sliding sleeve to slide on the guide rail, the sliding sleeve will move towards both ends of the guide rail. When the sliding sleeve moves close to the end of the guide rail, it will contact the travel limit blocks. The travel limit blocks limit the travel range of the sliding sleeve by blocking further movement of the sliding sleeve, thereby preventing the sliding sleeve from disengaging from the guide rail.

[0015] Preferably, a guide wheel is provided on one side of the screw for the diamond wire saw to turn, and the guide wheel enables the diamond wire saw to be accurately wound around the cathode conductive guide wheel after turning.

[0016] It should be noted that the guide wheel provides precise steering guidance for the diamond wire saw, ensuring that the wire saw can be accurately wound around the cathode conductive guide wheel. This helps to avoid problems such as deviation and entanglement of the wire saw during the winding process.

[0017] Preferably, the lifting device includes a base, a lifting cylinder, and a support plate. The support plate is mounted on the base via the lifting cylinder and can be lifted and lowered by the lifting cylinder. The electroplating tank is fixed on the support plate and can be lifted and lowered by the lifting and lowering of the support plate.

[0018] It should be noted that the base is the fundamental support component of the lifting device, providing a stable support platform for the entire device. It is typically installed on the ground or other fixed structures. Through its own weight and large contact area, it evenly distributes the weight of the lifting device and the electroplating tank it carries onto the support surface, ensuring that the device does not shake or shift during operation. The lifting cylinder is characterized by rapid action and quick response, enabling rapid lifting and lowering of the electroplating tank, improving the working efficiency of the electroplating device. Simultaneously, the cylinder's movement precision is high; the lifting height of the electroplating tank can be precisely controlled by adjusting air pressure and flow rate to meet different electroplating process requirements. The support plate, as the intermediate component connecting the lifting cylinder and the electroplating tank, provides a stable mounting platform for the electroplating tank, ensuring its stability during lifting. The structural design of the support plate can be optimized according to the shape and size of the electroplating tank, allowing the tank to be firmly fixed to the support plate, preventing shaking or tilting during lifting.

[0019] Preferably, the tank includes several splicing grooves and two end grooves. The splicing grooves are disposed between the end grooves. The splicing grooves are detachably connected by a sealing connection structure. The sealing connection structure includes a flange structure, a fitting groove, and an elastic sealing ring. The flange structure and the fitting groove are correspondingly disposed at both ends of the splicing groove. The flange structure and the fitting groove of adjacent tanks are locked together by a locking nut. The elastic sealing ring is arranged circumferentially along the splicing surface to form a leak-proof sealing layer.

[0020] It should be noted that the number of splicing grooves can be increased or decreased according to actual needs. They are detachably connected between two end grooves to form an electroplating tank with adjustable length. The inner walls of the end grooves and splicing grooves together form a space to contain the electrolyte, providing a reaction site for the electroplating of the diamond wire saw. The ends of adjacent tanks are respectively equipped with flanges (raised edges) and fitting grooves (recessed slots). The flanges can be embedded into the corresponding fitting grooves to form mechanical positioning and preliminary sealing. Then, the flanges and fitting grooves are locked with locking nuts, so that the adjacent tanks fit tightly together, compressing the elastic sealing ring in the middle and filling the tiny gap between the flanges and fitting grooves to form a leak-proof sealing layer, preventing the electrolyte from leaking from the splice. This solution achieves flexible adjustment of the length of the electroplating tank and leak-free operation through modular design (splicing grooves and end grooves) and reliable sealing structure (flange-fitting groove-elastic sealing ring-locking nut).

[0021] Preferably, a detachable partition is provided at the joint of adjacent tanks in the electroplating tank. The partition can separate the corresponding tank spaces in the electroplating tank, and the joint between the partition and the tank is sealed.

[0022] It should be noted that the partition is set at the joint of adjacent tanks (joint tanks or end tanks) and the sealed connection is achieved through a sealing structure (such as elastic sealing ring, sealing strip, embedded sealing groove). By removing or installing the partition, the electroplating tank can be divided into multiple independent sub-tanks. Each sub-tank can be filled with electrolytes of different compositions and concentrations, or equipped with different anode conductive devices, to realize segmented electroplating process. Furthermore, the length of the electroplating tank can be adjusted without disassembling the electroplating tank.

