A temperature-controlled storage device

Abstract

This application discloses a temperature-controlled storage device, including a main body comprising a housing; a cooling base comprising a cooling module, a power supply module, and a control module, wherein the cooling module and the power supply module are respectively electrically connected to the control module; and an identification module disposed on the main body and / or the cooling base, adapted to establish a communication connection with the control module. The main body is detachably installed at a preset position on the cooling base, enabling the cooling base to identify the main body. The control module is adapted to control the cooling module to cool the internal space of the housing. A communication connection can be established between the main body and the cooling base, allowing the cooling base to acquire information from the main body and adopt targeted cooling strategies to improve cooling efficiency, optimize cooling energy consumption, and extend battery life.

Description

Technical Field

[0001] This application relates to the field of refrigeration technology, specifically the design of a temperature-controlled storage device. Background Technology

[0002] Temperature-controlled storage devices, as common electrical appliances, play an important role in people's daily lives, mainly used to store food, beverages, and other items to extend their shelf life and maintain freshness. These devices typically consist of a storage compartment and a cooling base, usually designed as a single unit. However, with the rise of outdoor activities such as camping and picnics, some temperature-controlled storage devices that can operate independently of an external power outlet have become popular. Due to portability requirements, these devices are mostly designed as separate units, meaning the storage compartment and cooling base can be separated.

[0003] However, the separate design prevents the storage unit and the cooling base from establishing a communication or identification connection via cables. Because the storage unit and cooling base cannot communicate or identify each other, when the cooling base is installed outside storage units of different sizes and capacities, the cooling base cannot recognize the different storage units. It can only operate according to a predetermined mode, unable to flexibly adjust its cooling and power supply strategies for different storage units. This not only wastes electricity but may also affect the food preservation effect. Furthermore, the inability of the storage unit to establish a communication or identification connection with the cooling base can also lead to the cooling base starting up accidentally. Summary of the Invention

[0004] One objective of this application is to provide a temperature-controlled storage device to solve the problem that the storage box and the cooling base cannot establish a communication connection in existing split-type temperature-controlled storage devices.

[0005] To achieve the above objectives, the technical solution adopted in this application is: a temperature-controlled storage device, comprising:

[0006] Equipment body;

[0007] A refrigeration base, comprising a refrigeration module, a power supply module, and a control module, wherein the refrigeration module and the power supply module are respectively electrically connected to the control module;

[0008] The device also includes an identification module disposed on the device body and / or the refrigeration base. The identification module is adapted to establish a communication connection with the control module when the device body is installed in a preset position on the refrigeration base, so that the control module can identify the device body and / or obtain the device information of the device body.

[0009] As a preferred embodiment, the identification module is disposed on the refrigeration base, and the identification module is implemented as a micro switch. The micro switch circuit is connected to the control module. When the device body is installed on the refrigeration base, the device body triggers the micro switch disposed on the refrigeration base, and the control module identifies the device body.

[0010] Alternatively, the identification module is disposed on the refrigeration base, and the identification module is implemented as a photoelectric sensor or a position sensor. The photoelectric sensor or position sensor circuit is connected to the control module. When the main body of the device is installed on the refrigeration base, the photoelectric sensor or the position sensor acquires the position information of the main body of the device, and the control module identifies the main body of the device.

[0011] Alternatively, the identification module is disposed on the device body, the device body is provided with a connection terminal that is connected to the identification module circuit, and the cooling base is provided with a connection port that is connected to the control module circuit. When the device body is installed on the cooling base, the connection terminal is connected to the connection port, the identification module transmits the device identification code to the control module, and the control module identifies the device body and obtains the device information of the device body.

[0012] Further preferably, the identification module is disposed on the device body and the cooling base. The identification module disposed on the device body is implemented as an identification resistor. The device body is provided with a connection terminal connected to the identification resistor circuit. The identification module disposed on the device body is implemented as a resistance detector. The resistance detector circuit is connected to the control module. The cooling base is provided with a connection port connected to the resistance detector. When the device body is installed on the cooling base, the connection terminal is connected to the connection port. The resistance detector obtains the resistance value information of the identification resistor and transmits it to the control module. The control module identifies the device body and obtains the device information of the device body.

