A constant temperature crystal oscillator and electronic device
By using a housing made of insulating material in the temperature-controlled crystal oscillator, the problems of frequency jitter and increased device size were solved, achieving a balance between frequency stability and space utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-05-15
- Publication Date
- 2026-07-03
Smart Images
Figure CN224459754U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronics, and in particular to a temperature-controlled crystal oscillator and electronic device. Background Technology
[0002] An oven-controlled crystal oscillator (OCXO) consists of two key components: a quartz crystal and an integrated circuit (IC). A voltage is applied to the quartz crystal via the IC, utilizing the piezoelectric effect to generate a resonant frequency. The IC then outputs this resonant frequency. The frequency output by the IC is the output frequency of the oven-controlled crystal oscillator. Normally, the frequency generated by a quartz crystal varies greatly with temperature. However, an OCXO uses heating and temperature control to maintain the quartz crystal at a constant temperature, such as 90°C. Therefore, the frequency output by an OCXO generally exhibits high stability. The term "oven-controlled crystal oscillator" is also often simply referred to as a "temperature-controlled crystal oscillator."
[0003] Currently, even when a cryogenic crystal oscillator is in a steady state, its output frequency still exhibits some jitter. Here, "steady state" refers to the cryogenic crystal oscillator being at a constant temperature, as mentioned earlier.
[0004] Therefore, a solution is urgently needed to address the above problems. Utility Model Content
[0005] This application provides a temperature-controlled crystal oscillator and an electronic device that can reduce the jitter of the frequency output by the temperature-controlled crystal oscillator in steady state.
[0006] Firstly, this application provides a temperature-controlled crystal oscillator, comprising: a quartz crystal, a printed circuit board (PCB) connected to the quartz crystal, an integrated circuit deployed on the PCB, a first base, and a first package shell. The first package shell is made of a heat-insulating material, and the first base and the first package shell are used to encapsulate the quartz crystal, the PCB, and the integrated circuit. In this application, because the first package shell is made of a heat-insulating material, the package shell can slow down the conduction of heat to the interior of the temperature-controlled crystal oscillator, thereby reducing temperature fluctuations inside the temperature-controlled crystal oscillator and thus reducing frequency jitter at the output frequency of the temperature-controlled crystal oscillator. As an example, this solution can effectively reduce the frequency jitter at the output frequency of the temperature-controlled crystal oscillator in steady state.
[0007] In one possible implementation, the inner surface of the first package housing is made of the insulating material. In this scenario, heat conducted to the inner surface of the first package housing is insulated by the insulating material, thereby slowing down heat conduction into the temperature-controlled crystal oscillator. As an example, the inner surface of the first package housing may include a thin film of insulating material that does not increase the size of the temperature-controlled crystal oscillator.
[0008] In one possible implementation, considering that coating, spraying, or attaching processes can produce relatively stable films, in one example, where an insulating material is used on the inner surface of the first encapsulation housing, the insulating material can be processed onto the inner surface of the first encapsulation housing by coating, spraying, or attaching.
[0009] In one possible implementation, the outer surface of the first encapsulation housing is made of the insulating material. Therefore, heat conducted to the outer surface of the first encapsulation housing is isolated by the insulating material, thereby slowing heat conduction into the interior of the cryogenic crystal oscillator. As an example, the outer surface of the first encapsulation housing may include a thin film of insulating material, which does not increase the size of the cryogenic crystal oscillator.
[0010] In one possible implementation, the insulating material is processed onto the outer surface of the first encapsulation shell by coating, spraying, or attaching.
[0011] In one possible implementation, in yet another example, both the outer and inner surfaces of the first encapsulation housing can be made of thermally insulating material. In this scenario, heat conducted to the outer surface of the first encapsulation housing is isolated by the thermally insulating material, while unisolated heat conducted to the inner surface of the first encapsulation housing continues to be isolated by the thermally insulating material, thereby effectively slowing down heat conduction into the cryogenic crystal oscillator. As an example, the outer and inner surfaces of the first encapsulation housing can each include a thin film of thermally insulating material, which does not increase the size of the cryogenic crystal oscillator.
[0012] In one possible implementation, considering that in scenarios where the outer surface of the first encapsulation housing is covered by a heat-insulating material, there is a risk that the heat-insulating material may be scratched, which would affect the heat insulation performance of the first encapsulation housing. Therefore, in one example, the temperature-controlled crystal oscillator may further include a second encapsulation housing for encapsulating the first encapsulation housing.
