Camera packaging module

Abstract

This utility model relates to the field of optics and discloses a camera packaging module, including a bracket with a light inlet formed on its inner side along the optical axis, a stabilization motor mounted on one side of the bracket, a lens mounted on the stabilization motor, and an imaging component mounted on the other side of the bracket. The bracket is made of metal and has a receiving cavity formed on the side facing the imaging component to accommodate electronic components on the imaging component, and the receiving cavity is filled with a filling structure. By using a metal bracket, the overall rigidity of the bracket is greatly improved, allowing the thickness of the bracket's sidewalls to be reduced. While ensuring that the bracket has sufficient strength to support the stabilization motor and the imaging component, it also has sufficient compressive strength, thereby reducing the size of the bracket and the entire camera packaging module, facilitating the achievement of a thinner and lighter design.

Description

Technical Field

[0001] This utility model relates to the field of optics, and in particular to a camera packaging module. Background Technology

[0002] With the widespread adoption of smart electronic devices, people's reliance on mobile phones in daily life is constantly increasing, especially in terms of communication and camera functions. To meet consumers' demands for the photographic performance of electronic products, the application of cameras in electronic products is becoming increasingly popular.

[0003] As an important component of the camera, the plastic bracket supports the image stabilization motor, lens, and circuit board. However, in order to ensure that the plastic bracket has sufficient strength, its size needs to meet certain requirements. This results in the overall size of the camera being relatively large, making the camera bulky, which is not conducive to the pursuit of thin and light electronic products. Utility Model Content

[0004] In view of the shortcomings of the prior art, the technical problem to be solved by this utility model is to provide a camera packaging module to solve the problem of the large size of existing cameras.

[0005] To solve the above-mentioned technical problems, the present invention adopts a technical solution as follows: a camera packaging module is provided, including a bracket with a light inlet formed on the inner side along the optical axis, a stabilization motor mounted on one side of the bracket, a lens mounted on the stabilization motor, and an imaging component mounted on the other side of the bracket. The bracket is made of metal and has a receiving cavity for accommodating electronic components on the imaging component on the side facing the imaging component, and a filling structure is filled in the receiving cavity.

[0006] Furthermore, the receiving cavity is open on the side facing the imaging component, and the electronic components extend into the receiving cavity from the surface of the imaging component.

[0007] Furthermore, the receiving cavity is arranged outside the light inlet, and the receiving cavity is opened along the outer side of the bracket and the inner wall of the light inlet so that a thin wall is formed between the outer side of the bracket and the receiving cavity, and between the inner wall of the light inlet and the receiving cavity.

[0008] Furthermore, the thin-walled portion of the bracket facing away from the imaging assembly along the optical axis is configured as a top wall, and the image stabilization motor is connected to and overlaps the top wall.

[0009] Furthermore, the top wall is provided with a plurality of protrusions of equal height along the optical axis direction. Each of the protrusions is distributed circumferentially along the light inlet and arranged facing the lens along the optical axis direction to support the lens.

[0010] Furthermore, the imaging assembly includes a circuit board connected to the bracket, a photosensitive chip electrically connected to the side of the circuit board facing the bracket and directly opposite the light inlet, a connector mounted on the circuit board, and a filter mounted on the bracket and located at the light inlet.

[0011] Furthermore, a mounting cavity communicating with the light inlet is formed on the thin wall on the side opposite to the imaging component along the optical axis, and each side of the filter is connected to the mounting cavity to block the light inlet.

[0012] Furthermore, the thin wall between the light inlet and the receiving cavity is configured as an inner wall, and a holding gap is formed between the inner wall and the circuit board. The edge of the photosensitive chip is located within the holding gap, and the inner wall is attached to the photosensitive chip.

[0013] Furthermore, a black coating is provided on the inner wall of the light inlet.

[0014] Furthermore, the filling structure includes adhesive filling the receiving cavity.

[0015] The camera packaging module of this utility model has at least the following beneficial effects: by setting a metal bracket, the overall rigidity of the bracket is greatly improved, and the thickness of the side wall of the bracket can be reduced. While ensuring that the bracket has sufficient strength to support the image stabilization motor and imaging components, it also has sufficient compressive strength, thereby reducing the size of the bracket and the entire camera packaging module, which facilitates the realization of lightweight and thin design. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 This is a schematic diagram of the camera packaging module of this utility model;

[0018] Figure 2 This is an exploded view of the camera packaging module of this utility model;

[0019] Figure 3 This is an exploded view of the camera packaging module of this utility model (from another angle);

[0020] Figure 4 This is a half-sectional schematic diagram of the camera packaging module of this utility model;

[0021] Figure 5 This is a half-sectional schematic diagram of the camera packaging module (hidden filling structure) of this utility model.