[0013] Furthermore, the main body of the device includes a power module and a connection terminal. The power module is circuitically connected to the connection terminal. The cooling base includes a connection port. The control module is circuitically connected to the connection port. The main body of the device is detachably mounted on the cooling base so that the connection terminal and the connection port are mated. Through the mating of the connection terminal and the connection port, the power supply module is used as the power supply for the main body of the device and the cooling base, wherein:

[0014] The identification module is disposed on the main body of the device, and the identification module circuit is connected to the connection terminal;

[0015] Alternatively, the identification module is disposed on the cooling base, and the identification module circuit is connected to the connection port;

[0016] Alternatively, the identification module may be disposed on the device body and the cooling base, with the identification module circuit disposed on the device body connected to the connection terminal, and the identification module circuit disposed on the cooling base connected to the connection port.

[0017] Furthermore, the main body of the device also includes a power consumption module, a power supply module, and connection terminals. The power consumption module is circuitically connected to the connection terminals, and the power supply module is circuitically connected to both the power consumption module and the connection terminals. The cooling base includes a connection port, and the control module is circuitically connected to the connection port. The main body of the device is detachably mounted on the cooling base so that the connection terminals and the connection port are mated. At least one of the power supply module and the power supply module is used as a power source for the main body of the device and the cooling base, wherein:

[0018] The identification module is disposed on the main body of the device, and the identification module circuit is connected to the connection terminal;

[0019] Alternatively, the identification module is disposed on the cooling base, and the identification module circuit is connected to the connection port;

[0020] Alternatively, the identification module may be disposed on the device body and the cooling base, with the identification module circuit disposed on the device body connected to the connection terminal, and the identification module circuit disposed on the cooling base connected to the connection port.

[0021] Furthermore, the power module can be selected as at least one of a temperature detection module, a display module, a defrosting and ice-breaking module, a discharge module, or an audio module.

[0022] Furthermore, the identification module can be implemented as an identification chip or an MCU unit.

[0023] Furthermore, the identification chip is one of an EEPROM, an FC / SPI device, or an NFC tag.

[0024] Furthermore, the temperature-controlled storage device includes multiple device bodies, each device body is respectively equipped with a corresponding identification module, and when the control module establishes a communication connection with different identification modules, the control module controls the cooling module to execute different cooling strategies.

[0025] Furthermore, the main body of the device is at least one of a storage box, a storage box with semiconductor cooling, an ice maker body, and a cooling fan body.

[0026] Compared with the prior art, the beneficial effects of this application are as follows:

[0027] The main body of the device and the cooling base can establish a communication connection. The cooling base can obtain the device information of the main body. Since the internal space structure of different main bodies of the device is different, the cooling base can take targeted cooling strategies based on the obtained device information, thereby improving cooling efficiency, optimizing cooling energy consumption, and extending battery life. At the same time, the cooling base can determine whether the main body of the device is installed in place by whether a communication connection is established between the main body and the cooling base. The cooling base only starts when the main body of the device is installed in place, thereby avoiding accidental start-up of the cooling base. Attached Figure Description

[0028] Figure 1 This is a three-dimensional structural diagram of the first embodiment of the temperature-controlled storage device in this application.

[0029] Figure 2 This is an exploded view of the first embodiment of the temperature-controlled storage device in this application.

[0030] Figure 3 This is a cross-sectional schematic diagram of the first embodiment of the temperature-controlled storage device in this application.

[0031] Figure 4 This is a three-dimensional structural diagram of the second embodiment of the temperature-controlled storage device in this application.

[0032] Figure 5 This is a schematic diagram of a module of a second embodiment of the temperature-controlled storage device in this application.

[0033] Figure 6A This is a schematic diagram of a module of a third embodiment of the temperature-controlled storage device in this application.

[0034] Figure 6B This is a schematic diagram of the module of the fourth embodiment of the temperature-controlled storage device in this application.

[0035] Figure 7 This is a schematic diagram of the module of the fifth embodiment of the temperature-controlled storage device in this application.

[0036] In the diagram: 100, main body of the equipment; 100A, storage box; 100B, storage box with semiconductor refrigeration; 100C, ice maker main body; 100D, main body of the cooling fan; 110, power module; 120, power module; 130, connection terminal; 200, refrigeration base; 210, refrigeration module; 211, compressor; 212, condenser; 213, evaporator; 214, cooling fan; 220, power supply module; 230, control module; 240, connection port; 300, identification module; 310, MCU unit; 320, identification chip; 330, identification resistor.

