An upper cover of a power module
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI DAOZHI TECH CO LTD
- Filing Date
- 2025-05-22
- Publication Date
- 2026-07-03
AI Technical Summary
Traditional locating pins, which are placed on the power module housing, are easily damaged by collisions or squeezing, affecting PCB installation accuracy and overall assembly efficiency, and increasing production costs and time.
The positioning pin is integrated into the top cover of the power module and adopts a one-piece molding design. The positioning pin and the buckle are integrally formed with the top cover body, using insulating material, and have guide chamfers distributed at the diagonal position of the top cover. The buckle matches the outer shell.
It reduces the risk of damage to locating pins during the production process, improves production efficiency and product reliability, ensures PCB installation accuracy, and optimizes the assembly process.
Smart Images

Figure CN224460273U_ABST