Communication test box

Abstract

This application provides a communication test box, including a box body; a motherboard mounting tray installed inside the box body, on which a communication motherboard is mounted; and multiple daughterboard mounting trays installed inside the box body, each daughterboard mounting tray holding a communication daughterboard. This application allows for the centralized installation of a parallel communication system for multiple photovoltaic inverters using power line carrier communication within the box body, thereby reducing the difficulty of communication debugging for multiple parallel inverters based on power line carrier communication.

Description

Technical Field

[0001] This application relates to the field of communication technology, specifically to a communication test box. Background Technology

[0002] Currently, with the explosive growth of the global photovoltaic industry, the demand for power plant photovoltaic systems has surged. Based on considerations such as cost, reliability, and on-site construction, power line carrier communication is being used more and more widely in power plant photovoltaic systems.

[0003] In related technologies, before applying new commands to a power plant photovoltaic system, it is necessary to test and verify whether a power line carrier communication system composed of multiple parallel inverters can transmit and receive commands normally. If commands can be transmitted and received normally in a communication system with multiple inverters in parallel, it means that the command can be applied in a practical communication system. However, due to limitations in the space size and weight of a single photovoltaic inverter, the power line carrier communication system after multiple photovoltaic inverters are connected in parallel occupies a large test space, which makes the communication debugging process of multiple inverters in parallel based on power line carrier communication very difficult. Utility Model Content

[0004] This application provides a communication test box, which aims to solve the above-mentioned technical problems.

[0005] In a first aspect, this application provides a communication test box, comprising:

[0006] Box;

[0007] The motherboard mounting tray is installed inside the enclosure and houses the communication motherboard.

[0008] Multiple sub-board mounting trays are installed inside the enclosure, and each sub-board mounting tray is equipped with a communication sub-board.

[0009] The communication motherboard communicates with the communication daughterboards on each daughterboard mounting tray.

[0010] In some embodiments, the housing is further provided with a wire harness mounting slot, and a plurality of sub-board mounting trays are arranged at intervals along the extension direction of the wire harness mounting slot, with the motherboard mounting tray located at one end of the wire harness mounting slot.

[0011] In some embodiments, the wiring harness mounting slot divides the internal space of the enclosure into a first space and a second space, and the plurality of sub-board mounting trays include a plurality of first sub-board mounting trays and second sub-board mounting trays;

[0012] The first daughterboard mounting trays are arranged at intervals in the first space along the extension direction of the wire harness mounting groove, and the second daughterboard mounting trays are arranged at intervals in the second space along the extension direction of the wire harness mounting groove.

[0013] In some embodiments, the communication test box also includes a power mounting tray, which is configured to mount a power supply module.

[0014] The motherboard mounting tray is located at one end of the wire harness mounting slot and installed in the first space, while the power supply mounting tray is located at one end of the wire harness mounting slot and installed in the second space.

[0015] In some embodiments, the power supply mounting tray has a guide rail on which the power supply module is slidably mounted.

[0016] In some embodiments, at least one waterproof plug is installed at one end of the housing located in the wiring harness mounting slot, and the waterproof plug is configured to introduce an external wiring harness.

[0017] In some embodiments, at least one waterproof plug includes a first waterproof plug and a second waterproof plug arranged at intervals;

[0018] The first waterproof plug is configured to introduce a communication harness, and the second waterproof plug is configured to introduce a power harness.

[0019] In some embodiments, the inner wall surface of the housing facing the wire harness mounting slot is provided with a plurality of first support portions, and the wall surface of the wire harness mounting slot facing the first support portions is provided with a plurality of second support portions;

[0020] Multiple first support parts correspond one-to-one with multiple second support parts, and the sub-plate mounting tray is fixed on the corresponding first support parts and second support parts.

[0021] In some embodiments, the housing includes a first sub-plate and a second sub-plate;

[0022] The first and second daughter boards are spliced ​​together along the extension direction of the wire harness mounting groove to encapsulate one side of the enclosure.