[0037] 100. Main body of the equipment; 110. Housing; 120. Identification module; 121. MCU unit; 122. Identification chip; 123. Identification resistor; 130. Power module; 140. Power supply module; 150. Connection terminal; 200. Refrigeration base; 210. Refrigeration module; 211. Compressor; 212. Condenser; 213. Evaporator; 214. Refrigeration fan; 220. Power supply module; 230. Control module; 240. Connection port. Detailed Implementation

[0038] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0039] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0040] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0041] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0042] like Figure 1-7 As shown in the figure, this application provides a temperature-controlled storage device, which includes:

[0043] The equipment body 100 includes a housing with a storage space.

[0044] The cooling base 200 includes a cooling module 210, a power supply module 220, and a control module 230. The cooling module 210 and the power supply module 220 are respectively electrically connected to the control module 230.

[0045] And an identification module 300, which is disposed on the device body 100 and / or the cooling base 200. The identification module 300 is adapted to establish a communication connection with the control module 230 when the device body 100 is installed in a preset position on the cooling base 200, so that the control module 230 identifies the device body 100 and / or obtains the device information of the device body 100. The control module 230 is adapted to control the cooling module 210 to cool the device body 100.

[0046] It is worth mentioning that the identification module 300 only establishes a communication connection when the device body 100 and the cooling base 200 are correctly installed. In other words, the correct installation of the device body 100 and the cooling base 200 can be determined by whether a communication connection is established between the identification module 300 and the control module 230. Therefore, the control module 230 is configured to control the cooling module 210 to start only after a communication connection is established with the identification module 300, thereby preventing the cooling module 210 from mistakenly starting and wasting power when the device body 100 and the cooling base 200 are not correctly installed.

[0047] Furthermore, based on the modular design of the device body 100 and the cooling base 200, the cooling base 200 can be used in combination with different types of device bodies 100, such as storage cabinet 100A, storage cabinet 100B with semiconductor cooling, ice maker body 100C, and air cooler body 100D. Different device bodies 100 require different cooling strategies. Using only a single cooling strategy to cool the device body 100 would result in low cooling efficiency and wasted power. The temperature-controlled storage device provided in this embodiment allows for a communication connection between the device body 100 and the cooling base 200. The control module 230 can identify the device body 100 and obtain its device information through the identification module 300. The control module 230 can then adopt targeted cooling strategies based on the device information of the device body 100, improving cooling efficiency while optimizing cooling energy consumption and extending battery life.

[0048] Furthermore, the refrigeration module 210 is selected as an air-cooled refrigeration module 210. Specifically, the main body 100 is provided with a first air outlet and a second air outlet connecting its internal storage space. The refrigeration module 210 includes a compressor 211, a condenser 212, an evaporator 213, a refrigeration fan 214, and a refrigeration chamber. The evaporator 213 and the refrigeration fan 214 are located inside the refrigeration chamber. The evaporator 213 is adapted to cool the refrigeration chamber through heat exchange. The refrigeration base 200 is provided with an air outlet and a return air outlet connecting the refrigeration chamber. When the main body 100 is installed on the refrigeration base 200, the first air outlet is connected to the air outlet, and the second air outlet is connected to the return air outlet. The storage space is connected to the refrigeration chamber. The refrigeration fan 214 can drive the cold airflow in the refrigeration chamber to flow between the storage space and the refrigeration chamber to cool the storage space.

[0049] In some embodiments, the identification module 300 is disposed on the cooling base 200. The identification module 300 is implemented as a micro switch. The micro switch circuit is connected to the control module 230. When the device body 100 is installed on the cooling base 200, the device body 100 triggers the micro switch. The control module 230 identifies that the device body 100 and the cooling base 200 are correctly installed. At this time, the user can control the cooling module 210 to start through the control panel disposed on the cooling base 200 and connected to the control module 230 circuit.

[0050] In some embodiments, the identification module 300 is disposed on the cooling base 200. The identification module 300 is implemented as a photoelectric sensor or a position sensor. The photoelectric sensor and the position sensor circuit are connected to the control module 230. When the device body 100 is installed on the cooling base 200, the photoelectric sensor or the position sensor obtains the position information of the device body 100. The control module 230 identifies that the device body 100 and the cooling base 200 are correctly installed. At this time, the user can control the cooling module 210 to start through the control panel disposed on the cooling base 200 and connected to the control module 230 circuit.

