Housing assembly and electronic device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING XIAOMI MOBILE SOFTWARE CO LTD
- Filing Date
- 2025-06-04
- Publication Date
- 2026-07-03
AI Technical Summary
The housing components of existing electronic devices have low strength at the edges, making the whole device easy to bend and deform, which makes it difficult to meet the requirements of high reliability testing.
The reinforcing part using metal parts is formed by bending the edge of the main body to form at least three layers of walls, and combined with the frame part to form a composite bending structure of "S", "Z" or stepped type, which enhances the edge strength of the shell assembly.
It improves the bending resistance of the housing components, enabling them to resist pressure more effectively and avoid bending deformation, while reducing the space occupied by the reinforcement, thus adapting to the thinner and lighter design of electronic devices.
Smart Images

Figure CN224460178U_ABST