[0013] In one possible implementation, considering that metals generally have a certain degree of hardness, the second encapsulation shell can be made of metal to protect the heat insulation material on the outer surface of the first encapsulation shell.
[0014] In one possible implementation, the entire first encapsulation shell is made of thermally insulating material. For example, in scenarios where the thermally insulating material has high hardness and stability, the entire first encapsulation shell is made of thermally insulating material. Because the entire first encapsulation shell is made of thermally insulating material, heat is isolated from the first encapsulation shell when it is conducted to it, thereby slowing down the heat conduction into the interior of the cryogenic crystal oscillator. Using this method is equivalent to replacing the metal encapsulation shell of a traditional cryogenic crystal oscillator with thermally insulating material, without increasing the size of the cryogenic crystal oscillator.
[0015] In one possible implementation, considering that porous materials, vacuum materials, and heat-reflective materials can all slow down heat conduction, the insulating material includes: a porous material, or a vacuum material, or a heat-reflective material.
[0016] In one possible implementation, the porous material includes: aerogel, polyurethane foam, graphite polystyrene board, or inorganic fiber insulation material. When the insulation material used for the first encapsulation shell includes porous materials such as aerogel, polyurethane foam, graphite polystyrene board, or inorganic fiber insulation material, it can effectively reduce and slow down the conduction of heat into the temperature-controlled crystal oscillator.
[0017] In one possible implementation, the vacuum material includes a vacuum insulation panel. When the insulation material used for the first encapsulation housing includes a vacuum insulation panel, it can effectively reduce and slow down the conduction of heat into the temperature-controlled crystal oscillator.
[0018] In one possible implementation, the heat-reflective material includes an aluminized polyester film. When the insulating material used for the first encapsulation housing includes an aluminized polyester film, it can effectively reduce and slow down the conduction of heat into the temperature-controlled crystal oscillator.
[0019] In one possible implementation, the quartz crystal includes: a quartz wafer, a second base for encapsulating the quartz wafer, and a top cover located on top of the second base.
[0020] Secondly, this application provides an electronic device, which includes the isothermal crystal oscillator described in any one of the first aspects above.
[0021] In one possible implementation, the electronic device is a network device or a terminal device. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1a A schematic diagram of a temperature-controlled crystal oscillator is shown.
[0024] Figure 1b A schematic diagram of a temperature-controlled crystal oscillator is shown.
[0025] Figure 2 This is a schematic diagram of the structure of a temperature-controlled crystal oscillator provided in an embodiment of this application;
[0026] Figure 3a A schematic diagram of another type of isothermal crystal oscillator provided in this application embodiment;
[0027] Figure 3b A schematic diagram of another type of isothermal crystal oscillator provided in this application embodiment;
[0028] Figure 3c A schematic diagram of another type of isothermal crystal oscillator provided in this application embodiment;
[0029] Figure 3d A schematic diagram of another type of isothermal crystal oscillator provided in this application embodiment;
[0030] Figure 3e A schematic diagram of another type of isothermal crystal oscillator provided in this application embodiment;
[0031] Figure 3f This is a schematic diagram of another type of isothermal crystal oscillator provided in the embodiments of this application. Detailed Implementation
[0032] This application provides a temperature-controlled crystal oscillator and an electronic device that can reduce the jitter of the frequency output by the temperature-controlled crystal oscillator in steady state.
[0033] To make it easier to understand, we will first introduce the traditional temperature-controlled crystal oscillator.
[0034] See Figure 1a , Figure 1a A schematic diagram of a temperature-controlled crystal oscillator is shown.
[0035] exist Figure 1aThe illustrated temperature-controlled crystal oscillator includes: a base 1, a top cover 2 on top of the base 1, a quartz crystal 3, electrode connection points 4, a cavity 5, a PCB 7, ICs 6-1 and 6-2 deployed on the PCB 7, a package housing 9, a base 10, and a cavity 8 between the package housing 9 and the base 10. In one example, the cavity 8 is filled with nitrogen gas. The base 1, top cover 2, quartz crystal 3, electrode connection points 4, and cavity 5 constitute the quartz crystal. Electrode connection points 4 connect the quartz crystal 3 and the base 1, and the quartz crystal is connected to the PCB 7 via the base 1. ICs 6-1 and 6-2 have functions such as driving the quartz crystal, outputting frequency signals, and controlling the temperature of the quartz crystal. Although... Figure 1a The diagram shows two ICs, 6-1 and 6-2. However, in practice, the number of ICs deployed on PCB 7 is not limited to two; it can be one or more than two. This application does not impose any limitations. In some scenarios, Figure 1a The quartz crystal in it is also known as a "crystal resonator".
