A polishing slurry mixing device for a polishing machine
By designing a polishing slurry mixing device for polishing machines, the problem of inaccurate polishing slurry preparation was solved, achieving accurate slurry supply and safety, and improving the quality and automation of wafer processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WAFER WORKS ZHENGZHOU CORP
- Filing Date
- 2025-08-05
- Publication Date
- 2026-07-03
Smart Images
Figure CN224442896U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing technology, and specifically relates to a polishing slurry mixing device for a polishing machine. Background Technology
[0002] Semiconductor wafers, as the core material for integrated circuit manufacturing, have seen their quality requirements continuously rise with the rapid advancement of semiconductor technology. In the wafer production process, polishing is a critical manufacturing step, and its processing quality directly determines the performance indicators and technical parameters of the finished chip. Currently, the commonly used wafer polishing method is chemical mechanical polishing (CMP). Specifically, the wafer is placed between the upper and lower disks of a polishing machine, which then rotate and introduce polishing slurry to polish the wafer. Therefore, the polishing slurry directly affects the quality of the polished wafer.
[0003] In actual wafer polishing, the polishing slurry usually needs to be mixed and prepared in advance. A common method is for the operator to pour the polishing slurry and pure water, among other ingredients, into a mixing tank in a specific ratio. After mixing, the mixture is ready for use on the polishing machine. However, operators often cannot precisely control the amount of polishing slurry added, resulting in either too much or too little, leading to abnormal parameters in the mixed slurry and consequently, defective wafer quality after polishing. Furthermore, since the polishing slurry is a chemical, accidental contact with it can affect the operator's health.
[0004] Therefore, a polishing slurry mixing device is needed. When liquid preparation is required, this device can automatically supply polishing slurry to the mixing tank, and at the same time, it can also measure the polishing slurry to ensure the accuracy and safety of the polishing slurry supply. Utility Model Content
[0005] The purpose of this invention is to provide a polishing slurry mixing device for a polishing machine to address the shortcomings of existing technologies.
[0006] The objective of this utility model is achieved through the following technical solution:
[0007] A polishing slurry mixing device for a polishing machine includes a mixing tank, a raw slurry tank, and a delivery pump;
[0008] The raw material tank is used to store the polishing slurry raw material;
[0009] A first pipeline is provided between the raw slurry tank and the inlet end of the delivery pump;
[0010] A second pipeline and a return pipeline are respectively provided between the outlet end of the delivery pump and the mixing tank and the raw slurry tank;
[0011] The second pipeline is equipped with a raw slurry flow meter; each of the pipelines is equipped with a raw slurry control valve;
[0012] The mixing device also includes a pure water delivery pipeline connected to the mixing tank.
[0013] Preferably, the raw slurry control valve on the first pipeline is a first pneumatic valve;
[0014] The raw slurry control valve on the second pipeline is a second pneumatic valve;
[0015] The slurry control valve on the return pipeline is a manual valve.
[0016] Preferably, the pure water delivery pipeline is equipped with a pure water control valve and a pure water flow meter.
[0017] Preferably, a transparent liquid level tube is provided on the outside of the mixing tank to display the liquid level inside the mixing tank.
[0018] Preferably, the pulp tank is provided with a lid.
[0019] Preferably, the mixing device provided in this application further includes a support, and the raw pulp tank is fixed on the support.
[0020] Preferably, the mixing device provided in this application further includes a base, and the delivery pump is fixed on the base.
[0021] Preferably, the mixing tank is provided with a first tank lid and a second tank lid;
[0022] The area of the second bucket lid is larger than that of the first bucket lid.
[0023] Preferably, the second lid covers the entire upper surface of the mixing barrel, and the second lid has a through hole, with the first lid covering the through hole.
[0024] Preferably, the volume of the mixing tank is larger than that of the raw slurry tank.
[0025] This application addresses some problems in the polishing slurry preparation process of polishing machines by providing a polishing slurry mixing device for polishing machines. This device makes the polishing slurry preparation process much more convenient, ensuring not only the accuracy of slurry replenishment but also greater safety and reliability. This achieves the goals of improving product yield, increasing the automation level of the machine, and enhancing personnel safety. Therefore, the polishing slurry mixing device provided in this application has good practical value and technological improvement significance in the semiconductor wafer processing and manufacturing process. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of the front side of the mixing device provided in this application;
[0027] Figure 2This is a schematic diagram of the rear of the mixing device;
[0028] Figure 3 This is a schematic diagram of the right side of the mixing device;
[0029] Figure 4 This is a schematic diagram of the upper side of the mixing device.
