An optical module

Abstract

In the optical module provided in this disclosure, one end of a first flexible circuit board is connected to a circuit board. The first flexible circuit board includes a first electrical connection surface and a second electrical connection surface, with the first electrical connection surface facing away from the circuit board and the second connection surface facing the circuit board. The first flexible circuit board also includes a first inclined surface, a second inclined surface, and a third inclined surface. The first inclined surface is electrically connected to the first electrical connection surface, the second inclined surface is connected to the first inclined surface, and the third inclined surface is used to connect the second inclined surface and the second electrical connection surface. The axis of the first inclined surface forms a first bending angle with the axis of the second inclined surface. The axis of the third inclined surface forms a second bending angle with the axis of the second inclined surface. The third inclined surface is inclined relative to the second electrical connection surface, which can guide the first bending angle and the second bending angle to be acute angles within a preset range, reduce bending moment, disperse stress distribution, thereby reducing stress concentration caused by bending and improving the bending resistance of the first flexible circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve. Utility Model Content

[0003] In some embodiments, an optical module is provided to give the flexible circuit board strong bending resistance.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Circuit board;

[0006] A first flexible circuit board, one end of which is electrically connected to the circuit board, includes:

[0007] The first electrical connection surface faces away from the circuit board;

[0008] The second electrical connection surface is electrically connected to the circuit board and faces the circuit board.

[0009] The first inclined surface is connected to the first electrical connection surface;

[0010] The second inclined surface is connected to the first inclined surface; the axis of the first inclined surface and the axis of the second inclined surface form a first bending angle.

[0011] A third inclined surface is used to connect the second inclined surface and the second electrical connection surface; the axis of the third inclined surface and the axis of the second inclined surface form a second bending angle; the third inclined surface is inclined relative to the second electrical connection surface to guide the first bending angle and the second bending angle to form an acute angle within a preset range.

[0012] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board and a first flexible circuit board. One end of the first flexible circuit board is connected to the circuit board. The first flexible circuit board includes a first electrical connection surface and a second electrical connection surface. The first electrical connection surface faces away from the circuit board, and the second connection surface is electrically connected to the circuit board and faces the circuit board. Since the first electrical connection surface faces away from the circuit board, the first flexible circuit board exhibits multi-directional bending and turning to adapt to the relative spatial relationship between the first and second electrical connection surfaces. However, stress concentration is easily generated at the bending points, reducing the bending resistance of the first flexible circuit board. The first flexible circuit board also includes a first inclined surface and a second inclined surface. The first inclined surface is electrically connected to the first electrical connection surface, and the second inclined surface is connected to the first inclined surface. The first and second inclined surfaces exhibit inclinations in different directions, so that the first flexible circuit board forms a bending structure between the first and second electrical connection surfaces, and the first flexible circuit board turns to adapt to the relative spatial relationship between the first and second electrical connection surfaces. The axis of the first inclined surface and the axis of the second inclined surface form a first bending angle. The first flexible circuit board includes a third inclined surface, which connects the second inclined surface and the second electrical connection surface. This third connection surface allows for a smoother transition when the second flexible circuit board is connected to the circuit board, preventing sharp bends. The axis of the third inclined surface forms a second bending angle with the axis of the second inclined surface. The inclination of the third inclined surface relative to the second electrical connection surface guides the first and second bending angles to be acute angles within a preset range, reducing bending moment and dispersing stress distribution. This reduces stress concentration caused by bending and improves the bending resistance of the first flexible circuit board.

[0013] In some embodiments, a first fillet is formed at the connection between the first inclined surface and the second inclined surface, and a second fillet is formed at the connection between the third inclined surface and the second inclined surface;

[0014] The radius of curvature of the first fillet and the radius of curvature of the second fillet are both greater than the preset radius of curvature.

[0015] The above technical solution has the following advantages or beneficial effects: a first rounded corner is formed at the connection between the first and second inclined surfaces, and a second rounded corner is formed at the connection between the third and second inclined surfaces. The design of the first and second rounded corners allows the first flexible circuit board to form a smooth transition at the bending point, avoiding sharp edges, thereby reducing stress concentration and improving the bending resistance of the first flexible circuit board. Simultaneously, the radii of curvature of the first and second rounded corners are greater than the preset radii of curvature, reducing the stress concentration coefficient and further reducing stress concentration, thus improving the bending resistance of the first flexible circuit board.

