A water-cooled plate structure with embedded welding of aluminum heat spreader plate
By setting an inclined plate and a sealing threaded ring between the aluminum base plate and the top cover plate, combined with a stepped brazing process, the high cost and weight of the copper VC water cooling plate are solved, achieving uniform heat exchange and improving the cooling effect and chip life of high-power electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN WENJIAN PRECISION TECHNOLOGY CO LTD
- Filing Date
- 2025-08-11
- Publication Date
- 2026-07-03
AI Technical Summary
Traditional copper VC water cooling plates are expensive and heavy. Uneven heat flux density leads to chip performance degradation. Existing welding processes have thermal resistance delamination problems and have not achieved an integrated embedded structure of the heat spreader and water cooling channels.
The structure employs a left-inclined plate, a right-inclined plate, and a sealing threaded ring between the aluminum base plate and the top cover plate, combined with a stepped brazing process, to form a uniform temperature-water-cooled composite structure. Using 3003 aluminum alloy, the embedded welding of the aluminum uniform temperature plate is achieved.
It reduces material costs by 30%, lightens weight by 30%, improves thermal uniformity by 40%, reduces interface thermal resistance to below 0.08 K·cm2/W, extends chip lifespan, and improves cooling performance.
Smart Images
Figure CN224460377U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for high-power electronic devices, and in particular to a water-cooled plate structure with an embedded welded aluminum heat spreader. Background Technology
[0002] An aluminum vapor chamber embedded in a welded structure is a composite structure that combines heat conduction and dissipation by embedding copper or aluminum tubes into an aluminum alloy substrate through a welding process. Typically, an aluminum alloy substrate (such as 6-series aluminum profiles) is used as the main material, and copper or aluminum tubes are embedded into internal grooves of the substrate through welding to form fluid circulation channels. Microchannels (such as channels with a diameter of 3 mm) can be machined on the substrate surface to achieve precise temperature control in conjunction with a temperature sensor.
[0003] The current high-performance IGBT module heat dissipation faces the following technical challenges:
[0004] 1. Traditional copper VC water-cooled plates are expensive and heavy (density 8.9g / cm³). 3 );
[0005] 2. Uneven heat flux density in multi-chip layouts can lead to localized hot spots that cause chip performance degradation of up to 30%.
[0006] 3. Existing welding processes (such as reflow soldering) exhibit thermal resistance delamination, with interfacial thermal resistance > 0.15 K·cm. 2 / W.
[0007] Although some patents have proposed aluminum heat dissipation solutions, none of them have achieved an integrated embedded structure of heat spreader and water cooling channels. Utility Model Content
[0008] To solve the above-mentioned technical problems, this utility model provides a water-cooled plate structure with an embedded welded aluminum heat spreader.
[0009] This utility model is achieved by the following technical solution: a water-cooled plate structure with embedded welding of aluminum heat spreader, including an aluminum base plate, a sealing threaded ring connected to the internal thread of the aluminum base plate, a connecting water pipe connected to the internal thread of the sealing threaded ring, and a fixing support ring fixedly connected to the top of the aluminum base plate.
[0010] A vertical aluminum heat spreader is fixedly connected to the top of the aluminum base plate. A left-tilted plate one is fixedly connected to the top of the aluminum base plate. A left-tilted plate two is fixedly connected to the top of the aluminum base plate. A flow guide bracket is fixedly connected to the top of the aluminum base plate. A right-tilted plate one is fixedly connected to the top of the aluminum base plate. A right-tilted plate two is fixedly connected to the top of the aluminum base plate. A flow guide frame is fixedly connected to the top of the aluminum base plate. An installation support is inserted into the inside of the fixed support ring. A top cover plate is fixedly connected to the top of the installation support.
[0011] Using the above technical solution, a 2mm deep groove is formed in the machined base plate, and the surface is anodized. The pre-formed aluminum heat spreader plate (including a 0.1mm sintered layer) is embedded in the groove, and TG-800 thermal paste is applied. The first stage of brazing is performed at 580℃ for 10min under argon protection. After assembling the water channel cover, the second stage of brazing is performed at 610℃ for 15min, and the pressure is tested (0.8MPa pressure holding for 30min with no leakage).