[0051] like Figure 6AAs shown, in some embodiments, the identification module 300 is disposed on the device body 100, and the device body 100 is provided with a connection terminal 130, which is electrically connected to the identification module 300. The cooling base 200 is provided with a connection port 240, which is electrically connected to the control module 230. When the device body 100 is installed on the cooling base 200, the connection terminal 130 and the connection port 240 are connected. Through the connection of the connection terminal 130 and the connection port 240, the identification module 300 can transmit the device identification code of the device body 100 to the control module 230. The control module 230 identifies that the device body 100 with the corresponding device identification code is correctly installed on the cooling base 200 and obtains the device information of the device body 100. At this time, the user can control the cooling module 210 to start through the control panel disposed on the cooling base 200 and electrically connected to the control module 230, and the control module 230 will automatically adjust the cooling strategy according to the device information of the device body 100.

[0052] In this embodiment, the identification module 300 can be implemented as an MCU unit 310 or an identification chip 320 (e.g., EEPROM, I2C / SPI device, NFC tag, etc.). The MCU unit 310 or the identification chip 320 can store different information, so different device entities 100 can store different identification codes in the MCU unit 310 or the identification chip 320. After the MCU unit 310 or the identification chip 320 establishes a communication connection with the control module 230, the control module 230 can read the identification code in the MCU unit 310 or the identification chip 320 to identify the device entity 100 and obtain the device information of the device entity 100 to distinguish different device entities 100.

[0053] like Figure 6BAs shown, in some embodiments, the identification module 300 is disposed on the device body 100 and the cooling base 200. The identification module 300 disposed on the device body 100 is implemented as an identification resistor 330. The device body 100 is provided with a connection terminal 130, which is circuitically connected to the identification resistor 330. The identification module 300 disposed on the cooling base 200 is implemented as a resistance detector. The resistance detector circuit is connected to the control module 230. The cooling base 200 is provided with a connection port 240, which is connected to the resistance detector. When the device body 100 is installed on the cooling base 200... The connection terminal 130 is connected to the connection port 240. Through the connection terminal 130 and the connection port 240, the resistance detector obtains the resistance value information of the identification resistor 330 and transmits it to the control module 230. The control module 230 identifies that the device body 100 and the cooling base 200 are correctly installed and obtains the device information of the device body 100. At this time, the user can control the cooling module 210 to start through the control panel set on the cooling base 200 and connected to the control module 230. The control module 230 will automatically adjust the cooling strategy according to the device information of the device body 100.

[0054] In this embodiment, the resistance values ​​of the identification resistors 330 set on different device bodies 100 are different. After the identification resistor 330 is connected to the resistance detector circuit, the resistance detector can determine the resistance value of the identification resistor 330 according to the change of current and transmit the resistance value information to the control module 230. The control module 230 can distinguish different device bodies 100 according to the resistance value information.

[0055] Furthermore, in some preferred embodiments, the device body 100 includes a power module 120 and a connection terminal 130. The power module 120 is electrically connected to the connection terminal 130. The cooling base 200 includes a connection port 240. The control module 230 is electrically connected to the connection port 240. The device body 100 is detachably mounted on the cooling base 200 so that the connection terminal 130 and the connection port 240 are connected. Through the connection of the connection terminal 130 and the connection port 240, the power supply module 220 of the cooling base 200 is used as the power supply for the device body 100 and the various modules on the cooling base 200.

[0056] Furthermore, in some other preferred embodiments, the device body 100 includes a power module 120, a power supply module 110, and a connection terminal 130. The power module 120 is electrically connected to the connection terminal 130, and the power supply module 110 is electrically connected to both the power module 120 and the connection terminal 130. The cooling base 200 includes a connection port 240, and the control module 230 is electrically connected to the connection port 240. The device body is detachably mounted on the cooling base 200 so that the connection terminal 130 and the connection port 240 are connected. Through the connection terminal 130 and the connection port 240, at least one of the power supply module 110 of the device body 100 and the power supply module 220 of the cooling base 200 is used as the power supply for each module on the device body 100 and the cooling base 200. That is, the power supply module 110 and the power supply module 220 can supply power simultaneously or alternately.

[0057] The type of power module 120 is not limited. For example, the power module 120 can be implemented as a temperature detection module. The temperature detection module is installed in the storage space and its circuit is connected to the connection terminal 130. The temperature detection module is connected to the control module 230 through the connection terminal 130 and the connection port 240. The temperature detection module is suitable for acquiring the temperature information of the storage space and transmitting the temperature information to the control module 230. The control module 230 is suitable for controlling the cooling module 210 to execute different cooling strategies according to the temperature information. When the temperature information is close to the preset temperature, the control module 230 controls the cooling module 210 to operate in a low-power state. When the temperature information is far from the preset temperature, the control module 230 controls the cooling module 210 to operate in a high-power state. In other words, the control module 230 can control the cooling module 210 in a closed loop according to the temperature information in the storage space, thereby improving the cooling efficiency, optimizing the cooling energy consumption, and extending the battery life.