[0023] Preferably, the anode conductive device is an anode plate, which is vertically arranged in the tank along the length of the tank, and each tank includes at least one set of detachable anode plates, so that the anode plates form an electric field distribution parallel to the diamond wire saw wire cutting direction.

[0024] It should be noted that the anode plates are arranged perpendicular to the bottom surface of the tank and along the length of the tank (i.e., the direction of the diamond wire saw). This arrangement ensures that the effective conductive area of ​​the anode plates is parallel to the direction of the wire saw's movement, maintaining a consistent distance between the anode plates and all points on the surface of the wire saw during its movement, thus forming a uniform electric field distribution. Each set of anode plates consists of two or more anode plates (e.g., one on each side and one in the middle), which are connected in parallel to the positive terminal of the power supply via conductive rods. At least one set of anode plates ensures that there is sufficient anode area in a single tank to meet the current load required for electroplating the wire saw of the corresponding length in that tank.

[0025] The beneficial effects of this utility model are:

[0026] This utility model provides a diamond wire saw thickening electroplating device. Through a modularly designed, detachable, and splicing tank, the length of the electroplating tank can be flexibly adjusted according to different coating thickness requirements. This eliminates the need to replace the entire equipment or undergo prolonged downtime for modification; simply increasing or decreasing the number of splicing tanks allows for rapid adaptation to the production of various specifications of diamond wire saws. The adjustable spacing component precisely adjusts the distance between the cathode conductive guide wheels, and combined with the automated control of the lifting device, ensures stable tension and precise contact during wire saw electroplating, improving coating uniformity and production efficiency. The sealed connection structure prevents electrolyte leakage, and the vertically symmetrical arrangement of the anode plates forms a uniform electric field, effectively improving the coating quality of diamond particles and extending the service life of the wire saw. The overall modular structure is easy to maintain, significantly enhancing the device's adaptability to multi-variety, small-batch production, and solving the bottleneck problems of traditional fixed-tank devices in coating thickness adjustment, production efficiency, and process flexibility. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural schematic diagram of a diamond wire saw thickening electroplating device according to Embodiment 1 of this utility model.

[0028] Figure 2 This is a schematic diagram of the installation structure of the pitch adjustment component and the cathode conductive guide wheel in Embodiment 1 of this utility model.

[0029] Figure 3 This is a schematic diagram of the disassembled structure of the electroplating tank in Embodiment 1 of this utility model.

[0030] Figure 4 This is a partially enlarged structural diagram of the sealing connection structure of Embodiment 1 of this utility model.

[0031] Figure 5 This is a schematic diagram of the lifting device in Embodiment 2 of this utility model.

[0032] In the diagram: 1. Electroplating tank; 11. Tank body; 111. Splicing groove; 112. End groove; 2. Frame; 3. Lifting device; 31. Base; 32. Lifting cylinder; 33. Support plate; 4. Adjustment assembly; 41. Drive motor; 42. Guide rail; 43. Sliding sleeve; 44. Screw; 45. Connecting rod; 46. Stroke limit block; 5. Cathode conductive guide wheel; 51. Guide wheel; 6. Anode conductive device; 7. Sealing connection structure; 71. Flange structure; 72. Fitting groove; 73. Elastic sealing ring; 8. Partition plate.

[0033] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the present invention in any way, but rather to illustrate the concept of the present invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Example 1

[0036] like Figures 1-5 As shown, a diamond wire saw thickening electroplating device includes: a frame 2, an electroplating tank 1, a lifting device 3, a pitch adjustment component 4, a cathode conductive guide wheel 5, and an anode conductive device 6. The electroplating tank 1 is mounted on the frame 2, the cathode conductive guide wheel 5 is correspondingly mounted on the frame 2 above the electroplating tank 1, and can be used to wind the diamond wire saw. The anode conductive device 6 is correspondingly mounted inside the tank body 11.

[0037] The electroplating tank 1 is composed of several detachable and splicable tank bodies 11, and is mounted on the frame 2 via a lifting device 3. The electroplating tank 1 can be raised and lowered by the lifting device 3 to allow the cathode conductive guide wheel 5 to enter the electroplating tank 1 and form an electrolytic circuit with the anode conductive device 6 in the electroplating tank 1. The cathode conductive guide wheel 5 is mounted on the frame 2 above the electroplating tank 1 via a spacing adjustment component 4, and the spacing between adjacent cathode conductive guide wheels 5 can be adjusted by the spacing adjustment component 4.