[0023] In some embodiments, the first daughterboard corresponds to a plurality of spaced-apart daughterboard mounting trays, and the second daughterboard corresponds to a motherboard mounting tray.

[0024] In some embodiments, the first sub-plate is provided with an opening; and / or

[0025] The second sub-board has openings.

[0026] In this application, the communication motherboard is installed on the motherboard mounting tray inside the enclosure, and multiple communication daughterboards are installed on the daughterboard mounting trays inside the enclosure. At the same time, the communication motherboard is connected to the communication daughterboards on each daughterboard mounting tray, so that the communication system of multiple photovoltaic inverters in parallel based on power line carrier communication is centrally installed in the communication test box, which helps to reduce the difficulty of communication debugging of multiple inverters in parallel based on power line carrier communication. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 A schematic diagram of a communication test box in an embodiment of this application is shown;

[0029] Figure 2 This paper shows a schematic diagram of a motherboard mounting tray and a communication motherboard in an embodiment of this application.

[0030] Figure 3 This paper shows a schematic diagram of a subboard mounting tray and a communication subboard in an embodiment of this application.

[0031] Figure 4 This illustration shows a schematic diagram of a communication motherboard and multiple communication daughterboards connected in parallel according to an embodiment of this application.

[0032] Figure 5 This paper shows a schematic diagram of a power supply mounting tray and a power supply module in an embodiment of this application.

[0033] Figure 6 A schematic diagram of a communication system according to an embodiment of this application is shown;

[0034] Figure 7 A schematic diagram of the front of the housing is shown in an embodiment of this application.

[0035] The components include: 1. Communication mainboard; 1A interface; 2. Communication subboard; 2A communication board; 2BPLC_STA board; 3. Power supply module; 3A circuit breaker; 3B switching power supply; 3C adapter terminal; 10. Enclosure; 101 first space; 102 second space; 11 support column; 12 handrail; 13 first support part; 14 first subboard; 15 second subboard; 151 opening; 20 mainboard mounting tray; 30 subboard mounting tray; 31 first subboard mounting tray; 32 second subboard mounting tray; 40 wire harness mounting slot; 41 second support part; 50 power supply mounting tray; 51 slide rail; 61 first waterproof plug; 62 second waterproof plug. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0037] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0038] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to implement and use the present invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the present invention can be implemented without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the present invention with unnecessary detail. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0039] This application provides a communication test box, which will be described in detail below. First, refer to... Figure 1 , Figure 1 A schematic diagram of a communication test box in an embodiment of this application is shown, wherein the communication test box includes a box body 10, a motherboard mounting tray 20, multiple daughterboard mounting trays 30, and a wire harness mounting slot 40.

[0040] Specifically, the enclosure 10 can provide installation space for communication modules, power supply devices, etc., to facilitate the integrated installation of multiple circuit modules and the debugging of the power line communication system. Generally, the shape of the enclosure 10 can be approximately cuboid or cube. Support columns 11 can be provided at the bottom of the enclosure 10 to prevent the enclosure 10 from directly contacting the ground. Handrails 12 can be provided on the sides or top of the enclosure 10 to facilitate the handling of the enclosure 10.

[0041] It is understandable that the enclosure 10 can also be other shapes or have other functional structures. For example, the enclosure 10 can also be a cylinder; or the enclosure 10 can also be provided with ventilation grilles to dissipate heat from the electrical equipment inside the enclosure 10.

[0042] The motherboard mounting tray 20 is installed inside the enclosure 10. The motherboard mounting tray 20 houses the communication motherboard 1. For example, taking power line carrier communication as an example, see [reference needed]. Figure 2 , Figure 2 The diagram shows a structural schematic of the motherboard mounting tray 20 and the communication motherboard 1 in an embodiment of this application. The communication motherboard 1 may be a PLC_CCO board containing a CCO (Central Coordinator) communication module. The communication motherboard 1 is provided with multiple interfaces 1A for connecting the communication sub-boards 2. The communication motherboard 1 can serve as the master node of the power line carrier communication system. Through the communication motherboard 1, the data of multiple sub-nodes can be transmitted to the host computer or cloud server.