[0016] In some embodiments, the second electrical connection surface is parallel to the circuit board; the first inclined surface is inclined relative to the first electrical connection surface into the optical module;

[0017] The second inclined surface is connected to the bottom end of the first inclined surface and is inclined relative to the first inclined surface toward the second electrical connection surface;

[0018] The third inclined surface is inclined outward relative to the second electrical connection surface to the optical module in order to connect to the second inclined surface.

[0019] The above technical solution has the following advantages or beneficial effects: The second electrical connection surface is parallel to the circuit board, facilitating electrical connection with the circuit board. The first inclined surface is inclined inward relative to the first electrical connection surface towards the optical module, gradually guiding the first flexible circuit board to bend inward towards the optical module, causing a certain deformation of the first flexible circuit board to facilitate connection to the second electrical connection surface. The second inclined surface connects to the bottom end of the first inclined surface and is inclined towards the second electrical connection surface relative to the first inclined surface, further guiding the first flexible circuit board to bend towards the circuit board. The third inclined surface is inclined outward relative to the second electrical connection surface towards the optical module to connect to the second inclined surface, forming a smooth transition, avoiding abrupt bending, thereby dispersing stress and improving bending resistance.

[0020] In some embodiments, the angle between the third inclined surface and the axis pointing into the optical module in the second electrical connection surface is not less than 100°;

[0021] The second bending angle is less than the first bending angle, and the first bending angle is no greater than 70°.

[0022] The above technical solution has the following advantages or beneficial effects: the angle between the third inclined surface and the axis pointing into the optical module in the second electrical connection surface is not less than 100°, which can guide the second inclined surface to present a relatively gentle state, thereby reducing the first bending angle and the second bending angle, and reducing stress concentration. The second bending angle is smaller than the first bending angle, and the first bending angle is controlled within 70°, which allows the first flexible circuit board to achieve a smooth transition during the bending process, avoiding abrupt bending, effectively reducing stress concentration, and improving its bending resistance.

[0023] In some embodiments, the radius of curvature of the first fillet and the radius of curvature of the second fillet are both greater than 0.15 mm.

[0024] The above technical solution has the following advantages or beneficial effects: the radius of curvature of the first fillet and the second fillet is greater than 0.15 mm, which can ensure a sufficiently smooth transition at the bend, further reduce stress concentration, and improve the bending resistance of the first flexible circuit board.

[0025] In some embodiments, an optical module is provided, comprising:

[0026] Circuit board;

[0027] A first flexible circuit board, one end of which is electrically connected to the circuit board, includes:

[0028] The first electrical connection surface faces away from the circuit board;

[0029] The second electrical connection surface is electrically connected to the circuit board and faces the circuit board.

[0030] The first inclined surface is connected to the first electrical connection surface;

[0031] The second inclined surface is connected to the first inclined surface; the axis of the first inclined surface and the axis of the second inclined surface form a first bending angle; the length of the edge of the second inclined surface facing the inside of the optical module is less than the length of the edge facing the outside of the optical module.

[0032] A third inclined surface is used to connect the second inclined surface and the second electrical connection surface; the axis of the third inclined surface and the axis of the second inclined surface form a second bending angle; the third inclined surface is inclined relative to the second electrical connection surface to guide the first bending angle and the second bending angle to form an acute angle within a preset range.

[0033] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board and a first flexible circuit board. One end of the first flexible circuit board is connected to the circuit board. The first flexible circuit board includes a first electrical connection surface and a second electrical connection surface. The first electrical connection surface faces away from the circuit board, and the second connection surface is electrically connected to the circuit board and faces the circuit board. Since the first electrical connection surface faces away from the circuit board, the first flexible circuit board exhibits multi-directional bending and turning to adapt to the relative spatial relationship between the first and second electrical connection surfaces. However, stress concentration is easily generated at the bending points, reducing the bending resistance of the first flexible circuit board. The first flexible circuit board also includes a first inclined surface and a second inclined surface. The first inclined surface is electrically connected to the first electrical connection surface, and the second inclined surface is connected to the first inclined surface. The edge length of the second inclined surface facing the inside of the optical module is less than the edge length facing the outside of the optical module, so that the second inclined surface gradually tilts towards the direction of the first inclined surface, and the first inclined surface can tilt relative to the second inclined surface towards the outside of the optical module, thereby guiding the first inclined surface to easily connect with the first electrical connection surface. The first and second inclined surfaces are inclined in different directions, causing the first flexible circuit board to form a bent structure between the first and second electrical connection surfaces. This causes the first flexible circuit board to rotate to adapt to the relative spatial relationship between the first and second electrical connection surfaces. The axis of the first inclined surface forms a first bending angle with the axis of the second inclined surface. The first flexible circuit board includes a third inclined surface that connects the second inclined surface and the second electrical connection surface. This third connecting surface allows for a smoother transition when the second flexible circuit board is connected to the circuit board, avoiding abrupt bending. The axis of the third inclined surface forms a second bending angle with the axis of the second inclined surface. The inclination of the third inclined surface relative to the second electrical connection surface guides the first and second bending angles to be acute angles within a preset range, reducing bending moment, dispersing stress distribution, thereby reducing stress concentration caused by bending and improving the bending resistance of the first flexible circuit board.

