Automatic polishing liquid mixing and supplying system
By designing an automated polishing slurry mixing and replenishment system, the problem of time-consuming and labor-intensive manual replenishment was solved, the accuracy of polishing slurry ratio and process stability were achieved, and the efficiency and output of silicon wafer polishing were improved.
CN224445614UActive Publication Date: 2026-07-03SHANDONG YOUYAN AISI SEMICON MATERIALS CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANDONG YOUYAN AISI SEMICON MATERIALS CO LTD
- Filing Date
- 2025-07-17
- Publication Date
- 2026-07-03
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Figure CN224445614U_ABST
Abstract
The utility model provides a kind of polishing solution automatic mixing supply system, including original solution unit, mixing unit, liquid supply unit;Original solution unit has original solution barrel and original solution pump, original solution pump import is connected to original solution barrel, and original solution pump export is equipped with original solution barrel liquid supply pipeline and original solution barrel circulation pipeline;Mixing unit has metering barrel, mixing barrel, water supply pipeline and mixing barrel pump, metering barrel import connects original solution barrel liquid supply pipeline, and metering barrel export connects mixing barrel;Water supply pipeline connects mixing barrel;Mixing barrel pump import is connected to the bottom of mixing barrel, and mixing pump export is equipped with mixing barrel liquid supply pipeline and connects to the top of mixing barrel mixing barrel circulation pipeline;Liquid supply unit has liquid supply barrel, and liquid supply barrel connects mixing barrel liquid supply pipeline and is connected with machine table by liquid supply pipeline, and liquid supply pump is equipped on liquid supply pipeline;Original solution barrel, metering barrel, mixing barrel, liquid supply barrel are equipped with liquid level sensor.The utility model effectively improves work efficiency and polishing solution proportioning accuracy rate, and it is helpful to the promotion of process stability and yield.
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