[0038] The adjustable distance assembly 4 includes a drive motor 41, a guide rail 42, and a sliding sleeve 43. The guide rail 42 is arranged on the frame 2 above the electroplating tank 1 along the length direction of the electroplating tank 1. The drive motor 41 is arranged in the middle of the guide rail 42. The sliding sleeve 43 is symmetrically arranged on the guide rail 42 on both sides of the drive motor 41 and is connected to the drive motor 41 through a screw 44. The sliding sleeve 43 can slide on the guide rail 42 through the cooperation of the drive motor 41 and the screw 44. The cathode conductive guide wheel 5 is vertically arranged at the lower end of the sliding sleeve 43 through a connecting rod 45.

[0039] The guide rail 42 of the adjustable component 4 is provided with travel limit blocks 46 at both ends. The travel limit blocks 46 can prevent the sliding sleeve 43 from disengaging from the guide rail 42 during the sliding process.

[0040] One side of the screw 44 is provided with a guide wheel 51 for the diamond wire saw to turn. The guide wheel 51 enables the diamond wire saw to be accurately wound around the cathode conductive guide wheel 5 after turning.

[0041] The lifting device 3 includes a base 31, a lifting cylinder 32, and a support plate 33. The support plate 33 is mounted on the base 31 via the lifting cylinder 32 and can be lifted and lowered via the lifting cylinder 32. The electroplating tank 1 is fixed on the support plate 33 and can be lifted and lowered by the lifting of the support plate 33.

[0042] The tank 11 includes several splicing grooves 111 and two end grooves 112. The splicing grooves 111 are disposed between the end grooves 112. The splicing grooves 111 are detachably connected by a sealing connection structure 7. The sealing connection structure 7 includes a flange structure 71, a fitting groove 72 and an elastic sealing ring 73. The flange structure 71 and the fitting groove 72 are respectively disposed at both ends of the splicing groove 111. The flange structure 71 and the fitting groove 72 of adjacent tanks 11 are locked together by a locking nut. The elastic sealing ring 73 is arranged circumferentially along the splicing surface to form a leak-proof sealing layer.

[0043] The electroplating tank 1 has a detachable partition 8 at the joint of adjacent tanks 11. The partition 8 can separate the space of the corresponding tank 11 in the electroplating tank 1, and the joint between the partition 8 and the tank 11 is sealed.

[0044] The anode conductive device 6 is an anode plate, which is vertically arranged in the tank 11 along the length of the tank 11. Each tank 11 includes four sets of detachable anode plates, and the anode plates form an electric field distribution parallel to the diamond wire saw's wire cutting direction.

[0045] The working principle and usage method of a diamond wire saw thickening electroplating device according to this embodiment:

[0046] This embodiment provides a diamond wire saw thickening electroplating device. The frame 2 serves as the basic support structure of the entire device, providing installation and fixing positions for various components such as the electroplating tank 1, lifting device 3, and pitch adjustment assembly 4. This allows the components to work together, providing a stable working environment for the thickening electroplating process of the diamond wire saw and preventing the electroplating effect from being affected by component shaking or unstable position. The electroplating tank 1 is composed of several detachable and splicable tank bodies 11. These tank bodies 11 include several splicing grooves 111 and two end grooves 112. The splicing grooves 111 are located between the end grooves 112 and are detachably connected by a sealing connection structure 7. This allows the electroplating device to flexibly adjust the length and capacity of the electroplating tank 1 according to actual production needs. When processing diamond wire saws of different specifications, the number of tank bodies 11 can be easily increased or decreased, improving the adaptability of the device to diverse production tasks. For example, when it is necessary to increase the coating thickness, by increasing the number of splicing grooves 111, the electrolyte holding space can be expanded, and the effective electroplating stroke in the electrolyte can be extended without reducing the wire saw's running speed.