[0034] In some embodiments, the optical module includes an optical receiving component with its end face facing away from the circuit board; the first flexible circuit board is electrically connected to the optical receiving component and the circuit board to match the relative positions between the optical receiving component and the circuit board.

[0035] The above technical solution has the following advantages or beneficial effects: the optical module includes an optical receiving component, the end face of which faces away from the circuit board. A first flexible circuit board electrically connects the optical receiving component and the circuit board to match the relative positions between the optical receiving component and the circuit board, and has strong resistance to bending.

[0036] In some embodiments, a first fillet is formed at the connection between the first inclined surface and the second inclined surface, and a second fillet is formed at the connection between the third inclined surface and the second inclined surface;

[0037] The radius of curvature of the first fillet and the radius of curvature of the second fillet are both greater than the preset radius of curvature.

[0038] The above technical solution has the following advantages or beneficial effects: a first rounded corner is formed at the connection between the first and second inclined surfaces, and a second rounded corner is formed at the connection between the third and second inclined surfaces. The design of the first and second rounded corners allows the first flexible circuit board to form a smooth transition at the bending point, avoiding sharp edges, thereby reducing stress concentration and improving the bending resistance of the first flexible circuit board. Simultaneously, the radii of curvature of the first and second rounded corners are greater than the preset radii of curvature, reducing the stress concentration coefficient and further reducing stress concentration, thus improving the bending resistance of the first flexible circuit board.

[0039] In some embodiments, the third inclined surface and the second electrical connection surface are in...

[0040] The included angle between the axes pointing into the interior of the optical module is not less than 100°;

[0041] The second bending angle is less than the first bending angle, and the first bending angle is no greater than 70°.

[0042] The above technical solution has the following advantages or beneficial effects: the angle between the third inclined surface and the axis pointing into the optical module in the second electrical connection surface is not less than 100°, which can guide the second inclined surface to present a relatively gentle state, thereby reducing the first bending angle and the second bending angle, and reducing stress concentration. The second bending angle is smaller than the first bending angle, and the first bending angle is controlled within 70°, which allows the first flexible circuit board to achieve a smooth transition during the bending process, avoiding abrupt bending, effectively reducing stress concentration, and improving its bending resistance.

[0043] In some embodiments, the radius of curvature of the first fillet and the radius of curvature of the second fillet are both greater than 0.15 mm.

[0044] The above technical solution has the following advantages or beneficial effects: the radius of curvature of the first fillet and the second fillet is greater than 0.15 mm, which can ensure a sufficiently smooth transition at the bend, further reduce stress concentration, and improve the bending resistance of the first flexible circuit board. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0046] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0047] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0048] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0049] Figure 4 An exploded view of an optical module according to some embodiments;

[0050] Figure 5 This is a structural diagram of the internal structure of an optical module according to some embodiments;

[0051] Figure 6 This is an exploded view of the interior of an optical module according to some embodiments;

[0052] Figure 7 This is an assembly diagram of a light emitting component and a light receiving component according to some embodiments;

[0053] Figure 8 This is a schematic diagram of the optical path of an optical emitting component and an optical receiving component according to some embodiments;

[0054] Figure 9 This is a partial internal structure diagram of an optical module according to some embodiments;

[0055] Figure 10 This is a first flexible circuit board assembly diagram according to some embodiments;

[0056] Figure 11 A three-dimensional structural diagram of a first flexible circuit board according to some embodiments;

[0057] Figure 12 This is a diagram showing the unfolded structure of a first flexible circuit board according to some embodiments. Detailed Implementation

[0058] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0059] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0060] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0061] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0062] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0063] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0064] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0065] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0066] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0067] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0068] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0069] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0070] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0071] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0072] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0073] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0074] Figure 2This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0075] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0076] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0077] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0078] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0079] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0080] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0081] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0082] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0083] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0084] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0085] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0086] like Figure 3 and Figure 4As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0087] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0088] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0089] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0090] In some implementations, the gold fingers 301 are disposed on one side of the surface of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is required.

