A magnetic tooling assembly board for solder paste printing

By using the magnets and mechanical positioning structure of the magnetic tooling assembly board, the positioning accuracy and splicing efficiency problems of solder paste printing tooling in the existing technology are solved, realizing high-precision, stable and efficient solder paste printing, and improving product quality and production efficiency.

CN224460157UActive Publication Date: 2026-07-03HEFEI E-ONG OPTOELECTRONICS TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HEFEI E-ONG OPTOELECTRONICS TECH CO LTD
Filing Date
2025-06-18
Publication Date
2026-07-03

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Abstract

This utility model relates to the field of solder paste printing tooling technology, specifically to a magnetic suction tooling panel for solder paste printing, comprising: a limiting mechanism, a positioning mechanism below the limiting mechanism, the limiting mechanism including a limiting shell, a limiting strip one symmetrically and elastically connected to the inner cavity of the limiting shell, and a second limiting strip two symmetrically and elastically connected to the inner cavity of the limiting shell, with an elastic element fixed at the lower end of the second limiting strip. This utility model uses the engagement of the limiting groove and the fixing groove, and the magnetic attraction generated by the magnet to tightly connect the panels into a flat printing platform, significantly improving the splicing efficiency of the device and effectively reducing errors during connection, providing a strong guarantee for high-quality solder paste printing. Furthermore, the arc-shaped hole provides movement space for the fixing plate, allowing the suction component to float slightly with the circuit board, avoiding uneven solder paste thickness caused by hard contact, further improving the printing quality and stability.
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Description

Technical Field

[0001] This utility model relates to the field of solder paste printing tooling technology, specifically to a magnetic tooling assembly board for solder paste printing. Background Technology

[0002] In the surface mount technology (SMT) production process of printed circuit boards (PCBs), solder paste printing is a crucial first step, and its quality directly affects the reliability of subsequent component soldering. To improve production efficiency, the industry generally adopts the "paneling" method, which involves pre-fixing multiple PCBs on a large tooling fixture and then completing the solder paste printing and component placement of multiple boards at once.

[0003] Existing solutions typically use a single, large-sized integrated fixture to support multiple PCBs. However, the larger the fixture, the more significant the impact of manufacturing tolerances and thermal deformation on positioning accuracy. This often leads to positioning deviations of PCBs at different positions on the fixture, resulting in solder paste printing offsets (e.g., offsets reaching 1 / 3 of the pad width), failing to meet the requirements of precision manufacturing and causing a decrease in product yield. Limitations of splicing methods: Some split fixtures use bolts for splicing, which is not only cumbersome and inefficient, but repeated disassembly and assembly can also cause wear on the connection points, making it difficult to guarantee the flatness and positional consistency after each splicing, which also affects printing quality. Insufficient support and protection for the PCB: During printing, the solder paste squeegee applies pressure to the PCB. If the fixture's support for the PCB is rigid or has gaps, it can easily cause slight vibrations or deformations in the PCB, resulting in uneven solder paste thickness and affecting soldering quality.

[0004] Therefore, how to provide a tooling technology that can ensure high-precision printing of single boards, achieve efficient and stable splicing of multiple boards, and provide good support for PCBs is a technical problem that urgently needs to be solved in this field. Utility Model Content

[0005] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a magnetic tooling panel for solder paste printing, which can effectively solve the problems of low splicing efficiency and easy error in the existing technology.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] This utility model provides a magnetic tooling assembly for solder paste printing, comprising: a limiting shell having at least one mating surface for docking with other independent tooling units;

[0008] A magnet is disposed on the mating surface to generate a magnetic attraction force with a magnet of another independent tooling unit, so as to realize the detachable splicing of the at least two independent tooling units;

[0009] A mechanical positioning structure is provided on the mating surface to provide precise positioning during magnetic splicing;

[0010] A limiting mechanism is disposed inside the limiting housing and is used to position a single printed circuit board supported thereon.

[0011] Preferably, the mechanical positioning structure includes: a limiting groove formed on one mating surface of the limiting housing, and a fixing groove formed on another mating surface that is adapted to the limiting groove.

