A processing apparatus for improving the solder resist quality of thick copper plates

Abstract

This utility model relates to the field of solder resist screen printing and discloses a processing device for improving the solder resist quality of thick copper plates. It includes a tool holder and a mounting bracket connected to the tool holder. A scraper is provided at the bottom of the tool holder, an adjustment component is provided at the top of the tool holder, and a tilting component is provided at the bottom of the tool holder. The adjustment component includes a crossbeam, a vertical rod, and a screw. The vertical rod is slidably connected to the inner wall of the tool holder, and the top of the vertical rod is fixedly connected to the bottom of the crossbeam. A round rod is fixedly connected to the bottom of the vertical rod. The screw passes through the interior of the tool holder and engages with an internal threaded groove on the surface of the tool holder. A knob is fixedly connected to the top of the screw. In this utility model, by passing the bolt through round holes at different positions, the tilt angle of the connecting bracket can be changed, thereby adjusting the contact angle between the scraper and the surface of the thick copper plate. The L-shaped protrusion and the grooves on both sides of the scraper ensure the stability of the scraper and the neatness of the solder resist edge.

Description

Technical Field

[0001] This utility model relates to the field of solder resist screen printing, and in particular to a processing device for improving the solder resist quality of thick copper plates. Background Technology

[0002] A PCB (Printed Circuit Board) is the basic carrier of electronic components, used to support and connect various electronic components and achieve electrical connections. A PCB refers to relatively thick copper conductors formed on its copper layer through specific processes. It is typically used to carry large currents or meet high-power transmission requirements. However, the surface finish and uniformity of thick copper lines are poor, making them susceptible to external environmental influences, leading to oxidation or corrosion. Therefore, to improve the long-term reliability and stability of the circuit board, solder mask processing is required on the thick copper lines. The solder mask layer is a non-conductive protective layer, usually made of solder resist ink coated on the surface of the copper lines on the PCB. It effectively isolates moisture and contaminants in the air, preventing oxidation or corrosion of the copper lines, and also preventing short circuits during soldering, ensuring circuit reliability.

[0003] Solder resist screen printing machines are key equipment in PCB (Printed Circuit Board) manufacturing, used to print solder resist layers on the surface of circuit boards to prevent short circuits or bridging during soldering. Their core function is to precisely apply solder resist ink to the non-soldered areas of the circuit board using screen printing technology, ensuring the safety and reliability of electronic components. However, the surface of thick copper plates is relatively rough, and when the squeegee contacts the printing surface at a vertical angle, the ink cannot fully fill the screen mesh, resulting in blank areas at the edges of the solder resist layer and reducing the uniformity of the solder resist printing. Therefore, a processing device for improving the solder resist quality of thick copper plates is proposed to solve these problems. Utility Model Content

[0004] To overcome the above deficiencies, this utility model provides a processing device for improving the solder resist quality of thick copper plates, aiming to improve the problem in the prior art that "when the squeegee contacts the printing at a vertical angle, the ink is difficult to fully fill the screen mesh, resulting in blanks at the edge of the solder resist layer".

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a processing device for improving the solder resist quality of thick copper plates, comprising a tool holder and a mounting bracket connected to the tool holder, wherein a scraper is provided at the bottom of the tool holder, an adjustment component is provided at the top of the tool holder, and an tilting component is provided at the bottom of the tool holder, the adjustment component comprising a crossbeam, a vertical rod and a screw, the vertical rod being slidably connected to the inner wall of the tool holder, the top of the vertical rod being fixedly connected to the bottom of the crossbeam, a round rod being fixedly connected to the bottom of the vertical rod, the screw passing through the interior of the tool holder and engaging with the internal thread groove on the surface of the tool holder, and a knob being fixedly connected to the top of the screw.

[0006] As a further description of the above technical solution:

[0007] The number of mounting brackets is set to two sets, and the two sets of mounting brackets are fixedly connected to the front and rear sides of the tool holder respectively. The surface of the mounting brackets is provided with mounting holes.

[0008] As a further description of the above technical solution:

[0009] The horizontal beam, vertical rod, and round rod are on the same vertical plane, and the horizontal beam and round rod are parallel to each other.