[0091] In some implementations, the gold fingers of the circuit board extend from the opening 204 and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0092] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0093] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0094] Figure 5 This is a diagram illustrating the internal structure of an optical module according to some embodiments. Figure 6 This is an exploded view of the interior of an optical module according to some embodiments. Figure 5 and Figure 6 As shown, in some embodiments, the optical module includes an optical emitting component 400. The optical emitting component 400 is electrically connected to the circuit board 300. The optical emitting component 400 is configured to convert received electrical signals into optical signals.

[0095] In some embodiments, the optical module includes an optical receiving component 500. The optical receiving component 500 is electrically connected to the circuit board 300. The optical receiving component 500 is configured to convert received optical signals into electrical signals.

[0096] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0097] In some embodiments, the optical module includes a circular-square tube 330. The sidewalls of the circular-square tube have openings.

[0098] In some embodiments, the light emitting component 400 is embedded in the opening of the round-square tube 330. The light receiving component 500 is embedded in the opening of the round-square tube 330. The light receiving component 500 and the light emitting component 400 are disposed on adjacent sidewalls of the round-square tube 330.

[0099] In some embodiments, the optical module includes a fiber optic adapter 340. The fiber optic adapter 340 is embedded within the opening of the round-square tube 330. The fiber optic adapter 340 can be disposed opposite to the optical emitting component 400. The fiber optic adapter 340 can be disposed adjacent to the optical receiving component 500. The optical signal generated by the optical emitting component 400 is output through the fiber optic adapter 340, and the optical signal to be transmitted to the optical receiving component 500 is input through the fiber optic adapter 340.

[0100] In some embodiments, the light emitting component 400 and the light receiving component 500 may be electrically connected to the surface of the circuit board 300 via a flexible circuit board.

[0101] In some embodiments, the light emitting component 400 is electrically connected to the surface of the circuit board 300 via a second flexible circuit board 320. One end of the second flexible circuit board 320 is electrically connected to the light emitting component 400, and the other end is electrically connected to the surface of the circuit board 300. The light receiving component 500 is electrically connected to the surface of the circuit board 300 via a first flexible circuit board 310. One end of the first flexible circuit board 310 is electrically connected to the light receiving component 500, and the other end is electrically connected to the surface of the circuit board 300.

[0102] Figure 7 This is an assembly diagram of a light emitting component and a light receiving component according to some embodiments. Figure 8 This is a schematic diagram of the optical path of an optical emitting component and an optical receiving component according to some embodiments. Figure 7 and Figure 8 As shown, in some embodiments, an optical component is disposed within the inner cavity of the round-square tube 330. The optical component includes a filter 331.

[0103] In some embodiments, the filter 331 is located at the intersection of the emission optical path of the light emitting component 400 and the reception optical path of the light receiving component 500. The filter 331 may be tilted, and along the light emission direction of the light emitting component 400, the filter 331 gradually tilts closer to the fiber optic adapter 340. The filter 331 is configured to transmit the optical signal generated by the light emitting component 132 and reflect the optical signal input to the light receiving component 500 via the fiber optic adapter 340.

[0104] In some embodiments, after the optical signal emitted by the optical emitting component 400 enters the round-square tube 330, the optical signal directly passes through the optical filter 331 and enters the optical fiber adapter 340 to realize the transmission of the optical signal.

[0105] In some embodiments, the optical signal output along the fiber optic adapter 340 is incident on the surface of the filter 331 and reflected by the filter 331 into the light receiving component 500.

[0106] In some embodiments, to prevent reflected light from returning to the optical emitting component 400 at the fiber end face, the optical components within the round-square tube 330 further include an optical isolator 332, which is located between the optical emitting component 400 and the filter 331. The optical signal generated by the optical emitting component 400 can directly pass through the optical isolator 332 and the filter 331, thus preventing the light signal reflected from the fiber end face of the fiber optic adapter 340 from passing through the filter 331 but not through the optical isolator 332, thereby preventing it from entering the optical emitting component 400 and ensuring the light emission quality of the optical emitting component 400.

[0107] In some embodiments, since the filter 331 is a semi-transparent and semi-reflective film, when the light signal generated by the light emitting component 400 passes through the filter 331, part of the light signal is reflected at the filter 331, and the reflected light signal undergoes diffuse reflection within the round-square tube 330, forming crosstalk light.

[0108] In some embodiments, to avoid signal crosstalk caused by crosstalk light, the optical components within the round-square tube 330 further include a light-absorbing sheet 333, which is disposed on the reflected light path of the light signal emitted by the light emitting component 400 after reflection by the filter 331. The light-absorbing sheet 333 can absorb the light signal reflected at the filter 331, thereby reducing the formation of crosstalk light.