[0036] See Figure 1b , Figure 1b A schematic diagram of a temperature-controlled crystal oscillator is shown.
[0037] like Figure 1b As shown, when the thermostatic crystal oscillator is working, IC 6-2 generates heat, which is transferred upwards to heat the quartz crystal. The heat is further conducted outwards through the chamber 8 and the package shell 9, achieving dynamic equilibrium and maintaining a constant temperature for the quartz crystal. The package shell 9 is made of metal.
[0038] When the external temperature changes, for example, when a cryogenic crystal oscillator is deployed in a network device, the fan speed of the network device increases or decreases, or the power consumption of other chips on the network device changes, leading to an increase or decrease in heat. These changes alter the temperature of the package 9, which in turn affects the temperature of the quartz crystal inside the cryogenic crystal oscillator. When the external temperature changes, the quartz crystal temperature changes suddenly, and IC 6-2 quickly adjusts the heating power of the quartz crystal, thereby rapidly stabilizing the quartz crystal temperature.
[0039] Research has revealed that when the external temperature changes, although the quartz crystal quickly returns to a steady state, the frequency of the output of the thermostatic crystal oscillator fluctuates greatly under steady state. The reason for this phenomenon is that the fluctuation of the external temperature is quickly conducted into the thermostatic crystal oscillator through the gas (nitrogen) in the encapsulation shell 9 and the chamber 8, causing the internal temperature of the thermostatic crystal oscillator to fluctuate.
[0040] Currently, a windproof shield can be added to the outside of the cryogenic crystal oscillator. The space between the windproof shield and the cryogenic crystal oscillator is air; when the outside temperature changes, heat convection is blocked by the windproof shield, thus slowing down heat transfer.
[0041] However, adding a windproof shield to the outside of the cryogenic crystal oscillator significantly increases its size, leading to increased costs for its placement on the circuit board. On some high-density circuit boards with high component density, there may not be sufficient space to deploy a cryogenic crystal oscillator with a windproof shield. The bottom area of the cryogenic crystal oscillator mentioned here can be understood as... Figure 1a The base 10 shown occupies a certain plane area.
[0042] In view of this, this application provides a temperature-controlled crystal oscillator that can not only reduce the frequency jitter of the output of the temperature-controlled crystal oscillator in steady state, but also hardly increase the size of the temperature-controlled crystal oscillator, thereby enabling the temperature-controlled crystal oscillator to be deployed on high-density single boards.
[0043] Next, the isothermal crystal oscillator provided in the embodiments of this application will be described.
[0044] See Figure 2 The figure is a schematic diagram of the structure of a temperature-controlled crystal oscillator provided in an embodiment of this application.
[0045] like Figure 2 As shown: The oven-controlled crystal oscillator provided in this embodiment includes: a quartz crystal 210, a PCB 7 connected to the quartz crystal, an integrated circuit deployed on the PCB 7, a first base 10, and a first package shell 9'. The first base 10 and the first package shell 9' are used to package the quartz crystal 210, the PCB 7, and the integrated circuit. Figure 2 For ease of understanding, two integrated circuits, 6-1 and 6-2, deployed on PCB 7 are shown.
[0046] exist Figure 2 The image shows a specific structure of quartz crystal 210, such as... Figure 2 As shown, the quartz crystal 210 includes: a second base 1, a top cover 2 located on top of the second base 1, and a quartz wafer 3. The quartz wafer 3 and the second base 1 are connected via an electrode connection point 4. The cavity 5 between the second base 1 and the top cover 2 can be considered almost a vacuum cavity. For more information on the quartz crystal 210, please refer to the previous section on... Figure 1a The description of the quartz crystal shown is not repeated here. Furthermore, although... Figure 2The quartz crystal 210 shown mainly includes a second base 1, a top cover 2, and a quartz wafer 3. However, the quartz crystal 210 may also include other components, which are not specifically limited in this application embodiment.