[0058] Of course, in addition to the temperature detection module mentioned above, the power module 120 can also be implemented as at least one of the following: a display module, a defrosting and ice-breaking module, a discharge module, or an audio module.

[0059] In another embodiment, such as Figure 7 As shown, the temperature-controlled storage device includes multiple device bodies 100, each device body 100 having a different housing and a corresponding identification module 300. When the control module 230 establishes a communication connection with the identification module 300, the control module 230 controls the refrigeration module 210 to start.

[0060] The main body of the equipment 100 is at least one of the following: storage box 100A, storage box 100B with semiconductor cooling, ice maker body 100C, and air cooler body 100D.

[0061] More preferably, when the cooling base 200 establishes a communication connection with different identification modules 300, the control module 230 controls the cooling module 210 to start different cooling modes.

[0062] The main body of the equipment 100 is a storage box 100A, which has a storage cavity. The storage cavity and the cooling base 200 form an air-cooled circuit to regulate the cold air inside the storage box 100A. The storage cavity can store items such as food and medicine.

[0063] The main body of the device 100 is a storage box 100B with semiconductor cooling. The storage box 100B with semiconductor cooling can be kept at a low temperature independently away from the cooling base 200.

[0064] The main body of the equipment 100 is the ice maker body 100C, which can be used for air-cooled ice making.

[0065] It is worth mentioning that the main body of the device 100 is equipped with a cover to close the storage space, in order to prevent cold air from leaking out of the opening.

[0066] When the main body 100 of the device is the cooling fan body 100D, the cooling fan body 100D can be connected to the external space to blow out cool air to reduce the ambient temperature for user use.

[0067] The identification module 300 is disposed in at least one of the cooling base 200 and the object being cooled. The cooling base 200 can identify different objects being cooled in order to provide different cooling solutions.

[0068] When triggered by the user, the cooling module 210 operates in at least one of the following modes: heat preservation mode, cold air mode, rapid cooling mode, and extreme cooling mode:

[0069] When the cooling base 200 identifies the object to be cooled as storage box 100A or semiconductor-cooled storage box 100B, the cooling module 210 operates in rapid cooling or heat preservation mode.

[0070] When the cooling base 200 detects that the temperature of the storage box 100A or the semiconductor-cooled storage box 100B is higher than the insulation temperature, the compressor 211 operates in high-speed mode, and the cooling fan 214 operates in high-speed mode.

[0071] When the cooling base 200 detects that the temperature of the storage box 100A or the semiconductor-cooled storage box 100B is lower than the temperature difference threshold for rapid cooling, the compressor 211 can start in intermittent mode, and the cooling fan 214 can operate in intermittent mode or normal mode to achieve heat preservation.

[0072] When the cooling base 200 identifies the object to be cooled as the ice maker body 100B, the cooling module 210 operates in extreme cooling mode, the compressor 211 starts in continuous high-speed mode, and the cooling fan 214 operates in fan extreme speed mode to achieve cooling.

[0073] When the cooling base 200 identifies the object to be cooled as the main body of the cooling fan 100D, the cooling module 210 operates in extreme cooling mode, the compressor 211 starts in continuous high-speed mode, and the cooling fan 214 operates in high-speed fan mode to continuously blow cold air outward.

[0074] Optionally, the compressor 211 continues to cool continuously until the ambient temperature falls below the user-preset temperature. Optionally, after the ambient temperature falls below the user-preset temperature, the compressor 211 can start intermittently to achieve a heat preservation effect.

[0075] The cooling base 200 is compatible with different device bodies 100. The cooling base 200 can implement different cooling solutions, making it more versatile and adaptable to a wider range of applications. The different cooling solutions refer to the cooling base 200 providing different frequencies, different airflow rates, and different temperatures.

[0076] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A temperature-controlled storage device, characterized by, include: Equipment body; A refrigeration base, comprising a refrigeration module, a power supply module, and a control module, wherein the refrigeration module and the power supply module are respectively electrically connected to the control module; The device also includes an identification module disposed on the device body and / or the refrigeration base. The identification module is adapted to establish a communication connection with the control module when the device body is installed in a preset position on the refrigeration base, so that the control module can identify the device body and / or obtain the device information of the device body.