[0047] The pitch adjustment assembly 4 is powered by the drive motor 41. When the drive motor 41 starts, its output shaft drives the screw 44 to rotate. The sliding sleeves 43, which are symmetrically distributed on both sides of the screw 44, move towards or away from each other along the guide rail 42 under the action of threaded transmission. Then, the lateral spacing of the cathode conductive guide wheels 5 is adjusted synchronously through the connecting rod 45. This spacing adjustment function can accurately match the tension parameters required by diamond wire saws of different diameters and electroplating processes: for wire saws with smaller diameters, the spacing of the guide wheels is reduced to reduce the span tension; for wire saws with lower tensile strength, the spacing is increased to reduce the risk of local stress concentration and avoid the wire saw from shaking or breaking due to uneven tension during electroplating. The travel limit blocks 46 at both ends of the guide rail 42 limit the extreme position of the sliding sleeves 43 through physical blocking to ensure the safety of the adjustment process and the integrity of the mechanical structure.

[0048] The anode plates are arranged vertically and symmetrically along the length of the tank 11 (on both sides and in the middle), with their planes parallel to the wire saw's running direction. This ensures that the distance between each point on the wire saw surface and the anode plate is equal, forming a uniform electric field intensity distribution. This avoids the edge effect (such as excessively thick or thin coating edges) caused by traditional single-sided anodes, ensuring a consistent deposition rate of metal ions on the wire saw surface. In particular, it provides more uniform coating of diamond particles, effectively improving the bonding force between the coating and the abrasive. Each set of anode plates is installed in the tank 11 via a detachable structure. The number of anodes can be adjusted according to the length of the tank 11 to ensure that the effective conductive area of ​​the anode matches the wire saw's running speed and the preset current density, avoiding excessively large or small local currents due to insufficient anodes.

[0049] In use, according to the required plating thickness of the diamond wire saw to be processed, select the appropriate number of splicing slots 111 and the end slots 112 at both ends for assembly. Align the flange structure 71 of the adjacent slots 11 with the fitting slot 72, insert the elastic sealing ring 73, and tighten it evenly around the circumference with the lock nut to ensure that the splice is sealed and leak-free. Then fix the assembled electroplating tank 1 on the mounting plate of the lifting device 3. Next, vertically install detachable anode plates (four sets in total) on the inner walls on both sides and in the middle of each tank 11, ensuring that the plane of the anode plate is parallel to the wire saw's cutting direction and perpendicular to the bottom surface of the tank 11. Connect the anode plates in the same tank 11 in parallel through the conductive rod, and then connect them uniformly to the positive terminal of the power supply to form a uniform electric field distribution. At the same time, start the drive motor 41 of the pitch adjustment component 4, and drive the screw 4 through the screw 4 4. The transmission causes the sliding sleeve 43 to slide along the guide rail 42, driving the cathode conductive guide wheel 5 to move laterally until the spacing between adjacent guide wheels matches the diameter and baseline tensile strength of the wire saw to be processed (e.g., reduce the spacing of small diameter wire saws to reduce tension, and increase the spacing of low strength baselines to disperse stress); then guide the wire saw to turn through the guide wheel 51, so that it is smoothly wound around the cathode conductive guide wheel 5 in sequence, ensuring that the wire saw is evenly distributed on the surface of the guide wheel without deviation or entanglement. Finally, inject the pre-prepared electrolyte (such as nickel sulfamate plating solution) into the electroplating tank 1 to complete the preparation before electroplating; start the lifting cylinder 32 to drive the support plate 33 to rise, driving the electroplating tank 1 to be vertically lifted until the cathode conductive guide wheel 5 is completely immersed in the electrolyte (the immersion depth is based on the fact that the surface of the wire saw is covered by the electrolyte and does not splash out of the tank). At this point, the diamond wire saw (cathode) is connected to the negative terminal of the power supply through the conductive guide wheel, and the anode plate (anode) is connected to the positive terminal of the power supply, forming a complete electrolytic circuit of "anode plate → electrolyte → wire saw → cathode guide wheel". The DC power supply is turned on, and the appropriate current density and voltage are set according to the wire saw material, the type of plating metal (such as nickel, cobalt) and the target thickness (such as by inputting parameters through the control cabinet panel). The wire saw drive system (external supporting equipment) is started, so that the wire saw passes through the electroplating tank 1 at a constant speed along the guide wheel group, ensuring that it moves at a uniform speed in the electrolyte, so that the plating thickness of the diamond wire saw can meet the process requirements.

[0050] Finally, it should be noted that the above description is only a preferred embodiment of this utility model and is used only to illustrate the technical solution of this utility model, and is not intended to limit the protection scope of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the protection scope of this utility model.