[0047] Figure 2 The shown isothermal crystal oscillator and Figure 1a The main difference between the shown temperature-controlled crystal oscillators is: Figure 1a The package 9 of the shown temperature-controlled crystal oscillator is made of metal. Figure 2 The first package 9' shown is made of a material including thermal insulation material. Since the thermal insulation material can slow down the rate of heat conduction, the first package 9' can slow down the conduction of heat into the interior of the temperature-controlled crystal oscillator, thereby reducing the temperature fluctuation inside the temperature-controlled crystal oscillator and thus reducing the jitter of the frequency output of the temperature-controlled crystal oscillator (e.g., reducing the jitter of the frequency output of the temperature-controlled crystal oscillator in steady state). Figure 2 The first package 9' in Figure 1a The encapsulation housing 9 shown is covered by a diagonal line to indicate the material difference between the first encapsulation housing 9' and the encapsulation housing 9.
[0048] In one example, the inner surface of the first encapsulation shell 9' is made of heat-insulating material. Because of this material, heat is isolated from the inner surface of the first encapsulation shell 9', thus slowing down heat conduction into the cryogenic crystal oscillator. In this scenario, the structure of the cryogenic crystal oscillator can be as follows: Figure 3a As shown. Figure 3a This is a schematic diagram of another type of temperature-controlled crystal oscillator provided in an embodiment of this application. Figure 3a In the diagram, the insulating material is indicated by a slash; the inner surface of the first encapsulation shell 9' is made of insulating material. In this scenario, Figure 3a The first encapsulation housing 9' shown can be considered as being in Figure 1a The inner surface of the encapsulation shell 9 shown has been increased with a layer of heat-insulating material.
[0049] As an example, the inner surface of the first package 9' may include a thin film of thermally insulating material that does not increase the size of the temperature-controlled crystal oscillator. That is, Figure 3a The temperature-controlled crystal oscillator shown has the same dimensions as... Figure 1a The temperature-controlled crystal oscillators shown are almost identical in size.
[0050] Considering that coating, spraying, or attaching processes can produce relatively stable films, in one example, where the inner surface of the first packaging shell 9' is covered with a heat-insulating material, the heat-insulating material can be applied to the inner surface of the first packaging shell 9' by coating, spraying, or attaching.
[0051] In another example, the outer surface of the first encapsulation shell 9' is made of heat-insulating material. Because of this material, heat is isolated from the outer surface of the first encapsulation shell 9', thus slowing down heat conduction into the cryogenic crystal oscillator. In this scenario, the structure of the cryogenic crystal oscillator can be as follows: Figure 3b As shown. Figure 3b This is a schematic diagram of another type of temperature-controlled crystal oscillator provided in an embodiment of this application. Figure 3b In the diagram, the insulating material is indicated by a slash; the outer surface of the first encapsulation shell 9' is made of insulating material. In this scenario, Figure 3b The first encapsulation housing 9' shown can be considered as being in Figure 1a A layer of heat-insulating material was added to the outer surface of the encapsulation shell 9 shown.
[0052] In one example, the outer surface of the first package 9' may include a thin film of thermally insulating material, which adds almost no increase to the size of the temperature-controlled crystal oscillator. That is, Figure 3b The temperature-controlled crystal oscillator shown has the same dimensions as... Figure 1a The temperature-controlled crystal oscillators shown are almost identical in size.
[0053] Similar to processing a thin film of heat-insulating material on the inner surface of the first packaging shell 9', in the scenario where heat-insulating material is used on the outer surface of the first packaging shell 9', the heat-insulating material can also be processed onto the outer surface of the first packaging shell 9' by coating, spraying, or attaching.
[0054] In some scenarios, considering that the outer surface of the first encapsulation shell 9' is covered with heat-insulating material, there is a risk that the heat-insulating material may be scratched. If the heat-insulating material is scratched, the heat insulation performance of the first encapsulation shell 9' will be affected. Therefore, in one example, the isothermal crystal oscillator may further include a second encapsulation shell 11 for encapsulating the first encapsulation shell 9'. In this scenario, the structure of the isothermal crystal oscillator can be as follows: Figure 3c As shown, Figure 3c The shown isothermal crystal oscillator and Figure 3b Compared to the temperature-controlled crystal oscillator shown, it also includes a second encapsulation shell 11 that encapsulates the first encapsulation shell 9'.