[0012] Preferably, the limiting mechanism includes:

[0013] The limiting strip one and the limiting strip two are symmetrically and elastically connected within the inner cavity of the limiting shell;

[0014] The lower end of the second limiting strip is fixed with an elastic element, and the telescopic end of the elastic element is fixed with a fixing plate; the fixing plate is used to clamp and fix the printed circuit board when the first limiting strip and the second limiting strip are reset.

[0015] Preferably, each of the independent tooling units further includes a positioning mechanism disposed below the limiting mechanism for supporting and adsorbing the printed circuit board from the bottom.

[0016] Preferably, the positioning mechanism includes:

[0017] A positioning housing fixed to the lower end of the limiting housing;

[0018] Two electric telescopic rods are fixed in the middle of the bottom wall of the positioning housing;

[0019] And the adsorption assembly fixed to the second telescopic end of the electric telescopic rod.

[0020] Preferably, an arc-shaped hole is provided at the lower center of the limiting shell, and the arc-shaped hole provides movement space for the fixing plate.

[0021] Preferably, the adsorption component includes:

[0022] A suction cup used to generate negative pressure for adsorption;

[0023] And an elastic buffer structure connected between the suction cup and the electric telescopic rod 2, for providing flexible support when the suction cup contacts the printed circuit board.

[0024] Preferably, the elastic buffer structure includes: a fixed cover fixed to the upper end of the electric telescopic rod, a movable cover slidably connected inside the fixed cover, and a spring connected between the movable cover and the piston rod.

[0025] The technical solution provided by this utility model has the following advantages compared with the known prior art:

[0026] 1. By incorporating magnets and mechanical positioning structures (such as limiting grooves and fixing grooves) at the mating surfaces, multiple independent tooling units can achieve rapid and automatic alignment and locking. Compared to traditional bolt connections, this significantly improves efficiency and ensures high repeatability and consistency in splicing, guaranteeing the overall flatness and stability of the assembled board. This provides a reliable platform for subsequent assembly line operations such as surface mount technology (SMT), achieving rapid, precise, and stable splicing, greatly improving production efficiency, fundamentally enhancing printing accuracy, and ensuring product quality. Each independent tooling unit is small in size, facilitating high-precision manufacturing and positioning, thus ensuring high precision for single PCBs during critical processes such as solder paste printing. After completing high-precision processes, multiple units are then spliced ​​together; this avoids printing misalignment issues caused by insufficient precision in large-size integrated tooling, significantly improving the yield and reliability of the final product.

[0027] 2. The positioning mechanism inside each independent tooling unit, especially the adsorption component with elastic buffer structure, can provide flexible support for the PCB from bottom to top during the printing process. This can effectively absorb the pressure and impact brought by the solder paste squeegee, prevent the PCB from generating slight vibrations or deformations, and allow the adsorption component to float slightly with the circuit board. This avoids the problem of uneven solder paste thickness caused by hard contact, further improves the printing quality and stability, provides flexible buffer support, and further improves printing uniformity.

[0028] 3. Due to the use of modular independent tooling units, when a unit is damaged, only that unit needs to be replaced. The maintenance cost is much lower than replacing the entire large integrated tooling. At the same time, different numbers of tooling units can be flexibly combined according to production needs to achieve panel production of different scales. It is highly adaptable, and the modular design reduces maintenance costs and improves production flexibility. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0031] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0032] Figure 3 This is a schematic diagram of the internal structure of the limiting mechanism of this utility model;

[0033] Figure 4 This is a schematic diagram of the internal structure of the positioning mechanism of this utility model;

[0034] Figure 5 This is a schematic diagram of the internal structure of the adsorption component of this utility model.

