Automobile electronic patch base with via hole heat dissipation

Abstract

This utility model discloses a through-hole heat dissipation automotive electronic patch base, comprising: a patch base body, connecting plates disposed on the bottom sides of the patch base body, and a limiting mechanism disposed within the patch base body; the connecting plates are fixedly connected to the bottom sides of the patch base body, and mounting holes are formed at the front, middle, and rear ends of the connecting plates; an electronic component receiving slot is formed in the middle of the upper surface of the patch base body, and a plurality of heat dissipation through holes are formed at equal intervals at the bottom of the electronic component receiving slot; electrode pin placement slots are formed on the front and rear sides of the bottom center of the electronic component receiving slot; and pin grooves are formed on the front and rear ends of the middle of the lower surface of the patch base body. This through-hole heat dissipation automotive electronic patch base allows for heat dissipation of the bottom of the electronic components through the heat dissipation through holes, enabling heat dissipation through the holes. The electrode pins are clamped and fixed to prevent them from lifting, which would hinder soldering.

Description

Technical Field

[0001] This utility model relates to the technical field of automotive electronic patch bases, specifically an automotive electronic patch base with through-hole heat dissipation. Background Technology

[0002] Automotive electronic surface mount bases are fixed support structures specifically designed for automotive electronic components. Their core feature is the efficient and precise manufacturing of capacitor bases through integrated production lines. They are mainly used for the packaging and fixing of automotive electronic components, such as surface mount capacitor bases, to meet the compactness and high reliability requirements of automotive electronic devices.

[0003] Chinese utility model patent CN206100638U discloses a surface-mount electronic device and its surface-mount base, relating to the technical field of automotive electronic surface-mount bases. The device includes a device body and electrode leads extending downwards from the lower end of the device body. The surface-mount base has a receiving groove on its top surface, a lead through-hole on its bottom wall, and an elongated lead groove on its bottom surface. One end of the lead groove connects to the lead through-hole, and the other end extends through the edge of the surface-mount base. A through-hole electronic device is fitted into the receiving groove, and the electrode leads of the through-hole electronic device pass through the lead through-hole, bend, and then extend out of the surface-mount base along the lead groove. This utility model's through-hole electronic device, constructed using a surface-mount base, is simple to assemble and can be produced using automated surface-mount assembly, improving production efficiency.

[0004] Based on existing solutions and actual production and processing, current automotive electronic patch bases still have some problems, such as: the electronic components generate heat during operation, making it difficult to dissipate heat; and the electrode pins on the electronic components are prone to displacement during soldering, making them difficult to fix. Therefore, we propose a through-hole heat dissipation automotive electronic patch base to solve the problems mentioned above. Utility Model Content

[0005] The purpose of this utility model is to provide a through-hole heat dissipation automotive electronic patch base to solve the problems mentioned in the background art, such as the fact that the electronic devices generate heat during operation, making it difficult to dissipate heat from the electronic devices, and that the electrode pins on the electronic devices are easy to move during soldering, making it difficult to fix them.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a through-hole heat dissipation automotive electronic patch base, comprising:

[0007] The patch base body, the connecting plates at the bottom of both sides of the patch base body, and the limiting mechanism inside the patch base body;

[0008] The bottom of the left and right sides of the patch base body is fixedly connected to a connecting plate, and the front, middle and rear ends of the connecting plate are provided with mounting holes. The upper surface of the patch base body is provided with an electronic component receiving slot, and the bottom of the electronic component receiving slot is provided with several heat dissipation through holes at equal intervals.

[0009] The bottom center of the electronic device receiving slot is provided with electrode pin placement slots on both the front and rear sides. The lower surface of the patch base body is provided with pin grooves on both the front and rear ends, and a sliding groove is provided on the outer side of the top of the electrode pin placement slot. A limiting mechanism is provided inside the electrode pin placement slot.

[0010] Preferably, the electrode pin placement slot, pin groove, and sliding groove are connected.