[0010] As a further description of the above technical solution:

[0011] The screw is threaded onto the inner wall of the internal thread groove.

[0012] As a further description of the above technical solution:

[0013] The tilting assembly includes a circular plate, which is rotatably connected to the outer wall of a circular rod. A connecting frame is fixedly connected to the bottom of the circular plate, and the circular plate is fixedly connected to the vertical rod by bolts.

[0014] As a further description of the above technical solution:

[0015] The circular plate has circular holes on its surface, and the bolt passes through the inside of the circular holes. The number of circular holes is set to multiple, and the multiple circular holes are arranged in a ring at equal angular intervals on the surface of the circular plate.

[0016] As a further description of the above technical solution:

[0017] The tilting assembly also includes a fixing clip, which is sleeved on the outer wall of the connecting frame. The bottom of the fixing clip is provided with a protrusion, which is L-shaped. The two sides of the scraper are provided with grooves that cooperate with the protrusion. The outer wall of the protrusion contacts the inner wall of the groove, and the top of the scraper abuts against the bottom of the connecting frame.

[0018] As a further description of the above technical solution:

[0019] The tilting assembly also includes an adjusting screw, which is threaded onto the inner wall of the fixing clamp. A pressure block is fixedly connected to the bottom of the adjusting screw, and the bottom of the pressure block contacts the top of the connecting frame.

[0020] This utility model has the following beneficial effects:

[0021] 1. In this utility model, by passing the bolt through the round holes at different positions, the tilt angle of the connecting frame can be changed, thereby adjusting the contact angle between the squeegee and the surface of the thick copper plate. The cooperation between the L-shaped protrusion and the grooves on both sides of the squeegee locks the tilt angle and prevents the squeegee from sliding laterally during the printing process, ensuring the stability of the squeegee and the neatness of the solder resist edge.

[0022] 2. In this utility model, by adjusting the fit between the screw and the internal thread groove in the component and the operation of the knob, the height of the scraper can be precisely adjusted. The sliding of the vertical rod on the inner wall of the tool holder, combined with the rigid guidance of the crossbeam and the round rod, enables the scraper to maintain constant pressure on the surface of the thick copper plate, reducing the thickness deviation of the solder resist layer and improving the uniformity and reliability of the solder resist layer. Attached Figure Description

[0023] Figure 1 This is a right-side view of the overall three-dimensional structure of this utility model;

[0024] Figure 2 This is a left-side view of the overall three-dimensional structure of this utility model;

[0025] Figure 3 This is a three-dimensional structural diagram of the tilting component in this utility model;

[0026] Figure 4 This is a three-dimensional exploded view of the tilting component in this utility model.

[0027] Legend:

[0028] 1. Tool holder; 2. Mounting bracket; 3. Scraper; 101. Crossbeam; 102. Vertical rod; 103. Round rod; 104. Screw; 105. Knob; 106. Internal thread groove; 10. Adjustment assembly; 11. Tilting assembly; 111. Round plate; 112. Connecting bracket; 113. Bolt; 114. Round hole; 115. Fixing clamp; 116. Protrusion; 117. Groove; 118. Adjusting screw; 119. Pressure block. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Reference Figure 1 and Figure 2This utility model provides an embodiment of a processing device for improving the solder resist quality of thick copper plates, including a tool holder 1 and a mounting frame 2 connected to the tool holder 1. The number of mounting frames 2 is set to two sets, and the two sets of mounting frames 2 are respectively fixedly connected to the front and rear sides of the tool holder 1. The tool holder 1 serves as the core support structure, supporting the scraper 3, the adjustment component 10, and the tilting component 11, providing a stable mounting base. The surface of the mounting frame 2 is provided with mounting holes, through which the tool holder 1 is mounted on the solder resist screen printing machine. The bottom of the tool holder 1 is provided with a scraper 3, which is used to directly contact the surface of the thick copper plate and achieve precise coating by scraping off excess solder resist ink. The top of the tool holder 1 is provided with an adjustment component 10, and the bottom of the tool holder 1 is provided with a tilting component 11 for adjusting the angle, adapting to the solder resist requirements of copper plates of different thicknesses and reducing the problems of ink accumulation or insufficient coverage.