[0035] Reference numerals in the attached drawings: 1. Limiting mechanism; 2. Positioning mechanism; 11. Limiting housing; 12. Limiting strip one; 13. Limiting strip two; 14. Elastic element; 15. Fixing plate; 16. Arc-shaped hole; 17. Magnet; 18. Limiting groove; 19. Fixing groove; 21. Positioning housing; 22. Positioning pin; 23. Electric telescopic rod two; 24. Adsorption assembly; 241. Fixing cover; 242. Movable cover; 243. Piston rod; 244. Air hole; 245. Elastic spring; 246. Conical ring; 247. Suction cup. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0037] The present invention will be further described below with reference to the embodiments.

[0038] Example: Refer to Figures 1 to 5 A magnetic fixture panel for solder paste printing, comprising at least two interlocking independent fixture units, wherein each independent fixture unit includes:

[0039] A limiting housing 11, having at least one mating surface for docking with other independent tooling units;

[0040] Magnet 17 is disposed on the mating surface and is used to generate magnetic attraction with the magnet of another independent tooling unit to achieve detachable splicing of at least two independent tooling units;

[0041] A mechanical positioning structure, set on the mating surface, is used to provide precise positioning during magnetic splicing;

[0042] The limiting mechanism 1 is located inside the limiting housing 11 and is used to position a single printed circuit board supported thereon.

[0043] To further explain, the following settings are made to ensure accuracy during tooling assembly, such as... Figure 3 As shown, the limiting mechanism 1 includes:

[0044] The limiting strip 12 and the limiting strip 2 13 are symmetrically and elastically connected to the inner cavity of the limiting shell 11;

[0045] The lower end of the second limiting strip 13 is fixed with an elastic element 14, and the telescopic end of the elastic element 14 is fixed with a fixing plate 15; the fixing plate 15 is used to clamp and fix the printed circuit board when the first limiting strip 12 and the second limiting strip 13 are reset.

[0046] A limiting groove 18 is formed on one mating surface of the limiting housing 11, and a fixing groove 19 is formed on another mating surface and adapted to the limiting groove 18.

[0047] An arc-shaped hole 16 is provided at the lower center of the limiting shell 11, which provides space for the fixed plate 15 to move.

[0048] To further explain, the following settings are made for positioning the device during printing, such as... Figure 4 As shown, each independent tooling unit also includes a positioning mechanism 2, located below the limiting mechanism 1, for supporting and adsorbing the printed circuit board from the bottom. The positioning mechanism 2 includes:

[0049] Positioning housing 21 fixed to the lower end of limiting housing 11;

[0050] Electric telescopic rod 23 is fixed to the middle of the bottom wall of the positioning housing 21;

[0051] And the adsorption assembly 24 fixed to the telescopic end of the electric telescopic rod 23.

[0052] To further explain, the following settings are made to allow for the adsorption and fixation of the circuit board within the device, such as... Figure 5 As shown, the elastic buffer structure includes: a fixed cover 241 fixed to the upper end of the electric telescopic rod 23, a movable cover 242 slidably connected inside the fixed cover 241, and a spring 245 connected between the movable cover 242 and the piston rod 243.

[0053] The working principle of this utility model is as follows: The circuit board requiring solder paste printing is pressed into the limiting housing 11, which squeezes the limiting strip 12 and limiting strip 23 to move away from each other until the circuit board is pressed against the bottom wall of the limiting housing 11. Then, under the action of elastic connection, the limiting strip 12 and limiting strip 23 move towards each other, so that the two fixing plates 15 are positioned above the circuit board and clamped by the elastic element 14, thus completing the initial fixing of the circuit board. Then, the electric telescopic rod 23 is activated to push the adsorption assembly 24 upward. After the suction cup 247 contacts the circuit board, the electric telescopic rod 23 continues to push the fixing cover 241 and the piston. As the piston rod 243 moves upward, it compresses the spring spring 245 during the movement of the piston rod 243, causing it to contract until the piston rod 243 moves above the air hole 244, causing the air hole 244 to close and form a negative pressure to adsorb the circuit board onto the bottom of the positioning housing 21. Compared with the traditional single adsorption method, the fixing accuracy of the circuit board can be improved, avoiding defects such as pad offset and bridging caused by displacement during solder paste printing. During splicing, the limiting groove 18 and fixing groove 19 of adjacent panels engage, and the strong magnetic attraction force generated by the magnet 17 makes the panels tightly connected into a flat printing platform. The magnetic connection method improves efficiency compared with bolt splicing and reduces the error during connection, ensuring the flatness consistency of multi-panel printing.

