A microwave absorbing patch

Abstract

This utility model provides a microwave absorbing patch, belonging to the field of electromagnetic microwave absorbing technology. The microwave absorbing patch includes a first absorbing layer and a microwave absorbing and heat-conducting mechanism. A second absorbing layer is bonded to the bottom of the first absorbing layer, and a base layer is bonded to the bottom of the second absorbing layer. A heat-conducting layer is disposed at the bottom of the second absorbing layer, and its top is bonded to the bottom of the second absorbing layer. A heat insulation layer is bonded to the bottom of the heat-conducting layer. By setting the microwave absorbing and heat-conducting mechanism, heat can be blocked from the first and second absorbing layers while simultaneously dissipating heat from them. This allows the first and second absorbing layers to effectively dissipate internal heat during operation, preventing the difficulty of heat dissipation from the first and second absorbing layers. Therefore, the heat dissipation effect and thermal conductivity of the first and second absorbing layers are improved.

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