New energy FPC reinforcing PI glue paper bonding equipment tooling

Abstract

The utility model discloses a new energy FPC reinforcing PI glue paper laminating equipment frock relates to new energy FPC production equipment field, including frock board, FPC board, whole board PI and whole board glue paper, whole board PI and whole board glue paper are all with frock board size consistent, a plurality of positioning pins are fixed on frock board, a plurality of positioning pins are set in seven rows four columns, fourteen rows PI auxiliary materials are equipped on whole board PI, fourteen rows glue paper auxiliary materials are equipped on whole board glue paper, and PI auxiliary material and glue paper auxiliary material are adapted respectively with the PI laminating area and glue paper laminating area of FPC board, and the positioning hole that is matched with positioning pin is all seted up on FPC board and PI auxiliary material, and the edge four corners of frock board are all equipped with L shaped auxiliary board, and four L shaped auxiliary boards are used for positioning whole board glue paper, the utility model discloses through whole board laminating mode, and production efficiency is improved significantly, compares traditional manual one by one laminating, and whole board laminating can complete PI / glue paper laminating of multiple FPC boards one time, and efficiency is improved by more than 3 times.

Description

Technical Field

[0001] This utility model mainly relates to the technical field of new energy FPC production equipment, specifically a tooling for a new energy FPC reinforcing PI adhesive paper lamination equipment. Background Technology

[0002] In the new energy FPC industry, key products such as blade batteries and short blade FPCs have seen a continuous increase in shipments due to strong market demand. In the production process, it is inevitable to perform PI auxiliary materials and adhesive tape bonding operations on FPCs that have already been fitted with devices.

[0003] However, under the current technological conditions, this bonding process mainly relies on manual operation one by one, which not only makes the bonding speed extremely slow but also very inefficient. This inefficient production method not only leads to high labor costs for enterprises but also makes it difficult to meet the market's urgent demand for large-scale shipments, thus having a significant negative impact on the overall production progress and seriously restricting the enterprise's production capacity and market competitiveness. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a tooling for a new energy FPC reinforcing PI adhesive paper bonding equipment to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A tooling for a new energy FPC reinforcement PI adhesive tape bonding equipment includes a tooling plate, an FPC plate, a whole PI plate, and a whole adhesive tape. The whole PI plate and the whole adhesive tape are the same size as the tooling plate. A number of positioning pins are fixed on the tooling plate, and the number of positioning pins are arranged in seven rows and four columns. The whole PI plate has fourteen rows of PI auxiliary material, and the whole adhesive tape has fourteen rows of adhesive tape auxiliary material. The PI auxiliary material and the adhesive tape auxiliary material are respectively adapted to the PI bonding area and the adhesive tape bonding area of ​​the FPC plate.

[0007] The FPC board and PI auxiliary material are provided with positioning holes that match the positioning pins. The tooling plate is provided with L-shaped auxiliary plates at the four corners of its edge. The four L-shaped auxiliary plates are used to position the adhesive tape on the whole board.

[0008] Specifically, in this technical solution, the adhesive tape is n-shaped, and the horizontal part of the adhesive tape has multiple adhesive-free areas, while the inner side of one vertical part of the adhesive tape has a tear-off position.

[0009] Specifically, in this technical solution, the vertical end of each L-shaped auxiliary plate is fixedly connected to the side wall of the tooling plate by screws, and the upper surface of the tooling plate is provided with matching grooves at the horizontal end of the L-shaped auxiliary plate. A cylindrical positioning block is fixed on the upper surface of the horizontal end of each L-shaped auxiliary plate.

[0010] Specifically, in this technical solution, a first set of holes is provided at each of the four corners of the edge of the whole board of adhesive paper, and a second set of holes is provided below each of the first set of holes on the whole board of adhesive paper, and each of the first set of holes and the second set of holes is matched with the positioning block.