[0011] Preferably, the limiting mechanism is composed of a moving rod, a clamping plate, a slot, a protrusion, a sliding rod, and a spring. The clamping plate is fixedly connected to the inner side of the moving rod, and a slot is opened in the middle of the inner side of the clamping plate. A protrusion is fixedly connected to the bottom of the outer end of the moving rod, and a sliding rod is fixedly connected to the inner end of the upper surface of the moving rod, and a spring is fixedly connected to the outer side of the sliding rod.

[0012] Preferably, the inner side of the clamp plate is in contact with the inner side of the electrode pin placement groove.

[0013] Preferably, the bottom surface of the protrusion is on the same plane as the lower surface of the patch base body.

[0014] Preferably, the outer end of the slide rod is slidably connected within the slide groove.

[0015] Preferably, the outer end of the spring is fixedly connected to the inner outer side of the groove.

[0016] Compared with the prior art, the beneficial effects of this utility model are: the automotive electronic patch base with through-hole heat dissipation allows the bottom of the electronic device to dissipate heat through the heat dissipation holes, and the electrode pins are clamped and fixed to prevent the electrode pins from lifting up, which is not conducive to soldering.

[0017] 1. An electronic component receiving slot is provided in the middle of the upper surface of the surface mount base body. Several heat dissipation holes are provided at equal intervals in the middle of the bottom of the electronic component receiving slot. The electronic component is placed in the electronic component receiving slot, and the bottom of the electronic component dissipates heat through the heat dissipation holes.

[0018] 2. Electrode pin storage slots are provided on both the front and rear sides of the bottom center of the electronic component receiving slot. A limiting mechanism is provided in the electrode pin storage slot to clamp and fix the electrode pins. By clamping and fixing the electrode pins, the electrode pins are prevented from tilting up, which is not conducive to soldering. Attached Figure Description

[0019] Figure 1 This is a frontal perspective view of the structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the bottom perspective structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the top perspective structure of this utility model;

[0022] Figure 4 This is a side perspective cross-sectional view of the present invention.

[0023] Figure 5 This is a perspective view of the limiting mechanism of this utility model.

[0024] In the diagram: 1. SMD base body; 2. Connecting plate; 3. Mounting hole; 4. Electronic component receiving slot; 5. Heat dissipation through hole; 6. Electrode pin placement slot; 7. Pin groove; 8. Slide groove; 9. Moving rod; 10. Clamping plate; 11. Slot; 12. Protrusion; 13. Slide rod; 14. Spring. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example 1: Please refer to Figures 1-4 Existing automotive electronic patch mounts generate heat during electronic device operation, making heat dissipation difficult. To address this technical problem, this embodiment discloses the following technical content.

[0027] A through-hole heat dissipation automotive electronic patch base, wherein the bottom of the left and right sides of the patch base body 1 is fixedly connected to the connecting plate 2, and the front, middle and rear ends of the connecting plate 2 are provided with mounting holes 3, and the upper surface of the patch base body 1 is provided with an electronic device receiving slot 4, and the bottom of the electronic device receiving slot 4 is provided with a plurality of heat dissipation through holes 5 at equal intervals.

[0028] Electrode pin placement slots 6 are provided on the front and rear sides of the bottom center of the electronic device receiving slot 4. Pin grooves 7 are provided on the front and rear ends of the lower surface of the patch base body 1. A sliding groove 8 is provided on the outer side of the top of the electrode pin placement slot 6. The electrode pin placement slot 6, pin grooves 7 and sliding groove 8 are connected.

[0029] The patch base body 1 can be fixed on the plane through the connecting plate 2 and the mounting hole 3. The mounting bolt is threaded through the mounting hole 3 and connected to the plane. When installing electronic devices, the electronic devices are placed inside the electronic device receiving slot 4, and the electrode pins of the electronic devices are placed in the electrode pin placement slot 6. The bottom surface of the electronic devices is in contact with the bottom surface of the electronic device receiving slot 4. Several heat dissipation holes 5 are opened at the bottom of the electronic device receiving slot 4. The electronic devices can be cooled through these heat dissipation holes 5 to prevent the electronic devices from overheating.