[0031] Reference Figures 1-3 The adjustment assembly 10 includes a crossbeam 101, a vertical rod 102, and a screw 104. The vertical rod 102 is slidably connected to the inner wall of the blade holder 1. The top of the vertical rod 102 is fixedly connected to the bottom of the crossbeam 101. A round rod 103 is fixedly connected to the bottom of the vertical rod 102. The crossbeam 101, the vertical rod 102, and the round rod 103 are on the same vertical plane. The crossbeam 101 and the round rod 103 are parallel to each other. The crossbeam 101, the vertical rod 102, and the round rod 103 form a rigid guide structure to ensure that the scraper 3 moves only in the vertical direction when the screw 104 is adjusted, thus avoiding uneven printing pressure caused by tilting.

[0032] Reference Figure 1 and Figure 2 The screw 104 passes through the interior of the tool holder 1 and engages with the internal thread groove 106 on the surface of the tool holder 1. The screw 104 is threaded onto the inner wall of the internal thread groove 106. A knob 105 is fixedly connected to the top of the screw 104. By rotating the knob 105, the height of the vertical rod 102 is adjusted to achieve fine adjustment of the height of the scraper 3, ensuring that the scraper 3 maintains constant pressure with the surface of the thick copper plate and reducing the thickness deviation of the solder resist layer.

[0033] Reference Figures 2-4 The tilting component 11 includes a circular plate 111, which is rotatably connected to the outer wall of the circular rod 103. A connecting frame 112 is fixedly connected to the bottom of the circular plate 111. The circular plate 111 is fixedly connected to the vertical rod 102 by bolts 113. A circular hole 114 is provided on the surface of the circular plate 111. The bolts 113 pass through the interior of the circular hole 114. The number of circular holes 114 is set to multiple. The multiple circular holes 114 are arranged in a ring at equal angular intervals on the surface of the circular plate 111. By passing the bolts 113 through the interior of the circular holes 114 at different positions, the tilt angle of the connecting frame 112 can be changed, thereby adjusting the contact angle between the scraper 3 and the surface of the thick copper plate and reducing the ink blank at the edge of the solder resist layer.

[0034] Reference Figures 2-4The tilting component 11 also includes a U-shaped fixing clip 115, which is sleeved on the outer wall of the connecting frame 112. The bottom of the fixing clip 115 is provided with a protrusion 116, which is L-shaped. The two sides of the squeegee 3 are provided with grooves 117 that cooperate with the protrusion 116. The outer wall of the protrusion 116 contacts the inner wall of the groove 117. The protrusion 116 and the groove 117 cooperate with each other to form a snap-fit ​​fixation, preventing the squeegee 3 from sliding laterally during the printing process. The top of the squeegee 3 abuts against the bottom of the connecting frame 112.

[0035] Reference Figures 2-4 The tilting assembly 11 also includes an adjusting screw 118, which is threaded onto the inner wall of the fixing clamp 115. A pressure block 119 is fixedly connected to the bottom of the adjusting screw 118. The bottom of the pressure block 119 contacts the top of the connecting frame 112. Rotating the adjusting screw 118 applies pressure through the pressure block 119, further locking the connection between the connecting frame 112 and the scraper 3.

[0036] Working principle: When in use, the operator first sets the initial height of the scraper 3 by adjusting component 10, rotates knob 105 to drive screw 104 to move along internal thread groove 106, and drives vertical rod 102 to slide up and down, thereby adjusting the position of crossbeam 101 and round rod 103. By observing the thickness of solder resist layer, the scraper 3 is precisely aligned with the surface of thick copper plate and downward pressure is applied to facilitate the precise coating of ink on PCB board.

[0037] When adjusting the angle of the scraper 3, loosen the bolt 113, rotate the circular plate 111 to the desired tilt angle, and achieve multiple position selection through the combination of the circular hole 114 and the bolt 113, so that the scraper 3 can adapt to the pressure of the thick copper plate. Then tighten the bolt 113, and the L-shaped protrusion 116 is inserted into the groove 117 of the scraper 3 to lock the tilt angle. At the same time, the adjusting screw 118 applies pressure through the pressure block 119 to further fix the relative position of the connecting frame 112 and the scraper 3.