2. The temperature-controlled storage apparatus of claim 1, wherein, The identification module is disposed on the refrigeration base, and the identification module is implemented as a micro switch. The micro switch circuit is connected to the control module. When the main body of the device is installed on the refrigeration base, the main body of the device triggers the micro switch disposed on the refrigeration base, and the control module identifies the main body of the device. Alternatively, the identification module is disposed on the refrigeration base, and the identification module is implemented as a photoelectric sensor or a position sensor. The photoelectric sensor or position sensor circuit is connected to the control module. When the main body of the device is installed on the refrigeration base, the photoelectric sensor or the position sensor acquires the position information of the main body of the device, and the control module identifies the main body of the device.

3. The temperature-controlled storage apparatus of claim 1, wherein, The identification module is disposed on the main body of the device. The main body of the device is provided with a connection terminal that is connected to the circuit of the identification module. The cooling base is provided with a connection port that is connected to the circuit of the control module. When the main body of the device is installed on the cooling base, the connection terminal is connected to the connection port. The identification module transmits the device identification code to the control module. The control module identifies the main body of the device and obtains the device information of the main body of the device.

4. The temperature-controlled storage device of claim 1, wherein, The identification module is disposed on the device body and the cooling base. The identification module disposed on the device body is implemented as an identification resistor. The device body is provided with a connection terminal connected to the identification resistor circuit. The identification module disposed on the device body is implemented as a resistance detector. The resistance detector circuit is connected to the control module. The cooling base is provided with a connection port connected to the resistance detector. When the device body is installed on the cooling base, the connection terminal is connected to the connection port. The resistance detector obtains the resistance value information of the identification resistor and transmits it to the control module. The control module identifies the device body and obtains the device information of the device body.

5. The temperature-controlled storage apparatus of claim 1, wherein, The main body of the device includes a power module and connection terminals. The power module is electrically connected to the connection terminals. The cooling base includes a connection port. The control module is electrically connected to the connection port. The main body of the device is detachably mounted on the cooling base so that the connection terminals and the connection port are connected. Through the connection terminals and the connection port, the power supply module is used as the power supply for the main body of the device and the cooling base, wherein: The identification module is disposed on the main body of the device, and the identification module circuit is connected to the connection terminal; Alternatively, the identification module is disposed on the cooling base, and the identification module circuit is connected to the connection port; Alternatively, the identification module may be disposed on the device body and the cooling base, with the identification module circuit disposed on the device body connected to the connection terminal, and the identification module circuit disposed on the cooling base connected to the connection port.

6. The temperature-controlled storage apparatus of claim 1, wherein, The main body of the device further includes a power consumption module, a power supply module, and connection terminals. The power consumption module is circuitically connected to the connection terminals, and the power supply module is circuitically connected to both the power consumption module and the connection terminals. The cooling base includes a connection port, and the control module is circuitically connected to the connection port. The main body of the device is detachably mounted on the cooling base so that the connection terminals and the connection port are mated. At least one of the power supply module and the power supply module is used as a power source for the main body of the device and the cooling base, wherein: The identification module is disposed on the main body of the device, and the identification module circuit is connected to the connection terminal; Alternatively, the identification module is disposed on the cooling base, and the identification module circuit is connected to the connection port; Alternatively, the identification module may be disposed on the device body and the cooling base, with the identification module circuit disposed on the device body connected to the connection terminal, and the identification module circuit disposed on the cooling base connected to the connection port.

7. The temperature-controlled storage device of any of claims 5-6, wherein, The power module can be selected as at least one of a temperature detection module, a display module, a defrosting and ice-breaking module, a discharge module, or an audio module.

8. The temperature-controlled storage device of claim 3, wherein, The identification module can be implemented as an identification chip or an MCU unit.

9. The temperature-controlled storage device of claim 8, wherein, The identification chip is one of an EEPROM, an FC / SPI device, or an NFC tag.

10. The temperature-controlled storage device of claim 1, wherein, The temperature-controlled storage device includes multiple device bodies, each device body is equipped with a corresponding identification module, and when the control module establishes a communication connection with different identification modules, the control module controls the cooling module to execute different cooling strategies.

11. The temperature-controlled storage device as described in claim 1, characterized in that, The main body of the device is at least one of the following: a storage box, a storage box with semiconductor cooling, an ice maker body, and a cooling fan body.

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