[0055] This application does not limit the material used for the second packaging shell 11, as long as the second packaging shell 11 has a certain degree of hardness to prevent the heat insulation material from being scratched. In one example, considering that metals generally have a certain degree of hardness, the second packaging shell 11 can be made of metal. The specific metal material used for the second packaging shell 11 can be determined by considering factors such as the application scenario of the quartz crystal oscillator and its cost; this application does not impose specific limitations.
[0056] In another example, both the outer and inner surfaces of the first encapsulation shell 9' can be made of insulating material. Because both the outer and inner surfaces of the first encapsulation shell 9' are made of insulating material, heat conducted to the outer surface of the first encapsulation shell 9' is isolated by the insulating material, and unisolated heat conducted to the inner surface of the first encapsulation shell 9' continues to be isolated by the insulating material, thereby effectively slowing down heat conduction into the temperature-controlled crystal oscillator. In this scenario, the structure of the temperature-controlled crystal oscillator can be as follows: Figure 3d As shown. Figure 3d This is a schematic diagram of another type of temperature-controlled crystal oscillator provided in an embodiment of this application. Figure 3d In the diagram, the insulating material is indicated by a slash. Both the outer and inner surfaces of the first encapsulation shell 9' are made of insulating material. In this scenario, Figure 3d The first encapsulation housing 9' shown can be considered as being in Figure 1a A layer of heat-insulating material is added to both the outer and inner surfaces of the encapsulation shell 9 shown. The method of processing the heat-insulating material onto the first encapsulation shell 9' and its inner and outer surfaces can be referred to the relevant description above, and will not be repeated here.
[0057] In addition, in scenarios where both the outer and inner surfaces of the first encapsulation shell 9' are made of heat-insulating material, to prevent the heat-insulating material on the outer surface of the first encapsulation shell 9' from being scratched, the isothermal crystal oscillator may further include a second encapsulation shell 11 for encapsulating the first encapsulation shell 9'. In this scenario, the structure of the isothermal crystal oscillator can be as follows: Figure 3e As shown, Figure 3e The shown isothermal crystal oscillator and Figure 3d Compared to the temperature-controlled crystal oscillator shown, this also includes a second package 11 that encapsulates the first package 9'. For details regarding the second package 11, please refer to the preceding description; it will not be repeated here.
[0058] In another example, the entire first packaging shell 9' is made of insulating material. For instance, in scenarios where the insulating material has high hardness and stability, the entire first packaging shell 9' is made of insulating material. Because the entire first packaging shell 9' is made of insulating material, heat is isolated from the first packaging shell 9' when it is conducted to it, thereby slowing down the heat conduction into the temperature-controlled crystal oscillator. In this scenario, the structure of the temperature-controlled crystal oscillator can be as follows: Figure 3f As shown. Figure 3f This is a schematic diagram of another type of temperature-controlled crystal oscillator provided in an embodiment of this application. Figure 3f In the diagram, the insulating material is indicated by a slash; the entire first encapsulation shell 9' is made of insulating material. In this scenario, Figure 3f The temperature-controlled crystal oscillator shown can be considered as... Figure 1a The encapsulation shell 9 shown is replaced with a first encapsulation shell 9' made of heat-insulating material.
[0059] This application does not specifically limit the thermal insulation material, as long as the thermal insulation material can slow down heat conduction. In one example, the thermal insulation material can be a porous material, a vacuum material, or a heat-reflective material. Wherein:
[0060] Porous materials, also known as porous materials, refer to solids containing a certain number of pores. Based on the pore diameter, porous materials are further classified into microporous, mesoporous, and macroporous materials, which will not be detailed here. Porous materials may include aerogels, polyurethane foam, graphite polystyrene boards, or inorganic fiber insulation materials. When the insulation material used in the first encapsulation shell includes porous materials such as aerogels, polyurethane foam, graphite polystyrene boards, or inorganic fiber insulation materials, it can effectively reduce and slow down heat conduction into the isothermal crystal oscillator. Taking aerogel as an example, the internal porosity of aerogel is as high as 80%~99.8%, with air occupying most of the volume. When heat is transferred through the solid framework, it needs to bypass the tortuous nanopores, extending the path and thus effectively reducing thermal conductivity. Meanwhile, the nanopore size of aerogel (about 20 nanometers) is much smaller than the free path of air molecules (70 nanometers). The collision frequency between gas molecules and the pore walls is much higher than that between molecules, which hinders the movement of gas molecules. Air cannot flow freely to form convection, which can also reduce the thermal conductivity of the gas.