[0038] When the solder resist screen printing machine is working, the drive linear motor of the solder resist screen printing machine drives the blade holder 1 to move along the surface of the thick copper plate. The squeegee 3 scrapes off excess solder resist ink at a preset height and angle. The adjustment component 10 and the tilting component 11 work together to ensure that the squeegee 3 remains stable during high-speed movement, avoiding ink bridging or air bubbles between lines. After processing, the squeegee 3 can be quickly disassembled by the fixing clamp 115 and the adjusting screw 118 for easy replacement. The cooperation between the fixing clamp 115 and the adjusting screw 118 ensures that the squeegee 3 is stable and does not deviate during movement. Combined with the rigid structure of the blade holder 1, the edge of the solder resist layer is neat and the thickness is consistent, which can improve the solder resist quality of the thick copper plate.

[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A processing device for improving the solder resist quality of thick copper plate, comprising a tool holder (1) and a mounting frame (2) connected with the tool holder (1), characterized in that: The bottom of the tool holder (1) is provided with a scraper (3), the top of the tool holder (1) is provided with an adjustment component (10), and the bottom of the tool holder (1) is provided with an tilting component (11). The adjustment assembly (10) includes a crossbeam (101), a vertical rod (102), and a screw (104). The vertical rod (102) is slidably connected to the inner wall of the tool holder (1). The top of the vertical rod (102) is fixedly connected to the bottom of the crossbeam (101). A round rod (103) is fixedly connected to the bottom of the vertical rod (102). The screw (104) passes through the interior of the tool holder (1) and cooperates with the internal thread groove (106) on the surface of the tool holder (1). A knob (105) is fixedly connected to the top of the screw (104).

2. The processing apparatus for improving the solder resist quality of thick copper plates according to claim 1, characterized in that: The number of mounting brackets (2) is set to two sets, and the two sets of mounting brackets (2) are fixedly connected to the front and rear sides of the tool holder (1) respectively. The surface of the mounting brackets (2) is provided with mounting holes.

3. The processing apparatus for improving the solder resist quality of thick copper plates according to claim 1, characterized in that: The crossbeam (101), vertical rod (102), and round rod (103) are on the same vertical plane, and the crossbeam (101) and round rod (103) are parallel to each other.

4. The processing apparatus for improving the solder resist quality of thick copper plates according to claim 1, characterized in that: The screw (104) is threaded onto the inner wall of the internal thread groove (106).

5. The processing apparatus for improving the solder resist quality of thick copper plates according to claim 1, characterized in that: The tilting component (11) includes a circular plate (111) which is rotatably connected to the outer wall of the circular rod (103). A connecting frame (112) is fixedly connected to the bottom of the circular plate (111), and the circular plate (111) is fixedly connected to the vertical rod (102) by bolts (113).

6. The processing apparatus for improving the solder resist quality of thick copper plates according to claim 5, characterized in that: The surface of the circular plate (111) is provided with a circular hole (114), and the bolt (113) passes through the interior of the circular hole (114). The number of the circular holes (114) is set to multiple, and the multiple circular holes (114) are arranged in a ring at equal angular intervals on the surface of the circular plate (111).

7. The processing apparatus for improving the solder resist quality of thick copper plates according to claim 6, characterized in that: The tilting assembly (11) also includes a fixing clip (115), which is sleeved on the outer wall of the connecting frame (112). The bottom of the fixing clip (115) is provided with a protrusion (116), which is L-shaped. The scraper (3) has grooves (117) on both sides that cooperate with the protrusion (116). The outer wall of the protrusion (116) contacts the inner wall of the groove (117), and the top of the scraper (3) abuts against the bottom of the connecting frame (112).

8. The processing apparatus for improving the solder resist quality of thick copper plates according to claim 7, characterized in that: The tilting assembly (11) also includes an adjusting screw (118) which is threaded onto the inner wall of the fixing clamp (115). A pressure block (119) is fixedly connected to the bottom of the adjusting screw (118), and the bottom of the pressure block (119) contacts the top of the connecting frame (112).

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