[0051] In the description of this utility model, it should be understood that the terms "upper", "lower", "upper end", "lower end", "upper surface", "lower surface", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0052] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. A thickening electroplating device for diamond wire saws, comprising: The equipment comprises a frame (2), an electroplating tank (1), a lifting device (3), a pitch adjustment assembly (4), a cathode conductive guide wheel (5), and an anode conductive device (6). The electroplating tank (1) is mounted on the frame (2), and the cathode conductive guide wheel (5) is correspondingly mounted on the frame (2) above the electroplating tank (1) and is capable of being used to wind a diamond wire saw. The anode conductive device (6) is correspondingly mounted inside the tank body (11). Its features include: The electroplating tank (1) is composed of several detachable and splicable tank bodies (11) and is set on the frame (2) by a lifting device (3). The electroplating tank (1) can be raised and lowered by the lifting device (3) so that the cathode conductive guide wheel (5) can enter the electroplating tank (1) and form an electrolytic circuit with the anode conductive device (6) in the electroplating tank (1). The cathode conductive guide wheel (5) is set on the frame (2) above the electroplating tank (1) by a spacing adjustment component (4) and the spacing between adjacent cathode conductive guide wheels (5) can be adjusted by the spacing adjustment component (4).

2. The diamond wire saw thickening electroplating device as described in claim 1, characterized in that: The adjustable distance assembly (4) includes a drive motor (41), a guide rail (42) and a sliding sleeve (43). The guide rail (42) is set on the frame (2) above the electroplating tank (1) along the length direction of the electroplating tank (1). The drive motor (41) is set in the middle of the guide rail (42). The sliding sleeve (43) is symmetrically set on the guide rail (42) on both sides of the drive motor (41) and is connected to the drive motor (41) through a screw (44). The sliding sleeve (43) can slide on the guide rail (42) through the cooperation of the drive motor (41) and the screw (44). The cathode conductive guide wheel (5) is vertically set at the lower end of the sliding sleeve (43) through a connecting rod (45).

3. The diamond wire saw thickening electroplating device as described in claim 2, characterized in that: The guide rail (42) of the adjustable component (4) is provided with travel limit blocks (46) at both ends. The travel limit blocks (46) can prevent the sliding sleeve (43) from disengaging from the guide rail (42) during the sliding process.

4. The diamond wire saw thickening electroplating device as described in claim 2, characterized in that: One side of the screw (44) is provided with a guide wheel (51) for the diamond wire saw to turn. The guide wheel (51) enables the diamond wire saw to be accurately wound around the cathode conductive guide wheel (5) after turning.

5. The diamond wire saw thickening electroplating device as described in claim 1, characterized in that: The lifting device (3) includes a base (31), a lifting cylinder (32) and a support plate (33). The support plate (33) is mounted on the base (31) via the lifting cylinder (32) and can be lifted and lowered via the lifting cylinder (32). The electroplating tank (1) is fixed on the support plate (33) and can be lifted and lowered by the lifting of the support plate (33).

6. The diamond wire saw thickening electroplating device as described in claim 1, characterized in that: The tank (11) includes several splicing grooves (111) and two end grooves (112). The splicing grooves (111) are arranged between the end grooves (112). The splicing grooves (111) are detachably connected by a sealing connection structure (7). The sealing connection structure (7) includes a flange structure (71), a fitting groove (72), and an elastic sealing ring (73). The flange structure (71) and the fitting groove (72) are respectively arranged at both ends of the splicing groove (111). The flange structure (71) and the fitting groove (72) of adjacent tanks (11) are locked by a locking nut. The elastic sealing ring (73) is arranged circumferentially along the splicing surface to form a leak-proof sealing layer.

7. The diamond wire saw thickening electroplating device as described in claim 6, characterized in that: The electroplating tank (1) has a detachable partition (8) at the joint of adjacent tanks (11). The partition (8) can separate the space of the corresponding tank (11) in the electroplating tank (1), and the joint between the partition (8) and the tank (11) is sealed.

8. The diamond wire saw thickening electroplating device as described in claim 6, characterized in that: The anode conductive device (6) is an anode plate. The anode plate is vertically arranged in the tank (11) along the length direction of the tank (11). Each tank (11) includes at least one set of detachable anode plates, and the anode plates form an electric field distribution parallel to the diamond wire saw wire cutting direction.

Images