[0012] As a further improvement to the above solution, the number of the sealing threaded ring and the connecting water pipe is set to two, and the two sealing threaded rings and the connecting water pipe are symmetrically distributed on the left and right sides with the aluminum base plate as the center.
[0013] As a further improvement to the above solution, the upper cover plate is internally threaded with a sealing threaded ring, the connecting water pipe is located inside the upper cover plate, and the bottom of the upper cover plate is in contact with the top surface of the vertical aluminum heat exchange plate.
[0014] Through the above technical solution, the dense microchannel structure on the surface of the core heat exchange element greatly increases the contact area with the coolant. Combined with the high thermal conductivity of aluminum, it achieves rapid and uniform heat exchange. The design of the heat spreader being vertically embedded in the aluminum base plate allows the coolant to form a stable laminar flow state under the assistance of gravity, avoiding bubble retention and local overheating. The direct contact between the heat spreader and the bottom of the top cover plate further shortens the heat conduction path, ensuring that heat can be efficiently transferred to the coolant.
[0015] As a further improvement to the above scheme, the number of the left inclined plate one and the left inclined plate two is set to several, and the several left inclined plates one and the left inclined plate two are equidistantly distributed with the vertical aluminum heat spreader as the center.
[0016] With the above technical solution, the orientation of the left inclined plate 1, the left inclined plate 2, the right inclined plate 1 and the right inclined plate 2 forms an angle of 30-60° with the direction of water flow.
[0017] As a further improvement to the above solution, the bottom of the mounting column contacts the top surface of the aluminum base plate, and the bottom of the top cover plate contacts the top surface of the aluminum base plate.
[0018] As a further improvement to the above scheme, the number of right-tilted plate one and right-tilted plate two is set to several, and the several right-tilted plates one and right-tilted plates two are equidistantly distributed with the vertical aluminum heat spreader as the center.
[0019] As a further improvement to the above solution, the bottom of the upper cover plate contacts the top surface of the right inclined plate one, and the bottom of the upper cover plate contacts the top surface of the left inclined plate two.
[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0021] This invention improves the overall cooling effect of the equipment by setting up a left inclined plate 1, a left inclined plate 2, a right inclined plate 1, and a right inclined plate 2 between the aluminum base plate and the top cover plate, and then using a sealing threaded ring and connecting water pipes to transport coolant between the aluminum base plate and the top cover plate. The water flow resistance generated by the inclined plates increases the time that the coolant exists between the aluminum base plate and the top cover plate during actual use.
[0022] This invention features an overall temperature-equalizing and water-cooled composite structure: the corrugations on the temperature-equalizing plate are perpendicular to the water flow direction; a stepped brazing process is used: the temperature-equalizing plate is first brazed at 580℃, and then the top cover is welded at 610℃; cost-optimized design: using 3003 aluminum alloy, the material cost is reduced by 30% compared to copper; multi-chip temperature difference is <2℃; thermal uniformity is improved by 40% compared to copper VC solutions; and interface thermal resistance is reduced to 0.08 K·cm. 2 With a weight of less than / W, the overall weight is reduced by 30% compared to the copper solution, the cost is reduced by 30%, and the chip lifespan is extended. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0024] Figure 2 This is a schematic diagram of the disassembled structure of the upper cover plate of this utility model;
[0025] Figure 3 This is a schematic diagram of the structure of this utility model from below;
[0026] Figure 4 This is a schematic diagram of the exploded structure of this utility model.
[0027] Explanation of key symbols:
[0028] 1. Aluminum base plate; 2. Sealing threaded ring; 3. Connecting water pipe; 4. Fixing support ring; 5. Vertical aluminum heat spreader; 6. Left inclined plate one; 7. Left inclined plate two; 8. Flow guide bracket; 9. Right inclined plate one; 10. Right inclined plate two; 11. Flow guide frame; 12. Top cover plate; 13. Mounting support column. Detailed Implementation
[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0030] Example:
[0031] Please combine Figure 1-4The water-cooled plate structure of embedded welding of aluminum heat spreader in this embodiment includes an aluminum base plate 1, a sealing threaded ring 2 is connected to the internal thread of the aluminum base plate 1, a connecting water pipe 3 is connected to the internal thread of the sealing threaded ring 2, and a fixing support ring 4 is fixedly connected to the top of the aluminum base plate 1.