[0030] Example 2: Existing automotive electronic patch bases have electrode pins on electronic devices that are prone to shifting during soldering, making them difficult to fix. Therefore, this example uses the following technical solution, such as... Figures 1-5 As shown;

[0031] A limiting mechanism is provided in the electrode pin placement slot 6. The limiting mechanism is composed of a moving rod 9, a clamping plate 10, a slot 11, a protrusion 12, a sliding rod 13, and a spring 14. The clamping plate 10 is fixedly connected to the inner side of the moving rod 9, and the inner side of the clamping plate 10 is in contact with the inner side of the electrode pin placement slot 6. A slot 11 is opened in the middle of the inner side of the clamping plate 10. The protrusion 12 is fixedly connected to the bottom of the outer end of the moving rod 9, and the bottom surface of the protrusion 12 is on the same plane as the lower surface of the patch base body 1. The sliding rod 13 is fixedly connected to the inner end of the upper surface of the moving rod 9, and the outer end of the sliding rod 13 is slidably connected in the slide groove 8. The spring 14 is fixedly connected to the outer side of the sliding rod 13, and the outer end of the spring 14 is fixedly connected to the inner outer side of the slide groove 8.

[0032] When installing electronic components, first pinch the protrusion 12 and move the moving rod 9 outward to insert the electrode pins at the bottom of the electronic component between the clamping plate 10 and the electrode pin placement slot 6. The clamping plate 10 has a locking groove 11 on its inner side, which can hold the electrode pins in place and prevent the electronic pins from shifting. Then, release the protrusion 12. The moving rod 9, clamping plate 10 and sliding rod 13 move inward under the action of spring 14 to hold the electrode pins in place and prevent the position of the electrode pins from shifting during soldering, which would result in poor soldering effect.

[0033] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0034] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A through-hole heat dissipation automotive electronic patch base, comprising: The patch base body (1) and the connecting plates (2) provided at the bottom of both sides of the patch base body (1) and the limiting mechanism provided inside the patch base body (1); Its features are: The bottom of the left and right sides of the patch base body (1) is fixedly connected to a connecting plate (2), and the front, middle and rear ends of the connecting plate (2) are provided with mounting holes (3). The upper surface of the patch base body (1) is provided with an electronic device receiving slot (4), and the bottom of the electronic device receiving slot (4) is provided with several heat dissipation through holes (5) at equal intervals. The bottom center of the electronic device receiving slot (4) is provided with electrode pin placement slots (6) on both the front and rear sides. The bottom center of the patch base body (1) is provided with pin grooves (7) on both the front and rear ends. The top outer side of the electrode pin placement slot (6) is provided with a sliding groove (8). A limiting mechanism is provided inside the electrode pin placement slot (6).

2. The automotive electronic patch base of via heat dissipation according to claim 1, characterized in that: The electrode pin placement slot (6), pin groove (7), and slide (8) are connected.

3. The automotive electronic paster base of via heat dissipation according to claim 1, characterized in that: The limiting mechanism is composed of a moving rod (9), a clamping plate (10), a slot (11), a protrusion (12), a sliding rod (13), and a spring (14). The inner side of the moving rod (9) is fixedly connected to the clamping plate (10), and the middle of the inner side of the clamping plate (10) is provided with a slot (11). The bottom of the outer end of the moving rod (9) is fixedly connected to the protrusion (12), and the inner end of the upper surface of the moving rod (9) is fixedly connected to the sliding rod (13), and the outer side of the sliding rod (13) is fixedly connected to the spring (14).

4. The automotive electronic patch base of via heat dissipation according to claim 3, characterized in that: The inner side of the clamp (10) is in contact with the inner side of the electrode pin placement groove (6).

5. The automotive electronic patch base with through-hole heat dissipation according to claim 3, characterized in that: The bottom surface of the protrusion (12) is on the same plane as the lower surface of the patch base body (1).

6. The automotive electronic paster base of via heat dissipation according to claim 3, characterized in that: The outer end of the slide rod (13) is slidably connected in the slide groove (8).

7. The automotive electronic paster base of via heat dissipation according to claim 3, characterized in that: The outer end of the spring (14) is fixedly connected to the inner outer side of the groove (8).

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