[0043] Multiple sub-board mounting trays 30 are installed inside the housing 10, and each sub-board mounting tray 30 is equipped with a communication sub-board 2. For example, taking power line carrier communication as an example, see [reference needed]. Figure 3 , Figure 3 The diagram shows a structural schematic of the sub-board mounting tray 30 and the communication sub-board 2 in an embodiment of this application. The communication sub-board 2 can be a communication board 2A containing a communication module and a PLC_STA board 2B containing an STA (Station, terminal) module. As a sub-node of the power line carrier communication system, the communication sub-board 2 can transmit the data of its sub-node access device (e.g.) to the communication motherboard 1 corresponding to the master node. Finally, the data is uploaded to the host computer or cloud server through the communication motherboard 1.

[0044] For example, a motherboard mounting tray 20 and ten daughterboard mounting trays 30 can be installed inside the enclosure 10. Each daughterboard mounting tray 30 is equipped with a communication daughterboard 2. A communication motherboard 1 can be connected to the ten communication daughterboards 2 inside the enclosure 10 through communication cables. The hardware contained in each communication daughterboard 2 simulates the communication hardware used by a single inverter. The ten communication daughterboards 2 are equivalent to ten photovoltaic inverters. Therefore, the data of the ten photovoltaic inverters can be uploaded to the host computer or cloud server through the ten communication daughterboards 2.

[0045] In this embodiment, the communication motherboard 1 is installed on the motherboard mounting tray 20 inside the enclosure 10, and multiple communication daughterboards 2 are respectively installed on the daughterboard mounting trays 30 inside the enclosure 10. At the same time, the communication motherboard 1 is connected to the communication daughterboards 2 on each daughterboard mounting tray 30, so that the communication system of multiple photovoltaic inverters in parallel based on power line carrier communication is centrally installed in the communication test box, which ultimately helps to reduce the difficulty of communication debugging of multiple inverters in parallel based on power line carrier communication.

[0046] In some embodiments of this application, the housing 10 is further provided with a wire harness mounting groove 40, and multiple sub-board mounting trays 30 are arranged at intervals along the extending direction of the wire harness mounting groove 40, with the motherboard mounting tray 20 located at one end of the wire harness mounting groove 40. For example... Figure 1 As shown, the wire harness mounting slot 40 extends vertically, and multiple sub-board mounting trays 30 are arranged at intervals along the vertical direction. Meanwhile, the motherboard mounting tray 20 is located at the bottom of the internal space of the enclosure 10. Therefore, the cables connecting the communication motherboard 1 and the multiple communication sub-boards 2 can be passed through the bottom of the wire harness mounting slot 40 and then introduced to the corresponding communication sub-boards 2 for connection.

[0047] For example, see Figure 4 , Figure 4 This illustration shows a schematic diagram of a communication main board 1 and multiple communication sub-boards 2 connected in parallel in an embodiment of this application. Each communication sub-board 2 includes a PCL_STA board and a communication board 2A. The ARM interface of the PCL_STA board communicates with the PLC interface of the communication board 2A. The PCL_STA board and the communication board 2A serve as sub-nodes for power line carrier communication. The communication main board 1 includes a PLC_CCO board, which serves as the master node for power line carrier communication. Each communication sub-board 2 receives data from the corresponding photovoltaic inverter and transmits it to the PLC_CCO board via the PCL_STA board. Finally, the PLC_CCO board uploads the data to the host computer / monitoring platform, thereby enabling the host computer / monitoring platform to monitor the data or issue commands to each inverter, ultimately realizing the monitoring and control process of the photovoltaic inverter.