[0109] In some embodiments, the light-absorbing sheet 333 is fixed to the surface of the mounting base 334. The mounting base 334 is configured to support the light-absorbing sheet 333. The mounting base 334 is embedded in the opening of the round-square tube 330.

[0110] Figure 9 This is a partial internal structural diagram of an optical module according to some embodiments. For example... Figure 9 As shown, in some embodiments, the light emitting component 400 and the light receiving component 500 are disposed inside the opening of the adjacent side wall of the round-square tube 330, and the emitting end face of the light emitting component 400 and the receiving end face of the light receiving component 500 have different orientations.

[0111] In some embodiments, the circular-square tube 330 includes a first sidewall 335 and a second sidewall 336 disposed adjacent to each other. The first sidewall 335 forms a first opening 337, and the second sidewall 336 forms a second opening 338. An optical receiving component 500 is embedded in the first opening 337, and an optical emitting component 400 is embedded in the second opening 338, making the optical module structure more compact and preventing crosstalk between the optical signal emitted by the optical emitting component 400 and the optical signal received by the optical receiving component 500.

[0112] In some embodiments, if the first port 337 faces away from the circuit board 300, then the end face of the light receiving component 500 faces away from the circuit board 300. If the second port 338 faces the circuit board 300, then the end face of the light emitting component 400 faces the circuit board 300.

[0113] In some embodiments, the first sidewall 335 and the second sidewall 336 are perpendicular to each other, the end face of the light emitting component 400 is parallel to the first sidewall 335, and the end face of the light receiving component 500 is parallel to the second sidewall 336. Since the first sidewall 335 and the second sidewall 336 are perpendicular to each other, the end face of the light emitting component 400 and the end face of the light receiving component 500 are perpendicular to each other.

[0114] In some embodiments, the end face of the light emitting component 400 faces the circuit board 300. The receiving end face of the light receiving component 500 faces one of the lower side plates 2022 of the lower housing 202, and the end face of the light receiving component 500 faces away from the circuit board 300.

[0115] In some embodiments, the light receiving component 500 is electrically connected to the circuit board 300 via a first flexible circuit board 310. The light emitting component 400 is electrically connected to the circuit board 300 via a second flexible circuit board 320. The first flexible circuit board 310 and the second flexible circuit board 320 can be bent and folded to adapt to the compact spatial layout inside the optical module 200. In some embodiments, the first flexible circuit board 310 and the second flexible circuit board 320 can both be polyimide (PI) flexible circuit boards, which have excellent high temperature and low temperature resistance and can be used for a long time in the range of -200°C to 300°C. It is understood that when the positions of the light emitting component 400 and the light receiving component 500 are interchanged, the first flexible circuit board 310 is electrically connected to the light emitting component 400 and the circuit board 300, and the second flexible circuit board 320 is electrically connected to the light receiving component 500 and the circuit board. The following embodiments use the example of the first flexible circuit board 310 being electrically connected to the light receiving component 500 and the circuit board 300 for illustrative purposes.

[0116] In some embodiments, if the end face of the light receiving component 500 faces away from the circuit board 300, the normal vector of the end face of the light receiving component 500 cannot intersect with the normal vector of the circuit board 300. Therefore, the first flexible circuit board 310 needs to bend in multiple directions, generating twists and turns, to match the relative spatial and angular relationships between the light receiving component 500 and the circuit board 300, thereby achieving an electrical connection between them. If the end face of the light emitting component 400 faces the circuit board 300, the normal vector of the end face of the light emitting component 400 can intersect with the normal vector of the circuit board 300. The second flexible circuit board 320 can then electrically connect the light emitting component 400 and the circuit board 300 without twisting. Based on this, the second flexible circuit board 320 experiences less stress concentration compared to the first flexible circuit board 310, and the risk of breakage is lower. The first flexible circuit board 310 is prone to stress concentration, and the risk of breakage is higher.

[0117] In some embodiments, the end face of the light emitting component 400 faces the circuit board 300. Then, one end face of the second flexible circuit board 320 is parallel to the light emitting component 400, and the other end face is parallel to the circuit board 300. The extension direction of the second flexible circuit board 320 is from the light emitting component 400 to the circuit board 300, so as to adapt to the spatial positional relationship between the light emitting component 400 and the circuit board 300, and realize the electrical connection between the light emitting component 400 and the circuit board 300.