[0011] In summary, the present invention has the following advantages: by using a whole-board bonding method, production efficiency is significantly improved. Compared with traditional manual bonding one by one, whole-board bonding can complete the bonding of PI / adhesive paper on multiple FPC boards at one time, increasing efficiency by more than 3 times. At the same time, the positioning pins and positioning holes on the tooling plate ensure the precise alignment of the FPC board and the PI / adhesive paper, improving bonding accuracy and product quality.

[0012] It also boasts excellent operability and economy. The n-shaped design of the adhesive tape and the setting of the hand-tear position make it convenient for operators to quickly tear off the release paper, simplifying the operation process. This not only improves production efficiency and product quality, but also significantly reduces labor costs and equipment maintenance costs, making it highly practical and economical. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the tooling fitting of this utility model;

[0014] Figure 2 This is a top view of the tooling plate of this utility model;

[0015] Figure 3 This is a side view of the tooling plate of this utility model;

[0016] Figure 4 This is a schematic diagram of the entire PI board of this utility model;

[0017] Figure 5 This is a schematic diagram of the whole sheet of adhesive paper of this utility model;

[0018] Figure 6 This is a schematic diagram of the bonding process of this utility model.

[0019] Figure descriptions: 1. Tooling plate; 101. Positioning pin; 102. L-shaped auxiliary plate; 103. Positioning block; 2. FPC board; 3. Whole board PI; 301. PI auxiliary material; 4. Whole board adhesive tape; 401. Adhesive tape auxiliary material; 4011. Tear-off position; 4012. No-adhesive area; 403. First set of holes; 404. Second set of holes; 5. Positioning hole. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] The embodiments of this utility model will be described below based on its overall structure.

[0022] In this embodiment, please refer to Figures 1-6 As shown, a tooling for a new energy FPC reinforcement PI adhesive tape bonding equipment includes a tooling plate 1, an FPC plate 2, a whole PI plate 3, and a whole adhesive tape 4. The tooling plate 1 is made of high-strength aluminum alloy with an anodized surface to ensure flatness, smoothness, wear resistance, and corrosion resistance. The whole PI plate 3 and the whole adhesive tape 4 are the same size as the tooling plate 1 to ensure that they can support and adapt to the materials required for the entire bonding process. Several positioning pins 101 are fixed on the tooling plate 1, and the positioning pins 101 are arranged in seven rows and four columns. The PI board 3 has fourteen rows of PI auxiliary materials 301, and the adhesive paper board 4 has fourteen rows of adhesive paper auxiliary materials 401. The PI auxiliary materials 301 and the adhesive paper auxiliary materials 401 are respectively adapted to the PI bonding area and the adhesive paper bonding area of ​​the FPC board 2. The adhesive paper auxiliary materials 401 are n-shaped. The horizontal part of the adhesive paper auxiliary materials 401 has multiple glue-free areas 4012. The inner side of one vertical part of the adhesive paper auxiliary materials 401 has a tear-off position 4011. The tear-off position 4011 makes it convenient for the operator to tear off the release paper after bonding.

[0023] The FPC board 2 and PI auxiliary material 301 are both provided with positioning holes 5 that match the positioning pins 101. The tooling plate 1 is provided with L-shaped auxiliary plates 102 at the four corners of its edge. The four L-shaped auxiliary plates 102 are used to position the whole board adhesive tape 4. The FPC board 2 is a short blade FPC board to be bonded. It has a PI bonding area and an adhesive tape bonding area pre-set on it, which correspond one-to-one with the auxiliary material positions of the whole board PI3 and the whole board adhesive tape 4. The whole board PI3 is a whole board auxiliary material made of polyimide material. The number and spacing of each row of PI auxiliary material 301 are determined according to the design requirements of the FPC board 2 to ensure accurate matching with the PI bonding area of ​​the FPC board 2. The adhesive tape auxiliary material 401 uses high temperature resistant and high viscosity acrylic adhesive, and the substrate is PET film.