[0048] As can be seen from the above embodiments, since multiple daughterboard mounting trays 30 are arranged at intervals along the extension direction of the wire harness mounting slot 40, and the motherboard mounting tray 20 is located at one end of the wire harness mounting slot 40, the communication daughterboards 2 on the multiple daughterboard mounting trays 30 and the communication motherboard 1 on the motherboard mounting tray 20 can be connected through the cables in the wire harness mounting slot 40. This not only reduces the wiring difficulty between the communication daughterboards 2 and the communication motherboard 1, but also allows for the installation of more communication daughterboards 2, so as to facilitate the debugging of the power line carrier system containing more communication daughterboards 2.

[0049] In some embodiments of this application, the wire harness mounting groove 40 divides the internal space of the housing 10 into a first space 101 and a second space 102, and the plurality of sub-board mounting trays 30 include a plurality of first sub-board mounting trays 31 and second sub-board mounting trays 32; the first sub-board mounting trays 31 are arranged at intervals in the first space 101 along the extension direction of the wire harness mounting groove 40, and the second sub-board mounting trays 32 are arranged at intervals in the second space 102 along the extension direction of the wire harness mounting groove 40.

[0050] For example, see Figure 1 The wiring harness mounting slot 40 is located in the housing 10 and extends vertically. Therefore, the wiring harness mounting slot 40 divides the interior left space of the housing 10 into a first space 101 and the interior right space into a second space 102. Multiple first sub-board mounting trays 31 and second sub-board mounting trays 32 are arranged at intervals on both sides of the wiring harness mounting slot 40, so that more communication sub-boards 2 can be installed inside the housing 10, so as to facilitate the commissioning of the power line carrier system containing more communication sub-boards 2.

[0051] In some embodiments of this application, see further reference. Figure 1 The communication test box also includes a power supply mounting tray 50, which is configured to install the power supply module 3; wherein, the motherboard mounting tray 20 is located at one end of the wire harness mounting slot 40 and installed in the first space 101, and the power supply mounting tray 50 is located at one end of the wire harness mounting slot 40 and installed in the second space 102.

[0052] It should be noted that the power supply module 3 can supply power to multiple communication sub-boards 2 and the communication motherboard 1 to facilitate the normal debugging of the power line carrier communication system. Meanwhile, since the motherboard mounting tray 20 is located at one end of the wire harness mounting slot 40 and installed in the first space 101, and the power supply mounting tray 50 is located at one end of the wire harness mounting slot 40 and installed in the second space 102, this means that the communication cables connecting the communication motherboard 1 to multiple communication sub-boards 2 and the power cables connecting the power supply module 3 to multiple communication sub-boards 2 can be centrally installed through the wire harness mounting slot 40 to facilitate the communication and power supply connections of multiple communication sub-boards 2.

[0053] In some embodiments of this application, see Figure 5 , Figure 5The diagram shows a structural schematic of the power supply mounting tray 50 and the power supply module 3 in an embodiment of this application. The power supply module 3 includes a circuit breaker 3A, a switching power supply 3B, and an adapter terminal 3C. The circuit breaker 3A facilitates power-on and power-off control during testing and also protects the entire power supply system. The switching power supply 3B converts the 220V AC power from the grid to 12V DC power, thereby providing low-voltage DC power to the communication sub-board 2 and the communication main board 1. The adapter terminal 3C allows for centralized installation of power lines connecting the various communication sub-boards 2 and the communication main board 1, facilitating the connection of power lines.

[0054] For example, see Figure 6 , Figure 6 A schematic diagram of a communication system in an embodiment of this application is shown, wherein circuit breaker 3A is connected to a 220VAC input interface, switching power supply 3B converts 220V AC power to 12V AC power, and adapter terminal 3C connects each communication sub-board 2 and the communication main board 1, thereby supplying power to each communication sub-board 2 and the communication main board 1. Each communication sub-board 2 is connected to the communication main board 1 through a terminal block, and finally forwards the data of the photovoltaic inverter to the communication main board 1.