[0032] A vertical aluminum heat spreader 5 is fixedly connected to the top of the aluminum base plate 1. A left-tilted plate 6 and a left-tilted plate 7 are also fixedly connected to the top of the aluminum base plate 1. A flow guide bracket 8, a right-tilted plate 9, a right-tilted plate 10, and a flow guide frame 11 are all fixedly connected to the top of the aluminum base plate 1. A mounting column 13 is inserted into the inside of the fixing ring 4. The top is fixedly connected to the top cover plate 12. By setting the left inclined plate 6, left inclined plate 7, right inclined plate 9 and right inclined plate 10 between the aluminum base plate 1 and the top cover plate 12, and with the help of the sealing threaded ring 2 and the connecting water pipe 3, when the coolant is transported between the aluminum base plate 1 and the top cover plate 12, the water flow resistance generated by the inclined plates increases the time that the coolant exists between the aluminum base plate 1 and the top cover plate 12 during actual use, thereby improving the overall cooling effect of the equipment.
[0033] The machined base plate forms a 2mm deep groove, and the surface is anodized. The pre-formed aluminum heat spreader plate (including a 0.1mm sintered layer) is embedded into the groove, and TG-800 thermal paste is applied. The first stage of brazing is performed at 580℃ for 10min under argon protection. After assembling the water channel cover, the second stage of brazing is performed at 610℃ for 15min. Pressure testing is conducted (0.8MPa pressure holding for 30min with no leakage).
[0034] The number of sealing threaded rings 2 and connecting water pipes 3 is set to two, and the two sealing threaded rings 2 and connecting water pipes 3 are symmetrically distributed on the left and right sides with the aluminum base plate 1 as the center.
[0035] The upper cover plate 12 has a sealing threaded ring 2 inside, and the water pipe 3 is located inside the upper cover plate 12. The bottom of the upper cover plate 12 is in contact with the top surface of the vertical aluminum heat exchange plate 5.
[0036] As a core heat exchange element, its dense microchannel structure greatly increases the contact area with the coolant. Combined with the high thermal conductivity of aluminum, it achieves rapid and uniform heat exchange. The design of the heat spreader being vertically embedded in the aluminum base plate 1 allows the coolant to form a stable laminar flow state under the assistance of gravity, avoiding bubble retention and local overheating. The direct contact between the heat spreader and the bottom of the upper cover plate 12 further shortens the heat conduction path, ensuring that heat can be efficiently transferred to the coolant.
[0037] The number of left-inclined plates 1-6 and 2-7 is set to several, and the several left-inclined plates 1-6 and 2-7 are equidistantly distributed around the vertical aluminum heat spreader 5.
[0038] The left inclined plate 6, the left inclined plate 7, the right inclined plate 9, and the right inclined plate 10 are oriented at an angle of 30-60° to the direction of water flow.
[0039] The bottom of the mounting post 13 contacts the top surface of the aluminum base plate 1, and the bottom of the top cover plate 12 contacts the top surface of the aluminum base plate 1.
[0040] The number of right-tilted plates 1-9 and 2-10 is set to several, and these plates are equidistantly distributed around the vertical aluminum heat spreader 5. The overall equipment features a heat spreader-water cooling composite structure: the corrugations of the heat spreader are perpendicular to the water flow direction; a stepped brazing process is used: first, the heat spreader is brazed at 580℃, then the top cover plate 12 is welded at 610℃; cost optimization design: 3003 aluminum alloy is used, reducing material costs by 30% compared to copper; multi-chip temperature difference is <2℃; thermal uniformity is improved by 40% compared to the copper VC solution; and interface thermal resistance is reduced to 0.08 K·cm. 2 With a weight of less than / W, the overall weight is reduced by 30% compared to the copper solution, the cost is reduced by 30%, and the chip lifespan is extended.
[0041] The bottom of the upper cover plate 12 is in contact with the top surface of the right inclined plate 9, and the bottom of the upper cover plate 12 is in contact with the top surface of the left inclined plate 7.