[0022] The meanings of the labels in the attached diagram are as follows:

[0023] 1. Bracket, 11. Light inlet, 121. First side, 122. Second side, 13. Receiving cavity, 14. Black coating, 151. Top wall, 152. Inner side wall, 153. Outer side wall, 16. Filling structure, 17. Boss, 18. Mounting cavity, 2. Image stabilization motor, 3. Lens, 4. Imaging assembly, 41. Circuit board, 42. Photosensitive chip, 43. Connector, 44. Filter. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] Please see Figures 1 to 5 The camera packaging module of this utility model includes a bracket 1 with a light inlet 11 formed on its inner side along the optical axis, a stabilization motor 2 mounted on one side of the bracket 1, a lens 3 mounted on the stabilization motor 2, and an imaging component 4 mounted on the other side of the bracket 1. The bracket 1 supports the stabilization motor 2 and the imaging component 4, increases the strength of the imaging component 4, ensures the durability of the entire device, and improves the stability of the stabilization motor 2; the stabilization motor 2 drives the lens 3 to move, thereby realizing the automatic focusing of the lens 3; the lens 3 focuses external light onto the imaging component 4, and the imaging component 4 converts the light signal into an electrical signal for image display.

[0026] In this embodiment, the bracket 1 is formed of metal by CNC machining or die casting, using a rust-resistant and high-hardness metal material such as stainless steel or alloy, thereby fundamentally increasing the rigidity of the bracket 1 and extending its service life. The light inlet 11 is formed through the middle of the bracket 1 along the optical axis and also along the thickness direction of the bracket 1. Due to the structure of the imaging component 4, both the light inlet 11 and the bracket 1 are square in shape. The light inlet 11 is located at the center of the bracket 1 so that after other structures are installed, the light focused by the lens 3 is directed towards the light inlet 11. The bracket 1 has two sides distributed opposite to each other along its thickness direction. One side of the bracket 1 used to cooperate with the imaging component 4 is designated as the first side 121, facing the imaging component 4; the other side of the bracket 1 used to cooperate with the image stabilization motor 2 is designated as the second side 122, facing the image stabilization motor 2. A receiving cavity 13, open towards the imaging assembly 4, is formed on the second side 122 of the support 1. The receiving cavity 13 is recessed from the second side 122 along the optical axis and is formed in a "U" shape around the outer periphery of the light inlet 11. The receiving cavity 13 surrounds the outer side or periphery of the light inlet 11 so that when the support 1 and the circuit board 41 are attached together, electronic components and / or metal wires on the circuit board 41 can extend into and be accommodated therein, without hindering the imaging assembly 4 from receiving light. In order to reduce the reflection of stray light after light is incident on the light inlet 11, a black film 14 is coated on the inner wall of the light inlet 11 to absorb the light incident on the inner wall of the light inlet 11 and avoid it being reflected to form stray light, thereby improving the imaging quality.

