Wafer substrate appearance inspection device

By designing a wafer substrate appearance inspection device, and employing the coordinated operation of a feeding line, a dual-gripper assembly for picking up materials, a transfer and unloading line, and a vision inspection component, the device solves the problems of low transmission efficiency and poor positioning accuracy of traditional equipment. This enables efficient and accurate wafer substrate appearance inspection, meeting the high-precision inspection needs of the semiconductor industry.

CN224436162UActive Publication Date: 2026-06-30SUZHOU SHOLASER TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU SHOLASER TECH CO LTD
Filing Date
2025-06-11
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Traditional wafer substrate inspection equipment suffers from low transmission efficiency, poor positioning accuracy, and low automation, failing to meet the semiconductor industry's demand for high-precision and high-efficiency inspection.

Method used

Design a wafer substrate appearance inspection device, which adopts a feeding line, a dual gripper assembly, a transfer unloading line, an inspection carrier assembly, and a vision inspection assembly. Through the coordinated cooperation of the components, efficient material transfer and accurate inspection are achieved, thereby improving the level of automation.

Benefits of technology

It improves the efficiency and accuracy of wafer substrate appearance inspection, realizes full-process automation, reduces labor costs, avoids human error, and meets the high-precision inspection requirements of the semiconductor industry.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224436162U_ABST
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Abstract

This utility model provides a wafer substrate appearance inspection device, which includes a loading line arranged along the Y direction, a dual-jaw gripper assembly, a transfer unloading line arranged along the X direction, an inspection carrier assembly, a vision inspection assembly, and a single-jaw unloading assembly. The transfer unloading line is located at the end of the loading line and includes a connected transfer section and an unloading section. The dual-jaw gripper assembly includes a straight-line loading module and two grippers arranged side by side along the X direction on the straight-line loading module. The straight-line loading module drives the two grippers to move along the Y direction. One gripper picks up and places the substrate from the loading line onto the transfer section, and the other gripper picks up and places the substrate from the transfer section onto the inspection carrier assembly. The inspection carrier assembly drives the substrate to move in the X / Y direction and pass through the inspection position of the vision inspection assembly. The single-jaw unloading assembly is used to pick up and place the substrate from the inspection carrier assembly onto the unloading section, and the single-jaw unloading assembly drives the substrate to move along the Y direction.
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