[0055] In some embodiments of this application, the power supply mounting tray 50 has a guide rail on which the power supply module 3 is slidably mounted. For example, see [reference needed]. Figure 5 The circuit breaker 3A, the switching power supply 3B, and the adapter terminal 3C are mounted on the guide rail of the power supply mounting tray 50, with the front of the circuit breaker 3A, the switching power supply 3B, and the adapter terminal 3C facing the opening of the enclosure 10. When connecting the power cord or performing maintenance, the positions of the circuit breaker 3A, the switching power supply 3B, and the adapter terminal 3C can be moved through the guide rail, thereby reducing the wiring and maintenance difficulty of the power supply module 3.

[0056] In some embodiments of this application, see further reference. Figure 1 At least one waterproof plug is installed at one end of the housing 10, located in the wiring harness mounting slot 40. The waterproof plug is configured to introduce external wiring harnesses; for example, it can be used to introduce communication cables connecting the communication motherboard 1 to the host computer or backend system; or, for example, it can be used to introduce the 220V AC power line connected to the circuit breaker 3A. Simultaneously, the waterproof plug prevents cable sheath abrasion caused by sharp openings in the housing 10, thus avoiding short circuits between the housing and the power supply line, thereby increasing the long-term safety of the communication test box.

[0057] In some embodiments of this application, at least one waterproof plug includes a first waterproof plug 61 and a second waterproof plug 62 arranged at intervals; the first waterproof plug 61 is configured to introduce a communication harness, and the second waterproof plug 62 is configured to be a power harness.

[0058] For example, see Figure 1The first waterproof plug 61 is located on the left side of the bottom of the enclosure 10 and corresponds to the first space 101. The second waterproof plug 62 is located on the right side of the bottom of the enclosure 10 and corresponds to the second space 102. The first waterproof plug 61 can be used to introduce the communication cable connecting the communication motherboard 1 to the host computer. The second waterproof plug 62 can be used to introduce the 220V AC power line connected to the circuit breaker 3A. Since the first waterproof plug 61 and the second waterproof plug 62 are arranged alternately, the strong current and the weak current can be isolated to ensure electrical safety.

[0059] In some embodiments of this application, see further reference. Figure 1 The inner wall of the housing 10 facing the wire harness mounting slot 40 is provided with multiple first support portions 13, and the wall of the wire harness mounting slot 40 facing the first support portions 13 is provided with multiple second support portions 41. The multiple first support portions 13 and multiple second support portions 41 correspond one-to-one. The sub-plate mounting tray 30 is fixed on the corresponding first support portions 13 and second support portions 41. That is to say, each sub-plate mounting tray 30 can be installed on the first support portion 13 on the inner wall of the housing 10 and the second support portion 41 of the wire harness mounting slot 40. On the one hand, the two ends of the sub-plate mounting tray 30 can be fixed to improve the installation firmness. On the other hand, the sub-plate mounting tray 30 can be installed by a pull-out method, thereby effectively saving internal space and improving assembly efficiency.

[0060] In some embodiments of this application, the housing 10 includes a first sub-board 14 and a second sub-board 15; the first sub-board 14 and the second sub-board 15 are spliced ​​together along the extension direction of the wire harness mounting groove 40 to encapsulate one side of the housing 10.

[0061] For example, see Figure 7 , Figure 7 The diagram shows a schematic of the front of the enclosure 10 in an embodiment of this application. The wiring harness mounting groove 40 extends vertically. The first sub-board 14 and the second sub-board 15 are spliced ​​together vertically and encapsulate the front of the enclosure 10. The separate design of the first sub-board 14 and the second sub-board 15 can reduce the wiring difficulty of the communication test box and avoid the wiring difficulties caused by the large cover plate or the large number of fasteners (such as screws).