[0027] In this embodiment, the receiving cavity 13 is formed along the outer side of the bracket 1 and the inner wall of the light inlet 11, so as to form a thin wall between the outer side of the bracket 1 and the receiving cavity 13, and between the inner wall of the light inlet 11 and the receiving cavity 13. Since the bracket 1 is made of metal, even if the receiving cavity 13 is formed over a large area of ​​the bracket 1, and only a thin wall with a thickness less than the thickness of the bracket 1 is retained, the bracket 1 still has sufficient strength to support the image stabilization motor 2 and the circuit board 41, maintaining or increasing the compressive strength, thereby effectively reducing the material usage and cost of the bracket 1. At the same time, sufficient support strength allows the size of the camera packaging module to be greatly reduced, and the large-volume receiving cavity 13 can still accommodate the electronic components on the circuit board 41 under the premise of reducing the size of the bracket 1, thereby reducing the size of the entire camera packaging module and realizing the thinning of electronic products. The thin-walled portion of the support 1 facing away from the imaging assembly 4 along the optical axis is configured as the top wall 151. The thin-walled portion between the inner wall of the light inlet 11 and the receiving cavity 13 is configured as the inner side wall 152. The thin-walled portion between the receiving cavity 13 and the outer side of the support 1 facing away from the inner wall of the light inlet 11 is configured as the outer side wall 153. The second side 122 is penetrated by the receiving cavity 13. The thickness of the top wall 151, inner side wall 152, and outer side wall 153 can all be less than the thickness of the support 1. For example, the top wall 151, inner side wall 152, and outer side wall 153 can be one-quarter of the thickness of the support 1. The specific dimensions are determined according to the actual reduced size of the support 1, but it should be ensured that the receiving cavity 13 can accommodate all electronic components and metal wires on the circuit board 41. After all components are assembled, the cavity 13 is filled with a filling structure 16 to stabilize the electronic components and prevent dust or other debris from entering the cavity 13, which could affect its service life. Simultaneously, the filling structure 16 enhances the strength of the support 1. The filling structure 16 includes an adhesive, such as FP4803 premixed adhesive, that fills the cavity 13.

[0028] To facilitate support of the lens 3 and prevent damage to the imaging assembly 4 caused by the lens 3 contacting the imaging assembly 4 during focusing with the image stabilization motor 2, multiple protrusions 17 of equal height are provided on the top wall 151 along the optical axis. This increases the thickness of the top wall 151 and supports the lens 3, ensuring that the lens 3 remains separated from the imaging assembly 4 even when in contact with the protrusions 17. The protrusions 17 are spaced apart along the circumference of the light inlet 11. Corresponding to the square light inlet 11, four protrusions 17 are provided and located on the four sides of the light inlet 11. Each protrusion 17 faces a lens frame of the lens 3 along the optical axis, and the width of the protrusion 17 is greater than the thickness of the lens frame, so that even if the lens 3 moves, the protrusion 17 can still support the lens frame. However, to facilitate the connection between the top wall 151 and the image stabilization motor 2, the top wall 151 is recessed relative to each boss 17 on its outer side. The image stabilization motor 2 is connected to the bottom wall outside the boss 17 and recessed relative to it. The size of the bracket 1 is adapted to the size of the image stabilization motor 2 so that the image stabilization motor 2 can overlap the top wall 151 after it is mounted on it. A mounting cavity 18 communicating with the light inlet 11 is formed on the thin wall of the bracket 1 on the side facing away from the imaging assembly 4 along the optical axis, i.e., on the top wall 151 along the periphery of the light inlet 11. The mounting cavity 18 is recessed from the side of the boss 17 near the light inlet 11 and communicates with the light inlet 11 radially. The mounting cavity 18 has a square structure and is arranged coaxially with the light inlet 11, and the size of the mounting cavity 18 is larger than the size of the light inlet 11.

[0029] In this embodiment, the image stabilization motor 2 can be a voice coil motor, capable of single-axis, dual-axis, and tri-axis focusing as needed, specifically selected according to actual function. In this embodiment, it must be size-compatible with the bracket 1. The bottom of the image stabilization motor 2 is glued to the top wall 151 to overlap with the bracket 1, but a metal wire for electrical connection with the image stabilization motor 2 should be reserved on the bracket 1. For this purpose, one side of the bracket 1 can be recessed relative to the image stabilization motor 2 and the circuit board 41, and the metal wire for electrical connection with the image stabilization motor 2 passes through the aforementioned recess, which is also filled with glue. There is a mounting space inside the image stabilization motor 2 that runs through the optical axis, and the lens 3 is mounted in the mounting space.

[0030] In this embodiment, the lens 3 includes a frame and lenses mounted within the frame. Typically, there are four lenses to focus light, directing it towards the light inlet 11. A carrier is fitted onto the outer surface of the lens frame of the lens 3. The lens 3 is movably mounted within the mounting space via the carrier, and the end of the lens 3 used for light intake extends beyond the mounting space along the optical axis to facilitate image capture.

