An upper cover of a power module

CN224460273UActive Publication Date: 2026-07-03SHANGHAI DAOZHI TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI DAOZHI TECH CO LTD
Filing Date
2025-05-22
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Traditional locating pins, which are placed on the power module housing, are easily damaged by collisions or squeezing, affecting PCB installation accuracy and overall assembly efficiency, and increasing production costs and time.

Method used

The positioning pin is integrated into the top cover of the power module and adopts a one-piece molding design. The positioning pin and the buckle are integrally formed with the top cover body, using insulating material, and have guide chamfers distributed at the diagonal position of the top cover. The buckle matches the outer shell.

Benefits of technology

It reduces the risk of damage to locating pins during the production process, improves production efficiency and product reliability, ensures PCB installation accuracy, and optimizes the assembly process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224460273U_ABST
    Figure CN224460273U_ABST
Patent Text Reader

Abstract

This utility model provides a top cover for a power module, relating to the field of power module technology. It includes a top cover body, with multiple snap-fits on its lower surface and multiple positioning pins on its upper surface. The advantage is that the positioning pins, originally located on the power module housing, are integrated into the top cover. Since the top cover is the final step in power module assembly, this design effectively reduces the risk of damage to the positioning pins during handling and processing, improving production efficiency and product reliability. Furthermore, the one-piece molding design of the top cover ensures the stability of the positioning pins and allows for precise matching with the mounting holes on the PCB, further optimizing the power module assembly process.
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