[0118] In some embodiments, the second flexible circuit board 320 may include a third electrical connection surface 321 and a fourth electrical connection surface 322. The third electrical connection surface 321 is electrically connected to the light emitting component 400, and the fourth electrical connection surface 322 is electrically connected to the circuit board 300. The third electrical connection surface 321 is parallel to the light emitting component 400, and the fourth electrical connection surface 322 is parallel to the circuit board 300.

[0119] In some embodiments, the second flexible circuit board 320 may include a bent portion 323. One end of the bent portion 323 is electrically connected to a third electrical connection surface 321, and the other end is electrically connected to a fourth electrical connection surface 322. The bent portion 323 bends downward. The bent portion 323 can reduce the space occupied by the second flexible circuit board 320.

[0120] In some embodiments, the end of the circuit board 300 facing the light emitting component 400 is formed with a clearance notch 302 to avoid the bending portion 323 of the second flexible circuit board 320. The bending portion 323 can be smoothly embedded in the clearance notch 302 without being squeezed or damaged.

[0121] In some embodiments, a first flexible circuit board 310 is connected between the light receiving component 500 and the circuit board 300. Based on the spatial relationship between the light receiving component 500 and the circuit board 300, the first flexible circuit board 310 can electrically connect the light receiving component 500 and the circuit board by rotation and bending. The first flexible circuit board 310 is subjected to bending stress in multiple directions, which can easily cause stress concentration and increase the risk of breakage of the first flexible circuit board 310.

[0122] Figure 10 This is a first flexible circuit board assembly diagram according to some embodiments. Figure 11 A three-dimensional structural diagram of a first flexible circuit board according to some embodiments. Figure 12 This is a diagram showing the unfolded structure of a first flexible circuit board according to some embodiments. Figures 10-12 As shown, in some embodiments, the first flexible circuit board 310 is twisted and oriented to accommodate the relative positional relationship between the light receiving component 500 and the circuit board 300.

[0123] In some embodiments, the first flexible circuit board 310 may include a first electrical connection surface 311. The first electrical connection surface 311 is electrically connected to the light receiving component 500. The first electrical connection surface 311 may face the end face of the light receiving component 500 and is electrically connected to the light receiving component 500. The first electrical connection surface 311 is parallel to the end face of the light receiving component 500, and the two end faces are arranged side by side.

[0124] In some embodiments, the first flexible circuit board 310 may include a second electrical connection surface 312. The second electrical connection surface 312 is electrically connected to the circuit board 300. The second electrical connection surface 312 may face the surface of the circuit board 300 and is electrically connected to the circuit board 300. The second electrical connection surface 312 is parallel to the surface of the circuit board 300.

[0125] In some embodiments, the first electrical connection surface 311 faces away from the circuit board 300, and the second electrical connection surface 312 faces the circuit board 300. The first electrical connection surface 311 is electrically connected to the light receiving component 500, and the second electrical connection surface 312 is electrically connected to the circuit board 300. Since the first electrical connection surface 311 faces away from the circuit board, the first flexible circuit board 310 exhibits multi-directional bending and turning to adapt to the relative spatial relationship between the first electrical connection surface 311 and the second electrical connection surface 312. However, stress concentration is easily generated at the bending points, reducing the bending resistance of the first flexible circuit board 310.

[0126] In some embodiments, the first flexible circuit board 310 may include a first inclined surface 313. The first inclined surface 313 is connected to the first electrical connection surface 311. The first inclined surface 313 and the first electrical connection surface 311 are respectively in a vertical state, and are vertical surfaces.

[0127] In some embodiments, the first flexible circuit board 310 may include a second inclined surface 314. The second inclined surface 314 is connected to the first inclined surface 313. The second inclined surface 314 is connected to the bottom end of the first inclined surface 313 and begins to slope horizontally relative to the first inclined surface 313 to gradually connect to the horizontal second electrical connection surface 312.

[0128] In some embodiments, the first inclined surface 313 and the second inclined surface 314 are inclined in different directions so that the first flexible circuit board 310 forms a bending structure between the first electrical connection surface 311 and the second electrical connection surface 312. The first flexible circuit board bends and turns at a certain angle to match the relative spatial relationship between the first electrical connection surface 311 and the second electrical connection surface 312, such as the relative angle between them, thereby adapting to the relative spatial relationship between the light receiving component 500 and the circuit board 300.

[0129] In some embodiments, the first inclined surface 313 is inclined toward the interior of the optical module relative to the first electrical connection surface 311, gradually guiding the first flexible circuit board 310 to bend toward the interior of the optical module, causing the first flexible circuit board 310 to rotate to facilitate connection to the second electrical connection surface 312. The second inclined surface 314 is connected to the bottom end of the first inclined surface 313 and is inclined toward the second electrical connection surface 324 relative to the first inclined surface 313, further guiding the first flexible circuit board 310 to bend and rotate toward the circuit board 300, adapting to the relative angle between the first flexible circuit board 310 and the circuit board 300.