[0062] In some embodiments of this application, see further reference. Figure 1 as well as Figure 7 The first sub-board 14 corresponds to multiple spaced sub-board mounting trays 30, and the second sub-board 15 corresponds to the main board mounting tray 20. Therefore, when wiring or repairing the communication sub-board 2 mounted on the sub-board mounting tray 30, only the first sub-board 14 needs to be opened. When wiring or repairing the communication main board 1 mounted on the main board mounting tray 20, only the second sub-board 15 needs to be opened. This helps to shorten the time required to connect or repair the communication sub-board 2 or the communication main board 1 separately.

[0063] In some embodiments of this application, the first sub-board 14 is provided with an opening; and / or the second sub-board 15 is provided with an opening. For example, see below. Figure 7 The second sub-board 15 has an opening 151, which is directly opposite the circuit breaker 3A of the power supply module 3. Therefore, it is convenient for testers to control the circuit breaker 3A to perform power-on and power-off operations through the opening.

[0064] It is worth noting that the above description of the communication test box is intended to clearly illustrate the implementation and verification process of this application. Those skilled in the art can also make equivalent design modifications under the guidance of this application. For example, openings can be made in other design locations of the box.

[0065] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the detailed descriptions of other embodiments above, which will not be repeated here.

[0066] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0067] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0068] The communication test box provided in the embodiments of this application has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A communication test box, characterized in that, include: Box; A motherboard mounting tray is installed inside the enclosure, and a communication motherboard is mounted on the motherboard mounting tray. Multiple sub-board mounting trays are installed inside the housing, and each sub-board mounting tray is equipped with a communication sub-board. The communication motherboard is communicatively connected to the communication subboard on each of the subboard mounting trays.

2. The communication test box as described in claim 1, characterized in that, The box is also equipped with a wire harness mounting groove inside; Multiple daughterboard mounting trays are arranged at intervals along the extension direction of the wire harness mounting slot, and the motherboard mounting tray is located at one end of the wire harness mounting slot.

3. The communication test box as described in claim 2, characterized in that, The wiring harness mounting slot divides the internal space of the enclosure into a first space and a second space, and the plurality of sub-board mounting trays include a plurality of first sub-board mounting trays and a plurality of second sub-board mounting trays; The first sub-board mounting trays are spaced apart in a first space along the extension direction of the wire harness mounting groove, and the second sub-board mounting trays are spaced apart in a second space along the extension direction of the wire harness mounting groove.

4. The communication test box as described in claim 3, characterized in that, The communication test box also includes a power supply mounting tray, which is configured to install a power supply module. The motherboard mounting tray is located at one end of the wiring harness mounting slot and installed in the first space, while the power supply mounting tray is located at one end of the wiring harness mounting slot and installed in the second space.

5. The communication test box as described in claim 4, characterized in that, The power supply mounting tray has a guide rail, on which the power supply module is slidably mounted.

6. The communication test box as described in claim 2, characterized in that, At least one waterproof plug is installed at one end of the housing located in the wiring harness mounting slot, and the waterproof plug is configured to introduce an external wiring harness.

7. The communication test box as described in claim 6, characterized in that, At least one of the waterproof plugs includes a first waterproof plug and a second waterproof plug arranged at intervals; The first waterproof plug is configured to introduce a communication harness, and the second waterproof plug is configured to introduce a power harness.

8. The communication test box as described in claim 2, characterized in that, The inner wall of the housing facing the wire harness mounting slot is provided with a plurality of first support portions, and the wall of the wire harness mounting slot facing the first support portions is provided with a plurality of second support portions. Each of the first support portions corresponds to one of the second support portions, and the sub-plate mounting tray is fixed to the corresponding first support portions and second support portions.

9. The communication test box as described in claim 2, characterized in that, The enclosure includes a first sub-plate and a second sub-plate; The first sub-board and the second sub-board are spliced ​​together along the extension direction of the wire harness mounting groove to encapsulate one side of the housing.

10. The communication test box as described in claim 9, characterized in that, The first sub-board corresponds to a plurality of spaced-apart sub-board mounting trays, and the second sub-board corresponds to the motherboard mounting tray; The first sub-board has an opening; and / or the second sub-board has an opening.

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