[0031] In this embodiment, the imaging assembly 4 includes a circuit board 41 connected to the bracket 1, a photosensitive chip 42 electrically connected to the side of the circuit board 41 facing the bracket 1 and directly opposite the light inlet 11, a connector 43 mounted on the circuit board 41, and a filter 44 mounted on the bracket 1 and located at the light inlet 11. The side of the circuit board 41 with electronic components faces the bracket 1. The circuit board 41 is connected to the bracket 1 by applying adhesive and filling the receiving cavity 13 with adhesive, thus achieving encapsulation. Each side of the filter 44 is connected to the mounting cavity 18 with adhesive to block the light inlet 11, so that the light focused by the lens 3 passes through the filter 44 along the optical axis, thereby allowing the desired light to pass through while filtering out unwanted light, thereby improving the image quality. The inner wall 152 is shorter than the outer wall 153, creating a holding gap between the inner wall 152 and the circuit board 41. The depth of the holding gap is the same as the thickness of the photosensitive chip 42, and the edge of the photosensitive chip 42 is located within the holding gap. The inner wall 152 is attached to the photosensitive chip 42 so that the bracket 1 holds the photosensitive chip 42. At the same time, the edge of the photosensitive chip 42 seals the receiving cavity 13, thereby improving the connection stability between the imaging component 4 and the bracket 1. The side of the circuit board 41 has a portion extending outward from the outside of the bracket 1. The connector 43 is mounted on the circuit board 41 extending outward from the outside of the bracket 1 to cooperate with the complementary connector 43 to conduct electrical signals.

[0032] The working principle of one embodiment of the camera packaging module of this utility model is as follows: After the lens 3 captures the external scene through the part extending outside the anti-shake motor 2, light is directed towards the lens 3. During this process, the anti-shake motor 2 automatically focuses the lens 3, so that the light passes through the lens 3 and is directed towards the filter 44. The light passing through the filter 44 is directed towards the photosensitive chip 42 for photoelectric conversion, converting the light signal into an electrical signal. The image is then connected to the external circuit through the circuit board 41 and the connector 43 to realize the imaging and display of the image.

[0033] Compared with the prior art, the camera packaging module of this utility model can reduce the size of the camera packaging module by setting a metal bracket 1, while increasing the pressure resistance of the bracket 1, thus effectively reducing costs.

Claims

1.A camera module, comprising a bracket having a light inlet formed in a direction of an optical axis, a shake reduction motor mounted on one side of the bracket, a lens mounted on the shake reduction motor, and an imaging assembly mounted on the other side of the bracket, characterized in that: The support is made of metal and has a cavity formed on the side facing the imaging component to accommodate electronic components on the imaging component, and the cavity is filled with a filling structure. 2.The camera package module of claim 1, wherein: The cavity is open to the side facing the imaging component, and the electronic components extend into the cavity from the surface of the imaging component. 3.The camera package module of claim 1, wherein: The receiving cavity is arranged outside the light inlet, and the receiving cavity is opened along the outer side of the bracket and the inner wall of the light inlet so that a thin wall is formed between the outer side of the bracket and the receiving cavity, and between the inner wall of the light inlet and the receiving cavity. 4.The camera package module of claim 3, wherein: The thin-walled portion of the bracket facing away from the imaging component along the optical axis is configured as the top wall, and the image stabilization motor is connected to and overlaps the top wall. 5.The camera package module of claim 4, wherein: The top wall is provided with a plurality of protrusions of equal height along the optical axis. Each of the protrusions is distributed circumferentially along the light inlet and is arranged facing the lens along the optical axis to support the lens. 6.The camera package module of any one of claims 3 to 5, wherein: The imaging assembly includes a circuit board connected to the bracket, a photosensitive chip electrically connected to the side of the circuit board facing the bracket and directly opposite the light inlet, a connector mounted on the circuit board, and a filter mounted on the bracket and located at the light inlet. 7.The camera package module of claim 6, wherein: A mounting cavity communicating with the light inlet is formed on the thin wall on the side opposite to the imaging component along the optical axis. Each side of the filter is connected to the mounting cavity to block the light inlet. 8.The camera package module of claim 7, wherein: The thin wall between the light inlet and the receiving cavity is configured as an inner wall, and a holding gap is formed between the inner wall and the circuit board. The edge of the photosensitive chip is located within the holding gap, and the inner wall is attached to the photosensitive chip. 9.The camera package module of claim 1, wherein: The inner wall of the light inlet is coated with a black film. 10.The camera package module of claim 1, wherein: The filling structure includes adhesive that fills the receiving cavity.

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