[0030] Explanation of reference numerals in the attached figures:
[0031] 1-First tank cover; 2-Liquid level pipe; 3-Mixing tank; 4-Second tank cover; 5-Second pipeline; 6-Pulp flow meter; 7-Pulp tank; 8-Tank cover; 9-Transfer pump; 10-Base; 11-First pipeline; 12-Second pneumatic valve; 13-Manual valve; 14-Return pipeline; 15-First pneumatic valve; 16-Support. Detailed Implementation
[0032] This application provides a polishing slurry mixing device for a polishing machine, such as... Figures 1-4 As shown, it includes a mixing tank 3, a raw pulp tank 7, and a transfer pump 9.
[0033] The raw polishing slurry tank 7 is used to store the raw polishing slurry. Preferably, the raw polishing slurry tank 7 is equipped with a lid 8, which is normally closed and only opened when adding the raw polishing slurry, effectively preventing foreign objects from entering the tank and contaminating the slurry. Preferably, the raw polishing slurry tank 7 is fixed to the support 16. The raw polishing slurry tank 7 can be in various shapes such as cylindrical or rectangular.
[0034] The delivery pump 9 is used to transport slurry. Preferably, the delivery pump 9 is a diaphragm pump. The delivery pump 9 is fixed on the base 10 to prevent abnormalities such as shaking during operation and to improve the stability of the delivery pump operation.
[0035] A first pipeline 11 is provided between the raw slurry tank 7 and the inlet end of the transfer pump 9; a second pipeline 5 and a return pipeline 14 are provided between the outlet end of the transfer pump 9 and the mixing tank 3 and the raw slurry tank 7, respectively; through the transfer pump 9, the first pipeline 11 and the second pipeline 5, the polishing slurry in the raw slurry tank 7 can be automatically transported to the mixing tank 3. A raw slurry flow meter is provided on the second pipeline 5 to measure the slurry in the second pipeline 5 in real time to ensure the accuracy of the slurry supply. Each pipeline is equipped with a raw slurry control valve to facilitate the control of pipeline opening and closing and the adjustment of slurry delivery flow rate. The return pipeline 14 is used to divert the slurry in the second pipeline 5. The reason for diversion is that the slurry flow rate supplied by the transfer pump 9 is too large and unstable, which will cause the raw slurry flow meter 6 to measure inaccurately, resulting in too much or too little slurry being replenished. After diversion, the supplied slurry flow rate can be stabilized to ensure the accuracy of the replenished slurry.
[0036] The mixing device also includes a pure water delivery pipeline connected to the mixing tank, used to deliver a certain amount of pure water to the mixing tank to mix with the polishing slurry stock, thus preparing a polishing slurry that meets the requirements. Preferably, the pure water delivery pipeline is equipped with a pure water control valve and a pure water flow meter for convenient control of pure water delivery and metering. The pure water control valve is preferably a pneumatic valve.
[0037] Preferably, the raw slurry control valve on the first pipeline 11 is a first pneumatic valve 15; the raw slurry control valve on the second pipeline 5 is a second pneumatic valve 12; and the raw slurry control valve on the return pipeline 14 is a manual valve 13. The pneumatic valves are automatically controllable and are located on the first and second pipelines, facilitating the delivery and flow adjustment and control of the polishing slurry raw material. The manual valves are relatively stable and suitable for use in return pipelines where the flow rate of the return slurry is not frequently adjusted.
[0038] The mixing tank 3 can be cylindrical, rectangular, or similar in shape. It is mainly used for mixing slurry. Since a large amount of pure water needs to be added during the mixing process, the volume of the mixing tank 3 is preferably larger than that of the original slurry tank 7.
[0039] Preferably, a transparent liquid level tube 2 is provided on the outside of the mixing tank 3, which allows the liquid level inside the mixing tank 3 to be seen in real time, thus avoiding supply abnormalities due to too much or too little slurry in the tank.
