A local refrigeration device for high-density cabinets

Abstract

This invention provides a localized cooling device for high-density server racks, including cooling components and heat dissipation components. Multiple cooling components are installed inside the rack, each providing localized cooling for a specific part of the rack. Each cooling component within a rack is connected to the output end of a heat exchanger via a flexible hose. The heat dissipation components are installed on the outer wall of the rack, with their input end connected to the inside of the rack and their output end connected to the external environment. The advantages of this invention are: the cooling components enable separate cooling of different parts of the rack, and the multiple cooling components within the same rack provide individual cooling for each rack, thus achieving localized cooling for high-density server racks.

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