A semiconductor surface insulating thin film processing apparatus

Abstract

This application relates to the technical field of insulating film processing equipment, and discloses a semiconductor surface insulating film processing device, including a base plate. An adjusting track is fixedly connected to the upper surface of the base plate, and two symmetrically arranged winding frames are slidably connected inside the adjusting track. This semiconductor surface insulating film processing device, through the cooperation of an electromagnetic spring and a distance sensor, uses the distance sensor to monitor the change in film roll diameter in real time and feeds feedback to an external control system to dynamically adjust the output pressure of the electromagnetic spring. This ensures that the pressure applied to the film by the pressure roller always adaptively matches the change in roll diameter, effectively solving the problem of winding slack caused by tension fluctuations in traditional devices. It ensures uniform interlayer tightness during winding, significantly improves the flatness and consistency of film winding, and avoids film damage caused by rigid contact of traditional mechanical springs. The use of a bidirectional screw-driven adjusting track and a detachable winding roller structure enables the winding of films of different sizes.

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