[0024] The vertical end of each L-shaped auxiliary plate 102 is fixedly connected to the side wall of the tooling plate 1 by screws. The upper surface of the tooling plate 1 is provided with matching grooves at the horizontal end of the L-shaped auxiliary plate 102. A cylindrical positioning block 103 is fixed on the upper surface of the horizontal end of each L-shaped auxiliary plate 102. A first set hole 403 is provided at the four corners of the edge of the whole board adhesive tape 4. A second set hole 404 is provided on the whole board adhesive tape 4 below each first set hole 403. Each first set hole 403 and each second set hole 404 is matched with the positioning block 103.

[0025] The worker aligns the positioning hole 5 of the FPC board 2 with the positioning pin 101 on the tooling plate 1, and slowly lowers the FPC board 2 so that the positioning pin 101 passes through the positioning hole 5, ensuring that the FPC board 2 is placed flat on the upper surface of the tooling plate 1 without any lifting or tilting. The worker gently presses the four corners of the FPC board 2 to ensure that the FPC board 2 and the tooling plate 1 are tightly fitted together and to avoid gaps. Then, the worker takes the whole board PI3, peels off the release paper, and places it above the PI bonding area of ​​the FPC board 2. Through the cooperation of the positioning hole 5 and the positioning pin 101, the worker ensures that the PI auxiliary material 301 is precisely aligned with the front PI bonding area of ​​the FPC board 2. The worker uses a silicone roller to press the whole board PI3 evenly from the center to the periphery to ensure that the PI cover film is tightly bonded to the front of the FPC board 2 without any bubbles or lifting edges.

[0026] Next, flip the FPC board 2, with the PI cover film already attached to the front, so that the reverse side is facing up. Insert the positioning pin 101 of the tooling plate 1 through the original positioning hole 5. At this point, be careful to avoid contact between the front PI cover film and the tooling plate 1. A 0.5mm thick silicone pad can be added to the top of the positioning pin 101 to prevent damage to the front auxiliary material. Then, take the entire board of adhesive tape 4 and insert it through the first set of holes 403 at the four corners into the positioning block 103 of the L-shaped auxiliary plate 102, so that the n-shaped adhesive tape auxiliary material 401 aligns with the adhesive tape on the reverse side of the FPC board 2 for adhesion. In the first area, peel off the release paper of the whole sheet of adhesive tape 4 (this can be easily done through the tear-off section 4011 of the adhesive tape auxiliary material 401), and press evenly with the silicone roller to ensure that the adhesive tape auxiliary material 401 is tightly attached to the reverse bonding area. Pay special attention to the fact that the unattached area 4012 should be flat and free of air bubbles. After the bonding is completed, take the FPC board 2 to be bonded again and repeat the above steps. Then, position the whole sheet of adhesive tape 4 through the second set of holes 404 and then bond it, so that one whole sheet of adhesive tape 4 can bond two sets of FPC boards 2 to be bonded.

[0027] This method significantly improves production efficiency by using whole-board bonding. Compared to traditional manual bonding, whole-board bonding can complete the bonding of PI / adhesive paper on multiple FPC boards 2 at one time, increasing efficiency by more than 3 times. At the same time, the positioning pins 101 and positioning holes 5 on the tooling plate 1 ensure precise alignment between the FPC board 2 and the PI / adhesive paper, improving bonding accuracy and product quality.

[0028] It also has good operability and economy. The n-shaped design of the adhesive tape auxiliary material 401 and the setting of the hand tear position 4011 make it convenient for operators to quickly tear off the release paper, simplifying the operation process. It not only improves production efficiency and product quality, but also significantly reduces labor costs and equipment maintenance costs, making it highly practical and economical.