[0040] Preferably, the mixing tank 3 is provided with a first tank cover 1 and a second tank cover 4; the area of the second tank cover 4 is larger than that of the first tank cover 1. When the automatic supply of raw pulp and pure water is abnormal, the first tank cover 1 can be opened to add them manually, and the internal condition of the tank can be observed through the first tank cover. When the mixing tank needs maintenance and cleaning, the larger area of the second tank cover 4 can be opened.
[0041] More preferably, the second lid 4 covers the entire upper surface of the mixing barrel 3, and the second lid 4 has a through hole, with the first lid 1 covering the through hole.
[0042] The specific workflow of the mixing device provided in this application is as follows:
[0043] When slurry needs to be supplied, the first pneumatic valve 15 and the second pneumatic valve 12 are opened, and the delivery pump 9 is started to transport the slurry in the raw slurry tank 7 sequentially through the first pipeline 11 and the second pipeline 5 to the mixing tank 3. The return pipeline 14 returns excess slurry to the raw slurry tank 7, while also ensuring an appropriate slurry flow rate in the second pipeline 5. The raw slurry flow meter 6 measures the flow rate in real time to ensure accurate slurry supply. When the slurry reaches the preset amount, the first pneumatic valve 15 and the second pneumatic valve 12 are closed. Simultaneously, the pure water control valve is opened, and a certain amount of pure water is added to the mixing tank through the pure water delivery pipeline. The pure water flow meter measures the flow rate in real time, and the pure water control valve automatically closes after the set amount is reached. After replenishment, the slurry and pure water are mixed in the mixing tank 3 and finally supplied to the polishing machine.
[0044] Therefore, this application improves upon some problems in the polishing slurry preparation process of a polishing machine, and provides a polishing slurry mixing device for a polishing machine. This device makes the polishing slurry preparation process very convenient, not only ensuring the accuracy of slurry replenishment, but also ensuring its safety and reliability, thereby achieving the goals of improving product yield, increasing the automation level of the machine, and improving personnel safety. Therefore, the polishing slurry mixing device provided by this application has good practical value and technical improvement significance in the semiconductor wafer processing and manufacturing process.
[0045] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from its spirit and scope. Thus, if these modifications and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and modifications.
Claims
1. A polishing slurry mixing device for a polishing machine, characterized by, Includes mixing tank, pulp tank, and transfer pump; The raw material tank is used to store the polishing slurry raw material; A first pipeline is provided between the raw slurry tank and the inlet end of the delivery pump; A second pipeline and a return pipeline are respectively provided between the outlet end of the delivery pump and the mixing tank and the raw slurry tank; The second pipeline is equipped with a raw slurry flow meter; each of the pipelines is equipped with a raw slurry control valve; The mixing device also includes a pure water delivery pipeline connected to the mixing tank.
2. The polishing slurry mixing device for a polishing machine as described in claim 1, characterized in that, The raw slurry control valve on the first pipeline is a first pneumatic valve; The raw slurry control valve on the second pipeline is a second pneumatic valve; The slurry control valve on the return pipeline is a manual valve.
3. The polishing slurry mixing device for a polishing machine as described in claim 1, characterized in that, The pure water delivery pipeline is equipped with a pure water control valve and a pure water flow meter.
4. The polishing slurry mixing device for a polishing machine as described in claim 1, characterized in that, The mixing tank is equipped with a transparent liquid level tube on the outside to display the liquid level inside the mixing tank.
5. The polishing slurry mixing device for a polishing machine as described in claim 1, characterized in that, The raw pulp tank is equipped with a lid.
6. The polishing slurry mixing device for a polishing machine as described in claim 1, characterized in that, It also includes a support frame; The raw pulp tank is fixed to the bracket.
7. The polishing slurry mixing device for a polishing machine as described in claim 1, characterized in that, It also includes a base; The delivery pump is fixed to the base.
8. The polishing slurry mixing device for a polishing machine as described in claim 1, characterized in that, The mixing tank is equipped with a first tank lid and a second tank lid; The area of the second bucket lid is larger than that of the first bucket lid.
9. The polishing slurry mixing device for a polishing machine as described in claim 8, characterized in that, The second lid covers the entire upper surface of the mixing barrel, and the second lid has a through hole, which is covered by the first lid.
10. The polishing slurry mixing device for a polishing machine as described in claim 1, characterized in that, The volume of the mixing tank is larger than that of the raw slurry tank.