[0061] Vacuum materials refer to materials that can be used in a vacuum environment. In one example, the vacuum material includes a vacuum insulation panel. When the insulation material used for the first encapsulation shell includes vacuum insulation panels or other vacuum materials, it can effectively reduce and slow down the conduction of heat to the interior of the temperature-controlled crystal oscillator.
[0062] Heat-reflective materials refer to materials that can reflect heat. In one example, the heat-reflective material includes an aluminized polyester film. When the insulation material used for the first packaging shell includes a heat-reflective material such as an aluminized polyester film, it can effectively reduce and slow down the conduction of heat into the temperature-controlled crystal oscillator.
[0063] This application also provides an electronic device, which includes the oven-controlled crystal oscillator provided in the above embodiments. This electronic device includes, but is not limited to, a network device or a terminal device.
[0064] Among them, the network devices mentioned in the embodiments of this application include, but are not limited to, routers, switches, transmission devices or base stations.
[0065] The terminal devices mentioned in the embodiments of this application include, but are not limited to, mobile terminal devices such as mobile phones, tablets, or wearable smart devices, as well as terminal devices such as personal computers, which will not be listed here.
[0066] The transmission devices mentioned in the embodiments of this application include, but are not limited to, packet transport network (PTN) devices or optical transport network (OTN) devices.
[0067] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data used can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion, e.g., including a series of products or devices is not necessarily limited to those components explicitly listed, but may include other components not explicitly listed or inherent to those products or devices.
[0068] The above specific embodiments further illustrate the purpose, technical solution and beneficial effects of this application. It should be understood that the above are only specific embodiments of this application.
[0069] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A temperature-compensated crystal oscillator, characterized by, The isothermal crystal oscillator includes: The package includes a quartz crystal, a printed circuit board connected to the quartz crystal, an integrated circuit deployed on the printed circuit board, a first base, and a first encapsulation shell, wherein the first encapsulation shell is made of a heat-insulating material, and the first base and the first encapsulation shell are used to encapsulate the quartz crystal, the printed circuit board, and the integrated circuit.
2. The ovenized crystal oscillator of claim 1, wherein, The inner surface of the first encapsulation shell is made of the aforementioned heat-insulating material.
3. The isothermal crystal oscillator according to claim 2, characterized in that, The thermal insulation material is processed onto the inner surface of the first encapsulation shell by coating, spraying, or attaching.
4. The ovenized crystal oscillator of any of claims 1-3, wherein, The outer surface of the first encapsulation shell is made of the aforementioned heat-insulating material.
5. The ovenized crystal oscillator of claim 4, wherein, The isothermal crystal oscillator also includes a second encapsulation shell for encapsulating the first encapsulation shell.
6. The isothermal crystal oscillator according to claim 5, wherein the second packaged housing is made of metal material.
7. The isothermal crystal oscillator according to any one of claims 4-6, characterized in that, The thermal insulation material is processed onto the outer surface of the first encapsulation shell by coating, spraying, or attaching.
8. The ovenized crystal oscillator of claim 1, wherein, The entire first encapsulation shell is made of the aforementioned heat-insulating material.
9. The ovenized crystal oscillator of any of claims 1-8, wherein, The thermal insulation material includes: Porous materials, or vacuum materials, or heat-reflective materials.
10. The ovenized crystal oscillator of claim 9, wherein, The porous material includes: Aerogel, or polyurethane foam, or graphite polystyrene board, or inorganic fiber insulation material.
11. The isothermal crystal oscillator according to claim 9, characterized in that, The vacuum material includes: Vacuum insulation panel.
12. The ovenized crystal oscillator of claim 9, wherein, The heat-reflective material includes: Aluminized polyester film.
13. The ovenized crystal oscillator of any of claims 1-12, wherein, The quartz crystal comprises: A quartz wafer, a second base for encapsulating the quartz wafer, and a top cover located on top of the second base.
14. An electronic device, comprising: The electronic device includes a temperature-controlled crystal oscillator as described in any one of claims 1-13.
15. The electronic device according to claim 14, characterized in that, The electronic device is a network device or a terminal device.