[0130] In some embodiments, the first inclined surface 313 may be inclined toward the circuit board 300 relative to the first electrical connection surface 311, and the second inclined surface 314 may extend toward the second electrical connection surface 312. The inclination of the first inclined surface 313 ensures a smooth transition of the first flexible circuit board 310 at the first electrical connection surface 311, while the extension of the second inclined surface 314 allows the first flexible circuit board 310 to be connected to the second electrical connection surface 312, thereby enabling the first flexible circuit board 310 to be flexibly bent in a direction that adapts to the relative angle between the first electrical connection surface 311 and the second electrical connection surface 312.

[0131] In some embodiments, the length of the edge 3142 of the second inclined surface 314 facing the inside of the optical module is less than the length of the edge 3141 facing the outside of the optical module, so that the second inclined surface 314 gradually tilts toward the direction of the first inclined surface 313, and the first inclined surface 313 can tilt toward the outside of the optical module relative to the second inclined surface 314, thereby guiding the first inclined surface 313 to facilitate connection with the first electrical connection surface 311.

[0132] In some embodiments, the first flexible circuit board 310 may include a third inclined surface 315. One end of the third inclined surface 315 is connected to the second inclined surface 314, and the other end is connected to the second electrical connection surface 312 to connect the second inclined surface 314 and the second electrical connection surface 312.

[0133] In some embodiments, the axis of the first inclined surface 313 and the axis of the second inclined surface 314 form a first bending angle. The axis of the third inclined surface 315 and the axis of the second inclined surface 314 form a second bending angle. By reasonably setting the first bending angle and the second bending angle, the first flexible circuit board 310 achieves a smooth transition and change of direction between the first electrical connection surface 311 and the second electrical connection surface 312, effectively reducing stress concentration and improving the bending resistance of the first flexible circuit board 310.

[0134] In some embodiments, the third inclined surface 315 is inclined relative to the second electrical connection surface 312, rather than perpendicular to it. Exemplarily, the angle between the third inclined surface 315 and the second electrical connection surface 312 is obtuse, providing a gentle space for the second inclined surface 314, guiding it to be more gradual, thereby reducing the first and second bending angles and guiding them to form acute angles within a predetermined range. This reduces the bending moment of the first flexible circuit board 310, reduces stress concentration, and improves the bending resistance of the first flexible circuit board 310. Simultaneously, the third inclined surface 315 makes the transition between the second and third inclined surfaces 314 smoother when the first flexible circuit board 310 is connected to the circuit board 300, reducing stress concentration caused by abrupt angle changes and preventing sharp bending or folding, thus protecting the connection point between the circuit board 300 and the first flexible circuit board 310 from excessive mechanical stress.

[0135] In some embodiments, the third inclined surface 315 may have a gradually changing curvature, with the curvature gradually decreasing from the end connected to the second inclined surface 314 to the end connected to the second electrical connection surface 312, in order to achieve a smooth transition, which helps to disperse stress, avoid stress concentration, and further improve the bending resistance of the first flexible circuit board 310.

[0136] In some embodiments, the angle between the third inclined surface 315 and the axis pointing into the optical module in the second electrical connection surface 312 is not less than 100°, which can guide the second inclined surface 314 to present a relatively gentle state, thereby reducing the first bending angle and the second bending angle and reducing stress concentration.

[0137] In some embodiments, the second bending angle is smaller than the first bending angle, so that the first flexible circuit board 310 gradually reduces the degree of bending in the direction toward the circuit board 300, further reducing stress concentration and improving the structural stability and bending resistance of the first flexible circuit board 310.

[0138] In some embodiments, the second bending angle is smaller than the first bending angle, and the first bending angle is no greater than 70°, controlled within 70°, so that the first flexible circuit board 310 can achieve a smooth transition during the bending process, avoid abrupt bending, effectively reduce stress concentration, and improve its bending resistance.