[0029] The working principle of this utility model is as follows:

[0030] The worker aligns the positioning hole 5 of the FPC board 2 with the positioning pin 101 on the tooling plate 1, and slowly lowers the FPC board 2 so that the positioning pin 101 passes through the positioning hole 5, ensuring that the FPC board 2 is placed flat on the upper surface of the tooling plate 1 without any lifting or tilting. The worker gently presses the four corners of the FPC board 2 to ensure that the FPC board 2 and the tooling plate 1 are tightly fitted together and to avoid gaps. Then, the worker takes the whole board PI3, peels off the release paper, and places it above the PI bonding area of ​​the FPC board 2. Through the cooperation of the positioning hole 5 and the positioning pin 101, the worker ensures that the PI auxiliary material 301 is precisely aligned with the front PI bonding area of ​​the FPC board 2. The worker uses a silicone roller to press the whole board PI3 evenly from the center to the periphery to ensure that the PI cover film is tightly bonded to the front of the FPC board 2 without any bubbles or lifting edges.

[0031] Next, flip the FPC board 2 with the PI cover film already attached to the front side so that the back side is facing up. Insert the positioning pin 101 of the tooling plate 1 through the original positioning hole 5. At this time, be careful to avoid contact between the front PI cover film and the tooling plate 1. You can add a 0.5mm thick silicone pad on the top of the positioning pin 101 to prevent damage to the front auxiliary material. Then take the whole board of adhesive tape 4 and insert it into the positioning block 103 of the L-shaped auxiliary plate 102 through the first set hole 403 and the second set hole 404 at the four corners so that the n-shaped adhesive tape auxiliary material 401 is aligned with the adhesive tape bonding area on the back of the FPC board 2. Tear off the release paper of the whole board of adhesive tape 4 (you can easily do this through the tear-off position 4011 of the adhesive tape auxiliary material 401). Press it evenly with a silicone roller to ensure that the adhesive tape auxiliary material 401 is tightly bonded to the bonding area on the back side. Pay special attention to the fact that the non-adhesive area 4012 should be flat and free of air bubbles. The bonding is now complete.

[0032] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A new energy FPC reinforcing PI adhesive paper bonding equipment tool, comprising a tool plate (1), an FPC plate (2), a whole plate PI (3) and a whole plate adhesive paper (4), characterized in that, The entire PI board (3) and the entire adhesive tape (4) are the same size as the tooling board (1). The tooling board (1) is fixed with several positioning pins (101). The positioning pins (101) are arranged in seven rows and four columns. The entire PI board (3) is provided with fourteen rows of PI auxiliary materials (301). The entire adhesive tape (4) is provided with fourteen rows of adhesive tape auxiliary materials (401). The PI auxiliary materials (301) and the adhesive tape auxiliary materials (401) are respectively adapted to the PI bonding area and the adhesive tape bonding area of ​​the FPC board (2). The FPC board (2) and PI auxiliary material (301) are provided with positioning holes (5) that match the positioning pins (101). The tooling plate (1) is provided with L-shaped auxiliary plates (102) at the four corners of its edge. The four L-shaped auxiliary plates (102) are used to position the whole board of adhesive paper (4).

2. The new energy FPC reinforcing PI glue paper bonding equipment tooling according to claim 1, characterized in that, The adhesive tape (401) is n-shaped, and the horizontal part of the adhesive tape (401) has multiple non-adhesive areas (4012), and the inner side of one vertical part of the adhesive tape (401) has a tear-off position (4011).

3. The new energy FPC reinforcing PI glue paper bonding equipment tooling according to claim 1, characterized in that, The vertical end of each L-shaped auxiliary plate (102) is fixedly connected to the side wall of the tooling plate (1) by screws. The upper surface of the tooling plate (1) is provided with matching grooves at the horizontal end of the L-shaped auxiliary plate (102). A cylindrical positioning block (103) is fixed on the upper surface of the horizontal end of each L-shaped auxiliary plate (102).

4. The new energy FPC reinforcing PI glue paper bonding equipment tooling according to claim 3, characterized in that, The four corners of the edge of the whole board of adhesive tape (4) are provided with first sets of holes (403), and the whole board of adhesive tape (4) is provided with second sets of holes (404) below each first set of holes (403). Each first set of holes (403) and each second set of holes (404) are matched with the positioning block (103).

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