[0054] Limiting strip 12 and limiting strip 23 inside the limiting housing 11 are connected to the fixing plate 15 through the elastic element 14. They can absorb the slight vibration of the circuit board caused by the pressure of the solder paste squeegee during printing. The arc-shaped hole 16 provides the fixing plate 15 with room for movement, so that the adsorption component 24 can float slightly with the circuit board, effectively avoiding the problem of uneven solder paste thickness caused by hard contact. After the solder paste printing is completed, the electric telescopic rod 23 is activated to drive the adsorption component 24 to move upward, so that the piston rod 243 moves into the conical ring 246. The air hole 244 located below opens to break the negative pressure, so that the circuit board can be taken out. Limiting strip 12 and limiting strip 23 are reset under the action of the elastic element 14.

[0055] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of this utility model.

Claims

1. A magnetic type jig assembly plate for solder paste printing, characterized by, It consists of at least two independent tooling units that can be joined together, wherein each of the independent tooling units includes: A limiting housing (11) having at least one mating surface for docking with other independent tooling units; A magnet (17) is disposed on the mating surface to generate a magnetic attraction force with the magnet of another independent tooling unit, so as to realize the detachable splicing of the at least two independent tooling units; A mechanical positioning structure is provided on the mating surface to provide precise positioning during magnetic splicing; A limiting mechanism (1) is disposed inside the limiting housing (11) and is used to position a single printed circuit board supported thereon.

2. The magnetic tin paste printing jig assembly board according to claim 1, wherein, The mechanical positioning structure includes: a limiting groove (18) formed on one mating surface of the limiting housing (11), and a fixing groove (19) formed on another mating surface that is adapted to the limiting groove (18).

3. The magnetic tin paste printing jig assembly panel according to any one of claims 1 or 2, wherein, The limiting mechanism (1) includes: The limiting strip one (12) and the limiting strip two (13) are symmetrically and elastically connected to the inner cavity of the limiting shell (11). The lower end of the second limiting strip (13) is fixed with an elastic element (14), and the telescopic end of the elastic element (14) is fixed with a fixing plate (15); the fixing plate (15) is used to clamp and fix the printed circuit board when the first limiting strip (12) and the second limiting strip (13) are reset.

4. The magnetic tin paste printing jig assembly board according to claim 3, characterized in that, Each of the independent tooling units also includes a positioning mechanism (2) located below the limiting mechanism (1) for supporting and adsorbing the printed circuit board from the bottom.

5. The magnetic tin paste printing jig assembly panel of claim 4, wherein, The positioning mechanism (2) includes: Positioning housing (21) fixed to the lower end of the limiting housing (11); Electric telescopic rod 2 (23) is fixed in the middle of the bottom wall of the positioning housing (21); And the adsorption assembly (24) fixed to the telescopic end of the electric telescopic rod (23).

6. The magnetic tin paste printing jig assembly panel of claim 5, wherein, An arc-shaped hole (16) is provided at the lower center of the limiting shell (11), and the arc-shaped hole (16) provides the moving space for the fixing plate (15).

7. The magnetic tin paste printing jig assembly panel of claim 5, wherein, The adsorption component (24) includes: A suction cup (247) for generating negative pressure adsorption. And an elastic buffer structure connecting the suction cup (247) and the second electric telescopic rod (23) for providing flexible support when the suction cup (247) contacts the printed circuit board.

8. The magnetic tin paste printing jig assembly board according to claim 7, characterized in that, The elastic buffer structure includes: a fixed cover (241) fixed to the upper end of the electric telescopic rod (23), a movable cover (242) slidably connected inside the fixed cover (241), and a spring (245) connected between the movable cover (242) and the piston rod (243).