[0139] In some embodiments, a first fillet 316 is formed at the connection between the first inclined surface 313 and the second inclined surface 314, and a second fillet 317 is formed at the connection between the third inclined surface 325 and the second inclined surface 314. The first fillet 316 and the second fillet 317 allow the first flexible circuit board 310 to form a smooth transition at the bend, avoiding sharp edges, thereby reducing stress concentration and improving the bending resistance of the first flexible circuit board 310. Simultaneously, the radii of curvature of the first fillet 316 and the second fillet 317 can be set according to actual needs to ensure that the first flexible circuit board 310 maintains structural stability and reliability when bent. In some embodiments, the radii of curvature of the first fillet 316 and the second fillet 317 can be equal, making the transition of the first flexible circuit board 310 at the bend more uniform and consistent. In some embodiments, the radii of curvature of the first fillet 316 and the second fillet 317 can also be different to accommodate the bending requirements of the first flexible circuit board 310 at different locations.

[0140] In some embodiments, the radii of curvature of the first fillet 316 and the second fillet 317 are respectively greater than the preset radii of curvature, thereby reducing the stress concentration coefficient, further reducing stress concentration, and improving the bending resistance of the first flexible circuit board.

[0141] In some embodiments, the radii of curvature of the first fillet 316 and the second fillet 317 are greater than 0.15 mm, which can ensure a sufficiently smooth transition at the bend, further reduce stress concentration, and improve the bending resistance of the first flexible circuit board 310.

[0142] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module characterized by comprising: include: Circuit board; A first flexible circuit board, one end of which is electrically connected to the circuit board, includes: The first electrical connection surface faces away from the circuit board; The second electrical connection surface is electrically connected to the circuit board and faces the circuit board. The first inclined surface is connected to the first electrical connection surface; The second inclined surface is connected to the first inclined surface; the axis of the first inclined surface and the axis of the second inclined surface form a first bending angle. A third inclined surface is used to connect the second inclined surface and the second electrical connection surface; the axis of the third inclined surface and the axis of the second inclined surface form a second bending angle; the third inclined surface is inclined relative to the second electrical connection surface to guide the first bending angle and the second bending angle to form acute angles within a preset range.

2. The optical module according to claim 1, characterized by A first rounded corner is formed at the connection between the first inclined surface and the second inclined surface, and a second rounded corner is formed at the connection between the third inclined surface and the second inclined surface; The radius of curvature of the first fillet and the radius of curvature of the second fillet are both greater than the preset radius of curvature.

3. The optical module according to claim 1, characterized by The second electrical connection surface is parallel to the circuit board surface; the first inclined surface is inclined relative to the first electrical connection surface into the light-emitting module; The second inclined surface is connected to the bottom end of the first inclined surface and is inclined relative to the first inclined surface toward the second electrical connection surface; The third inclined surface is inclined outward relative to the second electrical connection surface to the optical module in order to connect to the second inclined surface.

4. The optical module according to claim 1, characterized by The angle between the third inclined surface and the axis pointing into the optical module in the second electrical connection surface is not less than 100°; The second bending angle is less than the first bending angle, and the first bending angle is no greater than 70°.

5. The optical module according to claim 2, characterized by The radius of curvature of the first fillet and the radius of curvature of the second fillet are both greater than 0.15 mm.

6. An optical module characterized by comprising: include: Circuit board; A first flexible circuit board, one end of which is electrically connected to the circuit board, includes: The first electrical connection surface faces away from the circuit board; The second electrical connection surface is electrically connected to the circuit board and faces the circuit board. The first inclined surface is connected to the first electrical connection surface; The second inclined surface is connected to the first inclined surface; the axis of the first inclined surface and the axis of the second inclined surface form a first bending angle; the length of the edge of the second inclined surface facing the inside of the optical module is less than the length of the edge facing the outside of the optical module. A third inclined surface is used to connect the second inclined surface and the second electrical connection surface; the axis of the third inclined surface and the axis of the second inclined surface form a second bending angle; the third inclined surface is inclined relative to the second electrical connection surface to guide the first bending angle and the second bending angle to form acute angles within a preset range.

7. The optical module according to claim 6, characterized by The optical module includes an optical receiving component with its end face facing away from the circuit board; the first flexible circuit board is electrically connected to the optical receiving component and the circuit board to match the relative positions between the optical receiving component and the circuit board.

8. The optical module according to claim 6, characterized by A first rounded corner is formed at the connection between the first inclined surface and the second inclined surface, and a second rounded corner is formed at the connection between the third inclined surface and the second inclined surface; The radius of curvature of the first fillet and the radius of curvature of the second fillet are both greater than the preset radius of curvature.

9. The optical module of claim 6, wherein, The angle between the third inclined surface and the axis pointing into the optical module in the second electrical connection surface is not less than 100°; The second bending angle is less than the first bending angle, and the first bending angle is no greater than 70°.

10. The optical module of claim 8, wherein, The radius of curvature of the first fillet and the radius of curvature of the second fillet are both greater than 0.15 mm.

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