[0042] The implementation principle of the water-cooled plate structure with embedded welding of aluminum heat spreader in this embodiment is as follows: By setting left inclined plate 6, left inclined plate 7, right inclined plate 9, and right inclined plate 10 between the aluminum base plate 1 and the top cover plate 12, and cooperating with the sealing threaded ring 2 and the connecting water pipe 3, the coolant is transported between the aluminum base plate 1 and the top cover plate 12. The water flow resistance generated by the inclined plates increases the time that the coolant exists between the aluminum base plate 1 and the top cover plate 12 during actual use, thus improving the overall cooling effect of the equipment. The equipment has a heat spreader-water cooling composite structure: the corrugation direction of the heat spreader is perpendicular to the water flow direction; a stepped brazing process is used: the heat spreader is first brazed at 580℃, and then the top cover plate 12 is welded at 610℃; cost optimization design: 3003 aluminum alloy is used, which reduces the material cost by 30% compared to copper; the temperature difference between multiple chips is <2℃; the thermal uniformity is improved by 40% compared to the copper VC solution; and the interface thermal resistance is reduced to 0.08K·cm. 2 With a weight of less than / W, the overall weight is reduced by 30% compared to the copper solution, the cost is reduced by 30%, and the chip lifespan is extended.
[0043] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.
Claims
1. An aluminum heat spreader embedded soldered water-cooling plate structure, characterized by, Includes an aluminum base plate (1), the aluminum base plate (1) is internally threaded with a sealing threaded ring (2), the sealing threaded ring (2) is internally threaded with a connecting water pipe (3), and the top of the aluminum base plate (1) is fixedly connected with a fixing support ring (4). A vertical aluminum heat spreader plate (5) is fixedly connected to the top of the aluminum base plate (1). A left inclined plate one (6) is fixedly connected to the top of the aluminum base plate (1). A left inclined plate two (7) is fixedly connected to the top of the aluminum base plate (1). A flow guide bracket (8) is fixedly connected to the top of the aluminum base plate (1). A right inclined plate one (9) is fixedly connected to the top of the aluminum base plate (1). A right inclined plate two (10) is fixedly connected to the top of the aluminum base plate (1). A flow guide frame (11) is fixedly connected to the top of the aluminum base plate (1). An installation support column (13) is inserted into the inside of the fixed support ring (4). An upper cover plate (12) is fixedly connected to the top of the installation support column (13).
2. The aluminum vapor chamber embedded soldered water-cooling board structure of claim 1, wherein: The number of the sealing threaded ring (2) and the connecting water pipe (3) is set to two, and the two sealing threaded rings (2) and the connecting water pipe (3) are symmetrically distributed on the left and right sides with the aluminum base plate (1) as the center.
3. The aluminum vapor chamber embedded soldered water-cooling board structure of claim 1, wherein: The upper cover plate (12) is internally threaded with a sealing threaded ring (2), the connecting water pipe (3) is located inside the upper cover plate (12), and the bottom of the upper cover plate (12) is in contact with the top surface of the vertical aluminum heat exchange plate (5).
4. The aluminum vapor chamber embedded soldered water-cooling board structure of claim 1, wherein: The number of the left inclined plate one (6) and the left inclined plate two (7) is set to several, and the several left inclined plates one (6) and the left inclined plate two (7) are equidistantly distributed with the vertical aluminum heat spreader (5) as the center.
5. The aluminum vapor chamber embedded soldered water-cooling board structure of claim 1, wherein: The bottom of the mounting post (13) is in contact with the top surface of the aluminum base plate (1), and the bottom of the upper cover plate (12) is in contact with the top surface of the aluminum base plate (1).
6. The aluminum vapor chamber embedded soldered water-cooling board structure of claim 1, wherein: The number of right inclined plate one (9) and right inclined plate two (10) is set to several, and the several right inclined plate one (9) and right inclined plate two (10) are equidistantly distributed with the vertical aluminum heat spreader (5) as the center.
7. The aluminum vapor chamber embedded soldered water-cooling board structure of claim 1, wherein: The bottom of the upper cover plate (12) is in contact with the top surface of the right inclined plate (9), and the bottom of the upper cover plate (12) is in contact with the top surface of the left inclined plate (7).